Patent application number | Description | Published |
20080197419 | Cell structure for dual port SRAM - An integrated circuit and methods for laying out the integrated circuit are provided. The integrated circuit includes a first and a second transistor. The first transistor includes a first active region comprising a first source and a first drain; and a first gate electrode over the first active region. The second transistor includes a second active region comprising a second source and a second drain; and a second gate electrode over the second active region and connected to the first gate electrode, wherein the first source and the second source are electrically connected, and the first drain and the second drain are electrically connected. | 08-21-2008 |
20080230855 | Gate strip with reduced thickness - A semiconductor structure with reduced inter-diffusion is provided. The semiconductor structure includes a semiconductor substrate; a first well region in the semiconductor substrate; a second well region in the semiconductor substrate; an insulating region between and adjoining the first and the second well regions; a gate dielectric layer on the first and the second well regions; and a gate electrode strip on the gate dielectric and extending from over the first well region to over the second well region. The gate electrode strip includes a first portion over the first well region, a second portion over the second well region, and a third portion over the insulating region. A thickness of the third portion is substantially less than the thicknesses of the first and the second portions. | 09-25-2008 |
20080246094 | Method for Manufacturing SRAM Devices with Reduced Threshold Voltage Deviation - A semiconductor device includes a semiconductor substrate; a gate dielectric layer disposed on the semiconductor substrate; a gate conductive layer doped with impurities selected from nitrogen, carbon, silicon, germanium, fluorine, oxygen, helium, neon, xenon or a combination thereof on the gate dielectric layer; and source/drain doped regions formed adjacent to the gate conductive layer in the semiconductor substrate, wherein the source and drain doped regions are substantially free of the impurities doped into the gate conductive layer. These impurities reduce the diffusion rates of the N-type of P-type dopants in the gate conductive layer, thereby improving the device performance. | 10-09-2008 |
20080265369 | Semiconductor Capacitor Structure - The present invention discloses a capacitor in an integrated circuit which comprises a first and second conductive lines substantially parallel to each other and having a thickness equals substantially to a sum of a via thickness and an interconnect thickness, the first and second conductive lines, the via and the interconnect being formed by a single deposition step, and at least one dielectric material in a space horizontally across the first and second conductive lines, wherein the first and second conductive lines serve as two conductive plates of the capacitor, respectively, and the dielectric material serves as an insulator of the capacitor. | 10-30-2008 |
20090014796 | Semiconductor Device with Improved Contact Structure and Method of Forming Same - A contact structure includes a first contact formed in a first dielectric layer connecting to the source/drain region of a MOS transistor, and a second contact formed in a second dielectric layer connecting to a gate region of a MOS transistor or to a first contact. A butted contact structure abutting a source/drain region and a gate electrode includes a first contact formed in a first dielectric layer connecting to the source/drain region of a MOS transistor, and a second contact formed in a second dielectric layer with one end resting on the gate electrode and the other end in contact with the first contact. | 01-15-2009 |
20090040858 | SRAM Device with a Power Saving Module Controlled by Word Line Signals - An SRAM device include: a latch unit for retaining data; one or more pass gate transistors controlled by a word line for coupling the latch unit to a bit line and a complementary bit line; and a power saving module coupled to the latch unit for raising a source voltage of the latch unit in response to a control signal on the word line, thereby reducing a leakage current for the latch unit. | 02-12-2009 |
20090045482 | Shallow Trench Isolation with Improved Structure and Method of Forming - A shallow trench isolation (STI) structure has a top portion tapering in width from wide to narrow in a direction from a substrate surface, from a first width at a top of the first portion to a second width at a bottom of the first portion. The STI structure also includes a bottom portion below the top portion, which expands from the bottom of the top portion to a substantially widened lateral distance having a third width. The third width is, in general, substantially larger than the second width. The inventive STI structure can provide desired isolation characteristics with a significantly reduced aspect ratio, thus suitable for device isolations in advanced processing technology. | 02-19-2009 |
20090168484 | MULTIPLE-PORT SRAM DEVICE - A multiple-port SRAM cell includes a latch having a first node and a second node for retaining a value and its complement, respectively. The cell has a write port separate from a read port for parallel operation. A number of transistors are used to connect the first and second nodes to a number of bit lines, such as a read port bit line, a read port complementary bit line, a read/write port bit line, and a read/write port complementary bit line. In a layout view of the multiple-port SRAM cell, the read port bit line, read port complementary bit line, read/write port bit line and read/write port complementary bit line are separated by at least one supply voltage line, one or more complementary supply voltage lines, and one or more word line landing pads. | 07-02-2009 |
20100177545 | MEMORY CIRCUITS AND ROUTING OF CONDUCTIVE LAYERS THEREOF - A memory circuit includes at least one memory cell for storing a datum. The memory cell is coupled with a word line, a bit line, a bit line bar, a first voltage line, and a second voltage line. The memory circuit includes a first conductive layer, a second conductive layer coupled with the first conductive layer, a third conductive layer coupled with the second conductive layer. The third conductive layer is routed for the word line and is free from including the bit line, the bit line bar, the first voltage line, and the second voltage line within the memory cell. | 07-15-2010 |
20100213514 | METAL STRUCTURE FOR MEMORY DEVICE - A semiconductor device is provided that includes a substrate, a static random access memory (SRAM) unit cell formed in the substrate, a first metal layer formed over the substrate, the first metal layer providing local interconnection to the SRAM unit cell, a second metal layer formed over the first metal layer, the second metal layer including: a bit line and a complementary bit line each having a first thickness and a Vcc line disposed between the bit line and the complementary bit line, and a third metal layer formed over the second metal layer, the third metal layer including a word line having a second thickness greater than the first thickness. | 08-26-2010 |
20100254210 | Multiple-Port SRAM Device - A static random access memory (SRAM) cell having a dedicated read port separated from a write port comprises a first and a second bit-line placed in parallel forming a complimentary bit-line pair for the dedicated read port, a first and second metal line adjacently flanking in both side of and in parallel to the first bit-line, the first and second metal line being formed in the same metal layer as the first bit-line and having a first and second predetermined distance to the first bit-line, respectively, and a third and fourth metal line adjacently flanking in both side of and in parallel to the second bit-line, the third and fourth metal line being formed in the same metal layer as the second bit-line and having a third and fourth predetermined distance to the second bit-line, respectively, wherein the first predetermined distance is equal to the third distance and the second predetermined distance is equal to the fourth distance for keeping the first and second bit-lines having balanced capacitance loading. | 10-07-2010 |
20100259971 | Two-Port 8T SRAM Design - An integrated circuit includes a two-port static random access memory (SRAM) cell, which includes a first half write-port, a second half write-port, and a read-port. The first half write-port includes a first pull-up transistor, a first pull-down transistor, and a first pass-gate transistor interconnected to each other. The second half write-port includes a second pull-up transistor, a second pull-down transistor, and a second pass-gate transistor interconnected to each other and to the first half write-port. Channel lengths of the first pass-gate transistor and the second pass-gate transistor are less than channel lengths of the first pull-down transistor and the second pull-down transistor. The read-port includes a read-port pull-down transistor connected to the first half write-port, and a read-port pass-gate transistor connected to the read-port pull-down transistor. | 10-14-2010 |
20110026289 | CELL STRUCTURE FOR DUAL PORT SRAM - A multi-port SRAM cell includes cross-coupled inverters each including a pull-up transistor and at least a pair of pull down transistors. The SRAM cell includes first and second access ports coupled to first and second word line conductors, each access port including a first pass gate transistor coupled to the data storage node and a second pass gate transistor coupled to the data bar storage node, each pass gate transistor being coupled to a respective bit line conductor, wherein the pull down transistors of the first inverter are formed in a first active region, the pull down transistors of the second inverter are formed in a second active region, the pass gate transistors coupled to the data storage node are formed in a third active region and the pass gate transistors coupled to the data bar storage node are formed in a fourth active region. | 02-03-2011 |
20110026308 | CELL STRUCTURE FOR DUAL PORT SRAM - A multi-port SRAM cell includes cross-coupled inverters each including a pull-up transistor and at least a pair of pull down transistors. The SRAM cell includes first and second access ports coupled to first and second word line conductors, each access port including a first pass gate transistor coupled to the data storage node and a second pass gate transistor coupled to the data bar storage node, each pass gate transistor being coupled to a respective bit line conductor, wherein the pull down transistors of the first inverter are formed in a first active region, the pull down transistors of the second inverter are formed in a second active region, the pass gate transistors coupled to the data storage node are formed in a third active region and the pass gate transistors coupled to the data bar storage node are formed in a fourth active region. | 02-03-2011 |
20110059604 | METHODS FOR FABRICATING STEP GATE ELECTRODE STRUCTURES FOR FIELD-EFFECT TRANSISTORS - A method is disclosed for forming at least two semiconductor devices with different gate electrode thicknesses. After forming a gate dielectric region, and determining whether a first or second device formed on the gate dielectric region expects a relatively faster gate dopant diffusion rate, a gate electrode layer is formed on the gate dielectric region wherein the gate electrode layer has a step-structure in which a portion thereof for the first device has a relatively larger thickness than that for the second device if the first device has a relatively faster gate dopant diffusion rate. | 03-10-2011 |
20110068413 | Embedded SRAM Memory for Low Power Applications - Circuits and methods for providing a dual gate oxide (DGO) embedded SRAM with additional logic portions, where the logic and the embedded SRAM have NMOS transistors having a common gate dielectric thickness but have different lightly doped drain (LDD) implantations formed using different LDD masks to provide optimum transistor operation. In an embodiment, a first embedded SRAM is a single port device and a second embedded SRAM is a dual port device having a separate read port. In certain embodiments, the second SRAM includes NMOS transistors having LDD implants formed using the logic portion LDD mask. Transistors formed with the logic portion LDD mask are faster and have lower Vt than transistors formed using a SRAM LDD mask. Dual core devices having multiple embedded SRAM arrays are disclosed. Methods for making the embedded SRAM are also disclosed. | 03-24-2011 |
20110157963 | SRAM WORD-LINE COUPLING NOISE RESTRICTION - A DC mode word-line coupling noise restriction circuit for multiple-port Random Access Memory cells. This circuit may comprise a Static Random Access Memory array. The SRAM array contains a plurality of columns and a plurality of rows with an SRAM cell formed at a cross-point of the columns and rows. Each SRAM cell has a first word-line conductor and a second word-line conductor. The first word-line conductor is connected to a first coupling noise restriction circuit. The first coupling noise restriction circuit comprises an inverter and a NMOSFET. The inverter has another NMOSFET and a PMOSFET. | 06-30-2011 |
20130164931 | Metal Structure for Memory Device - A semiconductor device is provided that includes a substrate, a static random access memory (SRAM) unit cell formed in the substrate, a first metal layer formed over the substrate, the first metal layer providing local interconnection to the SRAM unit cell, a second metal layer formed over the first metal layer, the second metal layer including: a bit line and a complementary bit line each having a first thickness and a Vcc line disposed between the bit line and the complementary bit line, and a third metal layer formed over the second metal layer, the third metal layer including a word line having a second thickness greater than the first thickness. | 06-27-2013 |
20140063919 | MULTIPLE-PORT SRAM DEVICE - A method for providing a SRAM cell having a dedicated read port separated from a write port includes providing a first and a second bit-line placed in parallel forming a complementary bit-line pair for the dedicated read port, and providing a third and a fourth bit-line placed in parallel forming a complementary bit-line pair for the write port. The method further includes providing a positive voltage supply line disposed between a first and a second ground line placed in parallel, providing a first and a second metal line adjacently flanking and in parallel to the first bit-line, and providing a third and a fourth metal line adjacently flanking and in parallel to the second bit-line to provide a new SRAM cell structure having a balanced read and write operation speed and an improved noise margin. | 03-06-2014 |