Patent application number | Description | Published |
20120028576 | FILTERING NETWORK IN HR-SI SILICON TECHNOLOGY - The invention relates to a filtering network in HR-Si silicon technology defined by at least one cut-off frequency and comprising an input terminal for receiving the signal to be filtered and an output terminal for delivering a filtered signal. The network comprises a first ground line connected by its ends to first and second ground points connected directly to the ground plane, a second ground line connected via its ends to third and fourth ground points directly connected to the ground plane, a plurality of L/C resonant elements connected in parallel and linked via one end to one of the two ground lines and via the other end between them, by means of coupling inductors which thus create transmission zeros. Each ground line forming inductive elements via inductances the network comprises capacitive elements in series with at least some of said inductive elements, the value of the capacitive elements being selected so that the resonant frequency of the inductive and capacitive elements in series corresponds to a frequency lying outside of the bandwidth. | 02-02-2012 |
20130293321 | ACTIVE BAND STOP FILTER - The present invention relates to an active band stop filter comprising a filter input and a filter output which are linked by a transmission line LT, a resonator RE coupled to the transmission line and connectable to a load impedance. Between the resonator and the load impedance there is mounted a means of activation of the filtering function in a chosen operating band. The filter is useable in multistandard terminals. | 11-07-2013 |
20140340174 | ACTIVE FILTER WITH DUAL RESPONSE - Based on an active low-pass filter structure comprising a main conductor line between an input port and an output port, consisting of an input conductor section, an output conductor section, and an inductance network in series between the input and output sections, the inductance network being coupled to the LC resonators, an LC resonator connected to each junction point between two network inductances, and at least one negative resistance in series with one of the resonators, a dual response filter is formed by providing an auxiliary conductor line, wherein an input end of the filter is connected to an electrical ground, forming a resonator with its own resonant frequency less than the cut-off frequency f | 11-20-2014 |
Patent application number | Description | Published |
20090053658 | Method of Controlling Burners for Heating Liquid Glass Flow Channels - Methods and apparatus for controlling the operation of a burner used for heating liquid glass feeders of a glass furnace. A burner is supplied with a fuel and oxygen. An additional gas is injected so that the sum of the oxygen flow, the fuel flow and the additional gas flow is greater than a minimum cooling flow for the burner. | 02-26-2009 |
20090148797 | Method for Carrying Out combined Burning in a Recovering Furnace - The invention relates to a burning method carried out in furnace provided with energy recovering means and burners, wherein a part of burners are embodied in the form of aero-combustible burners and the other part thereof are embodied in the form of oxy-combustible burners which are placed under the air ducts of the aero-combustible burners and carry out a staged combustion method. | 06-11-2009 |
20120006157 | METHOD FOR MELTING A SOLID CHARGE - A simple, compact burner achieves a more optimal melting of a solid charge followed by performance of combustion under distributed combustion conditions. The burner achieves this by fluidically bending the flame towards the solid charge during a melting phase with an actuating jet of oxidant, redirecting the flame in a direction away from the charge, and staging injection of oxidant among primary and secondary portions during a distributed combustion phase. | 01-12-2012 |
20130125707 | Process for Melting Scrap Metal - Process for melting scrap metal in a furnace comprising the steps of feeding a charge of solid scrap metal to the furnace, supplying fuel and an oxygen-rich oxidant to the furnace and combusting the fuel with the oxidant to generate heat inside the furnace, melting the charge of solid scrap metal in the furnace by means of the heat, withdrawing the molten metal from the furnace. Following the step of feeding the charge of solid scrap metal to the furnace, the fuel is combusted with the oxidant so as to generate one or more visible flames in the furnace above the charge and before the step of withdrawing the molten metal from the furnace, the fuel is combusted with the oxidant so as to generate flameless combustion in the furnace above the molten metal. | 05-23-2013 |
Patent application number | Description | Published |
20100006186 | ALUMINUM ALLOY PRODUCTS WITH HIGH TOUGHNESS AND PRODUCTION PROCESS THEREOF - Process for manufacturing aluminium alloy products, with high toughness and fatigue resistance comprising: (a) preparing an aluminium alloy bath, (b) adding a refining agent containing particles of AlTiC type phases into the bath, (c) casting an as-cast form such as an extrusion ingot, a forging ingot or a rolling ingot, (d) hot transforming the as-cast form, possibly after scalping, to form a blank or a product with final thickness, (e) optionally cold transforming the blank to a final thickness, (f) applying a solution heat treatment and quenching the product output from (d) or (e), followed by relaxation by controlled stretching with permanent elongation between 0.5 and 5%, and optionally annealing, wherein the quantity of refining agent is chosen such that the average casting grain size of the as-cast form is more than 500 μm. The present invention may be used, for example, to manufacture fuselage sheet or light-gauge plates made with 6056 alloy. | 01-14-2010 |
20120237395 | MANUFACTURING METHOD OF MAKING ALUMINUM ALLOY SEMI-FINISHED PRODUCT WITH IMPROVED MICROPOROSITY - The invention relates to a manufacturing method for making an unwrought semi-finished product having at mid thickness a density of micropores of size greater than 90 μm less than 50% and preferably less than 20% of the density of micropores of size greater than 90 μm obtained by a method according to prior art. The method according to the invention comprises in particular an ultrasound treatment step for the molten metal bath in a furnace and/or a vessel using an immersed device comprising at least one ultrasound transmitter. The semi-finished products obtained according to the method of the invention are particularly advantageous for manufacturing by rolling sheets designed for the aircraft industry to produce spars, ribs, upper and lower wing skins and for manufacturing by extrusion sections designed for the aircraft industry to produce stiffeners. | 09-20-2012 |
20140138041 | MULTI-ALLOY VERTICAL SEMI-CONTINUOUS CASTING METHOD - The invention relates to a method for the vertical semi-continuous direct chill casting of composite billets or plates comprising at least two layers of aluminium alloys, using a separator which is in contact with the solidification front and which provides a seal between the two alloys during casting, said separator being vibrated while it is in contact with the solidification front, so that the separator is not frozen in and entrained by the solid metal. The invention also relates to a device that can be used to carry out said method. | 05-22-2014 |
Patent application number | Description | Published |
20110006423 | SURFACE-MOUNTED SILICON CHIP - A silicon chip surface mounted via balls attached to its front surface, wherein the front and rear surfaces of the chip are covered with a thermosetting epoxy resin having the following characteristics: the resin contains a proportion ranging from 45 to 60% by weight of a load formed of carbon fiber particles with a maximum size of 20 μm and with its largest portion having a diameter ranging between 2 and 8 μm, on the front surface side, the loaded resin covers from 45 to 60% of the ball height, on the rear surface side, the loaded resin has a thickness ranging between 80 and 150 μm. | 01-13-2011 |
20110124157 | METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER - A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips. | 05-26-2011 |
20110300647 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER - A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame. | 12-08-2011 |
20120009763 | SEMICONDUCTOR CHIP MANUFACTURING METHOD - A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: a) arranging the wafer on a surface of an elastic film stretched on a first support frame having dimensions much greater than the wafer dimensions, so that, in top view, a ring-shaped film portion separates this outer contour from the inner contour of the frame; b) performing manufacturing operations by using equipment capable of receiving the first frame; c) arranging, on the ring-shaped film portion, a second frame of outer dimensions smaller than the inner dimensions of the first frame; d) cutting the film between the outer contour of the second frame and the inner contour of the first frame and removing the first frame; and e) performing manufacturing operations by using equipment capable of receiving the second frame. | 01-12-2012 |
20120149174 | METHOD FOR THINNING AND DICING ELECTRONIC CIRCUIT WAFERS - A method for thinning and dicing a wafer of electronic circuits, wherein: a thinning step is carried out while the wafer is supported by a first film bonded at the periphery of a support frame; and a dicing step is carried out while the thinned wafer is supported by a second film bonded at the periphery of the same frame from the other surface of the wafer, the first film being unstuck only once the second one is in place. | 06-14-2012 |
20130043586 | METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER - A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips. | 02-21-2013 |
20130178017 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER - A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame. | 07-11-2013 |
20130192435 | WAFER CUTTING METHOD AND DEVICE - A device for cutting a wafer provided with grooves on its upper surface having its lower surface supported by a flexible film secured to a frame. This device includes a system for locating the grooves and for positioning the frame with respect to a cutting system, and setting means for positioning the wafer in front of the locating system so that the located area is at a determined distance from the locating system. | 08-01-2013 |
20130216904 | METHOD FOR FORMING A MICROBATTERY - A method for forming a microbattery including, on a surface of a first substrate, one active battery element and two contact pads, this method including the steps of: a) forming, on a surface of a second substrate, two contact pads with a spacing compatible with the spacing of the pads of the first substrate; and b) arranging the first substrate on the second substrate so that the surfaces face each other and that the pads of the first substrate at least partially superpose to those of the second substrate, where a portion of the pads of the second substrate is not covered by the first substrate. | 08-22-2013 |