Patent application number | Description | Published |
20120245069 | ALDIMINE CLEANING COMPOSITION FOR REACTIVE POLYURETHANE COMPOSITIONS - Methods of using an aldimine of formula (I) as cleaning agent or ingredient of a cleaning agent composition for reactive polyurethane compositions, especially for reactive polyurethane hot melt adhesives. It has been found that such cleaning agents can greatly reduce the quantity of wastes and in particular mixtures of blocked and nonblocked reactive polyurethane compositions can be used without problem for gluing, without the gluing being negatively influenced in its properties, especially its thermal stability. | 09-27-2012 |
20120315491 | HOT MELT ADHESIVE COMPOSITIONS HAVING GOOD ADHESION ON BOTH POLAR AND NONPOLAR SUBSTRATES - A hot melt adhesive composition including a) at least one thermoplastic silane grafted poly-α-olefin that is solid at 25° C.; and b) at least one reaction product of a polyisocyanate having an isocyanate-reactive silane, wherein the isocyanate-reactive silane includes exactly one group reactive to an isocyanate group, selected from a hydroxyl group, a mercapto group, and an amino group, and wherein the reaction product includes a molecular weight M | 12-13-2012 |
20130212967 | USE OF POLYOLEFIN SEALING FILMS COATED WITH NON-REACTIVE HOT-MELT ADHESIVE FOR SEALING - The invention relates to a process for sealing an above-ground or underground construction. In particular it involves the use of non-reactive hot melt adhesives and flexible polyolefin films. This procedure in particular has the advantages that good and long-lasting adhesion can be achieved very quickly, and that in particular by using polyolefin strips coated with non-reactive hot melt adhesives, insulating strips can be obtained simply which are non-tacky at room temperature and can be processed and bonded easily at the construction site. | 08-22-2013 |
20130340368 | USE OF POLYOLEFIN MEMBRANES BEING COATED BY NON-REACTIVE HOTMELT ADHESIVES FOR SEALING - The invention relates to a process for sealing an above-ground or underground construction. In particular it involves the use of non-reactive hot melt adhesives and flexible polyolefin films. This procedure in particular has the advantages that good and long-lasting adhesion can be achieved very quickly, and that in particular by using polyolefin strips coated with non-reactive hot melt adhesives, insulating strips can be obtained simply which are non-tacky at room temperature and can be processed and bonded easily at the construction site. | 12-26-2013 |
20140329074 | REACTIVE POLYOLEFIN HOT-MELT ADHESIVE HAVING LOW VISCOSITY AND USE THEREOF FOR TEXTILE LAMINATIONS - The invention relates to hot-melt adhesive compositions having at least one thermoplastic poly-a-olefin that is solid at 25° C. and that contains silane groups, at least one soft resin having a melting point or softening point between −10 and 40° C., and at least one silane that is liquid at 25° C. The hot-melt adhesive compositions are characterized by an improved open time and reduced viscosity compared to the prior art that cannot be achieved by means of other low-molecular-weight components that are normally added to reduce the viscosity, because the components escape from the adhesive formulation over time. The hot-melt adhesives according to the invention are suitable in particular as laminating adhesives and have a desirable low viscosity during the application, while good cross-linking density can be achieved by the addition of silane that is liquid at room temperature. Despite the extended open time, the hot-melt adhesive compositions quickly build up an extremely high early strength and lead to a heat-stable adhesive bond. | 11-06-2014 |
Patent application number | Description | Published |
20120182041 | Method for supporting a tie of a chip to an electronic apparatus - A method for supporting a tie of a chip to an electronic apparatus includes generating once a chip-specific characteristic variable in a chip, reading out the chip-specific characteristic variable by the chip, and transmitting characteristic data representing the read-out characteristic variable of the chip to an electronic apparatus. | 07-19-2012 |
20140090092 | INPUT/OUTPUT MODULE, DATA PROCESSING APPARATUS AND METHOD FOR CHECKING THE OPERATION OF A DATA PROCESSING APPARATUS - Various embodiments provide an input/output module, including: at least one input/output port for the input of data; a signature generator that is coupled to the input/output port and is set up to generate a signature for the data from the data; a reference input, wherein the reference input is set up for the application of a reference signature; and a comparator that is coupled to the signature generator and to the reference input, and is set up to output an alarm signal if the signature of the data on the input/output port differs from the reference signature. | 03-27-2014 |
20140111234 | Die, Chip, Method for Driving a Die or a Chip and Method for Manufacturing a Die or a Chip - In various embodiments, a die is provided. The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output signal is dependent on at least one physical characteristic specific to the die; and a self-test circuit integrated with the physical unclonable function circuit on the die, wherein the self-test circuit is configured to provide at least one test input signal to the physical unclonable function circuit and to determine as to whether the output signal provided in response to the at least one test input signal fulfills a predefined criterion. | 04-24-2014 |
20140223569 | System on Chip with Embedded Security Module - An embedded security module includes a security processor, volatile and non-volatile memory, and an interface. The security processor includes transistors formed in one or more semiconductor layers of a semiconductor die, and implements one or more security-related functions on data and/or code accessed by the security processor. The volatile memory is fabricated on the same semiconductor die as the security processor and stores the data and/or code accessed by the security processor. The non-volatile memory includes non-volatile storage cells disposed above each semiconductor layer of the semiconductor die, and securely stores at least one of the data and/or code accessed by the security processor and security information relating to the data and/or code accessed by the security processor. The interface is fabricated on the same semiconductor die as the security processor and provides a communication interface for the security processor. | 08-07-2014 |
Patent application number | Description | Published |
20100096007 | PHOTOVOLTAIC CELL FRONT FACE SUBSTRATE AND USE OF A SUBSTRATE FOR A PHOTOVOLTAIC CELL FRONT FACE - The invention relates to a photovoltaic cell comprising a photovoltaic absorbent material, said cell including a front face substrate ( | 04-22-2010 |
20100269900 | PHOTOVOLTAIC CELL FRONT FACE SUBSTRATE AND USE OF A SUBSTRATE FOR A PHOTOVOLTAIC CELL FRONT FACE - The invention relates to a photovoltaic cell ( | 10-28-2010 |
20100282300 | METHOD FOR PRODUCING AN ELECTRODE MADE WITH MOLYBDENUM OXIDE - The present invention relates to a substrate notably designed to enter into the constitution of a solar cell, of which one face, called the inner face, is designed to receive a molybdenum-based conductive element. | 11-11-2010 |
20100300512 | MADE TO ELEMENTS CAPABLE OF COLLECTING LIGHT - A substrate having a glass function, comprising a main face intended to be combined with a layer based on an absorbent material, characterized in that it comprises, on at least one surface portion of the main face, at least one electrode that reflects in the wavelength range extending from the ultraviolet to the near infrared, said electrode being formed from a stack of n layers (where n≧2) defining between them interface zones. | 12-02-2010 |
20100300519 | PHOTOVOLTAIC CELL FRONT FACE SUBSTRATE AND USE OF A SUBSTRATE FOR A PHOTOVOLTAIC CELL FRONT FACE - The invention relates to a photovoltaic cell having an absorbent photovoltaic material, said cell comprising a front face substrate ( | 12-02-2010 |
20110005587 | MADE TO ELEMENTS CAPABLE OF COLLECTING LIGHT - A substrate ( | 01-13-2011 |
20110088774 | PHOTOVOLTAIC CELL AND PHOTOVOLTAIC CELL SUBSTRATE - The invention relates to a photovoltaic cell ( | 04-21-2011 |
20120167961 | TRANSPARENT SUBSTRATE EQUIPPED WITH AN ELECTRODE - The subject of the invention is a transparent substrate, especially made of glass, which is provided with an electrode, especially for a solar cell, comprising a conductive layer based on molybdenum Mo with a thickness of at most 500 nm, especially at most 400 nm or at most 300 nm or at most 200 nm. | 07-05-2012 |
20120186646 | TRANSPARENT SUBSTRATE EQUIPPED WITH AN ELECTRODE - The subject of the invention is a transparent substrate, especially made of glass, which is provided with an electrode, especially for a solar cell, comprising a conductive layer based on molybdenum Mo with a thickness of at most 500 nm, especially at most 400 nm or at most 300 nm or at most 200 nm. | 07-26-2012 |