Patent application number | Description | Published |
20110075501 | Multi-Channel Semiconductor Integrated Circuit Devices for Controlling Direct Current Generators and Memory Systems Including the Same - Multi-channel semiconductor integrated circuit devices are provided including a plurality of memory devices that are independently accessible, each of the plurality of memory devices including at least one power generation unit and a control unit for controlling an operation of the at least one power generation unit, a detection unit for detecting an operation state of the plurality of memory devices, and a common control unit for commonly controlling an operation of the at least one power generation unit of the plurality of memory devices, according to the operation state of the plurality of memory devices detected by the detection unit. The control unit of each of the plurality of memory devices controls the operation of the at least one power generation unit of a corresponding one of the plurality of memory devices. | 03-31-2011 |
20110090754 | INTERNAL POWER GENERATING APPARATUS, MULTICHANNEL MEMORY INCLUDING THE SAME, AND PROCESSING SYSTEM EMPLOYING THE MULTICHANNEL MEMORY - An internal power generating system for a semiconductor device is disclosed. The device may include a plurality of channels. The system comprises a reference voltage generator configured to generate a reference voltage. The system further comprises a plurality of internal power generators that are allocated to the plurality of channels in one-to-one correspondence and that are configured to commonly use the reference voltage generated by the reference voltage generator. Each internal power generator may be configured to receive a fed back internal power voltage, to compare the fed back internal power voltage to the reference voltage, and to generate an internal power voltage based on the comparison. The system further comprises a plurality of channel state detectors that are allocated to the plurality of channels in one-to-one correspondence, and that are configured to respectively detect operation states of the plurality of channels based on separate respective sets of command signals for each channel. The system additional comprises a plurality of internal power controllers that are allocated to the plurality of channels in one-to-one correspondence, and that are configured to respectively control driving capabilities for the internal power voltages according to the detected operation states. | 04-21-2011 |
20110093235 | SEMICONDUCTOR DEVICE - A semiconductor device is provided. The semiconductor device applies data applied through a bump pad on which a bump is mounted through a test pad to a test apparatus such that the reliability of the test can be improved. The amount of test pads is significantly reduced by allowing data output through bump pads to be selectively applied to a test pad. Data and signals applied from test pads are synchronized with each other and applied to bump pads during a test operation such that the reliability of the test can be improved without the need of an additional test chip. | 04-21-2011 |
20110095814 | CIRCUIT AND METHOD FOR GENERATING INTERNAL VOLTAGE, AND SEMICONDUCTOR DEVICE HAVING THE CIRCUIT - An internal voltage generating method performed in a semiconductor device, the internal voltage generating method including generating a plurality of initialization signals corresponding to a plurality of external power supply voltages; detecting a transition of a lastly-generated initialization signal from among the plurality of initialization signals and generating a detection signal; and generating a first internal voltage according to the detection signal. | 04-28-2011 |
20120163413 | SEMICONDUCTOR DEVICE WITH STACKED STRUCTURE HAVING THROUGH ELECTRODE, SEMICONDUCTOR MEMORY DEVICE, SEMICONDUCTOR MEMORY SYSTEM, AND OPERATING METHOD THEREOF - A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via. | 06-28-2012 |
20140211577 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A method of operating a semiconductor memory device is disclosed. The method may include receiving an access command, applying a first voltage to a selected word line of the semiconductor memory device for a period of time in response to receiving the access command, applying a second voltage to word lines adjacent to the selected word line before and after the period of time, and applying a third voltage to the word lines adjacent to the selected word line for the period of time, a voltage level of the third voltage greater than the second voltage. The applying the third voltage may occur when the semiconductor memory device is operated at a temperature below the predetermined temperature. | 07-31-2014 |
20140317470 | MEMORY DEVICES THAT PERFORM MASKED WRITE OPERATIONS AND METHODS OF OPERATING THE SAME - A method of operating a memory device includes: generating an internal read command in response to a received masked write command, the internal read command being generated one of (i) during a write latency associated with the received masked write command, (ii) after receipt of a first bit of masked write data among a plurality of bits of masked write data, and (iii) in synchronization with a rising or falling edge of a clock signal received with an address signal corresponding to the masked write command; reading, in response to the internal read command, a plurality of bits of data stored in a plurality of memory cells, the plurality of memory cells corresponding to the address signal; and storing, in response to an internal write command, the plurality of bits of masked write data in the plurality of memory cells. | 10-23-2014 |
20140317471 | SEMICONDUCTOR MEMORY DEVICES INCLUDING SEPARATELY DISPOSED ERROR-CORRECTING CODE (ECC) CIRCUITS - A semiconductor memory device may comprise: at least one bank, each of the at least one bank including a plurality of memory cells; an error-correcting code (ECC) calculator configured to generate syndrome data for detecting an error bit from among parallel data bits read out from the plurality of memory cells of each of the at least one bank; an ECC corrector separated from the ECC calculator, the ECC corrector configured to correct the error bit from among the parallel data bits by using the syndrome data and configured to output error-corrected parallel data bits; and/or a data serializer configured to receive the error-corrected parallel data bits and configured to convert the error-corrected parallel data bits into serial data bits. | 10-23-2014 |
20140331006 | SEMICONDUCTOR MEMORY DEVICES - A semiconductor memory device includes a memory cell array, a data inversion/mask interface and a write circuit. The data inversion/mask interface receives a data block including a plurality of unit data, each of the plurality of unit data having a first data size, and the data inversion/mask interface selectively enables each data mask signal associated with each of the plurality of unit data based on a number of first data bits in a second data size of each unit data. The second data size is smaller than a first data size of the unit data. The write circuit receives the data block and performs a masked write operation that selectively writes each of the plurality of unit data in the memory cell array in response to the data mask signal. | 11-06-2014 |
20140331101 | SEMICONDUCTOR MEMORY DEVICES, MEMORY SYSTEMS INCLUDING THE SAME AND METHOD OF WRITING DATA IN THE SAME - In one embodiment, the semiconductor device includes a memory array and a control architecture configured to control reading data from and writing data to the memory array. The control architecture is configured to receive data and a codeword location in the memory array, select one or more data units in the received data based on a data mask, read a codeword currently stored at the codeword location in the memory array, error correct the read codeword to generate a corrected read codeword, form a new codeword from the selected data units of the received data and data units in the corrected read codeword that do not correspond to the selected data units, and write the new codeword to the memory array. | 11-06-2014 |