Jang, TW
Ben-Hwa Jang, New Taipei City TW
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20130015922 | TRANSMISSION UNIT WITH REDUCED CROSSTALK SIGNALAANM Liu; Da-YuAACI New Taipei CityAACO TWAAGP Liu; Da-Yu New Taipei City TWAANM Liu; Da-YungAACI New Taipei CityAACO TWAAGP Liu; Da-Yung New Taipei City TWAANM Liu; Teng-LanAACI New Taipei CityAACO TWAAGP Liu; Teng-Lan New Taipei City TWAANM Jang; Ben-HwaAACI New Taipei CityAACO TWAAGP Jang; Ben-Hwa New Taipei City TW - A transmission unit with reduced crosstalk signal includes a first conductor group having at least one first conductor surrounded by a first sheath and at least one second conductor surrounded by a second sheath. The first and the second conductor are axially arranged corresponding to one another. The first sheath has a dielectric coefficient higher than that of the second sheath, so that a difference in dielectric property exists between the first and the second conductor to enable reduction of crosstalk occurred during high-speed signal transmission over the transmission unit. | 01-17-2013 |
20130017712 | SIGNAL TRANSMISSION CABLE WITH INSULATION PIERCING TERMINALSAANM Liu; Da-YuAACI New Taipei CityAACO TWAAGP Liu; Da-Yu New Taipei City TWAANM Liu; Da-YungAACI New Taipei CityAACO TWAAGP Liu; Da-Yung New Taipei City TWAANM Liu; Teng-LanAACI New Taipei CityAACO TWAAGP Liu; Teng-Lan New Taipei City TWAANM Jang; Ben-HwaAACI New Taipei CityAACO TWAAGP Jang; Ben-Hwa New Taipei City TW - A signal transmission cable with insulation piercing terminals includes a flat cable having a plurality of conductors, and a plurality of conductive terminals electrically connected to an end of the flat cable. The conductors respectively have a sheathed section, and a bare section located at an end of the sheathed section and having a length ranged between 0.01 mm and 4 mm. The sheathed sections are respectively surrounded by a first sheath before being together surrounded by a second sheath. The conductive terminals respectively include a spring contact and a plurality of piercing sections formed at an end of the spring contact for electrically connecting to the conductors of the flat cable. The bare sections with a defined length can reduce the stub effect on a signal transmitted via the signal transmission cable to achieve better impedance matching and reduced crosstalk interference during digital signal transmission. | 01-17-2013 |
Bi-Sheng Jang, Longtan Township TW
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20140308586 | Negative Electrode for Lithium Ion Rechargeable Battery and Manufacturing Method Thereof - The present invention relates to a negative electrode for lithium ion rechargeable battery and a manufacturing method thereof. The negative electrode comprises at least one vermicular graphite and at least one pitch, wherein the vermicular graphite is fabricated by way of thermally treating an expandable graphite powder, and the pitch is adsorbed in the pores of the vermicular graphite. In the present invention, the pitch adsorbed in the vermicular graphite would be carbonized and graphitized, such that a composite graphite having multi-layer flake graphite is formed, and the composite graphite is further pulverized to a composite graphite powder. Moreover, the manufacturing method of the present invention can be used for fabricating the negative electrode for lithium ion rechargeable battery under the conditions of reducing manufacturing cost and solvent usage, so as to protect the environment from the manufacturing process pollution. | 10-16-2014 |
Bor-Ping Jang, Hsin-Chu County TW
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20150097272 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a carrier, several dies disposed on a surface of the carrier and several scribing lines defined on the surface of the carrier. The scribing lines include several continuous lines along a first direction and several discontinuous lines along a second direction. Further, a method of dies singulation includes providing a carrier, disposing several dies on a surface of the carrier according to several scribing lines including several continuous lines along a first direction and several discontinuous lines along a second direction, cutting the carrier according to the continuous lines along the first direction, and cutting the carrier according to the discontinuous lines along the second direction. | 04-09-2015 |
Bor-Ping Jang, Hsinchu TW
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20140154871 | METHOD AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is provided. The method contains steps of providing the semiconductor device including a working area; directing a medium flow onto the working area; configuring a lens in contact with the medium flow; and directing a laser beam to the working area through the lens and the medium flow. A laser processing for manufacturing a semiconductor device is also provided. | 06-05-2014 |
Bor-Ping Jang, Chu-Bei TW
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20120018494 | Thermal Compress Bonding - A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together. | 01-26-2012 |
20120021183 | Forming Low Stress Joints Using Thermal Compress Bonding - A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer. | 01-26-2012 |
20120267423 | Methods and Apparatus for Thin Die Processing - A vacuum tip and methods for processing thin integrated circuit dies. A vacuum tip for attaching to an integrated circuit die is disclosed comprising a vacuum port configured to connect to a vacuum supply on an upper surface and having a bottom surface; and at least one vacuum hole extending through the vacuum tip and exposed at the bottom surface of the vacuum tip; wherein the vacuum tip is configured to physically contact a surface of an integrated circuit die. Methods for processing integrated circuit dies are disclosed. | 10-25-2012 |
20120299181 | Package-on-Package Process for Applying Molding Compound - A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film. | 11-29-2012 |
20130048027 | Package Assembly Cleaning Process Using Vaporized Solvent - A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly. | 02-28-2013 |
20130062761 | Packaging Methods and Structures for Semiconductor Devices - Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL. | 03-14-2013 |
20130126591 | Thermal Compress Bonding - A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together. | 05-23-2013 |
20130128486 | Forming Low Stress Joints Using Thermal Compress Bonding - A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer. | 05-23-2013 |
20130146647 | Integrated Reflow and Cleaning Process and Apparatus for Performing the Same - A method includes reflowing a solder region of a package structure, and performing a cleaning on the package structure at a cleaning temperature higher than a room temperature. Between the step of reflowing and the step of cleaning, the package structure is not cooled to temperatures close to the room temperature. | 06-13-2013 |
20130228951 | Wafer-Level Underfill and Over-Molding - A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes. | 09-05-2013 |
20130273717 | Apparatus and Method for the Singulation of a Semiconductor Wafer - The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput. | 10-17-2013 |
20140048586 | Innovative Multi-Purpose Dipping Plate - The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates. | 02-20-2014 |
20140291881 | WAFER LEVEL TRANSFER MOLDING AND APPARATUS FOR PERFORMING THE SAME - A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate. | 10-02-2014 |
20150021760 | MECHANISMS FOR FORMING BONDING STRUCTURES - Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar. | 01-22-2015 |
20150024606 | METHOD AND SYSTEM FOR THINNING WAFER THEREOF - Embodiments of a method for thinning a wafer are provided. The method includes placing a wafer on a support assembly and securing an etching mask to a backside of the wafer. The etching mask covers a peripheral portion of the wafer. The method further includes performing a wet etching process on the backside of the wafer to form a thinned wafer, and the thinned wafer includes peripheral portions having a first thickness and a central portion having a second thickness smaller than the first thickness. Embodiments of system for forming the thinned wafer are also provided. | 01-22-2015 |
20150044819 | Packaging Methods and Structures for Semiconductor Devices - Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL. | 02-12-2015 |
20150069604 | SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACKAGE STRUCTURE, AND A METHOD OF MAKING - A semiconductor device includes a substrate and a first conductive pad on a top surface of the substrate. The semiconductor device further includes a boundary structure on the top surface of the substrate around the conductive pad. | 03-12-2015 |
20150093858 | Methods for Controlling Warpage in Packaging - A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages. | 04-02-2015 |
20150130111 | Wafer-Level Underfill and Over-Molding - A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes. | 05-14-2015 |
Bow-Yi Jang, Taoyuan City TW
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20140052317 | METHOD FOR PREVENTING THEFT OF AN ELECTRIC VEHICLE AND AN ELECTRIC VEHICLE APPLYING THE SAME - A method for preventing theft of an electric vehicle includes steps (a) and (b). In step (a), when a switch detector detects that the state of a main switch is an OFF state, and when a rotation detector detects that a drive wheel is rotating, a controller is configured to count a time period of rotation of the drive wheel. In step (b), the controller is configured to enable a locking mechanism for locking the drive wheel from rotation when the time period counted by the controller reaches a preset time period. | 02-20-2014 |
Bow-Yi Jang, Taichung TW
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20080229859 | Eye module - An eye module is provided. The eye module includes a casing, an eyeball and a first driving element. The eyeball having a surface is disposed in the casing. The first driving element leans against the surface and drives the eyeball to rotate by a first friction force generated by rotating the first driving element. | 09-25-2008 |
Chau-Shin Jang, Hukou Township TW
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20080272668 | Three-phase DC motor - A three-phase DC motor includes a rotor having plurality of magnetic poles, and a stator. The stator has three corners. The second corner is adjacent to a first direction of the first corner. The third corner is adjacent to a second direction of the first corner. The first corner, the second corner, and the third corner extend forwards to the rotor to form a first winding slot, a second winding slot, and a third winding slot respectively. A first winding, a second winding, and a third winding respectively wind around the first winding slot, the second winding slot, and the third winding slot. The mechanical angle between the first winding slot and the second winding slot is between 75 and 85 degrees. The mechanical angle between the first winding slot and the third winding slot is also between 75 and 85 degrees. | 11-06-2008 |
Chau-Shin Jang, Hsinchu County TW
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20130093278 | ROTATIONAL KINETIC ENERGY OUTPUT DEVICE - A rotational kinetic energy output device comprises a housing component, a rotational component and a magnetism generating component. The rotational component includes a rotational body pivotally connected to the housing component, and the rotational body has at least one magnetic element. The magnetism generating component includes a plurality of magnetizers and coils wound on the magnetizers, the magnetizers are disposed in the housing component and surround the rotational body. Each of the magnetizers has a first magnetic arm and a second magnetic arm extended respectively toward the rotational body, and the rotational body is disposed between the first magnetic arm and the second magnetic arm. Thereby, the rotational kinetic energy output device allows a force to be balancedly exerted on the rotational body and a thin shape is also achieved. | 04-18-2013 |
20140103773 | ELECTRICAL ROTOR AND STATOR STRUCTURE - An electrical rotor and stator structure includes at least one stator, at least one rotor and multiple outward pillar structures. The at least one stator includes multiple first magnetic members. Each first magnetic member has a first surface. The at least one rotor is able to be rotated pivotally relative to the at least one stator. The at least one rotor includes multiple second magnetic members. Each second magnetic member has a second surface facing and opposite to the first surface. The multiple outward pillar structures are installed on the second surfaces and the first surfaces. | 04-17-2014 |
20140132102 | AXIAL FLUX HALBACH ROTOR - An axial flux Halbach rotor comprise: a first magnet set and a second magnet set. Further comprises: a plurality of first magnets that are respective featured by their respective first magnetizing directions and are arranged interconnecting to each other by the use of a first connecting element while allowing any two neighboring first magnets to be spaced from each other by a first distance; and the second magnet set further comprises: a plurality of second magnets that are respectively featured by their respective second magnetizing directions and are arranged interconnecting to each other by the use of a second connecting element while allowing any two neighboring second magnets to be spaced from each other by a second distance. In addition, the first magnet set and the second magnet set are arranged inlaid into each other while allowing the plural first magnets and the plural second magnets to be dispose alternatively. | 05-15-2014 |
20140319935 | MOVER AND STATOR ASSEMBLY OF ELECTRIC MACHINE - A mover and stator assembly of an electric machine includes at least one stator and at least one rotor. Each stator includes multiple magnetic components each including a first surface and a salient portion protruding from the first surface. The rotor includes multiple second magnetic components each including a second surface and a groove located on the second surface. The first surfaces face the second surfaces, and the width of each salient portion is less than that of each groove. | 10-30-2014 |
Chung-Sung Jang, Kaohsiung TW
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20140065553 | CHUCK AND SEMICONDUCTOR PROCESS USING THE SAME - An apparatus of semiconductor process including a chuck and a vacuum source is provided. The chuck has a plurality of holes for holding a semiconductor substrate, and the vacuum source is used for providing vacuum suction through the holes to make the semiconductor substrate be subjected to varied suction intensities according to a warpage level thereof. | 03-06-2014 |
Guang-Way Jang, Hsin-Chu TW
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20090104362 | Organic-inorganic hybrid material, hybrid film derived therefrom, and method for preparing the same - A method of preparing an organic-inorganic hybrid material is described. A M(OR)x and an organically modified Si-alkoxide having a predetermined functional group are dissolved in a first solvent and a second solvent to form a first solution and a second solution, respectively. The first solution and the second solution are then mixed and heated. As a result, the M(OR)x reacts with the organically modified Si-alkoxide to form a functionalized organic-inorganic hybrid material. Furthermore, the solid content of the functionalized organic-inorganic hybrid material is increased by transferring the same into another solvent. Therefore, a thick hybrid film is fabricated by means of the transferred functionalized organic-inorganic hybrid material. | 04-23-2009 |
Guang-Way Jang, Hsinchu TW
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20080214697 | Reactive organo-modified inorganic particles and biodegradable hybrid material containing the same - A reactive organo-modified inorganic particle. Inorganic particles are modified with functional groups through chemical bonding, ionic bonding, hydrogen bond or complex formation. The functional groups of organo-modified inorganic particle can react with monomer or oligomer of biodegradable materials to facilitate crosslinking and functionalization, thus improving physical properties of the inorganic particle-biodegradable hybrid materials. | 09-04-2008 |
20120083560 | BIO-BASED MATERIAL COMPOSITION AND OPTICAL DEVICE EMPLOYING THE SAME - The invention provides a bio-based material composition and an optical device employing the same. The composition can be a petroleum resin-free composition, including a polylactic acid resin, a filler, and a light diffusion agent. Further, the composition can be a composition with petroleum resin, including a polylactic acid resin, a petroleum resin, a light diffusion agent, and an antioxidant. | 04-05-2012 |
Jason Shian-Ching Jang, Hsinchu TW
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20150053312 | Metallic Glass Film for Medical Application - The present invention relates to a metallic glass film for medical application, which is an amorphous thin film metallic glass (TFMG) formed for covering the surface of a substrate (for example, a medical cutting instrument), so as to increase the wear resistance and the sharpness of the substrate, decrease the surface roughness of the substrate, protect the edge of the substrate from curl and chipping crack. In the present invention, the TFMG is a zirconium-based thin film metallic glass constituted by Zr material, Cu material, Al material, and Ta material with the atom percent of 53 at %, 33 at %, 9 at %, 5 at %, respectively. Moreover, the TFMG can also be constituted by Cu material, Zr material, Al material, and Ti material, and the atom percent of the Cu material, the Zr material, the Al material, and the Ti material are 48 at %, 42 at %, 6 at %, 4 at %, respectively. | 02-26-2015 |
Jason Shiang Ching Jang, Taoyuan County TW
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20130105300 | Application of Metallic Glass Coating for Improving Fatigue Resistance of Aluminum Alloys | 05-02-2013 |
20140353139 | APPLICATION OF METALLIC GLASS AND METALLIC GLASS THIN FILM COATING ON THE SHARPNESS ENHANCEMENT OF CUTTING TOOLS - A cutting tool having a metallic glass thin film (MGTF) coated thereon, a metallic glass cutting tool, and methods of fabricating the same are disclosed. The cutting tool having metallic glass thin film coated thereon comprises: a cutting element having a sharpened portion, and the cutting element is made of metal; and a metallic glass thin film coated on the cutting element, and the metallic glass is represented by the following formula 1 or formula 2, | 12-04-2014 |
Jason Shiang Ching Jang, Jhongli City TW
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20120265206 | MEDICAL DRILL - A medical drill is disclosed, which is made of amorphous alloy, the amorphous alloy is zirconium amorphous alloy comprising 45 at % or above of zirconium, wherein the tensile strength of the medical drill is 1500-2500 Mpa, and the Vicker's hardness of the medical drill is 400-750. Moreover, a medical drill made of titanium amorphous alloy is also disclosed. | 10-18-2012 |
20130108888 | APPLICATION OF METALLIC GLASS AND METALLIC GLASS THIN FILM COATING ON THE SHARPNESS ENHANCEMENT OF CUTTING TOOLS | 05-02-2013 |
20130325049 | REPLACEABLE MICRO-SURGICAL INSTRUMENT - The present invention provides a replaceable micro-surgical instrument which comprises a pull structure and a hollow tube attached to a grip. The hollow tube has a sleeve at one end with a U-type elastic element sliding in. The U-type elastic element includes a spring tension section and two opposite extending arms and the outer edge of each arm is against the inner wall of the sleeve. Two arms could move according to the pull structure to selectively extend out of the sleeve to be opened or pull back into the sleeve to be clip together. Particularly, there is a replaceable micro-surgical element set in the front-end of each arm, so when the micro-surgical element becomes blunt or broken, the doctor could only replace the micro-surgical element without replace a whole new instrument in order to reduce instrument cost, increase replacement rate, and maintain the quality of medical surgery. | 12-05-2013 |
Jen-Fang Jang, Taichung TW
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20100237125 | Nail Gun and Safety Device of the Same - A nail gun includes a housing, a safety device, a gun barrel, a supporting part, a block, a nosepiece, a linkage, a contacting part, a protrusion, a front linking part, a rear linking part and an arm. The safety device is arranged on the housing. The gun barrel is located at the front end of the housing. The supporting part is arranged inside the housing and has an elastic element. The block is disposed on the gun barrel. The nosepiece and the linkage are slidably arranged on the gun barrel. The contacting part is located at the front end of the nosepiece. The protrusion is applied to against the block. The front linking part is located at the rear end of the nosepiece. The rear linking part detachably connects the front linking part. The arm is located at the rear end of the linkage and against the elastic element. | 09-23-2010 |
Jeng Hsing Jang, Kaohsiung City TW
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20130043529 | Circuit Structure with Vertical Double Gate - A circuit structure including a semiconductor substrate having a depression; a first insulating layer positioned on the surface of the depression; a bottom conductor positioned in a bottom portion of the depression, wherein the bottom conductor is connected to an external bias through a plurality of longer vertical contact plugs; an upper conductor positioned in an upper portion of the depression, wherein the upper conductor is connected to a plurality of shorter vertical contact plugs, and a top surface of the upper conductor is higher than a depression-bearing surface of the semiconductor substrate; and a second insulating layer positioned between the bottom conductor and the upper conductor. | 02-21-2013 |
Jeng-Hsing Jang, Taoyuan County TW
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20130068264 | WAFER SCRUBBER APPARATUS - A wafer scrubber apparatus is disclosed, including a chamber, and holder connecting to a spindle disposed in the chamber, wherein the holder supports a wafer, and a gas purge pipe disposed at the top of a wall of the chamber, wherein the gas purge pipe comprises a plurality of gas injection holes facing downward to purge gas along the chamber wall making water flow along the chamber wall more smoothly and more quickly for preventing the water from scattering back to the wafer. | 03-21-2013 |
20130074878 | WAFER SCRUBBER - A wafer scrubber is disclosed, including a chamber, and a holder connecting to a spindle disposed in the chamber, wherein the holder supports a wafer, and the wafer spins to remove water on the wafer, and a mashed inner cup comprising a plurality of through holes disposed between the holder and a wall of the chamber, wherein the mashed inner cup receives water from a surface of the wafer and rotates around the spindle to release the water through the through holes. | 03-28-2013 |
20130078774 | METHOD FOR FORMING DOPE REGIONS WITH RAPID THERMAL PROCESS - The invention provides a method for forming a semiconductor device, including providing a substrate, forming a gate dielectric layer, forming a gate electrode on the gate dielectric layer, forming a spacer on sidewalls of the gate dielectric layer and the gate electrode, and using a rapid thermal process (RTP) apparatus comprising a plurality of lamps and a bias applying system to dope the substrate to form a source/drain region, wherein in the RTP apparatus, gaseous dopant species are illuminated by the lamps to be excited for transference gaseous dopant species to dopant ions and the dopant ions are moved by a bias from the bias applying system to be doped into the substrate. | 03-28-2013 |
20130078804 | METHOD FOR FABRICATING INTEGRATED DEVICES WITH REDUCTED PLASMA DAMAGE - A method for fabricating an integrated device with reduced plasma damage is disclosed, including providing a substrate, forming a structural layer on the substrate, forming a photoresist layer on the structural layer, and performing an etching process to the structural layer, wherein the photoresist layer is conductive to reduce plasma damage during the etching process. | 03-28-2013 |
20130099309 | VERTICAL MOSFET ELECTROSTATIC DISCHARGE DEVICE - A vertical MOSFET electrostatic discharge device is disclosed, including a substrate comprising a plurality of trenches, a recessed gate disposed in each trench, a drain region disposed between each of the two neighboring recessed gates, an electrostatic discharge implant region disposed under each drain region, and a source region surrounding and disposed under the recessed gates and the electrostatic discharge implant regions. | 04-25-2013 |
Jer-Huan Jang, Taishan Township TW
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20100024804 | SOLAR ENERGY COLLECTING AND STORING SYSTEM - A solar energy collecting and storing system includes a solar energy collecting unit and a heat reservoir. By the thermal energy collector, solar light is absorbed and converted into thermal energy for heating a working fluid contained in the thermal energy collector. Multiple input/output control valves and multiple input/output joints are connected with the heat reservoir for controlling the working fluid to flow into or out of the heat reservoir. If the light exposure is insufficient, the input control valve is closed and the heat reservoir is maintained in a thermally isolated state. For utilizing the thermal energy, the output control valve is opened and thus the thermal energy contained in the working fluid is transferred to the thermal energy application device through the thermal energy output piping line. | 02-04-2010 |
Jr-Shiung Jang, New Taipei City TW
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20130141391 | TOUCH CONTROL DEVICE, TOUCH CONTROL SYSTEM, AND TOUCHING CONTROL METHOD THEREOF - A touch control device, a touch control system, and a touching control method thereof are disclosed. The touch control device includes a light emission module, a first capture module, a second capture module, a computing module, and a first wireless transmission module. The light emission module projects a light signal to become a touch surface. When an object approaching the touch surface, the first capture module and the second capture module are used for capturing a first reflected signal and a second reflected signal according to reflect the light signal. The computing module is used for computing a first capturing angle and a second capturing angle according to the first reflected signal and the second reflected signal and computing a coordinate data of the object. The first wireless transmission module is used for transferring the coordinate data to a controlled system via a wireless transmission. | 06-06-2013 |
20140008516 | OPTICAL TOUCH DEVICE AND FOLDABLE FRAME ASSEMBLY THEREOF - A foldable frame assembly is adapted for an optical touch device. The foldable frame assembly includes a first frame, a second frame and a third frame. The second frame is pivotally connected to a first end of the first frame and the third frame is pivotally connected to a second end of the first frame, wherein the first end is opposite to the second end. The second frame and the third frame can rotate with respect to the first frame so as to be folded or expanded with respect to the first frame. | 01-09-2014 |
Jr-Yuan Jang, Changhwa City TW
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20120312641 | Bicycle brake device - A bicycle brake device is provided with a torsion spring on each of two brake arms, and the torsion spring has one end fixed to the fork tube of the bicycle and another end abutted against the brake arms to restrict a pivoting angle of the brake arm. The bicycle brake device is easy to assembly and capable of adjusting the position of the brake shoes as desired. In the case that the steel cord is broken, the bicycle brake device is further capable of preventing the brake arms from pivoting too far and getting stuck in the wheel, so as to improve riding safety. | 12-13-2012 |
Lih-Guong Jang, Hsinchu TW
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20090310865 | Video Surveillance System, Annotation And De-Annotation Modules Thereof - A video surveillance system gets a first image from at least a video source, and extracts its image features. It embeds annotation information with at least the image features into the first image, and converts the embedded image into a second image without changing the image format. After having compressed and decompressed the second image, the system extracts the embedded information from the decompressed embedded stream to separate the image and the annotation information, thereby obtaining completely recovered annotation information after a recovery process and an image processing. Because the image format is not changed, the operations on the second image at the rear end of the system, such as compression and decompression, are not affected. | 12-17-2009 |
20150160474 | CORRECTIVE LENS PRESCRIPTION ADAPTATION SYSTEM FOR PERSONALIZED OPTOMETRY - A method, system, and computer program product for adapting a corrective lens prescription. The system includes: an image capturing device; a lighting control device; a display; a memory; and a processor communicatively coupled to the image capturing device, the light generating device, the display, and the memory, wherein the processor is configured to perform the steps of a method including: generating a digital simulation for optometry, wherein the simulation is generated based on at least one lighting parameter, at least one activity parameter, at least one duration parameter, at least one personal parameter, and at least one target vision condition; recording user pupillary movement during the simulation; analyzing the recorded pupillary movement to determine a visual comfort assessment; and generating a message of the visual comfort assessment. | 06-11-2015 |
20150161783 | TRACKING EYE RECOVERY - A method and system for tracking eye recovery. The method includes: receiving eye data from an eyewear, wherein the eye data includes images acquired by an image capturing device in the eyewear; analyzing the eye data to determine an eye recovery status, wherein the analyzing is carried out by comparing the eye data to an initial set of eye conditions; and providing a notification of the eye recovery status. | 06-11-2015 |
Li-Wen Jang, Hsin-Chu TW
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20100148026 | Holder of display - A holder is adapted to be fixed on a display and adapted to hold a set-top box. The display includes a housing, and the housing includes at least one fastening portion and a first aperture. The holder includes a main body, at least one hook, and a lock component. The main body defines a holding space and has a second aperture. The holding space is adapted to contain the set-top box. The second aperture is located at one side of the holding space, and corresponds to the first aperture of the housing of the display. The hook is located at another side of the holding space for being lodged in the fastening portion. The lock component is through the second apertures and the first aperture to fix the main body of the holder on the housing of the display. | 06-17-2010 |
Ruei-Hung Jang, Jhubei City TW
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20130341757 | Masking-Less Fuse Formation with Oxide Remaining - The present disclosure relates to a method of fabricating a semiconductor device. A semiconductor device includes a bond pad and a fuse layer. The bond pad includes a coating on an upper surface. A dielectric layer is formed over the bond pad and the fuse layer. A passivation layer is formed over the dielectric layer. An etch is performed to form a bond pad opening and a fuse opening. The etch is performed using only a single mask. The fuse opening defines a fuse window. The upper surface of the bond pad is exposed by substantially removing the coating from the entire upper surface. | 12-26-2013 |
Ruei-Hung Jang, Jhubi City TW
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20090098283 | METHOD AND SYSTEM FOR PATTERNING ALIGNMENT MARKS ON A TRANSPARENT SUBSTRATE - Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. The light reflective layer is removed from a substantial portion of the transparent substrate excluding the region. In addition, a micro electro-mechanical systems device is disclosed. The device comprises an optically transparent substrate, at least one optically partially transparent alignment mark on the optically transparent substrate, and a plurality of reflective elements or imaging pixels attached to the optically transparent substrate. | 04-16-2009 |
Sheng-An Jang, Pingtung City TW
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20080320483 | RESOURCE MANAGEMENT SYSTEM AND METHOD - Resource management system is provided, implemented between a service bundle developer and provider and a service bundle user. A resource requirement determining device determines a system resource requirement for a service bundle provided by the service bundle developer and provider, and generates resource requirement information corresponding to the service bundle. A processor receives information of system resource utilization status from the service bundle user, determines whether available resource of the service bundle user is sufficient for the resource requirement of the service bundle, when the available resource of the service bundle user is insufficient, the processor generates a waiting queue, and adds the service bundle into the waiting queue. When available resource of the service bundle user is sufficient, the processor installs the service bundle specified in the waiting queue in the service user. A storage device stores the waiting queue and corresponding resource requirement information. | 12-25-2008 |
Sheng-Lyang Jang, Taipei TW
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20080197894 | Injection locked frequency divider - An injection locked frequency divider includes a signal injection unit, a Hartley voltage controlled oscillator and a biasing unit. The signal injection unit and the biasing unit output an injection signal to the Hartley voltage controlled oscillator to bias the Hartley voltage controlled oscillator. The Hartley voltage controlled oscillator, which includes a first transistor, a second transistor and a LC tank, receives the injection signal and outputs a differential output signal through a first output terminal and a second output terminal. First terminals of the first and second transistors are respectively coupled to the first and second output terminals, and second terminals of the first and second transistors are coupled to a first node. The LC tank decides a resonant frequency of the Hartley voltage controlled oscillator and serves as a positive feedback circuit for the first and second transistors. | 08-21-2008 |
20080231379 | Injection locker frequency divider - An injection locked frequency divider includes a ring oscillator, a first injection unit and a second injection unit. The ring oscillator includes a first delay cell and a second delay cell each including differential input terminals and differential output terminals. The differential input terminals and the differential output terminals of the first delay cell are respectively coupled to the differential output terminals and the differential input terminals of the second delay cell. The first injection unit connected between the differential output terminals of the first delay cell receives and injects a first injection signal to the differential output terminals of the first delay cell. The second injection unit connected between the differential output terminals of the second delay cell receives and injects a second injection signal to the differential output terminals of the second delay cell. | 09-25-2008 |
20090033430 | Injection-locked frequency divider - An injection-locked frequency divider includes a ring oscillator, a signal injection circuit, a first adjustable load circuit and a second adjustable load circuit. The ring oscillator generates an oscillation signal according to a differential signal outputted by the signal injection circuit. According to an adjustable voltage, the first and second adjustable load circuits can respectively change equivalent impedances of the first adjustable load circuit and the second adjustable load circuit so that a free-running frequency of the oscillation signal of the ring oscillator is adjusted and an injection-locked frequency range of the injection-locked frequency divider is expanded. | 02-05-2009 |
20090085682 | Injection-locked frequency divider with a wide injection-locked frequency range - An injection-locked frequency divider includes a signal injection circuit and colpitts VCO. The signal injection circuit is for injecting an injection signal. The colpitts VCO includes first and second transistors, first and second LC tank circuits and a cross-coupled transistor pair. The first terminals of the first and second transistors receive the injection signal. The first and second LC tank circuits are for determining resonance frequency of an oscillation signal of the colpitts VCO. The cross-coupled transistor pair includes third and fourth transistors. The control terminals of the third and fourth transistors are respectively coupled to first terminals of the fourth and third transistors. The first terminals of the third and fourth transistors are respectively coupled to a first terminal or control terminal of the first and second transistors for providing an equivalent negative resistance. The injection signal and oscillation signal are mixed in frequency to generate differential output signals. | 04-02-2009 |
20090251177 | INJECTION-LOCKED FREQUENCY DIVIDER - An injection-locked frequency divider for dividing a frequency of an injection signal and obtaining a frequency divided signal is provided. The injection-locked frequency divider includes a signal injection unit and an oscillator. The signal injection unit includes a first input terminal and a second input terminal for receiving the injection signal. The received injection signal exhibits a phase difference of 180° between the first input terminal and the second input terminal. The oscillator includes an inductor unit and a variable capacitance unit. The injection-locked frequency divider is featured with a wide injection locking range, and can be realized with a low operation voltage, and therefore can be conveniently used in different kinds of hybrid ICs. | 10-08-2009 |
Shian-Ching Jang, Taoyuan City TW
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20150162634 | PREPARATION METHOD OF ELECTROLYTES FOR SOLID OXIDE FUEL CELLS - The preparation method of electrolytes provided by the present invention involves applications of a first solid oxide powder and a second solid oxide powder, both of which are prepared by using a sol-gel process and a calcination process. Each of the first and second solid oxide powders is a Perovskite-type oxide. After the first and second solid oxide powders are readily mixed, they are compressed into a pellet and then sintered to prepare the afore-mentioned electrolytes for SOFC. It is found in the present invention that by mixing and compressing different solid oxide powders, the solid oxide powder having smaller particle size can fill into the gaps of the other solid oxide powder. After the pellet is sintered, the density of the product is significantly improved. | 06-11-2015 |
Shian-Ching Jang, Dashu Township TW
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20100036219 | Blood Sampler - A blood sampler is adapted for penetrating epidermis of skin in order to collect blood, and includes a plate, a thin-film electrode unit, and a plurality of spaced apart penetrating members. The plate has an upper surface that is indented to form a recess adapted for containing the blood. The thin-film electrode unit is provided in the plate and has a reactive section that is exposed at a bottom of the recess. The penetrating members are provided on the reactive section of the thin-film electrode unit. Each of the penetrating members has a bottom end that is wire-bonded to the reactive section of the thin-film electrode unit, and a top end that is not higher than the upper surface of the plate. | 02-11-2010 |
Shian-Ching Jang, Kaohsiung County TW
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20090246549 | GLASSY METAL COMPOSITE MATERIAL - A glassy metal composite material includes: a Mg-based amorphous metal matrix; and a plurality of porous metal particles dispersed in the Mg-based amorphous metal matrix. The Mg-based amorphous metal matrix penetrates into pores in the porous metal particles. The porous metal particles have a hardness less than that of the Mg-based amorphous metal matrix. | 10-01-2009 |
Shian-Ching Jang, Taoyuan County TW
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20130244054 | COMPOSITE MATERIAL AND METHOD FOR IMPROVING FATIGUE PROPERTIES OF TITANIUM ALLOY BY COATING METALLIC GLASS LAYER - The invention provides a composite material, which includes a titanium alloy substrate and a metallic glass layer. The metallic glass layer is disposed on the titanium alloy substrate. The thickness of the metallic glass layer is 50 nm-200 nm, in which in comparison with the titanium alloy substrate, the fatigue life of the composite material of the invention is increased by 5-17 times. | 09-19-2013 |
Shiang Ching Jang, Zhongli City TW
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20150023827 | Porous Amorphous Alloy Artificial Joint and Manufacturing Method Thereof - The present invention relates to a porous amorphous alloy artificial joint and a manufacturing method thereof The porous amorphous alloy artificial joint is formed of at least one of amorphous alloy compounds represented by Formula 1 to Formula 4 as described in the present specification. | 01-22-2015 |
20150037694 | PREPARATION METHOD OF ELECTROLYTES FOR SOLID OXIDE FUEL CELLS - The preparation method of electrolytes provided by the present invention includes a first solid oxide powder and a second solid oxide powder, both of which are prepared by using a sol-gel process and a calcination process. Each of the first and second solid oxide powders is a Perovskite-type oxide. After the first and second solid oxide powders are readily mixed, they are compressed into a pellet and then sintered to prepare the afore-mentioned electrolytes for SOFC. It is found in the present invention that by mixing and compressing different solid oxide powders, the solid oxide powder having smaller particle size can fill into the gaps of the other solid oxide powder. After the pellet is sintered, the density of the product is significantly improved. | 02-05-2015 |
Shih-Chieh Jang, Taoyuan County TW
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20110186810 | OPTOELECTRONIC COMPONENT WITH THREE-DIMENSION QUANTUM WELL STRUCTURE AND METHOD FOR PRODUCING THE SAME - An optoelectronic component with three-dimension quantum well structure and a method for producing the same are provided, wherein the optoelectronic component comprises a substrate, a first semiconductor layer, a transition layer, and a quantum well structure. The first semiconductor layer is disposed on the substrate. The transition layer is grown on the first semiconductor layer, contains a first nitride compound semiconductor material, and has at least a texture, wherein the texture has at least a first protrusion with at least an inclined facet, at least a first trench with at least an inclined facet and at least a shoulder facet connected between the inclined facets. The quantum well structure is grown on the texture and shaped by the protrusion, the trench and the shoulder facet. | 08-04-2011 |
20120231569 | OPTOELECTRONIC COMPONENT WITH THREE-DIMENSION QUANTUM WELL STRUCTURE AND METHOD FOR PRODUCING THE SAME - An optoelectronic component with three-dimension quantum well structure and a method for producing the same are provided, wherein the optoelectronic component comprises a substrate, a first semiconductor layer, a transition layer, and a quantum well structure. The first semiconductor layer is disposed on the substrate. The transition layer is grown on the first semiconductor layer, contains a first nitride compound semiconductor material, and has at least a texture, wherein the texture has at least a first protrusion with at least an inclined facet, at least a first trench with at least an inclined facet and at least a shoulder facet connected between the inclined facets. The quantum well structure is grown on the texture and shaped by the protrusion, the trench and the shoulder facet. | 09-13-2012 |
Shih-Chieh Jang, Taipei Hsien TW
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20090088044 | INTERACTIVE INTELLECTUAL ROBOTIC TOY AND CONTROL METHOD OF THE SAME - An interactive intellectual robotic toy and control method of the same includes a main processor. At least one memory unit connects the main processor for storing motion data and sound data. A control module respectively connects the main processor and a driver module, and the driver module further connects motors. The control module receives the motion data stored in the memory unit under control of the main processor. An audio handling module connects the main processor and a speaker, the audio handling unit receives the sound data stored in the memory unit under control of the main processor. A USB module connects the main processor for renewing the data stored in the memory unit. A RFID module has a reading module connecting the main processor, a first RF antenna connecting the reading module and identification modules, each identification module has a design, a tag with an electronic code corresponding to the design, and a second RF antenna. | 04-02-2009 |
Shih-Chieh Jang, Longtan Township TW
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20110027615 | ELECTRODE STRUCTURE ADAPTED FOR HIGH APPLIED VOLTAGE AND FABRICATION METHOD THEREOF - An electrode structure adapted for high applied voltage is provided, which comprises a conductive plate substrate and a covering layer disposed thereon such that a covering percentage of the covering layer over the conductive plate substrate is more than 50%. Since area of the conductive plate substrate covered by the covering layer is larger than the area exposed, the possibility of arcing is reduced and the voltage applied to the electrode structure may be increased. | 02-03-2011 |
20120280137 | ION IMPLANTING SYSTEM - An ion implanting system includes an ion beam generator, a mass separation device, a holder device and a first detector. The ion beam generator is configured for generating a first ion beam. The mass separation device is configured for isolating a second ion beam comprising required ions from the first ion beam. The holder device is configured for holding a least one substrate. The holder device and the first detector reciprocate relative to the second ion beam along a first direction to make the substrate and the first detector pass across a projection region of the second ion beam, wherein the first detector is configured for obtaining relevant parameters of the second ion beam. The above-mentioned system is able to obtain the relevant parameters of the ion beam during ion implantation so that the system may immediately adjust the fabrication parameters to obtain better effect of ion implantation. | 11-08-2012 |
Shin Hong Jang, Miaoli County TW
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20140171495 | STABLE PHARMACEUTICAL FORMULATION OF CABAZITAXEL - The present invention relates to a stable liquid cabazitaxel formulation in an enclosed container. The enclosed container comprises a liquid phase and an gaseous phase, wherein the liquid phase comprises cabazitaxel, polysorbate 80, ethanol, and one or more pH adjusters to maintain pH about 2.8-6.0, and the gaseous phase is saturated with CO | 06-19-2014 |
Shin-Hong Jang, Taichung TW
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20090062315 | Pharmaceutical Acceptable Composition Containing Non-Steroidal Anti-Inflammatory Drug and Local Anesthetics - A pharmaceutical acceptable composition is provided. The composition comprises an effective amount of a non-steroidal anti-inflammatory drug (NSAID), a local anesthetic, and an antiviral drug. | 03-05-2009 |
Shyue-Ming Jang, Hsinchu TW
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20090214893 | BORATE PHOSPHOR AND WHITE LIGHT ILLUMINATION DEVICE UTILIZING THE SAME - The invention provides borate phosphors composed of M | 08-27-2009 |
20090236970 | BORATE PHOSPHOR AND WHITE LIGHT ILLUMINATION DEVICE UTILIZING THE SAME - The invention provides borate phosphors composed of Ca | 09-24-2009 |
20110050086 | PHOSPHORS, FABRICATING METHOD THEREOF, AND LIGHT EMITTING DEVICE EMPLOYING THE SAME - The invention provides a phosphor composed of (M | 03-03-2011 |
20120212934 | BORATE PHOSPHOR AND WHITE LIGHT ILLUMINATION DEVICE UTILIZING THE SAME - Borate phosphors have a formula Zn | 08-23-2012 |
Syun-Ming Jang, Hsinchu TW
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20090014877 | Selective Formation of Boron-Containing Metal Cap Pre-layer - An interconnect structure with improved reliability is provided. The interconnect structure includes a semiconductor substrate; a dielectric layer over the semiconductor substrate; a metallic wiring in the dielectric layer; a pre-layer over the metallic wiring, wherein the pre-layer contains boron; and a metal cap over the pre-layer, wherein the metal cap contains tungsten, and wherein the pre-layer and the metal cap are formed of different materials. | 01-15-2009 |
20130127055 | MECHANISMS OF FORMING DAMASCENE INTERCONNECT STRUCTURES - The mechanisms of forming an interconnect structures described above involves using a reflowed conductive layer. The reflowed conductive layer is thicker in smaller openings than in wider openings. The mechanisms may further involve forming a metal cap layer over the reflow conductive layer, in some embodiments. The interconnect structures formed by the mechanisms described have better electrical and reliability performance. | 05-23-2013 |
Tu Cherng Jang, Taipei TW
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20090060794 | Eccentric rotating device - A motor driven rotating device is disclosed that includes a fixed base, an eccentric rotating mechanism above the base, first magnets in the base, and second magnets in the rotating mechanism. A polarity of each first magnet is opposite to that of each second magnet so as to maintain a gap between the base and the rotating mechanism. Also, the rotating mechanism is adapted to eccentrically rotate. | 03-05-2009 |
Wen-Yea Jang, Hsinchu TW
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20140182391 | PRESSURE AND SHEAR FORCE MEASUREMENT DEVICE AND METHOD - A pressure and shear force measurement device and a pressure and shear force measurement method are disclosed. The measurement device includes a flexible substrate; a plurality of signal outputting units embedded in the flexible substrate for outputting signals; and a plurality of signal detectors disposed at a peripheral of the flexible substrate for receiving at least a signal outputted from the signal outputting units, wherein when the flexible substrate has a load applied thereon and each of the signal outputting units has a displacement, each of the signal detectors detects a pressure and a shear force resulting from the load on the flexible substrate based on the signal received from the signal outputting units. | 07-03-2014 |
Yau-Chen Jang, Zhubei City TW
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20130098749 | TOUCH SENSING DEVICE AND MANUFACTURING METHOD THEREOF - The present disclosure relates to a touch sensing device comprising a plurality of sensing electrode units and an insulating pattern layer. The insulating pattern layer covers the plurality of sensing electrode units and has a plurality of openings that are not corresponding to plurality of sensing electrode units. The present disclosure also discloses a method for manufacturing the touch sensing device. | 04-25-2013 |
Yau-Tzu Jang, Hukou TW
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20120313126 | LED PACKAGE - An LED package comprises an encapsulation layer, an LED die and two electrodes. The LED die is capable of emitting a first light beam with a first wavelength, and, respectively, electrically connecting to the two electrodes. The encapsulation layer covers the LED die, and comprises a luminescent conversion element and a light-compensating element. A heat exhaustion of the luminescent conversion element is converse to that of the light-compensating element. The second and third wave lengths of the second and third light beams generated by the luminescent conversion element and the light-compensating element have oppositely different rates of change when temperatures of the luminescent conversion element and the light-compensating element are increased | 12-13-2012 |
20130240928 | OPTICAL LENS AND LIGHT EMITTING DIODE PACKAGE USING THE SAME - An LED package includes an LED light source and an optical lens located over the LED light source. The optical lens includes a top surface, a light reflective lateral surface and a bottom surface receiving the LED light source therein. The top surface includes a reflection surface located in the middle of the top surface and a refraction surface surrounding the reflection surface. The top surface receives light emitted from the LED light source, and the light striking the reflection surface is firstly reflected towards the lateral surface by the reflection surface, secondly reflected towards the refraction surface by the lateral surface, and finally refracted out of the optical lens by the refraction surface. | 09-19-2013 |
20140306240 | LIGHT EMITTING DIODE PACKAGE - An exemplary light emitting diode package includes a substrate, a first electrode and a second electrode embedded in the substrate, and a light emitting chip fixed onto the first electrode by first glue. The first electrode has a first barrier member at a periphery of the first glue and below the light emitting chip. The first barrier member obstructs the first glue from spreading toward a side of the first barrier member away from the first glue and the light emitting chip, whereby a contamination by the first glue to an area of the top surface beside the side of the first barrier of the first electrode away from the first glue and the light emitting chip is prevented. | 10-16-2014 |
20150162497 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACURING THE SAME - A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of each of the connecting pins is smaller than that of the conductive sheet. A top surface of each of the connecting pins is lower than that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer. | 06-11-2015 |
20150162498 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of the connecting pin is smaller than that of the conductive sheet. A top surface of the connecting pin is coplanar with that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer. | 06-11-2015 |
Yau-Tzu Jang, Hsinchu TW
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20120139002 | LED PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - An LED package structure comprises a substrate, two electrodes arranged on the substrate, an LED chip arranged on the substrate and electrically connected to the electrodes, an encapsulation covering the LED chip, and a shell surrounding the substrate and the encapsulation. The shell includes walls, of a height which exceeds the thickness of the substrate and so functions as a reflector. A circuit structure connected to the electrodes is arranged on the bottom of the walls. | 06-07-2012 |
20140167078 | LEAD FRAME AND LIGHT EMITTING DIODE PACKAGE HAVING THE SAME - An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way. | 06-19-2014 |
20140175482 | LIGHT EMITTING DIODE PACKAGE WITH LIGHT REFLECTING CUP INTERNALLY SLANTED - An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup. The reflecting cup is annular. The inner surface includes a reflecting portion slantwise extending from the top surface, and a transition portion extending downwardly from the reflecting portion. The transition portion defines a through hole therein. The reflecting portion defines a reflecting hole therein. An angle α is defined between the reflecting portion and an imaginary surface parallel to the bottom surface. An angle β is defined between the reflecting portion and the bottom surface. The angle β is larger than the angle α. | 06-26-2014 |
Yeong-Sheng Jang, New Taipei City TW
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20130087440 | KEY STRUCTURE AND KEYBOARD - The present invention relates to a key structure and a keyboard having the same. The key structure includes a seat, a conductive membrane disposed on the seat, a scissor assembly, a light source, and a cap. The seat has a plurality of protruding hooking portions. At least one conducting section is defined on the conductive membrane away from the central portion thereof. The collapsible scissor assembly is arranged between the seat and the cap. The key structure has at least one protrusion arranged above the corresponding conducting section. A rubber element having a hole formed on the top portion thereof is disposed centrally on the conductive membrane. The light source is arranged beneath and covered by the rubber element. The cap is disposed on the scissor assembly. The protrusion may be arranged on the side portion of the scissor assembly or the undersurface of the cap. | 04-11-2013 |
Yi-Feng Jang, Taishan Township TW
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20080307135 | High performance programmable logic system interface and chip - A chip with a high performance programmable logic system interface, including a first internal device, a second internal device and a bus master, is provided. The first internal device, which is integrated into the chip, communicates with an external device by a first set of internal buses and a first set of external buses. The second internal device, which is integrated into the chip, communicates with the external device by a second set of internal buses and a second set of external buses. The bus master is configured to control the first set of internal buses, the first set of external buses, the second set of internal buses and the second set of external buses. The first internal device and the second internal device communicate with the bus master simultaneously. | 12-11-2008 |
20080307157 | Method and system for updating firmware of microcontroller - A system for updating firmware of a microcontroller includes a serial peripheral interface (SPI), an inter integrated Circuit (I | 12-11-2008 |
Yi-Feng Jang, Taipei County TW
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20100100721 | METHOD AND SYSTEM OF SECURED DATA STORAGE AND RECOVERY - A method and a system of secured data storage and recovery are provided. First, a secured key and an encrypted user password of a storage device are obtained by using a controller of a storage device. Then, the secured key is encrypted by using the encrypted user password to generate a first private key, the encrypted user password is encrypted by using the secured key to generate a second private key, and data to be stored is encrypted by using the secured key. Finally, the encrypted data, the first private key, and the second private key are transmitted to a remote device for storage through a host. Thereby, the security of data storage is enhanced and data recovery mechanism is provided when the storage device is damaged or lost. | 04-22-2010 |
Yung-Li Jang, Dongshan Township TW
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20090071628 | HEAT-RADIATING DEVICE WITH COMPOSITE RADIATION EFFICIENCY - The heat-radiating device with composite heat radiation efficiency includes a foundation with a heating surface and a radiating surface. The foundation has an inner space for inserting phase-changing materials. A heat pipe includes a heat-absorbing end placed into the foundation and a radiating end protruded out of the foundation. A radiating fin set is arranged onto the radiating end of the heat pipe. The heat-radiating device enables the heat absorbed by the foundation to be quickly guided out of the foundation through the heat pipe. The radiation area is increased by the radiating fin set for improved heat radiation efficiency. The phase-changing material assists in heat absorption and storage by latent heat, thereby avoiding overheating of foundation and also helping to control efficiently the heat peak of the foundation. Furthermore, the heat-radiating device has a composite heat radiation effect with improved applicability. | 03-19-2009 |
20090074571 | VANE STRUCTURE OF AN AIRFLOW GENERATOR - The present invention provides a vane structure of an airflow generator. The plate of predefined thickness and width has a locating portion and a swinging end. The swinging end of the vane is wider than the locating portion. There is an oblique section placed between the swinging end and locating portion for linking purposes. A better wind guide effect can be obtained from the expanded swinging end, and the oblique section is employed to reduce inlet stagnation, thus greatly improving the smoothness of air flow and the operating performance of the vane with better applicability. | 03-19-2009 |
20090109623 | HEAT-RADIATING MODULE WITH COMPOSITE PHASE-CHANGE HEAT-RADIATING EFFICIENCY - The present invention provides a heat-radiating module with composite phase-change heat-radiating efficiency. The cooling pad of the heat-radiating module is fitted with a heating portion and radiating portion. The first and second chambers are placed at intervals into the cooling pad. The first and second phase-change materials are separately placed in two chambers. The reaction temperatures of two phase-change materials differ from each other. The phase-change material of higher reaction temperature assists in heat-absorbing and preventing overheating. There is a heat peak when the cooling pad reaches the preset high-temperature state. When the temperature of the cooling pad declines below a preset temperature, the phase-change material of lower reaction temperature will release the stored latent heat, enabling the cooling pad to maintain an operating temperature and improve the heat-radiating efficiency in a variety of equipment. | 04-30-2009 |
Yung-Li Jang, New Taipei City TW
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20120055653 | Heat Dissipating Unit And Heat Dissipating Device Having The Heat Dissipating Unit - A heat dissipating unit includes a plurality of heat dissipating fins arranged in an annular array and each including a flow guide plate extending from an inner side to an outer side of the annular array, two connecting plates respectively connected to and forming an angle with two opposite sides of the flow guide plate, and an air inlet and an air channel communicating fluidly with each other. Each connecting plate includes a connecting hole, a slanting edge opposite to the flow guide plate, and a connecting portion projecting from the slanting edge. The connecting portions of the connecting plates of each heat dissipating fin engage respectively the connecting holes in the connecting plates of an adjacent heat dissipating fin. The heat dissipating fins overlap each other so that the air inlets of the heat dissipating fins are arranged in a staggered manner. | 03-08-2012 |
20130107461 | FIXING MECHANISM AND RELATED ELECTRONIC DEVICE | 05-02-2013 |
20140305616 | THIN HEATING PIPE - A thin heating pipe includes a pipe, a main capillary structure, a first capillary structure, and a second capillary structure. The pipe has a hollow chamber and a connecting chamber. The first capillary structure is disposed in the chamber and between the first and the second capillary structures. The first capillary structure has a first channel, the second capillary structure has a second channel, and the connecting chamber is communicated with the first channel and the second channel. | 10-16-2014 |
20140332185 | HEAT INSULATING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND HEAT DISSIPATING SYSTEM INCLUDING THE SAME - A heat dissipating system is disclosed to be disposed in a casing of an electronic apparatus in which a heat source is disposed. The heat dissipating system includes a heat dissipating device and a heat insulating device. The heat dissipating device is in contact with the heat source and has a predetermined heat dissipating path for dissipating heat generated by the heat source. The heat insulating device includes a first layer that is in contact with one of the heat source and the heat dissipating device, and a second layer that is bonded to the first layer and that cooperates with the first layer to define an evacuated space therebetween. | 11-13-2014 |
20140345830 | DC MOTOR DEVICE AND DC FAN USING THE SAME - A heat dissipating device includes a substrate, a plurality of fins, and a heat pipe. The substrate has a plurality of retaining holes. Each of the fins includes a heat dissipating sheet and a retaining sheet extended from the heat dissipating sheet and passing through one of the retaining holes. The heat pipe is disposed on the fins. | 11-27-2014 |
20150030437 | Fan Device and Electronic Device Thereof - A fan device and an electronic device thereof are disclosed. The fan device is disposed in a casing of the electronic device and adjacent to a board of the casing, wherein the board has a first state and a second state. The fan device includes a plurality of fan blades, a shaft, and a ball. The shaft is connected to the plurality of fan blades and allows the plurality of fan blades rotating with the shaft, wherein at least one end of the shaft has a ball accommodating portion and an opening. The ball is disposed in the ball accommodating portion and limited by the opening for not separate from the ball accommodating portion. When the board is in the first state, a gap is between the ball and the casing. When the board is in the second state, the board and the ball touch each other. | 01-29-2015 |
20150069856 | ELECTRONIC DEVICE MODULE, ELECTRONIC DEVICE THEREOF, PROTECTION ELEMENT THEREOF AND METHOD OF RAISING WORKING FREQUENCY THEREOF - An electronic device module, an electronic device thereof, a protection element thereof and a method of raising working frequency thereof are provided. The electronic device module comprises the electronic device and the protection element. The electronic device comprises a main body, a device detection element and a central processing unit (CPU), wherein the device detection element and the CPU are disposed within the main body. The protection element comprises a protection cover and a protection detection element, wherein the protection detection element is disposed on the protection cover. The CPU raises a working frequency thereof according to an approaching movement between the device detection element and the protection detection element. | 03-12-2015 |
Yung-Li Jang, Taipei Hsien TW
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20100259889 | Electronic Device - An electronic device is provided, including a processing unit and a G-sensor electrically connected thereto. The G-sensor detects the posture of the electronic device and outputs a measurement signal to the processing unit accordingly. The processing unit produces a thermal control signal according to the measurement signal, so as to reduce heat generated from the electronic device or increase cooling efficiency of the electronic device. | 10-14-2010 |
20100296946 | PRESSURE SENSING DEVICE FOR ELECTRONIC DEVICE AND PRESSURE SENSING METHOD AND THERMAL DISSIPATION DEVICE THEREOF - A pressure sensing device for an electronic device includes a pressure sensing unit, a control unit, and an alarm unit. The pressure sensing unit is installed in the electronic device, and used for detecting fluid pressure to generate a pressure signal. The control unit is coupled to the pressure sensing unit, and used for determining variation in the fluid pressure in the electronic device according to the pressure signal and generating a control signal. The alarm unit is coupled to the control unit, and used for outputting an alarm signal according to the control signal to execute an alarm function. | 11-25-2010 |
20110235277 | HEAT PIPE CAPABLE OF TRANSFORMING DYNAMIC ENERGY INTO ELECTRIC ENERGY AND RELATED HEAT-DISSIPATING MODULE - A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a heat-dissipating end. The conductive capillary layer is formed on an inner wall of the conductive hollow case. A liquid stored in the conductive capillary layer can be heated to evaporate by the heat-generating component and then move toward the second end. The piezoelectric component is connected to the conductive capillary layer. The flexible component is disposed at a side of the piezoelectric component for being driven by the evaporated liquid so as to exert force upon the piezoelectric component. Thus, the piezoelectric component can generate electric energy, which can be transmitted from the conductive capillary layer to the conductive hollow case. | 09-29-2011 |
Yung-Sen Jang, Kaohsiung City TW
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20120269340 | HIERARCHICAL ENCRYPTION/DECRYPTION DEVICE AND METHOD THEREOF - A hierarchical encryption device for decrypting a ciphertext and outputting a plaintext is disclosed in the invention, wherein the ciphertext comprises an encrypted block and a plurality of ciphertext blocks. The device comprises a first decryption unit, a generator and a second decryption unit. The second decryption unit is for decrypting the encrypted block by a secret key with a second decryption method to generate at least one index block and a plurality of confusion blocks. The generator is for generating a plurality of mask blocks according to the plurality of confusion blocks and the index block, wherein the number of the plurality of mask blocks is the same as that of the plurality of ciphertext blocks. The first decryption unit is for decrypting the plurality of ciphertext blocks by the plurality of mask blocks with a first decryption method to generate a plurality of plaintext blocks, wherein the number of the plurality of plaintext blocks is the same as that of the plurality of ciphertext blocks. | 10-25-2012 |
Yung-Sen Jang, Kaohsiung TW
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20110078800 | DIGITAL CONTENT MANAGEMENT METHODS AND SYSTEMS - Digital content management methods and systems are provided. First, device ID of a first electronic device is received, and a data license including at least the device ID of the first electronic device, and a control license including at least a read authorization for a digital content are generated. Then, the digital content and the control license are packed as a content package, and the content package and the data license are respectively transmitted to the first electronic device. An electronic device determines whether the device ID of the electronic device conforms to the device ID recorded in the data license. If so, the digital content in the content package is allowed to be read according to the control license. A new data license is generated for the digital content according to the device ID of a second electronic device. The new data license is stored to the second electronic device, and the data license in the first electronic device is abrogated. Then, the content package is transmitted from the first electronic device to the second electronic device. | 03-31-2011 |
Yungtaek Jang, Taoyuan Hsien TW
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20120200246 | MOTOR CONTROL METHOD AND SYSTEM AND DIGITAL SIGNAL PROCESSOR THEREOF - A digital signal processor (DSP) is operable to receive a single-phase back electromotive force signal (back-EMF) fed back from a motor and control an inverter for driving the motor based on the single-phase back-EMF signal. The DSP includes an electrical angle building module, a rotation speed control module, and a pulse width modulation control module. | 08-09-2012 |
Yu-Sen Jang, Hsin-Chu TW
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20130301298 | Backlight Module - A thin backlight module includes a light guide plate, a light source module, and an adhesive layer. The light guide plate has a light-entering end and a bottom, wherein a plurality of troughs spaced at intervals are formed on a portion of the bottom connected to the light-entering end. The light source module is disposed corresponding to the light-entering end and includes a substrate and a plurality of light sources. The light sources are disposed on the substrate and distributed along the light-entering end, wherein each of the light sources corresponds to an interval between the adjacent troughs. The adhesive layer is attached to the substrate, faces the bottom of the light guide plate, and extends into the troughs to be attached to the light guide plate. | 11-14-2013 |
20140140092 | BACK LIGHT MODULE AND DISPLAY DEVICE USING THE SAME - A back light module includes a bezel, a light-guiding plate, an optical film and a fixing element. The bezel includes frame strips defining an accommodating space. Each frame strip has a bottom surface, a carrier surface opposite to the carrier surface, and a lateral surface connected between the bottom and carrier surfaces and facing to the accommodating space. The lateral surface of the frame strips has a first cave extended from the carrier surface through the bottom surface. The light-guiding plate and the optical film are configured in the accommodating space. The optical film has at least a first protrusion within the first cave. The fixing element is configured on the carrier surfaces of the frame strips and a portion of the optical film and corresponds to the boundary between the first protrusion and the first cave. A display device using the back light module is provided. | 05-22-2014 |