Patent application number | Description | Published |
20090154240 | NAND FLASH MEMORY DEVICES HAVING WIRING WITH INTEGRALLY-FORMED CONTACT PADS AND DUMMY LINES AND METHODS OF MANUFACTURING THE SAME - A NAND flash memory device includes a plurality of continuous conductors disposed on a common level of a multilayer substrate, the plurality of continuous conductors including respective conductive lines extending in parallel along a first direction, respective contact pads disposed at ends of the respective conductive lines and respective conductive dummy lines extending in parallel from the contact pads along a second direction | 06-18-2009 |
20110057765 | ARRAY TYPE CHIP RESISTOR - The present invention provides an array type chip resistor including: a substrate having a plurality of grooves formed on both sides thereof at equal spaces; lower electrodes formed on both sides of a bottom surface of the substrate; upper electrodes formed on both sides of a top surface of the substrate; side electrodes electrically connected to the upper and lower electrodes; a resistive element interposed between lower electrodes of the bottom surface of the substrate; a protection layer covered on the resistive element, the protection layer having both sides which cover a part of the lower electrodes and the resistive element; leveling electrodes being in contact with the lower electrodes exposed to outside of the protection layer; and a plating layer formed on the leveling electrodes. The array type chip resistor can prevent the resistive element from being damaged due to external impact when mounted since the resistive element is printed inside of the lower electrodes of the bottom surface of the substrate. | 03-10-2011 |
20110057767 | ARRAY TYPE CHIP RESISTOR - The present invention provides an array type chip resistor including: a substrate formed in a rectangular parallelepiped shape; lower electrodes disposed on both sides of a bottom surface of the substrate at equal spaces; side electrodes extended from some of lower electrodes, formed on outermost edges of both sides of the substrate, in all lower electrodes, to a side surface of the substrate; a resistive element interposed between lower electrodes of the bottom surface of the substrate; a protection layer covered on the resistive element, the protection layer having both sides which cover a part of the lower electrodes and the resistive element; leveling electrodes being in contact with the lower electrodes exposed to outside of the protection layer; and a plating layer formed on the leveling electrodes. The array type chip resistor can prevent the resistive element from being damaged due to external impact when mounted since the resistive element is printed inside of the lower electrodes of the bottom surface of the substrate. | 03-10-2011 |
20110103147 | NAND FLASH MEMORY DEVICES HAVING WIRING WITH INTEGRALLY-FORMED CONTACT PADS AND DUMMY LINES AND METHODS OF MANUFACTURING THE SAME - A NAND flash memory device includes a plurality of continuous conductors disposed on a common level of a multilayer substrate, the plurality of continuous conductors including respective conductive lines extending in parallel along a first direction, respective contact pads disposed at ends of the respective conductive lines and respective conductive dummy lines extending in parallel from the contact pads along a second direction | 05-05-2011 |
20120147674 | Nonvolatile Memory Devices that Utilize Dummy Word Line Segments to Inhibit Dishing During Fabrication - A NAND flash memory device includes a plurality of continuous conductors disposed on a common level of a multilayer substrate, the plurality of continuous conductors including respective conductive lines extending in parallel along a first direction, respective contact pads disposed at ends of the respective conductive lines and respective conductive dummy lines extending in parallel from the contact pads along a second direction | 06-14-2012 |
20130102151 | METHODS OF MANUFACTURING NAND FLASH MEMORY DEVICES - A NAND flash memory device includes a plurality of continuous conductors disposed on a common level of a multilayer substrate, the plurality of continuous conductors including respective conductive lines extending in parallel along a first direction, respective contact pads disposed at ends of the respective conductive lines and respective conductive dummy lines extending in parallel from the contact pads along a second direction | 04-25-2013 |
20150145826 | TOUCH SENSOR - Embodiments of the invention provide a touch sensor including a substrate, and an electrode on the substrate. The electrode includes a first diffusion barrier contacting the substrate, an intermediate layer formed on the first diffusion barrier, and a second diffusion barrier formed on the intermediate layer. According to an embodiment of the invention, corrosion of the intermediate layer and performance degradation caused by diffusion may be prevented by forming the intermediate layer on the first diffusion barrier contacting the substrate and forming the second diffusion barrier on the intermediate layer. | 05-28-2015 |
20150220184 | TOUCH SENSOR - Embodiments of the invention provide a touch sensor, including a window substrate including a central region and an edge region formed to enclose the central region, a bezel part formed in the edge region on a rear of the window substrate and including at least one bezel layer, an antenna pattern formed in the bezel part and transmitted or received to or from the outside by wireless communication, and a sensor module including an electrode pattern, which is formed on a base substrate and corresponds to the central region and formed on a plane different from the antenna pattern. | 08-06-2015 |