Patent application number | Description | Published |
20090286337 | Method of manufacturing light emitting diode package - There is provided a method of manufacturing a light emitting diode chip, the method including: providing a light emitting diode chip; forming a phosphor layer on a top of the light emitting diode chip; and forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder. There is also provided A method of manufacturing a light emitting diode package, the method including: forming a phosphor layer with a predetermined thickness; forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip. | 11-19-2009 |
20100020132 | Inkjet head actuator and manufacturing method of the same - There are provided an inkjet head actuator and a manufacturing method of the same. The inkjet head actuator includes: a vibration plate having a recess formed in a top surface thereof; a first electrode formed to cover a bottom surface and a side wall of the recess; a piezoelectric body formed on the first electrode to fill the recess; and a second electrode formed on the piezoelectric body. The inkjet head actuator having the thin film piezoelectric body and the vibration plate ensures large vibration displacement. | 01-28-2010 |
20100196681 | METHOD OF FORMING METAL WIRING AND METAL WIRING FORMED USING THE SAME - Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced. | 08-05-2010 |
20100209619 | Printed wiring board and method for manufacturing the same - A method for manufacturing a printed wiring board having one or more layers of a conductive pattern and an insulating pattern, including forming an insulating pattern on an insulating substrate; semi-hardening at least one of the insulating substrate and the insulating pattern; forming a conductive pattern on the insulating substrate and/or the insulating pattern, thereby providing a stack structure; performing a thermal treatment on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern; and firing the conductive pattern. In the method, the conductive pattern and the insulating pattern are simultaneously formed on the same layer using an inkjet process. | 08-19-2010 |
20100283820 | Inkjet head assembly - There is provided an inkjet head assembly. The inkjet head assembly includes an ink tank including a first storage part receiving ink, and a second storage part communicating with the first storage part through at least one through hole and maintaining a full ink level upon receiving ink from the first storage part, and an inkjet head connected to the second storage part by an ink supply path and ejecting ink upon receiving ink from the second storage part. The inkjet head assembly includes the ink tank supplying ink to the inkjet head and storing ink separately in the first storage part and the second storage part thereof, and the second storage part maintains a full ink level therein. Accordingly, deterioration in print quality can be minimized due to the second storage part attenuating pressure variations caused by ink movement when the inkjet assembly moves. | 11-11-2010 |
20110025794 | Inkjet head and inkjet head assembly - There is provided an inkjet head including an inkjet head plate slantedly coupled to a cartridge supplying ink; a nozzle ejecting ink moving through a path formed inside the inkjet head plate, and formed at a flattened edge of the inkjet head plate contacting a printing medium; and an actuator provided on a surface of the inkjet head plate opposite to that coupled to the cartridge and controlling the ejection of the ink. | 02-03-2011 |
20110032309 | Inkjet head, method of manufacturing the same, and electrical connection device therefor - An inkjet head according to an aspect of the invention may include: an inkjet head body having an ink chamber provided therein and an electrode portion provided on a surface thereof adjacent to the ink chamber; a piezoelectric actuator being mounted on the surface of the inkjet head body so that the piezoelectric actuator is electrically connected to the electrode portion; and a substrate being pressed using a bonding tool so that the substrate is electrically connected to the electrode portion and the piezoelectric actuator, arranged in different planes, through a conductive adhesive. | 02-10-2011 |
20110032314 | Inkjet head and method of manufacturing the same - An inkjet head according to an aspect of the invention may include: a manifold storing ink being injected from the outside; ink chambers receiving the ink from the manifold to eject the ink to the outside through nozzles; and a restrictor connecting the manifold and the ink chambers to each other and providing a plurality of interconnection paths. | 02-10-2011 |
20110043564 | Inkjet head and method of manufacturing the same - An inkjet head according to an aspect of the invention may include: a flow path plate having a plurality of ink chambers; a nozzle plate having a plurality of nozzles connected to the ink chambers in order to eject ink in the ink chambers to the outside; and a temperature control unit having a heat exchange passage in at least one of the flow path plate and the nozzle plate in order to control temperature of the ink. | 02-24-2011 |
20110057991 | Inkjet head and manufacturing method thereof - There is provided an inkjet head and a manufacturing method thereof. The inkjet head includes an upper substrate formed of a silicon material and having an ink chamber storing ink provided therein; an intermediate substrate bonded to the upper substrate, formed of a low temperature co-fired ceramic material, and having a connection path and a restrictor provided therein while the connection path and the restrictor are connected to the ink chamber; and a lower substrate bonded to the intermediate substrate, formed of a silicon material, and having a nozzle connected to the connection path provided therein. According to the inkjet head and the manufacturing method thereof, the densification and facilitation of bonding between substrates are achieved by using anodic bonding between a silicon substrate and a ceramic substrate, thereby improving manufacturing yield. | 03-10-2011 |
20110057995 | Inkjet head and inkjet head assembly having the same - There is provided an inkjet head and an inkjet head assembly having the same. The inkjet head includes an inkjet head plate having a plurality of nozzles ejecting ink provided therein; pressure chambers storing ink drawn in from both outer ends of the inkjet head plate in a width direction thereof and facing each other in a direction inwards of the width direction; piezoelectric elements supplying the pressure champers with driving force allowing ink to be ejected through the nozzles connected to the pressure chambers and disposed on the pressure chambers having membranes interposed therebetween; a pressure adjusting channel connecting the pressure chambers to adjust a pressure of ink ejected through the nozzles. | 03-10-2011 |
20110063360 | Inkjet print head and method of measuring temperature thereof - An inkjet print head includes a plurality of pressure chambers receiving and storing ink which is to be discharged to a nozzle, a piezoelectric body interposing a membrane with the pressure chamber, the piezoelectric body providing a driving force for discharging ink to each of the pressure chambers, and a measuring unit measuring capacitance of the piezoelectric body so that a temperature of ink being discharged to the nozzle is measured. | 03-17-2011 |
20110063368 | Multi inkjet head package, inkjet recording apparatus using the same, and method of aligning the same in inkjet recording apparatus - There is provided a multi inkjet head package. The multi inkjet head package may include: a plurality of inkjet head assemblies each having a head plate in which an inkjet head discharging ink is housed; a rack in which the head plate is housed so as to expose the inkjet head; and a preliminary fixation portion that is installed on the rack and allows the head plate to be preliminarily fixed to the rack. | 03-17-2011 |
20110065851 | Nonaqueous ink composition for ink jet and method of manufacturing ink comprising the same - A nonaqueous ink composition for an ink jet and a method of manufacturing ink comprising the same are provided. The nonaqueous ink composition for the ink jet includes: a glycol ether acetate solvent represented by a specific chemical formula; and a polypropylene glycol binder represented by a specific chemical formula. The nonaqueous ink composition for an ink jet has dynamic viscoelasticity obtained by a chemical interaction between the solvent and the binder, exhibits excellent print quality and is capable of high-speed printing. | 03-17-2011 |
20110102508 | Laminate substrate having bypass valve structure, inkjet print head and micro pump using the same - There is provided a laminate substrate having a bypass valve structure. The bypass valve structure formed in the laminate substrate includes a sloped path connecting a first straight path with a second straight path, and a bypass path connected with at least one of the first and second straight paths and configured as a curved path. | 05-05-2011 |
20110109702 | Inkjet head - There is provided an inkjet head. An inkjet head according to an aspect of the invention may include: a body having a nozzle in an outer surface thereof; a reservoir provided within the body and containing ink being externally injected; an ink chamber receiving the ink from the reservoir through a restrictor and ejecting the ink to an outside through the nozzle; and a reservoir actuator mounted on the body at a position corresponding to the reservoir and transmitting vibrations to the reservoir. | 05-12-2011 |
20110134182 | INKJET HEAD PACKAGE - There is provided an inkjet head package including: an ink head having an actuator mounted thereon and ejecting ink to the outside by a driving force of the actuator; an intermediate substrate disposed between the ink head and an ink storage supplying ink to the ink head, and having a socket provided on a surface thereof; and a lead frame provided on an upper surface of the ink head such that the intermediate substrate and the actuator are electrically connected to each other. | 06-09-2011 |
20110141199 | Inkjet head assembly - An inkjet head assembly includes: a tank head having an ink channel formed therein; an inkjet head disposed in the tank head to jet ink introduced through the ink channel; and a mass disposed on the inkjet head and applying a weight to control vibrations when ink is jetted from the inkjet head. | 06-16-2011 |
20110162181 | Device for polling piezoelectric element and polling method using the same - A device for polling a piezoelectric element includes: a polling chamber in which a plurality of piezoelectric elements are disposed; a power supply unit providing voltage to poll the piezoelectric elements; a capacitance measurement unit connected with the piezoelectric elements to measure the capacitance of the piezoelectric elements; and a switching system connected with the power supply unit and the piezoelectric elements within the polling chamber, and selectively providing the voltage of the power supply unit to the piezoelectric elements. | 07-07-2011 |
20110164087 | Apparatus for cleaning inkjet print head - An apparatus for cleaning an inkjet print head includes: a cleaning plate disposed to correspond to an inkjet print head with an ink flow space interposed therebetween; and a pneumatic device installed in the ink flow space and removing ink in a direction different from a direction in which ink is discharged by changing a fluid pressure of the ink remaining at a nozzle of the inkjet print head. | 07-07-2011 |
20110181668 | Inkjet print head and manufacturing method thereof - There is provided an inkjet print head including: a body portion including a nozzle ejecting ink, an ink chamber connected to the nozzle so as to supply the ink to the nozzle, and a vibration plate transferring vibrations to the ink chamber and formed of an elastomer; an actuator mounted on the body portion in order to be arranged to correspond to the ink chamber and generating the vibrations transferred to the ink chamber; and a buffer layer allowing for an electrical connection with the actuator and having a Young's modulus greater than that of the body portion. | 07-28-2011 |
20110181674 | Inkjet print head - There is provided an inkjet print head including: a reservoir storing a first ink drawn in through an ink inlet; a pressure chamber storing the first ink drawn in from the reservoir and transferring the first ink to a nozzle by a driving force of an actuator; and a damper disposed between the pressure chamber and the nozzle and allowing the first ink to be mixed with a second ink drawn through an ink flow path for the second ink. | 07-28-2011 |
20110193913 | Inkjet head cleaning apparatus - There is provided an inkjet head cleaning apparatus including: an air blowing unit spaced apart from a nozzle ejecting ink at a predetermined distance and blowing air toward the nozzle; a blocking surface disposed to face the air blowing unit and blocking ink being removed from the nozzle due to the air released by the air blowing unit; a rebound blocking unit disposed between the blocking surface and the nozzle and blocking ink droplets being rebounded farther than a predetermined distance from the blocking surface among the ink blocked by the blocking surface; and a storage unit receiving the removed ink. | 08-11-2011 |
20110193915 | Piezoelectric actuator, inkjet head including the same, and method of manufacturing piezoelectric actuator - A piezoelectric actuator according to an aspect of the invention may include: upper and lower electrodes supplying a driving voltage; and a piezoelectric material formed by solidifying a piezoelectric liquid having viscosity between the upper and lower electrodes and providing a driving force to ink inside an ink chamber of an inkjet head. | 08-11-2011 |
20110205301 | Inkjet head - There is provided an inkjet head including: a body portion ejecting ink therein by a driving of an actuator; and a rigidity reinforcing portion coupled to an outer surface of the body portion and reducing deformation of the body portion during the ejecting of the ink. | 08-25-2011 |
20110205313 | Inkjet print head and method of manufacturing the same - There is provided an inkjet print head including: a pressure chamber storing ink in order to eject the ink to a nozzle; a piezoelectric actuator receiving part being recessed in order to correspond to the pressure chamber in a direction of the pressure chamber; and a piezoelectric actuator received in the piezoelectric actuator receiving part, in which viscous liquid having piezoelectric properties is filled and hardened, and supplying the pressure chamber with a driving force for ejection of the ink. | 08-25-2011 |
20110232089 | Method of manufacturing inkjet print head - There is provided a method of manufacturing an inkjet print head. The method includes providing a head portion having a dummy portion disposed on a surface of a pressure area pressurizing an ink chamber, a nozzle connected to the ink chamber for ink ejection and the ink chamber for ink supply to the nozzle, and removing the dummy portion. The method allows for the improvement of ink ejection and nozzle density. Also, the method allows for the forming of a thin-type head portion using the dummy portion. | 09-29-2011 |
20110234657 | Inkjet head assembly - There is provided an inkjet head assembly that can readily store ink by separating a passage for transferring ink from a passage for transferring ink between a first storage unit and a second storage unit inside an ink tank. An inkjet head assembly according to an aspect of the invention may include: an ink tank including a first storage unit receiving ink therein and a second storage unit receiving the ink from the first storage unit to maintain a full ink level within the ink, and having an ink transfer hole, through which the ink is supplied from the first storage unit to the second storage ink, and an air transfer hole, through which air from the second storage unit is transmitted to the first storage unit, between the first and second storage units; and an inkjet head connected to the second storage unit via an ink supply passage, the inkjet head receiving the ink from the second storage unit to eject the ink. | 09-29-2011 |
20110234712 | Inkjet head assembly - Provided is an inkjet head assembly capable of reducing the generation of air bubbles during ink injection by using a guide formed inside an ink tank. The inkjet head assembly includes an ink tank including an ink inlet through which ink is injected from the outside, and storing ink injected through the ink inlet, an inkjet head connected with the ink tank through an ink supply channel, receiving ink from the ink tank and discharging the received ink, and a guide disposed inside the ink tank and guiding ink, injected through the ink inlet, to an inner surface of the ink tank. | 09-29-2011 |
20110254900 | Inkjet head assembly and method for manufacturing the same - There is provided an inkjet head assembly that includes: an inkjet head plate including an ink path; a piezoelectric actuator facing a pressure chamber in the inkjet head plate and providing driving force for ejecting ink to a nozzle from the pressure chamber; a package part stacked on the inkjet head plate and including a path moving ink introduced from the outside to an inlet of the inkjet head plate; and an electrical connector filling a via penetrating the package part and electrically connected with the piezoelectric actuator. | 10-20-2011 |
20110265297 | Method of manufacturing inkjet head - There is provided a method of manufacturing an inkjet head. A method of manufacturing an inkjet head according to an aspect of the invention may include: forming a piezoelectric actuator on a dummy substrate; cutting the piezoelectric actuator into head cell units of an inkjet head; preparing an inkjet head substrate including an ink chamber formed at a position corresponding to the piezoelectric actuator; bonding the dummy substrate and the inkjet head substrate to each other so that the piezoelectric actuator and the ink chamber correspond to each other; and removing the dummy substrate. | 11-03-2011 |
20110285782 | Apparatus for cleaning inkjet print head and inkjet printer having the same - There is provided an apparatus for cleaning an inkjet print head and an inkjet printer having the same. The apparatus for cleaning the inkjet print head includes a cleaning plate spaced apart from the inkjet print head with a cleaning area interposed therebetween, the inkjet print head ejecting ink through a nozzle; an electrode part allowing residual ink remaining at an end portion of the nozzle to be moved outwardly of the cleaning plate; and a power supply part electrically connecting the inkjet print head to the electrode part. | 11-24-2011 |
20120008287 | Electronic component module and method of manufacturing the same - Disclosed are an electronic component module and a method of manufacturing the same. The electronic component module includes a first insulating layer having a first surface in which first circuit patterns are embedded, electronic components of different kinds, the electronic components being mounted on the first circuit patterns and having electrode parts placed in different locations, and a molding layer encompassing the electronic components. Accordingly, a thin-film type electronic component module having a thin insulating layer with a circuit pattern can be provided. | 01-12-2012 |
20120024088 | Dissolution properties measurement system using piezoelectric sensor - There is provided a dissolution properties measurement system using a piezoelectric sensor, capable of continuously measuring dissolution properties of a substrate in an aqueous solution by using the piezoelectric sensor. The dissolution properties measurement system includes: a specimen receiving unit including a chamber receiving a specimen therein; a mass measuring unit connected with the specimen to measure a mass change of the specimen in real time; and a dissolution properties measuring unit measuring a dissolution properties of the specimen on the basis of the value measured by the mass measuring unit. | 02-02-2012 |
20120026248 | Inkjet head assembly and method for manufacturing the same - There are provided an inkjet head assembly and a method for manufacturing the same. The inkjet head assembly includes: an inkjet head plate having an ink flow passage formed therein and having an actuator formed thereon, the actuator providing driving force for discharging ink; a flexible printed circuit board (FPCB) applying voltage to the actuator; and an intermediate substrate provided so as to electrically connect the actuator to the flexible printed circuit board and having a second bonding portion bonded to the flexible printed circuit board formed inwardly of a first bonding portion, bonded to the actuator in a width direction of the inkjet head plate. | 02-02-2012 |
20120105543 | Inkjet head package, apparatus and method for assembling the same - There are provided an inkjet head package, an apparatus and a method for assembling the same. The inkjet head package may include a plurality of inkjet heads each having an ink channel so as to eject ink through a plurality of nozzles formed on one surface thereof, and a frame having one surface to which another surface of the plurality of inkjet heads is fixed while facing the one surface thereof, the frame including an opening for exposing a portion of the another surface disposed therein. | 05-03-2012 |
20130292164 | RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a rigid-flexible substrate including: a rigid area including a circuit layer; a flexible area formed at one end of the rigid area; and a raw material formed over the flexible area and having indentation formed on a surface thereof. | 11-07-2013 |