Jae-Sik
Jae Sik Choi, Suwon-Si KR
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20110127247 | PRE-HEATER APPARATUS FOR VEHICLE - A pre-heater apparatus for a vehicle includes a heat sink having a plurality of radiating fins which are layered, a Positive Temperature Coefficient (PTC) assembly inserted into the heat sink to be assembled therewith, and a housing. The pre-heater apparatus is mounted to a duct which is adjacent to a discharge duct, thus improving the performance of heating an interior when the vehicle is initially starting, and improving heat efficiency. | 06-02-2011 |
Jae Sik Choi, Daejeon KR
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20140157391 | SECURITY CERTIFICATION AND STORAGE COMBINED APPARATUS HAVING WIRELESS COMMUNICATION FUNCTION - A security certification and storage combined apparatus provides a wireless communication function in that it can provide a function of a security certification and a function of a storage device through a general terminal having an USB communication function and a mobile device, which is not equipped with an USB port, and it can exchange data with the mobile device or change the data received from the mobile device through a wireless communication module, thereby easily implementing the certificate verification interface. | 06-05-2014 |
20150127942 | SECURITY KEY DEVICE FOR SECURE CLOUD SERVICE, AND SYSTEM AND METHOD FOR PROVIDING SECURE CLOUD SERVICE - Provided are a security key device for a cloud service, and a system and a method for providing a secure cloud service. The security key device includes: an interface unit detachably connected to a user terminal, and providing an interface with the user terminal; a storage unit storing an encoded user file; and an encoding/decoding transformation supporting controller that, when receiving from the user terminal a file to upload to a cloud server, encodes the file, stores the encoded file in the storage unit, and then transmits the encoded file to the user terminal, and when receiving from the user terminal an encoded file downloaded from the cloud server, stores the encoded file in the storage unit, decodes the encoded file, and transmits the decoded file to the user terminal. | 05-07-2015 |
Jae Sik Choi, Woluwe-St-Pierre BE
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20110027740 | Method for Heating a SCR System - Process for heating a urea component of a SCR system comprising besides said component, a temperature sensor, a heating device in the component, according to which: 1. the temperature (Tcpt) of the liquid in the component is determined and compared to a 1 | 02-03-2011 |
Jae Sik Choi, Gyeonggi-Do KR
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20100018229 | METHOD FOR CONTROLLING INTAKE OF AIR-CONDITIONER OF VEHICLE - A method for controlling an intake of an air-conditioner of a vehicle is disclosed. The method includes the a-1) step (S | 01-28-2010 |
Jae Sik Choi, Hoeilaart BE
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20130125531 | RESERVOIR AND TANK EQUIPPED WITH A SELF-REGULATING HEATING ELEMENT - A reservoir for holding a quantity of fluid within a tank, the reservoir including a first resistive element for heating a first part of the tank and a second resistive element for heating a second part of the tank, the second resistive element having a positive temperature coefficient. The reservoir further includes a third resistive element for heating the second part of the tank, the second resistive element and the third resistive element forming a parallel circuit, and the first resistive element being connected in series with the parallel circuit. | 05-23-2013 |
20130298385 | METHOD FOR MANUFACTURING A FLEXIBLE HEATER - Method for manufacturing a flexible heater comprising a resistive track enclosed in two sheets of electrically insulating plastic material, said track comprising electrical connections to which electrical wires are connected, the method comprising the steps of: —enclosing the resistive track in the two sheets of electrically insulating plastic material—connecting the electrical wires to the electrical connections of the resistive track—putting an open mould around the connection area—injecting a liquid casting formulation into said mould—curing said composition—removing the mould. | 11-14-2013 |
20130334077 | ENGINE EXHAUST GAS ADDITIVE STORAGE SYSTEM - A system for storing an internal combustion engine exhaust gas liquid additive, and including a tank for storing the additive, the tank including two halve shells manufactured as two separate parts that are assembled, at least one of the shells including an active component fixed inside of it. | 12-19-2013 |
Jae Sik Chung, Seoul KR
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20100081015 | INTEGRAL CAP ASSEMBLY HAVING PROTECTIVE CIRCUIT MODULE, AND SECONDARY BATTERY COMPRISING THE SAME - An integral cap assembly comprising a top cap mounted as a base plate to an opening of a battery can and a cap subassembly including a protective circuit module and the like integrally mounted on the top cap, a method for manufacturing a secondary battery comprising the same, and a secondary battery manufactured thereby are disclosed. The cap assembly is provided as an integral member comprising the top cap acting as the base plate, and the cap subassembly having the protective circuit module provided thereon, thereby simplifying a manufacturing process of the battery while minimizing frequency of defective products. Additionally, the integral cap assembly is manufactured through insert injection molding, thereby providing notable advantages over the conventional technology. | 04-01-2010 |
20100304190 | BATTERY HAVING A/S LABEL AND METHOD FOR PRODUCING THE SAME - Disclosed is a battery in which an A/S label is disposed in a plastic member of the battery and a method for manufacturing the same. According to the present invention, the A/S label is prevented from being separated and disappeared and from being exchanged or modified arbitrarily by a battery user. | 12-02-2010 |
20110177363 | INTEGRAL CAP ASSEMBLY HAVING PROTECTIVE CIRCUIT MODULE, AND SECONDARY BATTERY COMPRISING THE SAME - An integral cap assembly comprising a top cap mounted as a base plate to an opening of a battery can and a cap subassembly including a protective circuit module and the like integrally mounted on the top cap, a method for manufacturing a secondary battery comprising the same, and a secondary battery manufactured thereby are disclosed. The cap assembly is provided as an integral member comprising the top cap acting as the base plate, and the cap subassembly having the protective circuit module provided thereon, thereby simplifying a manufacturing process of the battery while minimizing frequency of defective products. Additionally, the integral cap assembly is manufactured through insert injection molding, thereby providing notable advantages over the conventional technology. | 07-21-2011 |
Jae Sik Jung, Seoul KR
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20110218681 | AIR CONDITIONING SYSTEM AND METHOD OF CONTROLLING THE SAME - An air conditioning system and a method of controlling the same are provided. The air conditioning system may include at least one outdoor device, at least one indoor device connected to the at least outdoor device, voltage and current sensors installed in the at least one outdoor device, and a control device installed at or in the at least outdoor device, that collects operating information of the at least outdoor device and the at least one indoor device and calculates power consumption of the air conditioning system based on operating information, and voltage and current information. In such an air conditioning system, power consumption of the air conditioning system may be calculated via estimation using current and voltage values obtained by the current and voltage sensors and operating information of the at least one indoor device, whereby costs associated with installation of an additional power distribution device may be eliminated. | 09-08-2011 |
Jae Sik Jung, Geumcheon-Gu KR
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20110218682 | AIR CONDITIONER SYSTEM AND METHOD FOR CONTROLLING THE SAME - The present invention relates to a system for controlling an air conditioner and method for controlling the same, and more particularly, to a system for controlling an air conditioner and method for controlling the same which can make real time control for maintaining system reliability, can make real time control of air conditioners while minimizing a network load to minimize a load on a server, and can prevent transmission and reception delay of a data. | 09-08-2011 |
20130060386 | AIR CONDITIONING SYSTEM AND CONTROLLING METHOD THEREOF - An air conditioning system and a controlling method of the same are disclosed. A controlling method of an air conditioning system includes an information collecting step configured to collect the state information or the operation information of the outdoor unit or the indoor unit in a preset period by using the gateway ( | 03-07-2013 |
Jae Sik Kim, Yongin-City KR
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20140203275 | THIN-FILM TRANSISTOR AND DISPLAY DEVICE HAVING THE SAME - A thin-film transistor includes a substrate, a gate electrode formed over the substrate, a gate insulating layer formed over the gate electrode and the substrate, an oxide semiconductor layer formed over the gate insulating layer and comprising a source section and a drain section, a first electrode formed over the substrate and electrically connected to the source section, and a second electrode formed over the substrate and electrically connected to the drain section. The thin-film transistor further includes a first barrier layer disposed between the oxide semiconductor layer and the first electrode, a second barrier layer disposed between the first barrier layer and the first electrode, and the first electrode being electrically connected to the oxide semiconductor layer via the first barrier layer and the second barrier layer. | 07-24-2014 |
20150372259 | THERMAL TREATMENT DEVICE FOR DISPLAY APPARATUS AND THERMAL TREATMENT METHOD USING THE SAME - A thermal treatment method for a display apparatus includes providing an acceptor substrate on a substrate stage, providing on the acceptor substrate a pattern mask including a transfer layer, irradiating a flash light beam onto the pattern mask from a plurality of flash lamps, and transferring the transfer layer to the acceptor substrate. The plurality of flash lamps are symmetrically provided with respect to the acceptor substrate and are configured to irradiate flash light beams. | 12-24-2015 |
Jae Sik Lee, San Diego, CA US
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20140252561 | VIA-ENABLED PACKAGE-ON-PACKAGE - A via-enabled package-on-package circuit includes a first package including a first package die having a plurality of through substrate vias (TSVs). The TSVs are configured to carry the input/output signaling for at least one second package die. | 09-11-2014 |
20150228556 | INTEGRATED DEVICE COMPRISING VIA WITH SIDE BARRIER LAYER TRAVERSING ENCAPSULATION LAYER - Some novel features pertain to an integrated device that includes an encapsulation layer, a via structure traversing the encapsulation layer, and a pad. The via structure includes a via that includes a first side, a second side, and a third side. The via structure also includes a barrier layer surrounding at least the first side and the third side of the via. The pad is directly coupled to the barrier layer of the via structure. In some implementations, the integrated device includes a first dielectric layer coupled to a first surface of the encapsulation layer. In some implementations, the integrated device includes a substrate coupled to a first surface of the encapsulation layer. In some implementations, the integrated device includes a first die coupled to the substrate, where the encapsulation layer encapsulates the first die. In some implementations, the via includes a portion configured to operate as a pad. | 08-13-2015 |
20150255416 | INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS AND REDISTRIBUTION LAYERS - Some novel features pertain to an integrated device (e.g., integrated package) that includes a base portion for the integrated device, a first die coupled to a first surface of the base portion, and an underfill between the first die and the base portion. The base portion includes a dielectric layer, and a set of redistribution metal layers. In some implementations, the integrated device further includes an encapsulation material that encapsulates the first die. In some implementations, the integrated device further includes a second die coupled to the first surface of the base portion. In some implementations, the integrated device further includes a set of interconnects on the base portion, the set of interconnects electrically coupling the first die and the second die. In some implementations, the first die includes a first set of interconnect pillars and the second die includes a second set of interconnect pillars. | 09-10-2015 |
20150257282 | SUBSTRATE WITH CONDUCTIVE VIAS - A substrate includes a plurality of vias that are lined with dielectric polymer having a substantially uniform thickness. This substantial uniform thickness provides a lumen within each dielectric-polymer-layer-lined via that is substantially centered within the via. Subsequent deposition of metal into the lumen for each dielectric-polymer-layer-lined via thus provides conductive vias having substantially centered metal conductors. | 09-10-2015 |
20150294933 | PATTERN BETWEEN PATTERN FOR LOW PROFILE SUBSTRATE - An integrated circuit (IC) substrate that includes a second patterned metal layer formed in between a first patterned metal layer is disclosed. A dielectric layer formed on the first patterned metal layer separates the two metal layers. A non-conductive layer is formed on the dielectric layer and the second patterned metal layer. | 10-15-2015 |
20150318262 | INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANIC LAYERS AND REDISTRIBUTION LAYERS IN ORGANIC LAYERS - Some novel features pertain to an integrated device (e.g., integrated package) that includes a base portion for the integrated device, a first die (e.g., first wafer level die), and a second die (e.g., second wafer level die). The base portion includes a first inorganic dielectric layer, a first set of interconnects located in the first inorganic dielectric layer, a second dielectric layer different from the first inorganic dielectric layer, and a set of redistribution metal layers in the second dielectric layer. The first die is coupled to a first surface of the base portion. The second die is coupled to the first surface of the base portion, the second die is electrically coupled to the first die through the first set of interconnects. | 11-05-2015 |
20150325509 | SUBSTRATE BLOCK FOR PoP PACKAGE - A substrate block is provided that has an increased width. The substrate block comprises two substrate bars, and the substrate bars each comprise a substrate and a plurality of filled vias through the substrate. The substrate block may be used to manufacture package substrates, and these package substrate may be incorporated into a PoP structure. The package substrate includes a carrier having a plurality of vertical interconnections and a bar coupled to the vertical interconnections. | 11-12-2015 |
20160035664 | SEMICONDUCTOR PACKAGE ON PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A package on package structure may be formed by fabricating or providing a bottom package having a substrate, at least one die on top of the substrate, and bonding pads on the top of the substrate. Next, a frame is formed on the bonding pads and connected to the bonding pads. Next, a package material is molded over the top of the substrate to encapsulate the frame, the die, and the pads or substantially encapsulates these components. Next, a portion of the molded package material is removed to expose at least a portion of the frame. The exposed frame portions are formed such that a desired fan in or fan out configuration is obtained. Next, a non-conductive layer is formed on the exposed frame. Last, a second package having a die or chip is connected to the exposed portion of the frame to form a package on package structure. | 02-04-2016 |
Jae Sik Lee, Tongyoung KR
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20120261350 | Method for Using Air to Remove Precipitated Contaminating Oil - The present invention relates to a method of removing deposited pollutant oil using air, and more particularly to a method of removing pollutant oil, which comprises injecting compressed air when oil has been deposited at the bottom of the sea, and injecting compressed air while supplying water when oil has been deposited on water-free sand, rock or soil, thereby degassing the oil while floating the remaining degassed oil on the water surface. More specifically, the method: introducing an air jet at the bottom below the water surface; injecting compressed air from the air jet, thereby raising water and sand or soil together with the compressed water, discharging gas by the kinetic energy of air bubbles caused by the compressed air flow to degas oil, and floating the degassed oil on the water surface; and removing the floated oil. | 10-18-2012 |
20120263607 | AIR JET FOR REMOVING POLLUTING OIL - The present invention relates to an air jet for removing pollutant oil, and more particularly to an air jet capable of removing oil deposited on a small mud flat, sand or sedimentary soil in a coastal or inland area by injecting compressed air to float the oil on the water surface together with gas discharge. The air jet comprises: a hollow cylindrical air pipe open at both ends, the air pipe serving as a channel through which injected compressed air moves; a communication pipe having a diameter smaller than that of the air pipe and penetrating the air pipe to communicate the inside and outside of the air pipe, the outside of the air pipe being connected with an air hose for supplying compressed air; and an injection nozzle coupled with the communication pipe in the air pipe, the injection nozzle serving to accelerate compressed air supplied to the communication pipe and to rapidly inject the compressed air through the air pipe to an area polluted with oil. | 10-18-2012 |
Jae Sik Min, Anyang-City KR
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20140084321 | PACKAGE FOR LIGHT-EMITTING DEVICE - The present invention provides a package for a light-emitting device, including the light-emitting device configured to provide light having a specific wavelength region, electrode pads formed on the light-emitting device, and a phosphor layer formed over the light-emitting device other than regions where the electrode pads are formed and configured to convert the light of the light-emitting device into white light by changing the wavelength of the light provided by the light-emitting device, wherein the phosphor layer is formed in a conformable thickness and is formed in a region wider than an upper region of the light-emitting device other than the regions where the electrode pads are formed. | 03-27-2014 |
20140170788 | METHOD OF MANUFACTURING PHOSPHOR FOR LIGHT-EMITTING DIODE - The present invention provides a method of manufacturing a phosphor for a light-emitting diode, including filling a phosphor frame in which phosphor models are formed in an engraving form with a fluorescent material solution including a fluorescent material that converts light provided by the light-emitting diode into white light by changing a wavelength of the light provided by the light-emitting diode, polishing a top surface of the phosphor frame filled with the fluorescent material solution, and drying the phosphor frame filled with the fluorescent material solution and polished. | 06-19-2014 |
20140367548 | APPARATUS FOR MANUFACTURING FLUORESCENT LAYERS - The present invention relates to an apparatus for manufacturing fluorescent layers and, more particularly, to an apparatus for manufacturing fluorescent layers, which converts light from a light-emitting diode into white light by varying a wavelength of the light emitted from the light-emitting diode. The present invention provides the apparatus for manufacturing fluorescent layers includes a vertical frame and a fluorescent layer pattern hole formed in a direction vertical to the vertical frame in a fluorescent layer pattern form within the vertical frame. | 12-18-2014 |
20150093843 | METHOD OF DISPOSING PHOSPHOR LAYERS - Disclosed herein is a method of disposing phosphor layers, which can prevent damage to phosphors and also effectively dispose phosphor layers at desired locations of Light-Emitting Diodes (LEDs) when the phosphor layers are detached and disposed at the top surfaces of the LEDs. According to an embodiment, phosphor layers fabricated by filling phosphor layer pattern holes within an area of the vertical frame with a phosphor solution are detached from the phosphor layer pattern holes by applying force downwardly or upwardly in a vertical manner. | 04-02-2015 |
20150311408 | LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a light-emitting diode (LED) package in accordance with an embodiment of the present invention, which includes an LED configured to provide light of a wavelength having a specific region, a circuit board electrically connected to the LED through bonding pads formed at the bottom of the LED, a phosphor layer formed as a cap, disposed to surround sides and a top of the LED, and configured to have sides and top thereof formed to a uniform thickness, and a buffer layer disposed between the top of the LED and a bottom of the phosphor layer and configured to suppress heat, generated from the top of the LED, from being transferred to the bottom of the phosphor layer and to prevent a bottom of the phosphor layer from being deviated from the top of the LED. | 10-29-2015 |
Jae Sik Park, Gyeonggi-Do KR
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20140187380 | TORQUE ASSIST SYSTEM AND AUTOMATED MANUAL TRANSMISSION UTILIZING THE SAME - The torque assist system of the present invention includes a torque assist shaft having a first terminating part connected to the input shaft, an outer shaft and an inner shaft rotating independently from the outer shaft; a planetary gear set mounted on the inner shaft exposed to a second terminating part of the torque assist shaft; a clutch being disposed adjacent to the planetary gear set and operated by an external force; and an input gear mounted on the exposed inner shaft of the torque assist shaft and connected to the planetary gear set by the clutch to transmit power to an output gear mounted on the output shaft of the vehicle transmission. | 07-03-2014 |
Jae Sik Park, Gwangju KR
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20130328192 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - One embodiment provides a semiconductor package by forming a redistribution layer extending from a bonding pad of a semiconductor chip using a photoresist pattern plated with the seed layer. Fabrication of the semiconductor package is relatively simple thereby shortening a manufacturing time and reducing the manufacturing cost, and which can increase an adhered area of input/output terminals and can prevent delamination by connecting and welding the input/output terminals to a pair of redistribution layers. | 12-12-2013 |
Jae Sik Seo, Seoul KR
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20150231941 | BUMPER STOPPER INTEGRATED WITH DUST COVER - An integrated bumper stopper may include a dust cover and a bumper stopper constituting a shock absorber of a vehicle. The bumper stopper may be formed on an upper portion of the dust cover and continuously extend from the upper portion of the dust cover. The dust cover and the bumper stopper may be integrally molded by using a material comprising a thermoplastic ether ester (TPEE) elastomer. | 08-20-2015 |
Jae Sik Shin, Seoul KR
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20160040168 | Composition for Treatment or Metastasis Suppression of Cancers Which Includes P34 Expression Inhibitor or Activity Inhibitor as Active Ingredient - The present invention relates to a composition for treatment or metastasis suppression of cancers which includes a p34 expression inhibitor or activity inhibitor as an active ingredient. According to the present invention, the p34 protein knock-down causes monoubiquitination of PTEN and accordingly nuclear localization of PTEN is induced, as a result, an Akt pathway which is related to survival, proliferation, invasive properties and metastatic properties of tumors is inhibited, and thus there is an effect of significantly reducing clonogenic potential and tumor forming potential of various cancer cells which simultaneously express PTEN and NEDD4-1. Consequently, the p34 gene expression inhibitor or p34 protein activity inhibitor according to the present invention can be effectively used as a treatment agent or a metastasis suppression agent for cancers. | 02-11-2016 |
Jae Sik Yoon, Daejeon KR
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20140127547 | LITHIUM ION SECONDARY BATTERY WITHOUT INTERNAL SHORT - A lithium ion secondary battery including a compound containing at least one thiol group (—SH) in a molecule in a unit cell of the battery is provided. By including the compound containing thiol group (—SH) having good reactivity with copper or copper ions, the formation of dendrite through the reduction of copper ions present in the inner portion of the battery or produced during operating the battery at the surface of an anode may be prevented. The internal short between two electrodes due to the dendrite may be also prevented. | 05-08-2014 |
20140356674 | ANODE FOR LITHIUM SECONDARY BATTERY AND LITHIUM ION SECONDARY BATTERY INCLUDING THE SAME - Provided are an anode for a secondary battery including an anode collector, an anode active material coated on the anode collector, and a non-coating portion (anode tab) which protrudes from one side of the anode collector and is not coated with an anode active material, wherein the anode includes a metal member which is bonded to the non-coating portion and has higher reactivity or reducibility with respect to a metal oxide than the anode collector, and a secondary battery including the anode. | 12-04-2014 |
Jae Sik Yun, Gyeongsangnam-Do KR
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20150036938 | METHOD FOR RECOGNIZING OBJECT USING COVARIANCE DESCRIPTOR AND APPARATUS THEREOF - Disclosed are object recognizing method and apparatus. The method may comprise extracting a feature point of an object to be recognized in an input image; generating a plurality of feature images by extracting orientation information of a region adjacent to the feature point and normalizing the region based in the orientation information; deriving a covariance descriptor based on the feature images; and recognizing the object in the input image by comparing the covariance descriptor with a reference covariance descriptor stored in advance. Thus, the object can be recognized fast and robustly to changes on the size of the input image, rotations of the input image, and illumination, whereby the recognition performance can be enhanced. | 02-05-2015 |
Jae-Sik Bae, Osan-Si KR
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20150340445 | SUBSTRATE STRUCTURE AND SEMICONDUCTOR DEVICE ON THE SUBSTRATE STRUCTURE - A substrate structure include a lower substrate doped with n-type impurities having a first impurity concentration, an epitaxial layer on the lower substrate, and a metallic-contaminant collection area spaced apart from the epitaxial layer in the lower substrate, the metallic-contaminant collection area doped with impurities having a second impurity concentration higher than the first impurity concentration, the metallic-contaminant collection area having lattice defects, and an upper surface of the metallic-contaminant collection area being spaced apart from a top surface of the lower substrate at a distance in a range of about 0.1 μm to about 3 μm. | 11-26-2015 |
Jae-Sik Chung, Asan-Si KR
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20090209063 | Chipstack package and manufacturing method thereof - A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages. | 08-20-2009 |
20110237004 | CHIPSTACK PACKAGE AND MANUFACTURING METHOD THEREOF - A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages. | 09-29-2011 |
Jae-Sik Hwang, Gyeonggi-Do KR
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20090217331 | EFFICIENT NVOD SERVICE METHOD FOR VARIOUS CLIENT ENVIRONMENTS AND APPARATUS THERE-FOR - An efficient near video on demand (NVOD) service for various client environments is provided. The NVOD service method for transmitting video data including moving pictures to a plurality of clients in a network includes identifying a relative network bandwidth “m” of a client with respect to a video playout bandwidth, dividing the video data into data segments having different sizes according to the relative network bandwidth “m” and transmitting the data segments to the client through a plurality of channels. | 08-27-2009 |
Jae-Sik Jo, Daegu KR
Jae-Sik Kim, Hwaseong-Si KR
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20150102317 | THIN FILM TRANSISTOR SUBSTRATES, DISPLAY DEVICES AND METHODS OF MANUFACTURING DISPLAY DEVICES - A thin film transistor substrate may include a gate electrode on a base substrate, a gate insulation layer covering the gate electrode on the base substrate, an active pattern on the gate insulation layer, an etch-stop layer pattern partially exposing the active pattern, a source electrode and a drain electrode in contact with a portion of the exposed active pattern, and an inorganic barrier layer on the source electrode, the drain electrode, and the etch-stop layer pattern. The active pattern may be superimposed over the gate electrode. The source electrode and the drain electrode may be superimposed over both ends of the gate electrode. The inorganic barrier layer may be in contact with a remaining portion of the exposed active pattern. | 04-16-2015 |
20150144952 | DISPLAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE INCLUDING THE SAME - A display substrate, method of manufacturing the same, and a display device including the same are disclosed. In one aspect, a display substrate includes a first gate electrode formed on a base substrate, a scan line electrically connected to the first gate electrode, a gate insulation layer, an etch stop layer and a passivation layer formed on the base substrate to at least partially overlap the first gate electrode and the scan line, and a data line formed on the passivation layer to at least partially overlap the scan line. | 05-28-2015 |
20150270486 | MASK FOR FORMING ORGANIC LAYER PATTERN, FORMING METHOD OF ORGANIC LAYER PATTERN, AND MANUFACTURING METHOD OF ORGANIC LIGHT EMITTING DIODE DISPLAY USING THE SAME - A mask for forming an organic layer pattern, the mask including a photomask having a first substrate and a reflecting layer on the first substrate; and a donor substrate on the photomask and separated therefrom, the donor substrate including a second substrate and an absorption part on the second substrate, wherein the photomask comprises a reflecting part configured to reflect light incident to the photomask and a light concentrating part configured to concentrate the light and transmit the light to the donor substrate. | 09-24-2015 |
Jae-Sik Kim, Kyungnam KR
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20080263921 | Multi Function Signs - Disclosed herein is a multifunctional signboard having a window function. The signboard is constructed so that a film ( | 10-30-2008 |
20100101125 | Multipurpose Advertisement Board - Disclosed is a multipurpose advertisement board having a film between glass plates of a double glazed window, wherein pieces of steel wire are provided to respective ends of the film and the pieces of steel wire can be wound around winding rollers, so that the multipurpose advertisement board can display a variety of patterns printed on the film, and also can act as a normal glass window. The multipurpose advertisement board includes a double glazed window that includes two or more glass plates, a film moving in the space of the double glazed window, an upper winding roller and a lower winding roller installed at the upper and lower portions of the double glazed window for winding the film, pieces of steel wire connected to the left and right ends of the film, and steel wire winding grooves provided to the upper and lower winding rollers. | 04-29-2010 |
Jae-Sik Kim, Yongin-Si KR
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20150190999 | FILM FOR DISPLAY WINDOW, METHOD OF MANUFACTURING THE SAME, DISPLAY WINDOW HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME - A film for a display window using a roll to roll method and a method of manufacturing the same includes forming a bonding layer or a release layer on a fabric film using a roll to roll method, and forming a decorative layer having a pattern or a color on the bonding layer or the release layer using the roll to roll method. When the film is manufactured by the roll to roll process, it is possible to improve productivity and reduce a unit price. | 07-09-2015 |
Jae-Sik Ryu, Jeonbuk KR
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20130299121 | POLYMER COMPOSITE MATERIALS FOR BUILDING AIR CONDITIONING OR DEHUMIDIFICATION AND PREPARATION METHOD THEREOF - The present disclosure relates to the preparation of a polymer composite material for building air conditioning or dehumidification having superior water-adsorbing ability, durability and antibacterial properties by electro spinning. Specifically, the disclosed method for preparing a polymer composite material for building air conditioning or dehumidification includes: (S1) adding a crosslinking agent or a crosslinking agent and a porous filler for conferring durability and antibacterial properties into a hydrophilic polymer solution antibacterial properties to prepare a polymer composite material solution; (S2) electrospinning the polymer composite material solution to prepare a nanofiber sheet; and (S3) crosslinking the nanofiber sheet by heat-treatment. Since the disclosed polymer composite material for building air conditioning or dehumidification has superior antibacterial properties and excellent water-adsorbing ability and durability, the polymer composite material can perform dehumidification when used for air conditioning of a building, thereby reducing air conditioning load and improving energy efficiency. Further, through dehumidifying cooling, the high-efficiency polymer composite material can remove moisture from the hot and humid air in the summer, thus reducing air conditioning load by decreasing latent heat load and saving energy. In addition, the polymer composite material can be used in moisture-sensitive production processes, industrial applications requiring moisture control or protection from damage or corrosion by moisture to reduce moisture and provide dry air. | 11-14-2013 |
Jae-Sik Son, Incheon KR
Patent application number | Description | Published |
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20110051897 | Liquid Target Producing Device Being Able to use Multiple Capillary Tube And X-Ray and EUV Light Source Device with the Same - A liquid target producing device to which multiple capillary tubes are mountable includes a capillary tube for injecting a liquid target in a jet form; a gas storage tank connected to the capillary tube through a gas line to store a gas to be supplied to the capillary tube; a metal jacket positioned at an outer circumference of the capillary tube such that a plurality of capillary tubes are installable thereto, the metal jacket liquefying the gas supplied through the gas line; a cryo-cooler connected to the metal jacket through a thermal conductive wire to cool the metal jacket; and a moving means for moving the metal jacket so as to set an initial position of the capillary tube. | 03-03-2011 |
Jae-Sik Yang, Gyeonggi-Do KR
Patent application number | Description | Published |
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20140018402 | PHARMACEUTICAL COMPOSITION FOR PREVENTING OR TREATING MACULAR DEGENERATION - The present invention provides a pharmaceutical composition for preventing or treating macular degeneration, which comprises benzopyran derivatives substituted with secondary amines including imidazole or pharmaceutically acceptable salts thereof as an active ingredient. The pharmaceutical composition of the present invention may be used in the form of eye drops. | 01-16-2014 |
Jae-Sik Yoo, Seoul KR
Patent application number | Description | Published |
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20090313745 | Face Shield for Safety Helmet - Disclosed is a face protector ( | 12-24-2009 |