Patent application number | Description | Published |
20130091348 | SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY THERMAL MANAGEMENT METHOD OF MULTICHIP PACKAGE - A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode. | 04-11-2013 |
20130139524 | THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF - Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature. | 06-06-2013 |
20130166093 | ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF - An electronic device may be operated in any of a plurality of heat-dissipation modes to accommodate temperature rises, including rapid temperature rises, while allowing an electronic device to continue operating. A parameter such as clock frequency, a supply voltage, current consumption, the number of applications running, or other operating parameter, may be manipulated to control internal heat dissipation and thereby accommodate factors, such as external temperature rises. One operation mode may be a maximum operation mode in which clock(s) operate at their highest frequencies and power is supplied at its highest level. A shut-down operation mode, in which a processor cuts power to electronic components, may be entered when a temperature of interest exceeds a predetermined threshold. | 06-27-2013 |
20130208426 | SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING THE SAME - A semiconductor chip and a first heat dissipation pattern are mounted on a substrate. The first heat dissipation pattern has an opening therein and exposes the semiconductor chip therethrough. A second heat dissipation pattern including a thermal interface material (TIM) is interposed between a side surface of the semiconductor chip and the first heat dissipation pattern. | 08-15-2013 |
20140136827 | MOBILE DEVICE AND DATA COMMUNICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT OF MOBILE DEVICE - According to one general aspect, a data communication method may include detecting a temperature using a temperature sensor. The method may include selecting a bandwidth for data communications by a semiconductor integrated circuit based, at least in part, upon the detected temperature. The method may also include performing the communication of data based, at least in part, on the selected bandwidth. | 05-15-2014 |
20140239434 | SEMICONDUCTOR PACKAGE - According to example embodiments, a semiconductor package may include a first package substrate, a first semiconductor chip on the first package substrate, and a thermistor array film on the first semiconductor chip. The thermistor array film may include a variable resistive film that covers the first semiconductor chip, and an array of electrode patterns that are connected to the variable resistive film. The array of electrode patterns may be connected to at least one of the upper and lower surfaces of the variable resistive film. | 08-28-2014 |
20140324245 | APPLICATION PROCESSOR AND DYNAMIC THERMAL MANAGEMENT METHOD THEREOF - Provided is a dynamic thermal management method performed by an application processor which stores a first dynamic voltage and frequency scaling (DVFS) table and a second DVFS table, the method including comparing a surface temperature of a mobile apparatus with a critical surface temperature, controlling performance of the application processor according to the first DVFS table when the surface temperature is less than the critical surface temperature, and controlling performance of the application processor according to the second DVFS table when the surface temperature is not less than the critical surface temperature. | 10-30-2014 |
20150121105 | ELECTRONIC SYSTEMS INCLUDING HETEROGENEOUS MULTI-CORE PROCESSORS AND METHODS OF OPERATING SAME - A method of operating an electronic system including a heterogeneous multi-core processor is provided. The method includes measuring the temperature and/or workload of a big (high-performance) core and switching a current core load from the big core to a small (low-power) core in response to the measured temperature and workload of the big core. | 04-30-2015 |
Patent application number | Description | Published |
20090072207 | FLAME RETARDANT RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE SAME AND MANUFACTURING METHOD THEREOF - The present invention relates to a flame retardant resin composition for a printed circuit board and a printed circuit board using the same, in more detail, to a flame retardant resin composition which includes a complex epoxy resin, photo acid generator, a curing agent, a curing accelerator, and an inorganic filler, so that UV curable and property-maintainable insulating material can be manufactured, and to a printed circuit board using the same. | 03-19-2009 |
20100048858 | POLY(P-XYLYLENE)-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTY AND INSULATING MATERIAL, PRINTED CIRCUIT BOARD AND FUNCTIONAL ELEMENT USING THE SAME - The present invention relates to a poly(p-xylylene)-based polymer having a low dielectric constant suitable for low loss dielectrics (LLD), and an insulating material, a printed circuit board and a functional element using the same. More particularly, the poly(p-xylylene)-based polymer includes at least one repeat unit expressed by the following formula (1): | 02-25-2010 |
20100063226 | NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES, AND INSULATING MATERIAL, PRINTED CIRCUIT BOARD AND FUNCTION ELEMENT USING THE SAME - The present invention relates to a to a norbornene-based polymer having a low dielectric constant and low-loss properties, and an insulating material, a printed circuit board and a functional device using the same. More particularly, it relates to a norbornene-based polymer expressed by the following formula (1): | 03-11-2010 |
20100210803 | NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES AND INSULATING MATERIAL USING THE SAME - It relates to a norbornene-based polymer having low dielectric constant which is thus suitable for a low loss dielectric material, an insulating material using the same, an embedded printed circuit board and a functional device, in which the norbornene-based polymer includes at least one repeat unit of formula 1: | 08-19-2010 |
20110298786 | Color electronic paper display device and method for manufacturing the same - The present invention provides a color electronic paper display device including: rotating balls; a barrier structure for partitioning the rotating balls; and an electrode structure which is provided in the barrier structure and applies voltages to the rotating balls, wherein the barrier structure is made of a photo-reactive barrier material including insulating resin, hardener, and a photo-sensitive material. | 12-08-2011 |
20110317382 | Insulating resin composition and printed circuit substrate using the same - Disclosed herein are an insulating resin composition soluble fluorine-based resin, thermosetting resin; a solvent capable of simultaneously dissolving the soluble fluorine-based resin and the thermosetting resin, and a printed circuit substrate using the same. | 12-29-2011 |
20120064231 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING FLAME RETARDANT INSULATION LAYER - The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer. | 03-15-2012 |
20120074430 | Radiating substrate and method for manufacturing the radiating substrate, and luminous element package with the radiating substrate - Disclosed herein is a radiating substrate radiating heat generated from a predetermined heating element to the outside. The radiating substrate includes polymer resins and graphenes distributed in the polymer resins. | 03-29-2012 |
20120103507 | Photosensitive composite and build-up insulation film with the photosensitive composite, and method for manufacturing circuit board using the build-up insulation film - Disclosed herein is a method for manufacturing a circuit board. The method for manufacturing a circuit board includes: preparing a photosensitive composite; preparing a build-up insulating film by casting the photosensitive composite into a film made of poly ethylene terephthalate (PET) material; stacking the build-up insulation film on the board; forming via holes on the build-up insulation film by using a photolithography process; and forming conductive vias in the via holes. | 05-03-2012 |
20140037889 | INSULATOR FOR BUILD-UP PCB AND METHOD OF MANUFACTURING PCB USING THE SAME - Disclosed are an insulator for a build-up PCB and a method of manufacturing a printed circuit board using the insulator. The insulator for a build-up PCB in accordance with an embodiment of the present invention includes: an insulation film layer, of which one surface has an area corresponding to a circuit board to be built-up; and a cover film layer, which is stacked on the insulation film layer and of which one surface has a larger area than the one surface of the insulation film layer so as to cover an entire outer perimeter of the insulation film layer. | 02-06-2014 |
20140065413 | INSULATING FILM AND PRODUCING METHOD FOR INSULATING FILM - Disclosed herein are an insulating film and a producing method of the insulating film which can address problems caused by dents by providing a reinforcing layer having the weight ratio of the silica of 60 to 80 wt % on one surface of the insulating film. | 03-06-2014 |
20150053458 | INSULATING FILM FOR PRINTED CIRCUIT BOARD AND PRODUCTS HAVING THE SAME - Disclosed herein are an insulating film for a printed circuit board and products having the same. In detail, in the insulating film according to a representative embodiment of the present invention, an insulating material in which a content of an inorganic filler in an insulating layer has a concentration gradient and a printed circuit board using the same may increase fillability of an inner layer circuit and a through hole of the inner layer circuit. | 02-26-2015 |
20150056472 | Laminate for Printed Circuit Board and Printed Circuit Board Using The Same - Disclosed herein are a laminate for a printed circuit board, a printed circuit board using the same, and a method of manufacturing the same. | 02-26-2015 |
Patent application number | Description | Published |
20110067097 | PLATFORM SECURITY APPARATUS AND METHOD THEREOF - A platform security apparatus and a method thereof are capable of protecting a mobile communication terminal from an abnormal or unintended operation of an application program installed over a platform of the mobile communication terminal. An authentication key is created with respect to each function of an application program, and the authentication key and an identifier of the application program are associated with each other and stored. An authentication process is performed by comparing an authentication key and an identifier of an application program registered as function parameters with an authentication key and an identifier of the application program which have been stored, when the application program calls the function. | 03-17-2011 |
20120204255 | MOBILE PLATFORM SECURITY APPARATUS AND METHOD - A mobile platform security apparatus and method is provided. The apparatus may perform a security setting by generating a first authentication key, a second authentication key, and a third authentication key for each function called by an application program. The apparatus may store the first authentication key and an identifier for identifying the application program in a first storage unit, the second authentication key and the identifier in a secret domain of a second storage unit, and register the third authentication key and the identifier as a function parameter in the application program. Subsequently, if the function is called by the application program, the apparatus may determine values for the first authentication key, the second authentication key, and the third authentication key corresponding to the called function, and may perform authentication processing using the three authentication key values. | 08-09-2012 |
20130227652 | TERMINAL AND METHOD FOR ASSIGNING PERMISSION TO APPLICATION - A terminal to assign permission to an application includes a storage device to store an application list including information of applications authorized to receive manager permission, and an application processor to receive a request for the manager permission from the application and to determine to allow the manager permission to the application in response to a determination that the application is included in the application list. A method that uses a processor to assign permission to an application includes receiving a request for manager permission from the application, determining, using the processor, whether the application is included in an application list including information of applications authorized to receive manager permission, and determining whether to allow the manager permission to the application if the application is included in the application list. | 08-29-2013 |