Patent application number | Description | Published |
20090028005 | WRISTWATCH-TYPE MOBILE DEVICE - Provided is a wristwatch-type mobile device. The wristwatch-type mobile device includes a wristwatch device, a mobile device, and an I/O device. The I/O device is selectively used as one of an output device of the wristwatch device and an I/O device of the mobile device. | 01-29-2009 |
20090072225 | FLAT PANEL DISPLAY DEVICE HAVING ORGANIC THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF - Provided is a flat panel display device having an organic TFT and a manufacturing method thereof. The flat panel display device includes a first organic TFT having a first organic semiconductor active layer, and a second organic TFT having a second organic semiconductor active layer. At this point, the particle size of the organic semiconductor crystal of the first organic semiconductor active layer is greater than that of the organic semiconductor crystal of the second organic semiconductor active layer. | 03-19-2009 |
20090072226 | DISPLAY DEVICE HAVING ORGANIC THIN FILM TRANSISTOR - Provided is a display device having an organic TFT. The display device includes the organic TFT on a substrate, a passivation layer covering the organic TFT, and a bank layer on the passivation layer. At this point, at least one of the passivation layer and the bank layer is formed of a material blocking light incident from a portion on the substrate to the organic TFT. | 03-19-2009 |
20100035376 | METHOD OF LOCALLY CRYSTALLIZING ORGANIC THIN FILM AND METHOD OF FABRICATING ORGANIC THIN FILM TRANSISTOR USING THE SAME - A method of partially crystallizing an organic thin film and a method of fabricating an organic thin film transistor (OTFT) are provided. An organic thin film used as an active layer of an OTFT is partially coated with an organic solvent by direct graphic art printing or partially annealed by laser beam irradiation, thereby local improving the crystallinity of the organic thin film. The charge mobility of the OTFT can be improved and crosstalk between devices can be reduced without additional patterning the organic thin film. | 02-11-2010 |
20100108996 | COMPOSITION FOR ORGANIC THIN FILM TRANSISTOR, ORGANIC THIN FILM TRANSISTOR FORMED BY USING THE SAME, AND METHOD FOR FORMING THE ORGANIC FILM TRANSISTOR - Provided are a composition for organic thin film transistors including a material including an anthracenyl group and a cross-linker including a maleimide group, an organic thin film transistor formed by using the composition, and a method for manufacturing the same. | 05-06-2010 |
20100140706 | METHOD OF MANUFACTURING THIN FILM TRANSISTOR AND THIN FILM TRANSISTOR SUBSTRATE - Provided is a method of manufacturing a thin film transistor that can improve self-alignment. In this method, a semiconductor layer comprising a first doped region, a second doped region and a channel region is formed on a sacrificial layer on a first substrate. Next, the semiconductor layer is separated from the first substrate and is then coupled on a second substrate. Next, a dielectric layer is formed on the second substrate and the semiconductor layer, and a first photoresist layer is formed on the dielectric layer. Thereafter, the first photoresist layer is exposed to light from a rear surface of the second substrate by using the first doped region and the second doped region as a mask, to form a first mask pattern. Next, a gate electrode overlapping the channel region is formed on the dielectric layer by using the first mask pattern as a mask, and a source electrode and a drain electrode connected to the first doped region and the second doped region, respectively are formed to complete a thin film transistor. | 06-10-2010 |
20100141411 | TOUCH SCREEN AND METHOD OF OPERATING THE SAME - Provided are a touch screen and a method of operating the same. The touch screen includes a detecting part, a control part, and a tactile feedback part. The detecting part detects object's approach or contact. The control part receives a signal of the detecting part to output a feedback signal. The tactile feedback part receives the feedback signal of the control part to provide a tactile feedback to a contact position using a magnetic force. The tactile feedback uses the magnetic force of a magnetic dipole. | 06-10-2010 |
20100237443 | ORGANIC THIN FILM TRANSISTORS AND METHODS OF FORMING THE SAME - Provided is an organic thin film transistor, method of forming the same, and a memory device employing the same. The organic thin film transistor includes a substrate, a source electrode and a drain electrode on the substrate, an active layer on the substrate between the source electrode and the drain electrode, a gate electrode controlling the active layer, and an organic dielectric layer between the active layer and the gate electrode. The organic dielectric layer includes nanoparticles, a hydrophilic polymer surrounding the nanoparticles, and a hydrophobic polymer. | 09-23-2010 |
20110033971 | ORGANIC INVERTER INCLUDING SURFACE-TREATED LAYER AND METHOD OF MANUFACTURING THE SAME - An organic inverter and a method of manufacturing the same are provided, which regulates threshold voltages depending on positions when an inverter circuit is manufactured on a substrate using an organic semiconductor. To form a depletion load transistor and an enhancement driver transistor at adjacent positions of the same substrate, the surface of the substrate is selectively treated by positions or selectively applied by self-assembly monolayer treatment. Thus, a D-inverter having a combination of a depletion mode and an enhancement mode is more easily realized than a conventional method using a transistor size effect. Also, the D-inverter can be realized even with the same W/L ratio, thereby increasing integration density. That is, the W/L ratio does not need to be increased to manufacture a depletion load transistor, thereby improving integration density. | 02-10-2011 |
20110092032 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - Provided is a manufacturing methods of a semiconductor device. The methods includes: forming an active layer on a first substrate; bonding a top surface of the active layer with a second substrate and separating the active layer from the first substrate; forming conductive impurity regions corresponding to source and drain regions of the active layer bonded on the second substrate; bonding a third substrate on a bottom surface of the active layer and removing the second substrate; and forming a gate electrode on a top between the conductive impurity regions of the active layer bonded on the third substrate and forming source and drain electrodes on the conductive impurity regions. | 04-21-2011 |
20110094774 | MULTI-LAYER INTERCONNECTION STRUCTURE MANUFACTURING METHOD THEREOF - Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring. | 04-28-2011 |
20110133257 | TRANSFERRED THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME - Provided are a transferred thin film transistor and a method of manufacturing the same. The method includes: forming a source region and a drain region that extend in a first direction in a first substrate and a channel region between the source region and the drain region; forming trenches that extend in a second direction in the first substrate to define an active layer between the trenches, the second direction intersecting the first direction; separating the active layer between the trenches from the first substrate by performing an anisotropic etching process on the first substrate inside the trenches; attaching the active layer on a second substrate; and forming a gate electrode in the first direction on the channel region of the active layer. | 06-09-2011 |
20110136296 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method for manufacturing a semiconductor device. The method includes: providing a first substrate where an active layer is formed on a buried insulation layer; forming a gate insulation layer on the active layer; forming a gate electrode on the gate insulation layer; forming a source/drain region on the active layer at both sides of the gate electrode; exposing the buried insulation layer around a thin film transistor (TFT) including the gate electrode and the source/drain region; forming an under cut at the bottom of the TFT by partially removing the buried insulation layer; and transferring the TFT on a second substrate. | 06-09-2011 |
20110204334 | ORGANIC THIN FILM TRANSISTOR AND METHOD OF FORMING THE SAME - Provided are an organic thin film transistor and a method of forming the same. The method comprises forming a gate electrode on a substrate, forming a gate dielectric, which covers the gate electrode and includes a recess region at an upper portion, on the substrate, forming a source electrode and a drain electrode in the recess region, and forming an organic semiconductor layer between the source electrode and the drain electrode in the recess region. | 08-25-2011 |
20110272661 | RESISTIVE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a resistive memory device and a method of fabricating the same. The resistive memory device comprises an electron channel layer formed by means of a swelling process and an annealing process. Thus, conductive nanoparticles are uniformly dispersed in the electron channel layer to improve reliability of the resistive memory device. According to the method, an electron channel layer is formed by means of a printing process, a swelling process, and an annealing process. Thus, fabrication time is reduced. | 11-10-2011 |
20120125213 | CLICHE AND MANUFACTURING METHOD FOR THE SAME - Provided is a cliche and a method of manufacturing the cliche which can increase or maximize productivity and production yield. The manufacturing method of the cliche includes providing a substrate, forming organic patterns protruding on the substrate, and forming an ink absorption layer on the organic patterns or on the substrate exposed from the organic patterns. | 05-24-2012 |
20120125214 | OFFSET PRINTER - Provided is an offset printer configured to increase or maximize productivity and yield. The offset printer includes a printing roller, a coating unit configured to apply a printing substance to the printing roller, a patterning unit configured to pattern the printing substance applied to the printing roller from the coating unit, a printing unit configured to transfer the patterned printing substance to a printing medium, and a cleaning unit configured to clean the printing substance remaining on the printing roller by a dry cleaning method. | 05-24-2012 |
20120139558 | RADIO FREQUENCY IDENTIFICATION TAG - Provided is a radio frequency identification (RFID) tag. The RFID tags includes: a conductive layer and a conductive line disposed above and below an insulation layer, respectively; an antenna connected to one end of the conductive line; a resistor connected to the other end of the conductive line; a first conductive plate connected to the conductive line and constituting a first capacitor in conjunction with the conductive layer and the insulation layer; and a first sensing device connected between the conductive line and the conductive layer and having an impedance changed according to a sensing of a first target material. | 06-07-2012 |
20120141665 | METHOD OF AND APPARATUS FOR FORMING A METAL PATTERN - Provided are methods of and apparatuses for forming a metal pattern. In the method, an initiator and a metal pattern are sequentially combined on a previously-formed bonding agent pattern improving adhesion and/or junction properties between the substrate and the metal. The bonding agent pattern may be formed using a reverse offset printing method. The metal pattern may be formed using an electroless electrochemical plating method. The metal pattern can be formed with improved uniformity in thickness and planar area. | 06-07-2012 |
20120235961 | FLEXIBLE FLAT CABLE AND MANUFACTURING METHOD THEREOF - A flexible flat cable capable of minimizing distortion and interference of a signal and a manufacturing method thereof are provided. The cable includes wire cores, insulation coating layers surrounding the wire cores, shield coating layers surrounding the insulation coating layers, an upper insulation plate layer formed on the shield coating layers, a lower insulation plate layer formed under the shield coating layers and opposite to the upper insulation plate layer, and a shield plate layer formed under the lower insulation plate layer. | 09-20-2012 |
20130005079 | ORGANIC THIN FILM TRANSISTORS AND METHODS OF FORMING THE SAME - Provided is an organic thin film transistor, method of forming the same, and a memory device employing the same. The organic thin film transistor includes a substrate, a source electrode and a drain electrode on the substrate, an active layer on the substrate between the source electrode and the drain electrode, a gate electrode controlling the active layer, and an organic dielectric layer between the active layer and the gate electrode. The organic dielectric layer includes nanoparticles, a hydrophilic polymer surrounding the nanoparticles, and a hydrophobic polymer. | 01-03-2013 |
20130056713 | ORGANIC LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - The inventive concept provides organic light emitting diodes and methods of fabricating the same. The method may include forming an insulating layer on a substrate, coating a metal ink on the insulating layer, thermally treating the substrate to permeate the metal ink into the insulating layer, thereby forming an assistant electrode layer the insulating layer and the metal ink embedded in the insulating layer, and sequentially forming a first electrode, an organic light emitting layer, a second electrode on the assistant electrode layer. | 03-07-2013 |
20130092415 | CABLE, METHOD OF MANUFACTURING THE SAME, AND APPARATUS FOR DEPOSITING DIELECTRIC LAYER - The inventive concept provides cables, methods of manufacturing the same, and apparatuses for depositing a dielectric layer. The cable may include a first electrode, a second electrode spaced apart from the first electrode, and a dielectric layer disposed between the first and second electrodes and including a polymer having xylene as a monomer. | 04-18-2013 |
20130108777 | METHOD FOR MANUFACTURING FLEXIBLE ELECTRODE SUBSTRATE | 05-02-2013 |
20130161704 | TRANSFERRED THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME - Provided are a transferred thin film transistor and a method of manufacturing the same. The method includes: forming a source region and a drain region that extend in a first direction in a first substrate and a channel region between the source region and the drain region; forming trenches that extend in a second direction in the first substrate to define an active layer between the trenches, the second direction intersecting the first direction; separating the active layer between the trenches from the first substrate by performing an anisotropic etching process on the first substrate inside the trenches; attaching the active layer on a second substrate; and forming a gate electrode in the first direction on the channel region of the active layer. | 06-27-2013 |
20130292160 | MULTI-LAYER INTERCONNECTION STRUCTURE - Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring. | 11-07-2013 |
20130314633 | DUAL MODE DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A dual mode display apparatus according to the inventive concept includes a lower substrate, a first lower electrode on the lower substrate, a light switching layer on the first lower electrode, a first upper electrode on the light switching layer, a passivation layer on the first upper electrode, a contact plug connected to the first upper electrode and penetrating the passivation layer, a second lower electrode on the contact plug and the passivation layer, an organic light-emitting layer on the second lower electrode, a second upper electrode on the organic light-emitting layer, and an upper substrate on the second upper electrode. | 11-28-2013 |
20130314634 | DUAL-MODE DISPLAY DEVICE AND METHOD OF MANUFACTURING SAME - Provided are a dual-mode display device and a method of manufacturing the same. The device includes a lower substrate, an upper substrate facing the lower substrate, a thin-film transistor portion between the upper substrate and the lower substrate, a first anode on one side of the thin-film transistor portion, a first cathode between the first anode and the upper substrate, an organic light-emitting layer between the first cathode and the first anode, a second anode on the other side of the thin-film transistor portion, a second cathode between the second anode and the upper substrate, or the second anode and the lower substrate, and a optical switching layer between the second cathode and the second anode. | 11-28-2013 |
20140014915 | DUAL MODE DISPLAY DEVICES AND METHODS OF MANUFACTURING THE SAME - Disclosed are dual mode display devices and methods of manufacturing the same. The dual mode display device may include a first substrate, a first electrode on the first substrate, a second substrate opposite to the first electrode and the first substrate, a second electrode between the second substrate and the first electrode, a third electrode between the first electrode and the second electrode, an optic switching layer between the first electrode and the third electrode, and an organic light-emitting layer between the second electrode and the third electrode. | 01-16-2014 |
20140077297 | THIN FILM TRANSISTOR AND METHOD OF FABRICATING THE SAME - Provided is a thin film transistor. The thin film transistor according to an embodiment of the present invention may include a source electrode and a drain electrode buried in a first flexible substrate, a semiconductor layer disposed on the first flexible substrate to be positioned between the source electrode and the drain electrode, a gate insulating layer completely cover the semiconductor layer, and a gate electrode facing the semiconductor layer on the gate insulating layer. | 03-20-2014 |
20140084283 | THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME - Provided are a thin film transistor and a method for manufacturing the same. The thin film transistor manufacturing method includes forming a gate electrode on a substrate, forming an active layer that is adjacent to the gate electrode and includes an oxide semiconductor, forming an oxygen providing layer on the active layer, forming a gate dielectric between the gate electrode and the active layer, forming source and drain electrodes coupled to the active layer, forming a planarizing layer covering the gate electrode and the gate dielectric, forming a hole exposing the active layer, and performing a heat treatment process onto the planarizing layer in an atmosphere of oxygen. | 03-27-2014 |
20140085840 | ELECTRONIC CIRCUIT AND METHOD OF FABRICATING THE SAME - Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region. | 03-27-2014 |
20140086289 | RADIO COMMUNICATION ANTENNA AND RADIO COMMUNICATION DEVICE - The present invention relates to a radio communication antenna and a radio communication device including the same. The radio communication antenna of the present invention includes first conductive wires extending in opposite directions with respect to a first direction on a substrate to form a dipole antenna, second conductive wires separated from the first conductive wires to be parallel with the first conductive wires, and stubs connected between the first conductive wires and the second conductive wires in a second direction intersecting with the first direction. | 03-27-2014 |
20140104793 | STRETCHABLE ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME - Provided are a stretchable electronic device and a method of manufacturing the same. The manufacturing method includes forming coil interconnection on a first substrate, forming a first stretchable insulating layer that covers the coil interconnection, forming a second substrate on the first stretchable insulating layer, separating the first substrate from the coiling interconnection and the first stretchable insulating layer, and forming a transistor on the coil interconnection. | 04-17-2014 |
20140134840 | METHOD FOR MANUFACTURING STRETCHABLE THIN FILM TRANSISTOR - Provided is a method for manufacturing a stretchable thin film transistor. The method for manufacturing a stretchable thin film transistor includes forming a mold substrate, forming a stretchable insulator on the mold substrate, forming a flat substrate on the stretchable insulator, removing the mold substrate, forming discontinuous and corrugated wires on the stretchable insulator, forming a thin film transistor connected between the wires, and removing the flat substrate. | 05-15-2014 |
20140158997 | DUAL-MODE PIXEL INCLUDING EMISSIVE AND REFLECTIVE DEVICES AND DUAL-MODE DISPLAY WITH THE SAME - Provided is a dual-mode display including a substrate, and a plurality of sub pixels on the substrate. Each of the sub pixels may include an emissive device, a reflective optical filter provided on a surface of the emissive device, and an optical shutter provided on other surface of the emissive device. | 06-12-2014 |
20140161976 | METHOD OF FORMING CORE-SHELL NANO PARTICLE FOR METAL INK - Disclosed are methods of forming a core-shell nano particle for a metal ink. The method includes forming a metal oxide nano particle core, and forming a metal shell on a surface of the metal oxide nano particle core to form a core-shell nano particle. | 06-12-2014 |
20140205747 | METHOD OF MANUFACTURING A FLEXIBLE FLAT CABLE - A flexible flat cable which includes wire cores, insulation coating layers surrounding the wire cores, shield coating layers surrounding the insulation coating layers, an upper insulation plate layer formed on the shield coating layers, a lower insulation plate layer formed under the shield coating layers and opposite to the upper insulation plate layer, and a shield plate layer formed under the lower insulation plate layer. | 07-24-2014 |
20140218872 | ELECTRONIC CIRCUIT AND METHOD OF FABRICATING THE SAME - Provided is an electronic circuit. The electronic circuit includes: a substrate including a device region and a wiring region; an electronic device disposed on the device region; and a conductive wire disposed on the wiring region and connected to the electronic device, wherein the substrate has a first side where the electronic device and the conductive wire contact and a second side facing the first side; the first side and the second side of the wiring region have a convex structure; the first side of the device region is flat; and the device region is thicker than the wiring region. | 08-07-2014 |
20140299362 | STRETCHABLE ELECTRIC DEVICE AND MANUFACTURING METHOD THEREOF - Provided are a stretchable electric circuit and a manufacturing method thereof The method for manufacturing the stretchable electric circuit includes forming a mold substrate, forming a stretchable substrate having a first flat surface and a first corrugated surface outside the first flat surface on the mold substrate, removing the mold substrate, forming a corrugated wire on the first corrugated surface, and forming an electric device connected to the corrugated wire on the first flat surface. | 10-09-2014 |
20150048375 | METHOD OF MANUFACTURING STRETCHABLE SUBSTRATE AND STRETCHABLE SUBSTRATE MANUFACTURED USING THE METHOD - Provided is a method of manufacturing a gradually stretchable substrate. The method includes forming convex regions and concave regions on a top surface of a stretchable substrate by compressing a mold onto the stretchable substrate and forming non-stretchable patterns by filling the concave regions of the stretchable substrate. The stretchable substrate includes a stretchable region defined by the non-stretchable patterns, the non-stretchable patterns have side surfaces in contact with the stretchable region, and the side surfaces of the non-stretchable patterns are formed of protrusions and a non-protrusion between the protrusions repetitively connected to one another. | 02-19-2015 |