Patents - stay tuned to the technology

Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Iyengar, US

Ajay Iyengar, Stone Mountain, GA US

Patent application numberDescriptionPublished
20140069125SYSTEMS, METHODS, AND APPARATUS FOR PREVENTING CONDENSATION IN REFRIGERATED DISPLAY CASES - Systems, methods, and apparatuses are provided for preventing condensation in refrigerated display cases. A display case can be provided with one or more heater circuits and one or more sensors communicably coupled thereto. The sensor can sense ambient humidity levels, ambient temperature levels, and surface temperature levels. In certain embodiments, dewpoint temperatures may be calculated based on the ambient humidity and temperature levels provided by the sensor. The sensed ambient humidity level, temperature level, surface temperature, or calculated dewpoint can be compared to preset trigger levels and at least one of the heater circuits can be activated if the preset trigger level is violated. Activation of the heater circuit can be for a predetermined amount or percentage of time or at a predetermined voltage level based on the sensed or calculated level or the amount the sensed or calculated level is over the preset trigger level.03-13-2014

Ajay Iyengar, Johns Creek, GA US

Patent application numberDescriptionPublished
20150101359MODULAR REFRIGERATION SYSTEMS - The present application provides a refrigerated merchandising case. The refrigerated merchandising case may include a refrigerated product area, a rear panel with a roller channel and a number of support apertures, and a number of shelves with a roller and a number of attachment prongs. The shelves may maneuver along the rear panel via the roller within roller channel and attach via the attachment prongs and the support apertures.04-16-2015

Anand Iyengar, Mountain View, CA US

Patent application numberDescriptionPublished
20140330781Parallel Filesystem Traversal For Transparent Mirroring of Directories and Files - A system and method for parallel file system traversal using multiple job executors is disclosed. The system includes a pool of job executors, a job queue, and a trigger tracker. An object, representative of a node in the filesystem, is added (i.e., pushed) to the job queue for processing by an job executor. The job queue assigns (i.e., pops) objects to job executors in accordance to a LIFO (Last In First Out) ordering. Then the job executor performs an action such as copy. In one embodiment, the trigger tracker follows the processing of a child nodes to a particular child node. Thus, the filesystem is being traversed by several job executors at the same time.11-06-2014

Arun K.s. Iyengar, Delmont, PA US

Patent application numberDescriptionPublished
20120034539HIGH EFFICIENCY AND RELIABLE FUEL CELL SYSTEM OPERATING AT NEAR 100% FUEL UTILIZATION - A fuel cell system 02-09-2012
20140302410HIGH EFFICIENCY FUEL CELL SYSTEM WITH ANODE GAS CHEMICAL RECUPERATION AND CARBON CAPTURE - A method of providing anode gas exhaust (10-09-2014

Arun K. S. Iyengar, Delmont, PA US

Patent application numberDescriptionPublished
20140242476OPERATING BATTERY STACK SYSTEM PERFORMANCE BY ALTERNATING THE FLOW OF HEAT CARRYING FLUID USED THEREIN - What is provided is an operating battery stack system (08-28-2014
20160043422HIGH EFFICIENCY FUEL CELL SYSTEM WITH ANODE GAS CHEMICAL RECUPERATION AND CARBON CAPTURE - A method of providing anode gas exhaust from a fuel cell stack and carbon dioxide capture by feeding reformed fuel and air into a fuel cell stack where gas exhaust is fed to a series of oxidation/reduction beds to provide exit streams a) of H02-11-2016

Arun K. S. Iyengar, Monroeville, PA US

Patent application numberDescriptionPublished
20140234735HIGH TEMPERATURE FUEL CELL/ELECTROLYZER SYSTEM WITH ENERGY STORAGE MEDIA AND AUXILIARIES OUTSIDE THE FUEL CELL POWER GENERATOR - A fuel cell system (08-21-2014

Ashok Kumar Iyengar, Encinitas, CA US

Patent application numberDescriptionPublished
20140034720SELF-DIAGNOSING SOFTWARE SYSTEMS USING QR-CODE - Systems, methods and computer program products for diagnosing consistency of a software cluster are provided herein. The system includes a deployment manager configured to function as a master node of the software cluster, a plurality of nodes connected to the deployment manager, and an electronic device or devices registered with the deployment manager. The deployment manager ban be configured to generate a master quick response (QR) code and each of the plurality of nodes can be configured to generate a node QR code. The electronic device(s) may be associated with a system administrator and may also be installed with application software. Embodiments may allow the system administrator to encode, manage and analyze diagnostic information of the nodes in the software cluster utilizing the master QR code and the node QR code in an efficient manner.02-06-2014
20140034721SELF-DIAGNOSING PROCESSES USING QR-CODE - Systems, methods and computer program products for diagnosing consistency of a software cluster are provided herein. The system includes a deployment manager configured to function as a master node of the software cluster, a plurality of nodes connected to the deployment manager, and an electronic device or devices registered with the deployment manager. The deployment manager ban be configured to generate a master quick response (QR) code and each of the plurality of nodes can be configured to generate a node QR code. The electronic device(s) may be associated with a system administrator and may also be installed with application software. Embodiments may allow the system administrator to encode, manage and analyze diagnostic information of the nodes in the software cluster utilizing the master QR code and the node QR code in an efficient manner.02-06-2014

Gopal Iyengar, Stevens Point, WI US

Patent application numberDescriptionPublished
20100059597Multifunctional Paper Identification Label - A multifunctional identification label comprises a paper substrate formed from a cellulose furnish including 1 to 2.5 percent of a wet strength resin and a rosin size. A front side of the substrate is machine glazed, coated with a print receptive coating, and printed with a bar code. The back side of the substrate has a coating comprising one or more pigments selected from the group of clay, magadite and mixtures thereof, a binder, and 1 to 2.5 parts by dry weight of pigment of a salt. A conductive ink antenna is printed on the back side coating. A RFID chip is secured to the back side of the coated substrate and electrically connected to the antenna. Embodiments of the invention include a pressure sensitive adhesive label including RFID and bar code identification, a ticket adapted for printing on both sides incorporating RFID identification, and an RFID insert.03-11-2010
20100178523SUBSTANTIALLY BIODEGRADABLE AND COMPOSTABLE HIGH-BARRIER PACKAGING MATERIAL AND METHODS FOR PRODUCTION - Bio-degradable, high-barrier packaging materials and methods for production are provided. The present high-barrier packaging materials include a substrate having a print side and a back side, a coating having nano pigments on the print side and a metalized film applied to the back side with a binding layer. Preferably, at least one of the metalized film and the binding layer includes polylactic acid. Moreover, the back side preferably also includes a polylactic acid heat seal layer.07-15-2010
20120121893BETTER CURING COATED RELEASE LINER SUBSTRATE - Release liner substrates and release liners produced therefrom wherein the substrate includes a coating layer containing a binder and a hyperplatey talc. The release liner may comprise a release liner substrate with a binder and a hyperplatey talc coating and a silicone coating applied to the substrate coating. In accordance with certain aspects, the binder may comprise a carboxylated latex binder.05-17-2012

Patent applications by Gopal Iyengar, Stevens Point, WI US

Jagannathan N. Iyengar, Centreville, VA US

Patent application numberDescriptionPublished
20110008229SULFUR RECOVERY PLANT TAIL GAS TREATMENT PROCESS - A process for the removal of hydrogen sulfide from a gas stream in which the gas stream is first passed through a Claus unit operating at a sub-stoichiometric ratio (H01-13-2011

Jayanthi Iyengar, Flushing, MI US

Patent application numberDescriptionPublished
20110153175DRIVER-BASED CONTROL SYSTEM AND METHOD TO IMPROVE FUEL ECONOMY - The technology described herein provides an active driver control system. Additionally, in various example embodiments, this technology provides methods for optimizing fuel economy (or energy consumption) through active compensation of driver controlled inputs. The active compensation functionality is used to moderate ‘sweet spot’ vehicle response with driver desired performance. In particular, the active compensation functionality can be used to smooth the vehicle response and attenuate undesired frequency content from the driver input. One of the benefits to this technology is that it assists all drivers in achieving better fuel economy in real world driving. Another benefit is that active compensation of driver controlled inputs can mitigate some of the negative effects of more aggressive driving styles. In addition to active compensation functionality, the technology described herein is also capable of generating a Green Driver Index which is derived by quantifying the driver's control ability and normalizing the result against desired fuel economy and performance targets.06-23-2011

Kishen Iyengar, Boulder, CO US

Patent application numberDescriptionPublished
20120197904SYSTEMS AND METHODS FOR DOMINANCE RANKINGS - This disclosure describes systems and methods for dominance rankings. The disclosure describes a novel approach for determining dominance rankings between competing interacting objects.08-02-2012

Madhusudan K. Iyengar, Foster City, CA US

Patent application numberDescriptionPublished
20130068423AIR-SIDE ECONOMIZER FACILITATING LIQUID-BASED COOLING OF AN ELECTRONICS RACK - A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.03-21-2013
20130068441DATA CENTER COOLING WITH AN AIR-SIDE ECONOMIZER AND LIQUID-COOLED ELECTRONICS RACK(S) - A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.03-21-2013
20130070420FLOW BOILING HEAT SINK WITH VAPOR VENTING AND CONDENSING - A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive structure which has one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).03-21-2013
20130077246HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).03-28-2013
20130077247VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.03-28-2013
20130081258TWO-PHASE, WATER-BASED IMMERSION-COOLING APPARATUS WITH PASSIVE DEIONIZATION - Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a housing about an electronic component to be cooled, the housing at least partially surrounding and forming a compartment about the electronic component to be cooled; disposing a fluid within the compartment, wherein the electronic component to be cooled is at least partially immersed within the fluid, and wherein the fluid comprises water; and providing a deionizing structure within the compartment, the deionizing structure comprising deionizing material, the deionizing material ensuring deionization of the fluid within the compartment, wherein the deionizing structure is configured to accommodate boiling of the fluid within the compartment.04-04-2013
20130091693THERMAL EXPANSION-ENHANCED HEAT SINK FOR AN ELECTRONIC ASSEMBLY - A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.04-18-2013
20130091706COMBINED POWER AND COOLING RACK SUPPORTING AN ELECTRONICS RACK(S) - A method is provided for facilitating powering and cooling of one or more electronics racks. The method includes: providing a frame; associating at least one bulk power assembly with the frame, the at least one bulk power assembly being configured to provide power to the electronics rack(s), wherein the frame with the associated one or more bulk power assemblies is distinct from the electronics rack(s); and associating one or more heat exchange assemblies with the frame, the heat exchange assembly(ies) being configured to cool system coolant provided to the electronics rack(s). In operation, heat is transferred by the heat exchange assembly(ies) from the system coolant to a facility coolant, and the frame with the associated bulk power assembly(ies) and associated heat exchange assembly(ies) provides both power and cooling to the electronics rack(s).04-18-2013
20130091868THERMOELECTRIC-ENHANCED, VAPOR-CONDENSER FACILITATING IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) - Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.04-18-2013
20130097862DRY-COOLING UNIT WITH GRAVITY-ASSISTED COOLANT FLOW - A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.04-25-2013
20130104383MULTI-RACK ASSEMBLY METHOD WITH SHARED COOLING UNIT05-02-2013
20130104399MULTI-RACK ASSEMBLY WITH SHARED COOLING APPARATUS05-02-2013
20130105116COOLANT MANIFOLD WITH SEPARATELY ROTATABLE MANIFOLD SECTION(S)05-02-2013
20130133873DIRECT FACILITY COOLANT COOLING OF A RACK-MOUNTED HEAT EXCHANGER - A method is provided for dissipating heat from a rack. The method includes: disposing a coolant-cooled heat exchanger within the rack, and providing a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.05-30-2013
20130138253DYNAMICALLY LIMITING ENERGY CONSUMED BY COOLING APPARATUS - Cooling methods are provided which include providing: one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is also provided to dynamically adjust operation of the N controllable components, based on Z input parameters and one or more specified constraints, and provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.05-30-2013
20130174421DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE - A method is provided for fabricating a cooling apparatus for cooling an electronics rack, which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures, and a tube. The heat exchanger is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of coolant-carrying tube sections, each tube section having a coolant inlet and outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.07-11-2013
20130180686PRESSURE CONTROL UNIT AND METHOD FACILITATING SINGLE-PHASE HEAT TRANSFER IN A COOLING SYSTEM - A pressure control unit and method are provided for facilitating single-phase heat transfer within a liquid-based cooling system. The pressure control unit includes a pressure vessel containing system coolant, and a pressurizing mechanism associated with the pressure vessel. A coolant line couples system coolant in the pressure vessel in fluid communication with the coolant loop of the cooling system, and a regulator mechanism couples to the pressurizing mechanism to maintain pressure within the pressure vessel at or above a defined pressure threshold, thus maintaining pressure within the coolant loop above the pressure threshold. The defined pressure threshold is set to facilitate system coolant within the coolant loop remaining single-phase throughout an operational temperature range of the system coolant within the coolant loop. More particularly, the pressure threshold is set to ensure pressure of system coolant within the coolant loop remains above the coolant's saturation pressure at maximum operational temperature.07-18-2013
20130180687CONDENSER FIN STRUCTURES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Vapor condensers and cooling apparatuses are provided herein which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel when the thermally conductive base structure is in the operational orientation and the vapor condenser is facilitating vapor condensate formation.07-18-2013
20130186612APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) - A method is presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.07-25-2013
20130191096FLUID DISTRIBUTION METHOD FACILITATING COOLING OF ELECTRONICS RACK(S) AND SIMULATING HEATED AIRFLOW EXHAUST OF ELECTRONICS RACK(S) - Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.07-25-2013
20130340994CONTROLLED COOLING OF AN ELECTRONIC SYSTEM FOR REDUCED ENERGY CONSUMPTION - Energy efficient control of a cooling system cooling an electronic system is provided. The control includes automatically determining at least one adjusted control setting for at least one adjustable cooling component of a cooling system cooling the electronic system. The automatically determining is based, at least in part, on power being consumed by the cooling system and temperature of a heat sink to which heat extracted by the cooling system is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on one or more experimentally obtained models relating the targeted temperature and power consumption of the one or more adjustable cooling components of the cooling system.12-26-2013
20130340995CONTROLLED COOLING OF AN ELECTRONIC SYSTEM FOR REDUCED ENERGY CONSUMPTION - Energy efficient control of a cooling system cooling an electronic system is provided. The control includes automatically determining at least one adjusted control setting for at least one adjustable cooling component of a cooling system cooling the electronic system. The automatically determining is based, at least in part, on power being consumed by the cooling system and temperature of a heat sink to which heat extracted by the cooling system is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on one or more experimentally obtained models relating the targeted temperature and power consumption of the one or more adjustable cooling components of the cooling system.12-26-2013
20130340996CONTROLLED COOLING OF AN ELECTRONIC SYSTEM BASED ON PROJECTED CONDITIONS - Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system.12-26-2013
20130343005THERMAL TRANSFER STRUCTURES COUPLING ELECTRONICS CARD(S) TO COOLANT-COOLED STRUCTURE(S) - Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.12-26-2013
20130345893CONTROLLED COOLING OF AN ELECTRONIC SYSTEM BASED ON PROJECTED CONDITIONS - Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system.12-26-2013
20140043759MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.02-13-2014
20140043760MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.02-13-2014
20140043761MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.02-13-2014
20140043762MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.02-13-2014
20140047702THERMAL EXPANSION-ENHANCED HEAT SINK FOR AN ELECTRONIC ASSEMBLY - A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.02-20-2014
20140048233HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).02-20-2014
20140048242HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).02-20-2014
20140049914DEHUMIDIFYING COOLING APPARATUS AND METHOD FOR AN ELECTRONICS RACK - Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.02-20-2014
20140049917DEHUMIDIFYING COOLING APPARATUS AND METHOD FOR AN ELECTRONICS RACK - Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.02-20-2014
20140049919HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).02-20-2014
20140053575CONTAMINANT SEPARATOR FOR A VAPOR-COMPRESSION REFRIGERATION APPARATUS - Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.02-27-2014
20140055949DEHUMIDIFYING COOLING APPARATUS AND METHOD FOR AN ELECTRONICS RACK - Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.02-27-2014
20140068942VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE - A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.03-13-2014
20140068943THERMOELECTRIC-ENHANCED AIR AND LIQUID COOLING OF AN ELECTRONIC SYSTEM - Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.03-13-2014
20140069111THERMOELECTRIC-ENHANCED AIR AND LIQUID COOLING OF AN ELECTRONIC SYSTEM - Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.03-13-2014
20140071626VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE - A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.03-13-2014
20140071627COOLANT DRIP FACILITATING PARTIAL IMMERSION-COOLING OF ELECTRONIC COMPONENTS - Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.03-13-2014
20140078674COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.03-20-2014
20140078675COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.03-20-2014
20140082942WICKING AND COUPLING ELEMENT(S) FACILITATING EVAPORATIVE COOLING OF COMPONENT(S) - A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.03-27-2014
20140085817IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.03-27-2014
20140085822WICKING AND COUPLING ELEMENT(S) FACILITATING EVAPORATIVE COOLING OF COMPONENT(S) - Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.03-27-2014
20140085823IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.03-27-2014
20140096386HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).04-10-2014
20140096387HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).04-10-2014
20140102668VAPOR-COMPRESSION REFRIGERATION APPARATUS WITH BACKUP AIR-COOLED HEAT SINK AND AUXILIARY REFRIGERANT HEATER - Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with a component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with a refrigerant loop, an air-cooled heat sink coupled to the refrigerant evaporator, for providing backup cooling to the electronic component in a backup, air cooling mode, and a controllable refrigerant heater coupled to the heat sink. The refrigerant heater is in thermal communication across the heat sink with refrigerant passing through the refrigerant evaporator, and is controlled in a primary, refrigeration cooling mode to apply an auxiliary heat load to refrigerant passing through the refrigerant evaporator to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.04-17-2014
20140102669COOLING METHOD WITH AUTOMATED SEASONAL FREEZE PROTECTION - An automated multi-fluid cooling method is provided for cooling an electronic component(s). The method includes obtaining a coolant loop, and providing a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.04-17-2014
20140102672COOLING SYSTEM WITH AUTOMATED SEASONAL FREEZE PROTECTION - An automated multi-fluid cooling system and method are provided for cooling an electronic component(s). The cooling system includes a coolant loop, a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.04-17-2014
20140123492PUMP-ENHANCED, SUB-COOLING OF IMMERSION-COOLING FLUID - A method of fabricating a cooling apparatus is provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.05-08-2014
20140123493SECTIONED MANIFOLDS FACILITATING PUMPED IMMERSION-COOLING OF ELECTRONIC COMPONENTS - Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.05-08-2014
20140124163GROUND-BASED HEAT SINK FACILITATING ELECTRONIC SYSTEM COOLING - Cooling systems and methods are provided which include a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.05-08-2014
20140124164GROUND-BASED HEAT SINK FACILITATING ELECTRONIC SYSTEM COOLING - Cooling methods are provided which include providing a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.05-08-2014
20140124167SECTIONED MANIFOLDS FACILITATING PUMPED IMMERSION-COOLING OF ELECTRONIC COMPONENTS - Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more components, a supply manifold, a return manifold, and a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.05-08-2014
20140124174PUMP-ENHANCED, SUB-COOLING OF IMMERSION-COOLING FLUID - Cooling apparatuses and methods of fabrication thereof are provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.05-08-2014
20140124189COOLANT-CONDITIONING UNIT WITH AUTOMATED CONTROL OF COOLANT FLOW VALVES - A coolant-conditioning unit is provided which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.05-08-2014
20140124190COOLANT-CONDITIONING UNIT WITH AUTOMATED CONTROL OF COOLANT FLOW VALVES - A method is provided which includes providing a coolant-conditioning unit which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.05-08-2014
20140126149SEPARATE CONTROL OF COOLANT FLOW THROUGH COOLANT CIRCUITS - Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.05-08-2014
20140126151SEPARATE CONTROL OF COOLANT FLOW THROUGH COOLANT CIRCUITS - Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.05-08-2014
20140133096AIR-COOLING AND VAPOR-CONDENSING DOOR ASSEMBLY - A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.05-15-2014
20140133099AIR-COOLING AND VAPOR-CONDENSING DOOR ASSEMBLY - A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.05-15-2014
20140146467IMMERSION-COOLED AND CONDUCTION-COOLED ELECTRONIC SYSTEM - A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.05-29-2014
20140146468IMMERSION-COOLED AND CONDUCTION-COOLED METHOD FOR ELECTRONIC SYSTEM - A method of facilitating cooling of an electronics board having a plurality of electronic components mounted to the board by providing an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.05-29-2014
20140158339THERMOSTAT-CONTROLLED COOLANT FLOW WITHIN A HEAT SINK - Cooling apparatuses and methods are presented for facilitating dissipation of heat generated by one or more electronic components. The apparatuses include, for instance, a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).06-12-2014
20140158341THERMOSTAT-CONTROLLED COOLANT FLOW WITHIN A HEAT SINK - Methods are presented for facilitating dissipation of heat generated by one or more electronic components. The methods include providing a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).06-12-2014
20140163764EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS - Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.06-12-2014
20140163767EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS - Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.06-12-2014
20140231061APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) - A method is presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.08-21-2014
20150036288VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the coolant exhaust.02-05-2015
20150062804VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust.03-05-2015
20150107801COOLANT-COOLED HEAT SINK CONFIGURED FOR ACCELERATING COOLANT FLOW - Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.04-23-2015
20150109728FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS - A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.04-23-2015
20150109729FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS AND SEPARABLE HEAT SINKS - Cooled electronic systems and cooling methods are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the electronic system. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into, for instance, one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink is configured and disposed to physically couple to the enclosure and facilitates rejection of heat from the fluid disposed within the compartment when the field-replaceable bank of electronic components is operatively inserted into the electronic system.04-23-2015
20150109730DIRECT COOLANT CONTACT VAPOR CONDENSING - Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser which includes a condenser housing with a condensing chamber accommodating the working fluid and coolant, which are in direct contact within the condensing chamber and are immiscible fluids. The condensing chamber includes a working fluid vapor layer and a working fluid liquid layer; and a working fluid vapor inlet facilitates flow of fluid vapor into the condensing chamber, and a working fluid vapor outlet facilitates egress of working fluid liquid from the condensing chamber. A coolant inlet structure facilitates ingress of coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing the vapor into working fluid liquid, and the coolant outlet structure facilitates subsequent egress of coolant from the condensing chamber.04-23-2015
20150109735PUMP-ENHANCED, IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) - Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.04-23-2015
20150114601FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.04-30-2015
20150114602FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.04-30-2015
20150116941FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.04-30-2015
20150138715THERMOELECTRIC-ENHANCED, LIQUID-BASED COOLING OF A MULTI-COMPONENT ELECTRONIC SYSTEM - Methods are provided for facilitating cooling of an electronic component. The methods include providing: a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.05-21-2015
20150351281PUMP-ENHANCED, IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) - Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.12-03-2015
20150359132FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS - A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.12-10-2015
20150359137COOLANT-COOLED HEAT SINK CONFIGURED FOR ACCELERATING COOLANT FLOW - Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.12-10-2015
20150359139LIQUID-COOLING APPARATUS WITH INTEGRATED COOLANT FILTER - Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.12-10-2015
20160088777EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS - Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.03-24-2016

Patent applications by Madhusudan K. Iyengar, Foster City, CA US

Madhusudan K. Iyengar, Santa Clara, CA US

Patent application numberDescriptionPublished
20160143192COOLANT AND AMBIENT TEMPERATURE CONTROL FOR CHILLERLESS LIQUID COOLED DATA CENTERS - Cooling control methods include measuring a temperature of at least one component of each of multiple nodes and finding a maximum component temperature across all such nodes, comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold, and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the nodes based on the comparisons.05-19-2016

Madhusudan Krishnan Iyengar, Foster City, CA US

Patent application numberDescriptionPublished
20150282389SERVER DEVICE COOLING SYSTEM - The principles described herein provide a server device having a cooling system that provides an efficient cooling of server device components. The cooling system can include a radiator block having air passageways that are oriented substantially orthogonal to the initial airflow path direction. In addition, the server device can include one or more baffles that create an airflow path that passes through the radiator block multiple times. Moreover, the server device can include various additional features that provide convenient access to electronic components within the server device without diminishing the effectiveness of the cooling system.10-01-2015
20150293566HIGH-DENSITY STORAGE SERVER CHASSIS - Technology is provided for a high-density storage server chassis. The storage server chassis comprises a frame and an opposed pair of support ledges disposed in the frame and positioned to support a storage device therebetween. The support ledges are disposed on corresponding partitions mounted in the frame. The support ledges include at least one protrusion positioned to space the storage device away from the support ledge thereby defining an air flow region between the storage device and the support ledge. The storage server chassis further comprises a retainer moveably attached to a corresponding partition and operative to retain a corresponding storage device in the frame, wherein the retainer is movable between an open position and a closed position.10-15-2015

Madurai Sriram Iyengar, Houston, TX US

Patent application numberDescriptionPublished
20150160951REMOTE LAUNCH OF APPLICATION ON MOBILE DEVICE - A system allows remotely launching an application on a remote device. The application uses a guided document to provide instructional or procedural information to a user of the mobile device. An administrator of the system may define one-time or recurring events that will cause the remote system to instruct the mobile device to launch the application with the guided document.06-11-2015

Mukundan Iyengar, Jersey City, NJ US

Patent application numberDescriptionPublished
20150026606SYSTEM AND FRAMEWORK FOR MULTI-DIMENSIONALLY VISUALIZING AND INTERACTING WITH LARGE DATA SETS - An apparatus and method for accessing and controlling data has a computer coupled to a display screen and to a source of a plurality of data items. The computer is programmed with a program having a graphical user interface that displays symbols on the display screen that represent the data items. The symbols may be displayed and colored in groups based upon the similarity of content of the data that the symbols represent. The content may also generate labels for the symbols. Lines extending between symbols graphically indicate the relatedness of the data that the symbols represent and the size of symbols may indicate the calculated relevance to user interests.01-22-2015

Nandakumar Iyengar, San Ramon, CA US

Patent application numberDescriptionPublished
20150120676AUTOMATICALLY PUBLISHING COURSE OFFERINGS FOR DIFFERENT TYPES OF COURSES ACCORDING TO A PLURALITY OF POLICIES AND EDUCATIONAL INSTITUTIONS - A method and apparatus for automatically publishing course offerings for different types of courses according to a plurality of policies and templates is presented herein. Instructors and/or administrators for a course create course records for each course that will be offered at a particular educational institution. The course record includes, and/or is associated with, data that indicates when the course will start, what assets should be published in the course offering, what template should be used, when a course is eligible to be automatically published, and/or when a course should be published by. When courses are eligible to be published, a controller determines what priority to assign each course. The controller manages a pool of course publishing processes to publish each course according to the policies and templates defined by each course's educational institution. The controller also notifies administrators when a course publishing process fails to publish a course.04-30-2015

Prahallad Iyengar, Mountain View, CA US

Patent application numberDescriptionPublished
20110298099SILICON DIOXIDE LAYER DEPOSITED WITH BDEAS - A silicon dioxide layer is deposited onto a substrate using a process gas comprising BDEAS and an oxygen-containing gas such as ozone. The silicon dioxide layer can be part of an etch-resistant stack that includes a resist layer. In another version, the silicon dioxide layer is deposited into through holes to form an oxide liner for through-silicon vias.12-08-2011
20120097330DUAL DELIVERY CHAMBER DESIGN - A substrate processing system includes a thermal processor or a plasma generator adjacent to a processing chamber. A first processing gas enters the thermal processor or plasma generator. The first processing gas then flows directly through a showerhead into the processing chamber. A second processing gas flows through a second flow path through the showerhead. The first and second processing gases are mixed below the showerhead and a layer of material is deposited on a substrate under the showerhead.04-26-2012

Prahallad Iyengar, Sunnyvale, CA US

Patent application numberDescriptionPublished
20150260352LED BULB WITH CHASSIS FOR PASSIVE CONVECTIVE LIQUID COOLING - A light emitting diode (LED) bulb includes a base, a shell connected to the base forming an enclosed volume, a chassis disposed within the shell, and a plurality of LEDs disposed with the shell. The LED bulb also includes a thermally conductive liquid disposed within the enclosed volume. The LEDs and the chassis are immersed in the thermally conductive liquid. The chassis has a first opening and a second opening. The second opening is spaced from the first opening to facilitate a passive convective flow of the thermally conductive liquid to exchange a first volume of the thermally conductive liquid interior the chassis with a second volume of the thermally conductive liquid exterior the chassis.09-17-2015
20150260353LIQUID-FILLED LED BULB HAVING A UNIFORM LIGHT-DISTRIBUTION PROFILE - An LED bulb includes a base and a shell connected to the base. The shell is filled with a thermally conductive liquid for cooling the bulb. A plurality of LEDs is disposed within the shell. A first set of LEDs of the plurality of LEDs is positioned a first distance with respect to the center of a convex portion of the shell, and at a first angle with respect to a centerline of the LED bulb. A second set of LEDs of the plurality of LEDs is positioned a second distance with respect to the center of the convex portion of the shell, and at a second angle with respect to a centerline of the LED bulb. The first distance, first angle, second distance, and second angle are selected such that the LED bulb has a light-distribution profile that varies less than 20 percent in light intensity over 0 degrees to 135 degrees as measured from an axis from the center of the shell through an apex of the shell.09-17-2015

Prashanth Iyengar, Irvine, CA US

Patent application numberDescriptionPublished
20130274571HYPERSATURATION INDEX - Embodiments of the present disclosure provide a hypersaturation index for measuring a patient's absorption of oxygen in the blood stream after a patient has reached 100% oxygen saturation. This hypersaturation index provides an indication of the partial pressure of oxygen of a patient. In an embodiment of the present invention, a hypersaturation index is calculated based on the absorption ratio of two different wavelengths of energy at a measuring site. In an embodiment of the invention, a maximum hypersaturation index threshold is determined such that an alarm is triggered when the hypersaturation index reaches or exceeds the threshold. In another embodiment, an alarm is triggered when the hypersaturation index reaches or falls below its starting point when it was first calculated.10-17-2013
20160000362HYPERSATURATION INDEX - Embodiments of the present disclosure provide a hypersaturation index for measuring a patient's absorption of oxygen in the blood stream after a patient has reached 100% oxygen saturation. This hypersaturation index provides an indication of the partial pressure of oxygen of a patient. In an embodiment of the present invention, a hypersaturation index is calculated based on the absorption ratio of two different wavelengths of energy at a measuring site. In an embodiment of the invention, a maximum hypersaturation index threshold is determined such that an alarm is triggered when the hypersaturation index reaches or exceeds the threshold. In another embodiment, an alarm is triggered when the hypersaturation index reaches or falls below its starting point when it was first calculated.01-07-2016

Puneeth Iyengar, Houston, TX US

Patent application numberDescriptionPublished
20090011438Collagen VI and Cancer - Methods of determining whether a cancer is progressing by measuring surface-bound collagen VIα3 are provided. Also provided are methods of identifying hyperplasia in a tissue by measuring surface-bound collagen VIα3. Additionally, methods of identifying carcinoma in a tissue by measuring surface-bound collagen VIα3 are provided. Further provided are methods of imaging carcinoma in a tissue by staining the tissue with a specific binding partner to collagen VIα3. Methods of treating a cancer by preventing binding of collagen VIα3 onto cells of the cancer are additionally provided.01-08-2009

Rahul Iyengar, Union City, CA US

Patent application numberDescriptionPublished
20130109349MOBILE IDENTITY VERIFICATION05-02-2013
20150052554GEOGRAPHIC CONTENT RECOMMENDATION - Geographic context may be used to recommend media content items for consumption by users of a media content management system. A request for a media content recommendation may be associated with a content management account and a geographic location. The media content management system may determine whether the geographic location includes individuals who are not associated with the content management account. If the geographic location includes such individuals, the system may recommend content suitable for sharing such as games, music playlists, movies, or television programs.02-19-2015
20150058903GEOGRAPHIC CONTENT RECOMMENDATION - Geographic context may be used to recommend media content items for consumption by users of a media content management system. A request for a media content recommendation may be associated with a content management account and a geographic location. The media content management system may determine whether the geographic location includes individuals who are not associated with the content management account. If the geographic location includes such individuals, the system may recommend content suitable for sharing such as games, music playlists, movies, or television programs.02-26-2015
20160112482CAMERA CAPTURE FOR CONNECTED DEVICES - Techniques and mechanisms described herein facilitate the capture and coordination of audio and/or video data across connected devices in a communications system. The communications system may include at least two media devices in communication via a network. One of the media devices may be a media application device configured to provide one or more media applications. Another of the media devices may be a media input device configured to capture video and/or audio data. Coordination between a media application and a media input device may be facilitated by a driver layer configured to communicate with the applications.04-21-2016

Patent applications by Rahul Iyengar, Union City, CA US

Rajesh Iyengar, West Newton, MA US

Patent application numberDescriptionPublished
20090281050ANTI-BACTERIAL ACTIVITY OF 9-HYDROXY DERIVATIVES OF 6,11-BICYCLOLIDES - The present invention discloses compounds of formula (I) or pharmaceutically acceptable salts, esters, or prodrugs thereof:11-12-2009
20130231298ANTI-BACTERIAL ACTIVITY OF 9-HYDROXY DERIVATIVES OF 6,11-BICYCLOLIDES - The present invention discloses compounds of formula (I) or pharmaceutically acceptable salts, esters, or prodrugs thereof:09-05-2013
20150274712sGC STIMULATORS - Compounds of Formula I are described. They are useful as stimulators of sGC, particularly NO-independent, heme-dependent stimulators. These compounds may be useful for treating, preventing or managing various disorders that are herein disclosed.10-01-2015

Patent applications by Rajesh Iyengar, West Newton, MA US

Rajesh R. Iyengar, Newton, MA US

Patent application numberDescriptionPublished
20080312282Inhibitors of Diacylglycerol O-acyltransferase Type 1 Enzyme - The present invention relates to compounds of formula (I):12-18-2008

Rajesh R. Iyengar, West Newton, MA US

Patent application numberDescriptionPublished
20120184516sGC Stimulators - Compounds of Formula I are described. They are useful as stimulators of sGC, particularly NO-independent, heme-dependent stimulators. These compounds may be useful for treating, preventing or managing various disorders that are herein disclosed.07-19-2012
20120238581INHIBITORS OF DIACYLGLYCEROL O-ACYLTRANSFERASE TYPE 1 ENZYME - Compounds of formula (I), or a pharmaceutically acceptable salt, prodrug, salt of a prodrug, or a combination thereof.09-20-2012
20140323448sGC STIMULATORS - Compounds of Formula I are described. They are useful as stimulators of sGC, particularly NO-independent, heme-dependent stimulators. These compounds may be useful for treating, preventing or managing various disorders that are herein disclosed.10-30-2014
201500183532-BENZYL, 3-(PYRIMIDIN-2-YL) SUBSTITUTED PYRAZOLES USEFUL AS SGC STIMULATORS - Compound of Table I are described. They are useful as stimulators of sGC, particularly NO-independent, heme-dependent stimulators. These compounds may be useful for treating, preventing or managing various disorders that are herein disclosed.01-15-2015
201503429542-BENZYL, 3-(PYRIMIDIN-2-YL) SUBSTITUTED PYRAZOLES USEFUL AS SGC STIMULATORS - Compound of Table I are described. They are useful as stimulators of sGC, particularly NO-independent, heme-dependent stimulators. These compounds may be useful for treating, preventing or managing various disorders that are herein disclosed.12-03-2015
20160031903sGC STIMULATORS - Compounds of Formulae I′ and I are described, which are useful as stimulators of sGC, particularly NO-independent, heme-dependent stimulators. These compounds are also useful for treating, preventing or managing various disorders that are herein disclosed.02-04-2016

Patent applications by Rajesh R. Iyengar, West Newton, MA US

Ramanujam Iyengar, Holmdel, NJ US

Patent application numberDescriptionPublished
20150127364Preauthorization Management System - A preauthorization management system. The preauthorization management system allows a health care provider to submit a preauthorization request and track the status of the preauthorization request until a final determination is reached. Once a request has been submitted, the preauthorization management system monitors the status of the request until a final disposition is reached. The preauthorization management system documents the submission and determination process to provide a record that may be used to show an event or outcome occurred. The preauthorization management system offers a simplified and uniform system for managing preauthorization for health care services that reduces or eliminates the need for health care providers to learn diverse systems and procedures of a multitude of health insurance providers.05-07-2015
20150242955Preauthorization Knowledgebase System - A preauthorization knowledgebase system. The preauthorization knowledgebase system parses relevant information from an order submitted by a health care provider and compares that information against a set of rules used to determine whether preauthorization is required for a medical service specified in the order. The rules are arranged into various hierarchical levels from payer level to procedure level. Even if the order is incomplete, the preauthorization knowledgebase system checks as many of the hierarchical levels as possible with the information provided. The preauthorization knowledgebase system returns a result indicating whether preauthorization is required for the order and, optionally, the hierarchical level(s) requiring preauthorization.08-27-2015

Rangaraju Iyengar, Morgan Hill, CA US

Patent application numberDescriptionPublished
20140372744Bootstrapping From A Remote Disk Image Via A Network - A method of bootstrapping from a remote image file comprising loading, by a processor, an initial bootloader, employing the initial bootloader to download a final bootloader from the remote image file via a network, employing the final bootloader to mount the remote image file as a block device, downloading a kernel and root file system mounting data from the remote image, and executing the kernel to bootstrap the processor based on the root file system mounting data.12-18-2014

Rashmi Keshava Iyengar, San Diego, CA US

Patent application numberDescriptionPublished
20130225145OPTIMIZING SIGNALING LOAD OVERHEAD AND BATTERY CONSUMPTION FOR BACKGROUND APPLICATIONS - The disclosure relates to managing applications configured for execution on a mobile device. An embodiment of the disclosure receives one or more network access requests from one or more applications executing on the mobile device, determines that the mobile device is operating in a background mode, suppresses transmission to a network of the one or more network access requests to a network based on the determination, and transmits a subset of the one or more network access requests upon transition out of the background mode.08-29-2013
20150186158ADAPTIVE HARDWARE RECONFIGURATION OF CONFIGURABLE CO-PROCESSOR CORES FOR HARDWARE OPTIMIZATION OF FUNCTIONALITY BLOCKS BASED ON USE CASE PREDICTION, AND RELATED METHODS, CIRCUITS, AND COMPUTER-READABLE MEDIA - Adaptive hardware reconfiguration of configurable co-processor cores for hardware optimization of functionality blocks based on use case prediction, and related methods, circuits, and computer-readable media are disclosed. In one embodiment, an indication of one or more applications for possible execution is received. Execution probabilities for respective ones of the one or more applications are received. One or more mappings of the one or more applications to one or more functionality blocks is accessed, and a net benefit of hardware reconfiguration of one or more configurable co-processor cores of a multicore central processing unit for the one or more functionality blocks is calculated based on the execution probabilities and the mappings. An optimal hardware reconfiguration is determined based on a current hardware configuration and the calculated net benefit. The configurable co-processor cores are reconfigured based on the optimal hardware reconfiguration.07-02-2015
20160094608Proactive TCP Connection Stall Recovery for HTTP Streaming Content Requests - Methods, devices, systems, and non-transitory computer-readable storage media for improving the reception of data at a computing device by proactively utilizing new TCP connections in response to identifying that TCP connections have stalled. In an embodiment, a processor of the computing device may perform operations including monitoring a status of requests via a plurality of TCP connections, identifying a stalled TCP connection having a missing request based on the monitoring, wherein the stalled TCP connection is configured to utilize a first network interface and access a first data source, evaluating other TCP connections to determine whether the other TCP connections stall using the first network interface or when accessing the first data source; identifying a second network interface and a second data source based on the evaluating, and reissuing the missing request with a new TCP connection configured to use the second network interface and access the second data source.03-31-2016

Patent applications by Rashmi Keshava Iyengar, San Diego, CA US

Ravi Iyengar, Austin, TX US

Patent application numberDescriptionPublished
20140258687MICRO-OPS INCLUDING PACKED SOURCE AND DESTINATION FIELDS - A method and apparatus for register packing prior to register renaming in a microprocessor are provided. The method includes: receiving a plurality of micro operations (micro-ops) decoded from one or more instructions; packing a plurality of registers which are included in the micro-ops into a packed register structure including a plurality of packed registers based on a preset number of rename ports of a renamer through which the packed registers are read or written for register renaming; and sending the packed registers for register renaming.09-11-2014
20140281393REORDER-BUFFER-BASED STATIC CHECKPOINTING FOR RENAME TABLE REBUILDING - Out-of-order CPUs, devices and methods diminish the time penalty from stalling the pipe to rebuild a rename table, such as due to a misprediction. A microprocessor can include a pipe that has a decoder, a dispatcher, and at least one execution unit. A rename table stores rename data, and a check-point table (“CPT”) stores rename data received from the dispatcher. A Re-Order Buffer (“ROB”) stores ROB data, and has a static mapping relationship with the CPT. If the rename table is flushed, such as due to a misprediction, the rename table is rebuilt at least in part by concurrent copying of rename data stored in the CPT, in coordination with walking the ROB.09-18-2014
20140281404SYSTEM AND METHOD TO CLEAR AND REBUILD DEPENDENCIES - A data processing system and method of clearing and rebuilding dependencies, the data processing method including changing a counter associated with a first entry in response to selecting a second entry; comparing the counter with a threshold; and indicating that the first entry is ready to be selected in response to comparing the counter with the threshold; wherein the first entry is dependent on the second entry.09-18-2014
20140281414REORDER-BUFFER-BASED DYNAMIC CHECKPOINTING FOR RENAME TABLE REBUILDING - Out-of-order CPUs, devices and methods diminish the time penalty from stalling the pipe to rebuild a rename table, such as due to a misprediction. A microprocessor can include a pipe that has a decoder, a dispatcher, and at least one execution unit. A rename table stores rename data, and a check-point table (“CPT”) stores rename data received from the dispatcher. A Re-Order Buffer (“ROB”) stores ROB data, and has a dynamic mapping relationship with the CPT. If the rename table is flushed, such as due to a misprediction, the rename table is rebuilt at least in part by concurrent copying of rename data stored in the CPT, in coordination with walking the ROB.09-18-2014
20140281415DYNAMIC RENAME BASED REGISTER RECONFIGURATION OF A VECTOR REGISTER FILE - Reconfiguring a register file using a rename table having a plurality of fields that indicate fracture information about a source register of an instruction for instructions which have narrow to wide dependencies.09-18-2014
20140281431EFFICIENT WAY TO CANCEL SPECULATIVE 'SOURCE READY' IN SCHEDULER FOR DIRECT AND NESTED DEPENDENT INSTRUCTIONS - A method and apparatus for simultaneously canceling a dependent instruction and a nested dependent instruction when a cancel timer of a source of the dependent instruction and a cancel timer of a source of the nested dependent instruction expire and a producer instruction speculatively waking up the dependent instruction is canceled.09-18-2014

Shrivaths Iyengar, Redmond, WA US

Patent application numberDescriptionPublished
20140214976SYSTEMS AND METHODS OF AUTOMATICALLY ORDERING AND SELECTING RECIPIENTS FOR ELECTRONIC MAIL - Systems and techniques of providing suggestions for email recipients to a user who is composing an email communications are disclosed herein. In one embodiment, a user may register a plurality of email accounts with an email application. Once an email account is registered with the email application, contact data from each such registered email account may be received. In another embodiment, if the user employs a plurality of devices from which the user composes and/or sends email communications, device-specific contact information may also be received. Relevance metrics may be applied to such suggestions depending upon the contact data received from the various email accounts. Dynamic correction factor may be applied to such relevance metrics—e.g., a decay factor, decrement factor or the like that may or may not be time dependent.07-31-2014

Sridhar R. Iyengar, Portland, OR US

Patent application numberDescriptionPublished
20140331237PLATFORM INDEPENDENT ISA EMULATOR AS MIDDLEWARE - A hardware/software architecture cars include a high-level software stack on which a plurality of software applications are executing, an underlying hardware platform having a hardware platform type, and a middleware layer residing between the high-level software stack and the underlying hardware platform and configured to allow two or more of the plurality of software applications to interact with each other independent of the hardware platform type.11-06-2014

Srinath S. Iyengar, Louisville, KY US

Patent application numberDescriptionPublished
20110093289MEDICARE PHARMACY CALCULATOR II - A method and apparatus for providing a Medicare Part D Pharmacy Benefits Calculator. A computer user inputs data for prescriptions to be purchased by a prospective insured for a plan period. The prescription data includes a quantity, a days supply, and a number of fills. The data for each prescription the user enters is used to calculate anticipated out-of-pocket costs for the prescriptions for one or more pharmacy benefits plans available to the prospective insured. The cost data is presented to the user in a way that illustrates how out-of-pocket costs will vary over the course of a plan period. The user may view costs for alternative drugs and alternatives sources of drugs. The user may vary and expand the presentation of the cost data to better understand the available plan benefits. The invention helps prospective insureds decide among alternative Medicare Part D pharmacy benefits plans offered by one or more insurance companies.04-21-2011

Srinivasan Iyengar, Round Rock, TX US

Patent application numberDescriptionPublished
20100333050ANALOG/DIGITAL PARTITIONING OF CIRCUIT DESIGNS FOR SIMULATION - For increasing user control and insight into preparing a mixed-signal semiconductor design specification for simulation, there are provided methods responsive to commands that provide control over resolution of disciplines and partitioning of the design into analog and digital portions. In some aspects, the methods provide block-based assignment of disciplines, as well as design partitioning. In other aspects, the methods provide for resolving a discipline to apply in a block from among multiple possible disciplines. In some aspects, error flagging may be available for detecting disciplines different from what provided for assignment in a block. Assignments may be indicated based on instance, cell, terminal, or library names and may be specified with wild cards. In still other aspects, the methods may be embodied by instructions on computer readable media, and in systems comprising general and special purpose computer hardware that may communicate with various storage facilities and over various networks.12-30-2010
20130326440ANALOG/DIGITAL PARTITIONING OF CIRCUIT DESIGNS FOR SIMULATION - For increasing user control and insight into preparing a mixed semiconductor design specification for simulation, there are provided methods responsive to commands that provide control over resolution of disciplines and partitioning of the design into analog and digital portions. In some aspects, the methods provide block-based assignments of disciplines, as well as design partitioning. In other aspects, the methods provide for resolving a discipline to apply in a block from among multiple possible disciplines. In some aspects, error flagging may be available for detecting disciplines different from what provided for assignment in a block. Assignments may be indicated based on instance, cell, terminal, or library names and may be specified with wild cards. In still other aspects, the methods may be embodied by instructions on computer readable media, and in systems comprising general and special purpose computer hardware that may communicate with various storage facilities and over various networks.12-05-2013

Patent applications by Srinivasan Iyengar, Round Rock, TX US

Srinivasan R. Iyengar, Fremont, CA US

Patent application numberDescriptionPublished
20110131379PROCESSOR AND METHOD FOR WRITEBACK BUFFER REUSE - A processor may include a writeback configured to perform a first writeback operation to store corresponding writeback data back to a lower-level memory upon eviction of the writeback data, and a writeback buffer configured to store the writeback data after the writeback data has been evicted from the writeback cache and before the writeback data has been sent to the lower-level memory. After the writeback data has been sent from the writeback buffer to the lower-level memory, and before the lower-level memory has acknowledged completion of the first writeback operation, the writeback cache may perform a second writeback operation to store different writeback data in the writeback buffer in response to eviction of the different writeback data, such that a total size of the writeback data for the concurrently outstanding writeback operations exceeds a total size of writeback data that the writeback buffer is capable of concurrently storing.06-02-2011
20110185125RESOURCE SHARING TO REDUCE IMPLEMENTATION COSTS IN A MULTICORE PROCESSOR - A processor may include several processor cores, each including a respective higher-level cache; a lower-level cache including several tag units each including several controllers, where each controller corresponds to a respective cache bank configured to store data, and where the controllers are concurrently operable to access their respective cache banks; and an interconnect network configured to convey data between the cores and the lower-level cache. The controllers may share access to an interconnect egress port coupled to the interconnect network, and may generate multiple concurrent requests to convey data via the shared port, where each of the requests is destined for a corresponding core, and where a datapath width of the port is less than a combined width of the multiple requests. The given tag unit may arbitrate among the controllers for access to the shared port, such that the requests are transmitted to corresponding cores serially rather than concurrently.07-28-2011
20120239883RESOURCE SHARING TO REDUCE IMPLEMENTATION COSTS IN A MULTICORE PROCESSOR - A processor may include several processor cores, each including a respective higher-level cache; a lower-level cache including several tag units each including several controllers, where each controller corresponds to a respective cache bank configured to store data, and where the controllers are concurrently operable to access their respective cache banks; and an interconnect network configured to convey data between the cores and the lower-level cache. The controllers in a given tag unit may share access to a resource that may include one or more of an interconnect egress port coupled to the interconnect network, an interconnect ingress port coupled to the interconnect network, a test controller, or a data storage structure.09-20-2012

S.s. Iyengar, Davie, FL US

Patent application numberDescriptionPublished
20150310671SYSTEMS AND METHODS FOR AUGMENTED REALITY INTERACTION - An augmented reality system is described that comprises a movable object comprising an object hardware component; a control hardware component for wirelessly transmitting and receiving signals via a communication link to the object hardware component; and a software component stored on a non-transitory computer-readable medium and in operable communication with the control hardware component. An application user interface is provided for enabling a user to provide command input for controlling the movement of the movable object via the object hardware component.10-29-2015

Sujatha Iyengar, Northborough, MA US

Patent application numberDescriptionPublished
20120167481ABRASIVE PARTICLES HAVING PARTICULAR SHAPES AND METHODS OF FORMING SUCH PARTICLES - An abrasive article includes a shaped abrasive particle including a body having a first height (h07-05-2012
20130236725ABRASIVE PARTICLES HAVING COMPLEX SHAPES AND METHODS OF FORMING SAME - An abrasive grain is disclosed and may include a body. The body may define a length (l), a height (h), and a width (w). In a particular aspect, the length is greater than or equal to the height and the height is greater than or equal to the width. Further, in a particular aspect, the body may include a primary aspect ratio defined by the ratio of length:height of at least about 2:1. The body may also include an upright orientation probability of at least about 50%.09-12-2013
20140007518ABRASIVE PARTICLES HAVING PARTICULAR SHAPES AND METHODS OF FORMING SUCH PARTICLES - A shaped abrasive particle including a body having a length (l), a width (w), and a height (hi), wherein the height is at least about 28% of the width, and a percent flashing (f) of at least about 10% and not greater than about 45% for a total side area of the body.01-09-2014
20140106126ABRASIVE PARTICLES HAVING PARTICULAR SHAPES AND METHODS OF FORMING SUCH PARTICLES - An abrasive article comprising a first group including a plurality of shaped abrasive particles overlying a backing, wherein the plurality of shaped abrasive particles of the first group define a first non-shadowing distribution relative to each other.04-17-2014
20140182217ABRASIVE PARTICLES HAVING COMPLEX SHAPES AND METHODS OF FORMING SAME - An abrasive grain is disclosed and may include a body. The body may define a length (l), a height (h), and a width (w). In a particular aspect, the length is greater than or equal to the height and the height is greater than or equal to the width. Further, in a particular aspect, the body may include a primary aspect ratio defined by the ratio of length:height of at least about 2:1. The body may also include an upright orientation probability of at least about 50%.07-03-2014
20140325916ABRASIVE PARTICLES HAVING PARTICULAR SHAPES AND METHODS OF FORMING SUCH PARTICLES - An abrasive article includes a shaped abrasive particle including a body having a first height (h1) at a first end of the body defining a corner between an upper surface, a first side surface, and a second side surface, and a second height (h2) at a second end of the body opposite the first end defining an edge between the upper surface and a third side surface, wherein the average difference in height between the first height and the second height is at least about 50 microns. The body also includes a bottom surface defining a bottom area (A11-06-2014
20150068130ABRASIVE ARTICLE INCLUDING SHAPED ABRASIVE PARTICLES - A shaped abrasive particle having a major surface-to-side surface grinding orientation percent difference (MSGPD) of at least about 40%.03-12-2015
20150183089ABRASIVE ARTICLE INCLUDING SHAPED ABRASIVE PARTICLES - A fixed abrasive article including a blend of abrasive particles having a first type of shaped abrasive particle comprising a first height (h07-02-2015
20150291865ABRASIVE ARTICLE INCLUDING SHAPED ABRASIVE PARTICLES - A shaped abrasive particle including a body having a first major surface, a second major surface, and a side surface extending between the first major surface and the second major surface, wherein the body includes a sharpness-shape-strength factor (3SF) within a range between about 0.7 and about 1.7 and a Shape Index within a range between at least about 0.51 and not greater than about 0.99.10-15-2015
20150343603METHOD OF USING AN ABRASIVE ARTICLE INCLUDING SHAPED ABRASIVE PARTICLES - A method of removing material from one or more workpieces including moving a coated abrasive article having a plurality of shaped abrasive particles relative to a surface of the one or more workpieces at high material removal rates.12-03-2015
20160090516ABRASIVE PARTICLES HAVING COMPLEX SHAPES AND METHODS OF FORMING SAME - An abrasive grain is disclosed and may include a body. The body may define a length (l), a height (h), and a width (w). In a particular aspect, the length is greater than or equal to the height and the height is greater than or equal to the width. Further, in a particular aspect, the body may include a primary aspect ratio defined by the ratio of length:height of at least about 2:1. The body may also include an upright orientation probability of at least about 50%.03-31-2016

Patent applications by Sujatha Iyengar, Northborough, MA US

Sundaraja Sitaram Iyengar, Miami, FL US

Patent application numberDescriptionPublished
20110288396Device to directly monitor intra ocular pressure by a person based on pattern and colour changes - A Device which enables a person to see for himself changes in Intra Ocular Pressure when he looks at his eye in the Mirror, in the routine course of everyday, as every one likes to see his Own face and eyes in the Mirror everyday. The device being Tiny and inserted surgically with minimum incision between Iris and Cornea, enables early indication of IOP in people with high risk of Glaucoma due to high blood pressure and genetic reasons and old age, the early indication enabling timely treatment before retinal damage. The device works on pattern changes due to pressure change which is compared with fixed background pattern and changes in spacing between lines of Diffraction grating and Hologram leading to colour changes due to interference effect of light. Mirror with an area of concave surface and Magnifying device along with comparison Chart enables proper monitoring of drug efficacy.11-24-2011

Sundaravarathan R. Iyengar, Federal Way, WA US

Patent application numberDescriptionPublished
20120331310Increasing Power Efficiency Of Turbo Mode Operation In A Processor - In one embodiment, a processor has multiple cores to execute threads. The processor further includes a power control logic to enable entry into a turbo mode based on a comparison between a threshold and value of a counter that stores a count of core power and performance combinations that identify turbo mode requests of at least one of the threads. In this way, turbo mode may be entered at a utilization level of the processor that provides for high power efficiency. Other embodiments are described and claimed.12-27-2012
20130007475EFFICIENT FREQUENCY BOOST OPERATION - Systems and methods of operating a computing system may involve identifying a plurality of state values, wherein each state value corresponds to a computing thread associated with a processor. An average value can be determined for the plurality of state values, wherein a determination may be made as to whether to grant a frequency boost request based at least in part on the average value.01-03-2013
20130179703Increasing Power Efficiency Of Turbo Mode Operation In A Processor - In one embodiment, a processor has multiple cores to execute threads. The processor further includes a power control logic to enable entry into a turbo mode based on a comparison between a threshold and value of a counter that stores a count of core power and performance combinations that identify turbo mode requests of at least one of the threads. In this way, turbo mode may be entered at a utilization level of the processor that provides for high power efficiency. Other embodiments are described and claimed.07-11-2013
20140149774INCREASING POWER EFFICIENCY OF TURBO MODE OPERATION IN A PROCESSOR - In one embodiment, a processor has multiple cores to execute threads. The processor further includes a power control logic to enable entry into a turbo mode based on a comparison between a threshold and value of a counter that stores a count of core power and performance combinations that identify turbo mode requests of at least one of the threads. In this way, turbo mode may be entered at a utilization level of the processor that provides for high power efficiency. Other embodiments are described and claimed.05-29-2014

Patent applications by Sundaravarathan R. Iyengar, Federal Way, WA US

Swati Iyengar, Sunnyvale, CA US

Patent application numberDescriptionPublished
20090276603TECHNIQUES FOR EFFICIENT DATALOADS INTO PARTITIONED TABLES - Techniques for efficiently loading data into a partition of a partitioned table of a database are provided. Data is stored in a swap table and the high water mark of the swap table has been reset prior to storing the data. The swap table is swapped with the partition. After the swap, the swap table becomes the partition of the partitioned table and the partition of the partitioned table becomes the swap table, and the swap table is truncated to reset the high water mark of the swap table.11-05-2009

Vardarajan R. Iyengar, Macomb, MI US

Patent application numberDescriptionPublished
20090014681Magnetorheological fluid with a fluorocarbon thickener - A magnetorheological fluid formulation comprising magnetizable particles dispersed in carrier fluid and a thixotropic agent wherein the thixotropic agent comprises a fluorocarbon grease.01-15-2009

Patent applications by Vardarajan R. Iyengar, Macomb, MI US

Vasu Iyengar, Pleasanton, CA US

Patent application numberDescriptionPublished
20130332157AUDIO NOISE ESTIMATION AND AUDIO NOISE REDUCTION USING MULTIPLE MICROPHONES - Digital signal processing techniques for automatically reducing audible noise from a sound recording that contains speech. A noise suppression system uses two types of noise estimators, including a more aggressive one and less aggressive one. Decisions are made on how to select or combine their outputs into a usable noise estimate in a different speech and noise conditions. A 2-channel noise estimator is described. Other embodiments are also described and claimed.12-12-2013
20150221322THRESHOLD ADAPTATION IN TWO-CHANNEL NOISE ESTIMATION AND VOICE ACTIVITY DETECTION - A method for adapting a threshold used in multi-channel audio voice activity detection. Strengths of primary and secondary sound pick up channels are computed. A separation, being a measure of difference between the strengths of the primary and secondary channels, is also computed. An analysis of the peaks in separation is performed, e.g. using a leaky peak capture function that captures a peak in the separation and then decays over time, or using a sliding window min-max detector. A threshold that is to be used in a voice activity detection (VAD) process is adjusted, in accordance with the analysis of the peaks. Other embodiments are also described and claimed.08-06-2015
20150325251SYSTEM AND METHOD FOR AUDIO NOISE PROCESSING AND NOISE REDUCTION - Electronic system for audio noise processing and noise reduction comprises: first and second noise estimators, selector and attenuator. First noise estimator processes first audio signal from voice beamformer (VB) and generate first noise estimate. VB generates first audio signal by beamforming audio signals from first and second audio pick-up channels. Second noise estimator processes first and second audio signal from noise beamformer (NB), in parallel with first noise estimator and generates second noise estimate. NB generates second audio signal by beamforming audio signals from first and second audio pick-up channels. First and second audio signals include frequencies in first and second frequency regions. Selector's output noise estimate may be a) second noise estimate in the first frequency region, and b) first noise estimate in the second frequency region. Attenuator attenuates first audio signal in accordance with output noise estimate. Other embodiments are also described.11-12-2015
20150334489MICROPHONE PARTIAL OCCLUSION DETECTOR - Digital signal processing for microphone partial occlusion detection is described. In one embodiment, an electronic system for audio noise processing and for noise reduction, using a plurality of microphones, includes a first noise estimator to process a first audio signal from a first one of the microphones, and generate a first noise estimate. The electronic system also includes a second noise estimator to process the first audio signal, and a second audio signal from a second one of the microphones, in parallel with the first noise estimator, and generate a second noise estimate. A microphone partial occlusion detector determines a low frequency band separation of the first and second audio signals and a high frequency band separation of the first and second audio signals to generate a microphone partial occlusion function that indicates whether one of the microphones is partially occluded.11-19-2015
20150341722METHODS AND DEVICES FOR REVERBERATION SUPPRESSION - In one embodiment, a process for suppressing reverberation begins with a device of a user obtaining a reverberant speech signal from a voice of the user. The device determines a first estimated reverberation component of the reverberant speech signal. The device generates a first de-reverberated output signal with a first reverberation suppression based on the reverberant speech signal and the first estimated reverberation component. Then, the device generates a second improved reverberation component using the first de-reverberated output signal. The device generates a second de-reverberated output signal with a second reverberation suppression based on the reverberant speech signal and the second improved reverberation component.11-26-2015
20160127535SYSTEM AND METHOD OF DOUBLE TALK DETECTION WITH ACOUSTIC ECHO AND NOISE CONTROL - System of improving sound quality includes loudspeaker, microphone, accelerometer, acoustic-echo-cancellers (AEC), and double-talk detector (DTD). Loudspeaker outputs loudspeaker signal including downlink audio signal from far-end speaker. Microphone generates microphone uplink signal and receives at least one of: near-end speaker, ambient noise, and loudspeaker signals. Accelerometer generates accelerometer-uplink signal and receives at least one of: near-end speaker, ambient noise, and loudspeaker signals. First AEC receives downlink audio, microphone-uplink and double talk control signals, and generates AEC-microphone linear echo estimate and corrected AEC-microphone uplink signal. Second AEC receives downlink audio, accelerometer uplink and double talk control signals, and generates AEC-accelerometer linear echo estimate and corrected AEC-accelerometer uplink signal. DTD receives downlink audio signal, uplink signals, corrected uplink signals, linear echo estimates, and generates double-talk control signal. Uplink audio signal including at least one of corrected microphone-uplink signal and corrected accelerometer-uplink signal is generated. Other embodiments are described.05-05-2016

Patent applications by Vasu Iyengar, Pleasanton, CA US

Vasu Iyengar, Shrewsbury, MA US

Patent application numberDescriptionPublished
20120076311Dynamic Gain Adjustment Based on Signal to Ambient Noise Level - Methods and apparatuses for deriving a signal-to-noise ratio based at least in part on a measured level of a signal carrying far-end speech, and a measured level of a signal carrying ambient acoustic noise; determining a target gain adjustment based at least in part on the derived signal-to-noise ratio; applying the target gain adjustment to the signal carrying far-end speech to produce a gain-adjusted signal; and providing the gain-adjusted signal for audio output from a communications device.03-29-2012
20120076312Noise Level Estimator - Methods and apparatuses for comparing a level of a signal carrying ambient acoustic noise with a threshold level; and based on results of the comparison, ignoring time intervals identified as noise burst in estimating ambient noise levels.03-29-2012
20120076320Fine/Coarse Gain Adjustment - Methods and apparatuses for deriving a signal-to-noise ratio based at least in part on a measured level of a signal carrying far-end speech, and a measured level of a signal carrying ambient acoustic noise, determining a target gain adjustment based at least in part on the derived signal-to-noise ratio, including determining a coarse gain adjustment and a fine gain adjustment, the target gain adjustment corresponding to a combination of the coarse gain adjustment and the fine gain adjustment, applying the coarse gain adjustment to the signal carrying far-end speech using first gain adjustment circuitry to produce a first gain-adjusted signal, applying the fine gain adjustment to the signal carrying far-end speech using second gain adjustment circuitry to produce a second gain-adjusted signal, and providing a result of combining the first gain-adjusted signal and the second gain-adjusted signal to audio output from a wireless communications device.03-29-2012
20120076321Single Microphone for Noise Rejection and Noise Measurement - A microphone includes a sensing element having two opposing sides; and a housing including a first acoustic port having an external-facing portion defined in part by a first aperture located on a first housing side and an internal-facing portion defined in part by a first cavity within the housing, the first cavity being coupled to a first side of the element; and a second acoustic port having an external-facing portion defined in part by a second aperture located on the first housing side and an internal-facing portion defined in part by a second cavity within the housing, the second cavity being coupled to a second side of the element. The ports are spaced apart at a distance such that a level of an electrical response by the element to an ambient acoustic noise at 50 dB A-weighted sound pressure level exceeds an internal electrical noise level of the element.03-29-2012
20120253798Rejecting Noise with Paired Microphones - A system for combining signals includes a first microphone generating a first input signal having a first voice component and a first noise component, a second microphone generating a second input signal having a second voice component and a second noise component, a mixing circuit, and an adaptive filter. The mixing circuit applies a first gain having a value α to the first input signal to produce a first scaled signal, applies a second gain having a value 1−α to the second input signal to produce a second scaled signal, and sums the first scaled signal and the second scaled signal to produce a summed signal. The adaptive filter computes an updated value of α to minimize the energy of the summed signal based on the summed signal, the first input signal and the second input signal, and provides the updated value of α to the mixing circuit.10-04-2012

Vasu S. Iyengar, Plainsboro, NJ US

Patent application numberDescriptionPublished
20090008443Information Storage Tag System for Use and Method - Medical information storage tags to be carried on a person have two separate data storage devices on a base. Each has a data reader or reader/writer interface. Read only data storage identifies the bearer and provides vital medical information required for emergency treatment; it can be accessed by a data reader only, preferably with a printer. A read and write data storage area prerecords encrypted medical history data using industry standard formats that can be amended or deleted. Access to the read and write data storage is restricted to designated users by security means. Both data areas provide personal identification of the bearer name and address, a photo of the bearer, name and contact information to reach the bearer's doctors and next of kin. Both areas may also include financial and insurance information. Means is provided for forwarding data from ambulance to a designated receiving hospital, such as a radio link.01-08-2009

Veneeth Iyengar, Miami, FL US

Patent application numberDescriptionPublished
20110288396Device to directly monitor intra ocular pressure by a person based on pattern and colour changes - A Device which enables a person to see for himself changes in Intra Ocular Pressure when he looks at his eye in the Mirror, in the routine course of everyday, as every one likes to see his Own face and eyes in the Mirror everyday. The device being Tiny and inserted surgically with minimum incision between Iris and Cornea, enables early indication of IOP in people with high risk of Glaucoma due to high blood pressure and genetic reasons and old age, the early indication enabling timely treatment before retinal damage. The device works on pattern changes due to pressure change which is compared with fixed background pattern and changes in spacing between lines of Diffraction grating and Hologram leading to colour changes due to interference effect of light. Mirror with an area of concave surface and Magnifying device along with comparison Chart enables proper monitoring of drug efficacy.11-24-2011

Vikram N. Iyengar, San Antonio, TX US

Patent application numberDescriptionPublished
20130035842Fueling Systems, Methods And Apparatus For An Internal Combustion Engine - The present disclosure provides a method to operate an internal combustion engine comprising storing a fueling command map having fueling index values, each of the fueling index values defining values for a plurality of fueling parameters, and a plurality of predetermined non-linear relationships that directly relate fueling index values to in-cylinder oxygen mass values; determining a temporary fueling index value; determining an in-cylinder oxygen mass value; identifying a predetermined relationship that directly relates fueling index values to in-cylinder oxygen mass values from the plurality of predetermined relationships to provide an identified predetermined relationship; determining that a current relationship of the temporary fueling index value to the calculated oxygen mass value differs from the identified predetermined relationship; and adjusting the temporary fueling index value using at least one fueling correction model to provide a revised fueling index value that approaches the identified predetermined relationship.02-07-2013

Vinay Iyengar, Cupertino, CA US

Patent application numberDescriptionPublished
20140085958Pre-Computation Based Ternary Content Addressable Memory - A pre-computation based TCAM configured to reduce the number of match lines being pre-charged during a search operation to save power is disclosed. The pre-computation based TCAM stores additional information in a secondary TCAM that can be used to determine which match lines in a primary TCAM storing data words to be searched need not be pre-charged because they are associated with data words guaranteed to not match. The additional information stored in secondary TCAM can include a pre-computation word that represents a range inclusive of a lower and upper bound of a number of ones or zeroes possible in a corresponding data word stored in the primary TCAM.03-27-2014
20150235701Pre-Computation Based Ternary Content Addressable Memory - A pre-computation based TCAM configured to reduce the number of match lines being pre-charged during a search operation to save power is disclosed. The pre-computation based TCAM stores additional information in a secondary TCAM that can be used to determine which match lines in a primary TCAM storing data words to be searched need not be pre-charged because they are associated with data words guaranteed to riot match. The additional information stored in secondary TCAM can include a pre-computation word that represents a range inclusive of a lower and upper bound of a number of ones or zeroes possible in a corresponding data word stored in the primary TCAM.08-20-2015
Website © 2016 Advameg, Inc.