| Patent application number | Description | Published |
|---|
| 20110286582 | IMAGING SYSTEM AND CONTROL METHOD THEREFOR - An imaging system includes a plurality of imaging apparatuses, each of the imaging apparatuses includes a detector for performing an imaging operation for outputting image data corresponding to applied radiation or light and a controller for controlling the operation of the detector. The imaging apparatuses can independently perform an imaging operation and are movable in accordance with a relative positional relationship thereof. Sensing means obtain information indicative of the relative positional relationship between the imaging apparatuses. A control computer sends a control signal for determining operations of the imaging apparatuses to the controller. The control computer determines the operations of the imaging apparatuses by using the information obtained from the sensing means; and sets an appropriate scanning direction of each of the imaging apparatuses in accordance with the positional relationship thereof. | 11-24-2011 |
| 20120075600 | IMAGING APPARATUS, IMAGING SYSTEM, AND METHOD FOR CONTROLLING IMAGING APPARATUS - An imaging apparatus includes a detector in which a plurality of pixels are arranged in a matrix; each pixel includes a conversion element that converts radiation or light into an electric charge. The detector performs an exposure imaging operation for outputting exposure image data, a correction imaging operation for outputting correction image data, and a correction imaging preparation operation including an initialization operation for initializing the conversion element between the exposure imaging operation and the correction imaging operation. A correction unit corrects the exposure image data using the correction image data; and a control unit controls the operation of the detector so that the detector performs the initialization operation based on an amount of variation in offset of the conversion element at the time of transitioning from an exposure imaging preparation operation to the exposure imaging operation. | 03-29-2012 |
| 20120127353 | IMAGE-PICKUP SYSTEM AND METHOD OF CONTROLLING SAME - An image-pickup apparatus including a detector comprising a detecting unit and a reading circuit, the detecting unit including pixels, each of which including a conversion element, the reading circuit which includes a connecting unit that is electrically connected to a signal wire transferring an electric signal and that electrically connects the signal wire to a node, and which performs a reading operation to output the electric signal from the pixel. A control unit controls an operation of the reading circuit, and a sensing unit senses the end of radiation irradiation based on an output of the reading circuit, which is acquired during the period of an accumulation operation of the detector. The control unit starts establishing the electrical connection between the signal wire and the node through the connecting unit based on the sensed irradiation end, and retains the electrical connection until the start of the reading operation. | 05-24-2012 |
| 20120241634 | IMAGE PICKUP APPARATUS, IMAGE PICKUP SYSTEM, AND METHOD OF CONTROLLING THEM - In an image pickup apparatus, a detector includes a detection unit and a driving circuit; the detection unit including a plurality of pixels each including a conversion element having a semiconductor layer, and the driving circuit being configured to drive the detection unit whereby the detector performs an image pickup operation to output the electric signal. A power supply unit supplies a voltage to the conversion element. A control unit controls the power supply unit such that the voltage applied to the semiconductor layer is higher in at least part of a period from the start of supplying the voltage to the semiconductor layer from the power supply unit to the start of the image pickup operation than in the image pickup operation. | 09-27-2012 |
| 20120241639 | IMAGE PICKUP APPARATUS, IMAGE PICKUP SYSTEM, AND METHOD FOR CONTROLLING THE SAME - An image pickup apparatus includes a detector that includes a detection unit having a plurality of pixels in which conversion elements are included and a driving circuit that drives the detection unit and that executes an image pickup operation for outputting electrical signals, and a temperature control unit that includes a heating section that heats the conversion elements and that controls, before the image pickup operation begins, the temperature of the conversion elements by controlling the heating section such that the heating section heats the conversion elements in order to cause the temperature of the conversion elements before the image pickup operation begins to be higher than the temperature of the conversion elements during the image pickup operation. | 09-27-2012 |
| 20120242871 | IMAGE PICKUP APPARATUS, IMAGE PICKUP SYSTEM, AND METHOD OF CONTROLLING THEM - In an image pickup apparatus, a calculation unit calculates an amount of noise and an amount of afterimage that can be included in an electric signal or image data in an image pickup operation, based on output characteristic information indicating a manner in which the amount of noise and the amount of after image change as a function of an elapsed time since a voltage is applied to a detection unit, a temperature of the detection unit detected by a temperature detection unit, the voltage supplied to the conversion elements from a power supply unit, and an image pickup operation start time indicating a time elapsed since the supplying of the voltage to the detection unit is started until the image pickup operation is started to output the electric signal corresponding to an electric charge generated by the conversion element in the detection unit. | 09-27-2012 |
| 20130082166 | IMAGING APPARATUS, IMAGING SYSTEM, AND METHOD FOR CONTROLLING IMAGING APPARATUS - An imaging apparatus includes a detector having a plurality of conversion elements for converting radiation or light into an electric charge, a power supply unit that supplies a first voltage to the conversion element in a first imaging operation, and a control unit that controls the detector and the power supply unit. During a period between the first imaging operation and a second imaging operation, the control unit controls to perform a first inter-imaging operation in which a second voltage different from the first voltage is supplied to the conversion element, and, subsequently to the first inter-imaging operation, a second inter-imaging operation in which a third voltage different from the first and the second voltages is supplied to the conversion element. The absolute value of the difference between the third and the first voltages is smaller than the absolute value of the difference between the second and the first voltages. | 04-04-2013 |
| 20130169784 | IMAGE PICKUP APPARATUS, IMAGE PICKUP SYSTEM, AND METHOD FOR CONTROLLING IMAGE PICKUP APPARATUS - An image pickup apparatus includes a detector and an image processing unit. The detector executes image pickup operations in which electrical signals based on radiation are output and executes, in a period between a first image pickup operation and a second image pickup operation, a first inter-image pickup operation for suppressing a lag generated by the first image pickup operation and a second inter-image pickup operation for obtaining dark signals from the detector after the first inter-image pickup operation. The signal processing unit calculates a correction coefficient using a first time ts, a second time te, and the dark signals, predicts an amount of offset to be included in electrical signals of the second image pickup operation using a third time ts′, a fourth time te′, and the correction coefficient, and executes calculation using the electrical signals and the amount of offset output from the detector in the second image pickup operation. | 07-04-2013 |
| 20130240712 | RADIATION IMAGING APPARATUS AND IMAGING SYSTEM - A radiation imaging apparatus, comprising an imaging unit in which a plurality of pixels are arranged to form a plurality of rows and a plurality of columns, and a control unit configured to control the imaging unit so as to perform reset operation for initializing each of the plurality of pixels repeatedly, and readout operation, after the reset operation, for reading out a signal from each of the plurality of pixels sequentially, wherein one cycle length of the reset operation is shorter than a period of time required for the readout operation, and a pulse width of a signal supplied to each of the plurality of pixels in the reset operation is shorter than a pulse width of a signal supplied to each of the plurality of pixels in the readout operation. | 09-19-2013 |
| 20130264487 | RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD FOR CONTROLLING THE RADIATION IMAGING APPARATUS - A radiation imaging apparatus includes plural pixels arranged in a matrix each including a conversion element and a switch element, plural drive wires arranged in a column direction, a drive circuit configured to sequentially supply a conduction voltage to the plural drive wires and supply a non-conduction voltage to the drive wires other than the drive wire supplied with the conduction voltage among the plural drive wires, and a sensing unit configured to sense radiation irradiation to the pixel, in which the sensing unit includes a sensing circuit configured to sense the radiation irradiation to the pixel on the basis of a current flowing through the drive wire supplied with the non-conduction voltage among the plurality of drive wires. | 10-10-2013 |
| 20130264488 | RADIATION IMAGING APPARATUS, METHOD OF CONTROLLING THE SAME, AND RADIATION IMAGING SYSTEM - A radiation imaging apparatus including pixels; driving lines; a driving circuit; bias lines; an acquisition unit configured to acquire an evaluation value based on a current flowing in the bias line; a determination unit configured to compare the evaluation value with a comparison target value to determine whether radiation is irradiated; a control unit configured to control the acquisition unit and the determination unit; and a storage unit configured to store the evaluation value used in the determination process, is provided. A comparison target value used in a given determination process is based on one or more evaluation values used in one or more determination processes which are performed before the given determination process and in which it is determined that radiation has not been irradiated. | 10-10-2013 |
| 20130264489 | RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND CONTROL METHOD FOR THE RADIATION IMAGING APPARATUS - A radiation imaging apparatus includes a pixel array including a plurality of pixels arranged in a matrix in which each pixel includes a conversion element configured to convert radiation into a charge and a switch element configured to transfer an electric signal based on the charge, a bias wiring through which the conversion element is supplied with a voltage for the conversion element to convert the radiation into the charge, a power supply unit configured to supply the voltage to the bias wiring; and a detecting unit configured to detect start of radiation irradiation to the pixel array, in which the detecting unit includes a detecting circuit configured to detect the start of the radiation irradiation to the pixel array on the basis of a comparison result through computation on at least two currents flowing through at least two bias wirings among the plurality of bias wirings. | 10-10-2013 |
| 20130264490 | RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND CONTROL METHOD FOR THE RADIATION IMAGING APPARATUS - A radiation imaging apparatus includes a pixel array including a plurality of pixels arranged in a matrix in which each pixel includes a conversion element configured to convert radiation into a charge and a switch element configured to transfer an electric signal based on the charge, a plurality of wirings arranged in the pixel array, and a detecting unit configured to detect radiation irradiation to the pixel array, in which the detecting unit includes a detecting circuit configured to detect the radiation irradiation to the pixel array on the basis of a plurality of currents flowing through the plurality of wirings detected for each of the plurality of wirings. | 10-10-2013 |
| 20140008519 | METHOD FOR CONTROLLING RADIATION IMAGE PICKUP APPARATUS, RADIATION IMAGE PICKUP APPARATUS, AND RADIATION IMAGE PICKUP SYSTEM - A radiation image pickup apparatus capable of setting an optimum threshold value used for instantaneously and highly accurately detecting the presence/absence of irradiation includes a pixel array having a plurality of pixels arranged in a matrix, where each of the pixels includes a conversion element and a switch element, a drive circuit for supplying a drive signal for controlling the switch element between a conducting state and a non-conducting state, a detection unit for outputting a detection signal varying with the intensity of irradiation of the pixel array, and an arithmetic unit for calculating an end threshold value used to detect end of irradiation on the basis of the signal output from the detection unit during a period of time during which irradiation is applied to the pixel array in which the switch elements of the pixels are set in a non-conducting state by the drive circuit. | 01-09-2014 |
| 20140008544 | METHOD FOR CONTROLLING RADIATION IMAGE PICKUP APPARATUS, RADIATION IMAGE PICKUP APPARATUS, AND RADIATION IMAGE PICKUP SYSTEM - A radiation image pickup apparatus includes a pixel array having pixels each including a conversion element and a switch element, a drive circuit for controlling the switch element between a conducting state and a non-conducting state, a detection unit for outputting a detection signal varying with the intensity of irradiation of the pixel array, and an arithmetic unit for calculating a start threshold value used to detect start of irradiation based on the signal output from the detection unit during a period when radiation is not emitted onto the pixel array in which the switch elements are sequentially set in a conducting state on a row-by-row basis by the drive circuit and the signal output from the detection unit during a period when radiation is emitted onto the pixel array in which the switch elements are sequentially set in a conducting state on a row-by-row basis by the drive circuit. | 01-09-2014 |
| 20140014845 | IMAGE-PICKUP SYSTEM AND METHOD OF CONTROLLING SAME - An image-pickup apparatus including a detector comprising a detecting unit and a reading circuit, the detecting unit including pixels, each of which including a conversion element, the reading circuit which includes a connecting unit that is electrically connected to a signal wire transferring an electric signal and that electrically connects the signal wire to a node, and which performs a reading operation to output the electric signal from the pixel. A control unit controls an operation of the reading circuit, and a sensing unit senses the end of radiation irradiation based on an output of the reading circuit, which is acquired during the period of an accumulation operation of the detector. The control unit starts establishing the electrical connection between the signal wire and the node through the connecting unit based on the sensed irradiation end, and retains the electrical connection until the start of the reading operation. | 01-16-2014 |
| 20140042329 | RADIOGRAPHIC APPARATUS AND RADIOGRAPHIC SYSTEM - A radiographic apparatus includes a scintillator configured to convert radiation into first light, a photoelectric conversion unit including a plurality of photoelectric conversion elements each configured to convert the first light into an electrical signal, and a light detection unit configured to detect the first light. In such a radiographic apparatus, the photoelectric conversion unit and the light detection unit are arranged to sandwich the scintillator therebetween, and the light detection unit includes a light guide plate, a photodetector arranged on a side face of the light guide plate, and a light reflection section arranged to reflect the first light toward the photodetector. | 02-13-2014 |
| 20140061488 | RADIATION IMAGING APPARATUS AND RADIATION IMAGING SYSTEM - A radiation imaging apparatus comprises: a detector that includes a detection unit in which pixels having a conversion element that converts radiation to an electric charge are arranged in a matrix shape, a drive circuit that drives the detection unit, and a read circuit that outputs an electric signal corresponding to the electric charge as image data; a radiation detection unit that detects a radiation irradiation state at a plurality of positions in the detection unit; and a control unit that controls operations of the drive circuit and the read circuit in accordance with a detection result obtained by the radiation detection unit, wherein the radiation detection unit detects a radiation irradiation state at least at a center region and a peripheral region in the detection unit, and a detection capability at the center region is set to a higher capability than a detection capability at the peripheral region. | 03-06-2014 |
| 20140061491 | RADIATION IMAGING APPARATUS, METHOD FOR CONTROLLING THE SAME, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM - A radiation imaging apparatus, comprising a sensor array in which a plurality of sensors configured to output signals corresponding to irradiated radiation, a detection unit configured to detect radiation, a driving unit configured to drive the sensor array, so as to initialize the plurality of sensors for each row repeatedly at least until the detection unit detects irradiation of radiation and to read out signals from the plurality of sensors for each row sequentially, and a processing unit configured to process signals from the sensor array, so as to correct a signal from the sensor on a row, of the plurality of sensors, which has been initialized during the irradiation of radiation, based on a timing of the initialization. | 03-06-2014 |
| 20140061492 | RADIATION IMAGING APPARATUS AND RADIATION IMAGING SYSTEM - To provide a radiation imaging apparatus and a radiation imaging system that can detect radiation with high accuracy, the radiation imaging apparatus includes: a detection unit in which conversion elements that convert radiation into an electric signal are arranged in a matrix shape; a radiation detection unit configured to detect an irradiation state of radiation; a drive circuit configured to drive the detection unit in accordance with the irradiation state detected by the radiation detection unit; and a radiographing kind setting unit configured to set a radiographing kind, wherein the radiation detection unit changes a radiation detection capability in accordance with the radiographing kind set by the radiographing kind setting unit. | 03-06-2014 |
| 20140061494 | RADIATION IMAGING APPARATUS AND RADIATION IMAGING SYSTEM - A radiation imaging apparatus including: a detector that includes a detection section in which pixels having a conversion element that converts radiation to an electric charge are arranged in a matrix shape, a drive circuit configured to drive the detection section, and a read circuit configured to output an electric signal that corresponds to the electric charge as image data; a radiation detection unit configured to detect a radiation irradiation state using two detection units that are adjacently arranged in the detection section; and a control unit configured to control operations of the drive circuit and the read circuit in accordance with a detection result obtained by the radiation detection unit, wherein a detection capability by one of the detection units is set to a lower capability than a detection capability at by the other of the detection units. | 03-06-2014 |
| 20140061495 | RADIATION IMAGING APPARATUS, METHOD FOR DRIVING THE SAME AND RADIATION IMAGING SYSTEM - A radiation imaging apparatus, comprising a sensor array configured to output a signal in accordance with irradiated radiation, a driving unit configured to output a signal from the sensor array by driving the sensor array, a detecting unit configured to detect irradiated radiation, a control unit configured to control the driving unit to perform first readout to read out a signal corresponding to charge accumulated in the sensor array from the sensor array and perform second readout to further read out a signal from the sensor array at least in a case where the first readout has started during irradiation of radiation, and a processing unit configured to correct the signal obtained by the first readout based on the signal obtained by the second readout. | 03-06-2014 |
| Patent application number | Description | Published |
|---|
| 20110070533 | PHOTOMASK BLANK, PHOTOMASK , AND METHOD FOR MANUFACTURING PHOTOMASK BLANK - The present invention provides a photomask blank used for producing a photomask to which an ArF excimer laser light is applied, wherein: a light-shielding film is provided on a light transmissive substrate; the light-shielding film has a laminated structure in which a back-surface antireflection layer, a light-shielding layer and a front-surface antireflection layer are laminated in this order from the side close to the light transmissive substrate; the thickness of the entire light-shielding film is 70 nm or less; the back-surface antireflection layer is made of a film containing a metal and has a first etching rate; the front-surface antireflection layer is made of a film containing a metal and has a third etching rate; the light-shielding layer is made of a film containing the same metal as that contained in the back-surface antireflection layer or the front-surface antireflection layer and has a second etching rate that is lower than the first etching rate and the third etching rate; and the thickness of the light-shielding layer is 45% or less of the thickness of the entire light-shielding film. | 03-24-2011 |
| 20110081605 | PHOTOMASK BLANK AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a photomask blank in which a light-shielding film consisting of a plurality of layers is provided on a light transmissive substrate, wherein a layer that is provided to be closest to the front surface is made of CrO, CrON, CrN, CrOC or CrOCN, and wherein the atom number density of the front-surface portion of the light-shielding film is 9×10 | 04-07-2011 |
| 20110104592 | PHOTOMASK BLANK, PHOTOMASK, AND METHOD FOR MANUFACTURING PHOTOMASK BLANK - The present invention provides a photomask blank used for producing a photomask to which an ArF excimer laser light is applied, wherein: a light-shielding film is provided on a light transmissive substrate; the light-shielding film has a laminated structure in which a back-surface antireflection layer, a light-shielding layer and a front-surface antireflection layer are laminated in this order from the side close to the light transmissive substrate; the thickness of the entire light-shielding film is 60 nm or less; the back-surface antireflection layer is made of a film containing a metal and has a first etching rate; the front-surface antireflection layer is made of a film containing a metal and has a third etching rate; the light-shielding layer is made of a film containing the same metal as that contained in the back-surface antireflection layer or the front-surface antireflection layer and has a second etching rate that is lower than the first etching rate and the third etching rate; and the thickness of the light-shielding layer is 30% or less of the thickness of the entire light-shielding film. | 05-05-2011 |
| 20110111332 | PHASE SHIFT MASK BLANK AND PHASE SHIFT MASK - The present invention provides a photomask blank used for producing a photomask to which an ArF excimer laser light is applied, wherein: a light-shielding film is provided on a light transmissive substrate; the light-shielding film has a laminated structure in which a lower layer, an interlayer and an upper layer are laminated in this order from the side close to the light transmissive substrate; the thickness of the entire light-shielding film is 60 nm or less; the lower layer is made of a film containing a metal and has a first etching rate; the upper layer is made of a film containing a metal and has a third etching rate; the interlayer is made of a film containing the same metal as that contained in the lower layer or the upper layer and has a second etching rate that is lower than the first etching rate and the third etching rate; and the thickness of the interlayer is 30% or less of the thickness of the entire light-shielding film. | 05-12-2011 |
| 20110318674 | PHOTOMASK BLANK, PHOTOMASK, AND METHODS OF MANUFACTURING THE SAME - A photomask blank has a light shieldable film formed on a light transmitting substrate. The light shieldable film has a light shielding layer which is formed of molybdenum silicide metal containing molybdenum in a content greater than 20 atomic % and not greater than 40 atomic % and which has a thickness smaller than 40 nm, an antireflection layer formed on the light shielding layer in contact with the light shielding layer and formed of a molybdenum silicide compound containing at least one of oxygen and nitrogen, and a low reflection layer formed under the light shielding layer in contact with the light shielding layer. | 12-29-2011 |
| 20120100466 | MASK BLANK AND TRANSFER MASK - A mask blank and transfer mask that overcomes problems caused by an electromagnetic field (EMF) effect when the DRAM half pitch (hp) specified in semiconductor device design specifications is 32 nm or less. The mask blank is used in manufacturing a transfer mask to which ArF exposure light is applied, and includes a light shielding film | 04-26-2012 |
| 20120100470 | MASK BLANK, TRANSFER MASK, AND METHOD OF MANUFACTURING A TRANSFER MASK - Provided is a mask blank which enables EB defect correction to be suitably applied and which further enables a reduction in the thickness of a light-shielding film. A mask blank | 04-26-2012 |
| 20140322634 | MASK BLACK, TRANSFER MASK, METHOD OF MANUFACTURING A TRANSFER MASK, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A mask blank for manufacturing a transfer mask adapted to be applied with ArF excimer laser exposure light that has a transparent substrate and a light-shielding film formed into a transfer pattern. The light-shielding film has at least two-layers, one a lower layer composed mainly of a first material containing a transition metal, silicon, and nitrogen, and the other an upper layer composed mainly of a second material containing a transition metal, silicon, and nitrogen. A ratio of a first etching rate of the lower layer to a second etching rate of the upper layer is 1.0 or more and 5.0 or less in etching carried out by supplying a fluorine-containing substance onto a target portion and irradiating charged particles to the target portion. Another ratio satisfies the following formula CN≧−0.00526CMo2−0.640CMo+26.624. | 10-30-2014 |
| Patent application number | Description | Published |
|---|
| 20090057090 | HYDRAULIC MECHANISM FOR VEHICLE - A clutch hydraulic mechanism wherein the positional relationship between two cylinders is not varied, and a compact structure can be achieved. A see-saw member for transmitting motive power is provided between a second release cylinder and a first master cylinder and the first master cylinder and the second release cylinder are formed in the same cylinder block. This eliminates the need for adjusting the positions of the first master cylinder and the second release cylinder. In addition, it is possible to dispose the first master cylinder and the second release cylinder close to each other. | 03-05-2009 |
| 20090057092 | CLUTCH HYDRAULIC SYSTEM FOR VEHICLE AND HYDRAULIC SYSTEM - A clutch hydraulic system for a vehicle wherein it is possible to independently operate two systems, to increase the degree of freedom in designing, and to achieve a reduction in cost. A seesaw member for transmitting motive power is provided between a second release cylinder and a first master cylinder, the first master cylinder and a second hydraulic oil pipe communicate with each other through a large diameter hole and a small diameter hole provided as communicating passages through which oil flows. A reservoir tank is provided for reserving the oil for controlling the amounts of the oil in the hydraulic oil passage on the side of the first master cylinder and the amount of the oil in the hydraulic oil passage on the side of the second release cylinder is connected to a second master cylinder. | 03-05-2009 |
| 20090084208 | TRANSMISSION FOR VEHICLES - A shift position changing drive member for a transmission includes an arm member capable of turning around the axis of a shift spindle for drivingly turning a shift drum in response to the turning of the shift spindle wherein the shift drum is prevented from coming into a neutral position even if the shifting speed is stopped in midstream. A lost motion spring includes gripping portions gripping a pressing portion from both sides of a coil portion surrounding the shift spindle. An arm member of shift position changing drive member is provided with a pressure-receiving member which is gripped by both gripping portions in such a manner that when the turning member is turned, if, in response to the turning direction, the pressing portion abuts against one of the gripping portions for turning, the other of the gripping portions abuts against the pressure-receiving member. | 04-02-2009 |
| 20090088298 | CLUTCH CONTROL SYSTEM FOR SADDLE RIDING TYPE VEHICLE - A grip force of a driving wheel is maintained by identifying an actual condition of a motorcycle and controlling a clutch in a timely manner. A clutch control system includes a clutch, an actuator unit causing the clutch to engage or disengage, a rear wheel speed sensor, a front wheel speed sensor, a clutch lever sensor and a controller controlling a control motor based on a rear wheel speed and a front wheel speed. When the rear wheel speed is lower than the front wheel speed and an absolute value of a difference between the rear wheel speed and the front wheel speed is greater than a threshold value, the control motor is driven so as to reduce a transmission force of the clutch. When an operational amount of the clutch lever is greater than a threshold value, processing to reduce the transmission force of the clutch is suspended. | 04-02-2009 |
| 20090249914 | Shifting system for a motorcycle, and motorcycle incorporating same - A shifting system for a motorcycle includes a shift link mechanism for transmitting operational force during a gear shifting operation. The shift link mechanism is arranged between a shift spindle and a change pedal operated by a shifting movement. A motion capture mechanism is provided on the shift link mechanism so as to transmit the operational force from the change pedal to the shift spindle via an resilient member including a compressive coil spring. | 10-08-2009 |
| 20090266671 | CLUTCH OPERATION MECHANISM - A clutch operation mechanism wherein when a clutch is disengaged and engaged by manual operation or by operation of an actuator the one operation does not affect the other operation. The clutch operation mechanism includes a lever side lost mechanism which is disposed between a clutch lever and a turn-operating force transmitting member for interrupting, from the clutch lever side, an operated-force applied from the turn-operating force transmitting member by driving the electric motor when the clutch lever is not operated. A motor side lost mechanism is disposed between the electric motor and the turn-operating force transmitting member and interrupts, from the side of the electric motor, the operated-force applied from the turn-operating force transmitting member by operating the clutch lever when the electric motor is not operated. | 10-29-2009 |
| 20100050805 | TRANSMISSION OF VEHICLE - A transmission for a vehicle for performing a shift manipulation at a desired time while ensuring a favorable operation feeling. A lost motion member is arranged in a shift drive force transmitting mechanism arranged between a shift spindle and a shift drum, and a rotary position of the shift drum is resiliently held by a shift stopper mechanism in a state where one of a plurality of sear trains is established or in a neutral state. A state which allows a changeover operation of an established state of a plurality of gear trains due to an action of a shift drive force which is temporarily accumulated by a lost motion means and a state which interrupts the changeover operation can be changed over by a shift restricting mechanism which is provided as a part separate from a shift stopper mechanism. | 03-04-2010 |
| Patent application number | Description | Published |
|---|
| 20110186868 | LED PACKAGE - According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package. | 08-04-2011 |
| 20110186886 | LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package. | 08-04-2011 |
| 20110186900 | LED PACKAGE, METHOD FOR MANUFACTURING LED PACKAGE, AND PACKING MEMBER FOR LED PACKAGE - According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface. | 08-04-2011 |
| 20110186901 | LED PACKAGE - According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame. | 08-04-2011 |
| 20110193112 | LED MODULE - According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package. | 08-11-2011 |
| 20120080674 | LED PACKAGE - According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other. | 04-05-2012 |
| 20120132931 | LED MODULE - According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface. | 05-31-2012 |
| Patent application number | Description | Published |
|---|
| 20080199617 | SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM, AND STORAGE MEDIUM - In the present invention, a resist pattern size shrink liquid is applied onto a resist pattern of the substrate. The substrate is then heated, whereby a lower layer portion of the resist pattern size shrink liquid in contact with the front surface of the resist pattern is changed in quality to insoluble to pure water. An upper layer portion of the resist pattern size shrink liquid is then removed with the removing solution. In this removing step, a solution film of pure water is first formed on the substrate with the substrate at rest to dissolve the upper layer portion of the resist pattern size shrink liquid by the solution film of pure water. Pure water is then supplied to the substrate with the substrate being rotated to remove the upper layer portion of the resist pattern size shrink liquid from a top of the substrate. The substrate is then rotated to be dried. | 08-21-2008 |
| 20100040980 | METHOD AND APPARATUS FOR REFORMING FILM AND CONTROLLING SLIMMING AMOUNT THEREOF - In a film reforming method for reforming a film layer to be reformed by irradiating electron beams thereon, the electron beams are irradiated in a state where the film layer is cooled. Further, in a slimming amount controlling method for controlling a slimming amount of a resist film layer, the slimming amount thereof is controlled by the irradiation amount of electron beams irradiated thereon in a state where the resist film layer having a specified opening dimension is cooled. Furthermore, in a film reforming apparatus including a mounting unit for mounting thereon an object to be processed and an electron beam irradiating unit for irradiating electron beams on the object disposed on the mounting unit to thereby reform a film layer to be reformed, formed on an object, the electron beams are irradiated from the electron beam irradiating unit in a state where the film layer is cooled by a cooling unit provided in the mounting unit. | 02-18-2010 |
| 20100307683 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS - To improve the etch resistance of a resist pattern corresponding to an exposure light source with a short wavelength. | 12-09-2010 |
| 20110318925 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A substrate processing method includes applying electroless plating of CoWB onto a Cu interconnection line formed on a wafer W, and then performing a post-cleaning process by use of a cleaning liquid on the target substrate or wafer before a by-product is precipitated on the surface of the CoWB film formed by the electroless plating to cover the Cu interconnection line. | 12-29-2011 |
| 20120247516 | SUPERCRITICAL DRYING METHOD AND APPARATUS FOR SEMICONDUCTOR SUBSTRATES - According to one embodiment, a supercritical drying method comprises cleaning a semiconductor substrate with a chemical solution, rinsing the semiconductor substrate with pure water after the cleaning, changing a liquid covering a surface of the semiconductor substrate from the pure water to alcohol by supplying the alcohol to the surface after the rinsing, guiding the semiconductor substrate having the surface wetted with the alcohol into a chamber, discharging oxygen from the chamber by supplying an inert gas into the chamber, putting the alcohol into a supercritical state by increasing temperature in the chamber to a critical temperature of the alcohol or higher after the discharge of the oxygen, and discharging the alcohol from the chamber by lowering pressure in the chamber and changing the alcohol from the supercritical state to a gaseous state. The chamber contains SUS. An inner wall face of the chamber is subjected to electrolytic polishing. | 10-04-2012 |
| 20120304485 | SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUM - A substrate processing method and apparatus which can remove an anti-drying liquid, which has entered a three-dimensional pattern with recessed portions formed in a substrate, in a relatively short time. The substrate processing method includes the steps of: carrying a substrate, having a three-dimensional pattern formed in a surface, into a processing container, said pattern being covered with an anti-drying liquid that has entered the recessed portions of the pattern; heating the substrate and supplying a pressurizing gas or a fluid in a high-pressure state into the processing container, thereby forming a high-pressure atmosphere in the processing container before the anti-drying liquid vaporizes to such an extent as to cause pattern collapse and bringing the anti-drying liquid into a high-pressure state while keeping the liquid in the recessed portions of the pattern; and thereafter discharging a fluid in a high-pressure state or a gaseous state from the processing container. | 12-06-2012 |
| 20130011555 | COATING APPARATUS AND COATING METHOD - The invention is a coating apparatus including: a substrate-holding part that holds a substrate horizontally; a chemical nozzle that supplies a chemical to a central portion of the substrate horizontally held by the substrate-holding part; a rotation mechanism that causes the substrate-holding part to rotate to thereby spread out the chemical on a surface of the substrate by centrifugal force, for coating the whole surface with the chemical; a gas-flow-forming unit that forms a down flow of an atmospheric gas on the surface of the substrate horizontally held by the substrate-holding part; a gas-discharging unit that discharges an atmosphere around the substrate; and a gas nozzle that supplies a laminar-flow-forming gas to the surface of the substrate, the laminar-flow-forming gas having a coefficient of kinematic viscosity larger than that of the atmospheric gas; wherein the atmospheric gas or the laminar-flow-forming gas are supplied to the central portion of the substrate. | 01-10-2013 |
| 20130019905 | SUPERCRITICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE AND SUPERCRITICAL DRYING APPARATUS - According to one embodiment, a supercritical drying method for a semiconductor substrate, comprises introducing the semiconductor substrate into a chamber in a state, a surface of the semiconductor substrate being wet with alcohol, substituting the alcohol on the semiconductor substrate with a supercritical fluid of carbon dioxide by impregnating the semiconductor substrate to the supercritical fluid in the chamber, and discharging the supercritical fluid and the alcohol from the chamber and reducing a pressure inside the chamber. The method further comprises performing a baking treatment by supplying an oxygen gas or an ozone gas to the chamber after the reduction of the pressure inside the chamber. | 01-24-2013 |
| 20130302525 | PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM - A plating apparatus includes a substrate holding/rotating device that holds/rotates a substrate; and a plating liquid supplying device that supplies a plating liquid onto the substrate. The plating liquid supplying device includes a supply tank that stores the plating liquid; a discharge nozzle that discharges the plating liquid onto the substrate; and a plating liquid supplying line through which the plating liquid of the supply tank is supplied into the discharge nozzle. Further, a first heating device is provided at either one of the supply tank and the plating liquid supplying line of the plating liquid supplying device, and heats the plating liquid to a first temperature. Furthermore, a second heating device is provided at the plating liquid supplying line between the first heating device and the discharge nozzle, and heats the plating liquid to a second temperature equal to or higher than the first temperature. | 11-14-2013 |
| 20140127410 | PLATING METHOD, PLATING APPARATUS AND STORAGE MEDIUM - A liquid displacement is performed by supplying a plating liquid onto a substrate | 05-08-2014 |
| 20140134345 | PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM - A plating apparatus of performing a plating process by supplying a plating liquid onto a substrate includes a substrate holding/rotating device configured to hold and rotate the substrate; a discharging device configured to discharge the plating liquid toward the substrate; a plating liquid supplying device configured to supply the plating liquid to the discharging device; and a controller configured to control the discharging device and the plating liquid supplying device. Further, the discharging device includes a first nozzle having a discharge opening, and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle. Furthermore, the plating liquid supplying device is configured to set a temperature of the plating liquid supplied to the first nozzle to be higher than a temperature of the plating liquid supplied to the second nozzle. | 05-15-2014 |
| 20140250714 | SUPERCRITICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE AND SUPERCRITICAL DRYING APPARATUS - According to one embodiment, a supercritical drying method for a semiconductor substrate, comprises introducing the semiconductor substrate into a chamber in a state, a surface of the semiconductor substrate being wet with alcohol, substituting the alcohol on the semiconductor substrate with a supercritical fluid of carbon dioxide by impregnating the semiconductor substrate to the supercritical fluid in the chamber, and discharging the supercritical fluid and the alcohol from the chamber and reducing a pressure inside the chamber. The method further comprises performing a baking treatment by supplying an oxygen gas or an ozone gas to the chamber after the reduction of the pressure inside the chamber. | 09-11-2014 |
| 20140356539 | PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM - A plating apparatus | 12-04-2014 |
| 20150030774 | PLATING METHOD, PLATING SYSTEM AND STORAGE MEDIUM - A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer | 01-29-2015 |
| 20150079785 | PLATING METHOD, PLATING SYSTEM AND STORAGE MEDIUM - A plating method can improve adhesivity with a substrate. The plating method of performing a plating process on the substrate includes forming a vacuum-deposited layer | 03-19-2015 |
| 20150099355 | PLATING APPARATUS, PLATING METHOD, AND STORAGE MEDIUM - A plating apparatus | 04-09-2015 |
| 20150147476 | PLATING METHOD, PLATING APPARATUS, AND STORAGE MEDIUM - A plating method can improve uniformity in a thickness of a plating layer formed on an inner surface of a recess. The plating method includes a loading process of loading the substrate in which the recess is formed into a casing; and a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess. The plating process includes a first plating process of supplying a first plating liquid to the substrate and forming a first plating layer; and a second plating process of supplying a second plating liquid to the substrate and forming a second plating layer on the first plating layer after the first plating process. Further, a concentration of an additive contained in the first plating liquid is different from a concentration of an additive contained in the second plating liquid. | 05-28-2015 |
| 20150232994 | PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM - A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus | 08-20-2015 |
| Patent application number | Description | Published |
|---|
| 20090220898 | PATTERN FORMING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME - The pattern forming method includes forming a catalyst film on a base layer having an uneven surface, wherein the catalyst layer is formed along the uneven surface of the base layer; forming a coating film by coating a fluid material on the catalyst film; forming an insoluble layer which is insoluble in a solvent in the coating film by reacting the coating film along the catalyst film; and maintaining the insoluble layer by removing an unreacted portion of the coating film by using the solvent. | 09-03-2009 |
| 20120132230 | Substrate Processing Apparatus, Substrate Processing Method, and Storage Medium - Disclosed is a substrate processing apparatus including a processing vessel in which a target substrate W is processed by using a high-pressure fluid in a supercritical state or a subcritical state, and pipes that are divided into a first pipe member and a second pipe member in a flowing direction of the fluid and circulate the fluid are connected to processing vessel. A connecting/disconnecting mechanism moves at least one of first and second pipe members between a connection position and a separation position of first pipe member and the second pipe member, and opening/closing valves are installed in each of first and second pipe members and are closed at the time of separating pipe members. | 05-31-2012 |
| 20120183909 | DEVELOPING TREATMENT METHOD - A developing treatment method includes: a treatment solution supplying step of supplying a treatment solution made by diluting a hydrophobizing agent hydrophobizing a resist pattern with hydrofluoroether onto a substrate on which a rinse solution has been supplied after development of the resist pattern; a hydrophobic treatment stabilizing step of stabilizing a hydrophobic treatment of the resist pattern with the supply of the treatment solution stopped and rotation of the substrate almost stopped; and a treatment solution removing step of removing the treatment solution from a top of the substrate on which the treatment solution has been supplied. The hydrophobizing agent is trimethylsilyldimethyl-amine. | 07-19-2012 |
| 20120328273 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD - Disclosed is a thermal processing apparatus and method that can acquire a high throughput and reduce the occupation area of the thermal processing apparatus. A wafer is heated by an LED module that irradiates infrared light corresponding to the absorption wavelength of the wafer, and therefore, the wafer can be rapidly heated. Since an LED is used as a heat source and a temperature rise of LED is small, a cooling process after the heating process can be performed in the same process area as the heating process area. As a result, an installation area of the thermal processing apparatus can be reduced. Since the time for moving between a heating process area and a cooling process area can be saved, a time required for a series of processes including the heating process and the subsequent cooling process can be shortened, thereby improving a throughput. | 12-27-2012 |
| 20140302242 | PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM HAVING PLATING PROGRAM STORED THEREON - A plating apparatus | 10-09-2014 |
| 20150096490 | APPARATUS FOR PLATING PROCESS - An apparatus for a plating process includes: an outer chamber; an inner chamber covered by the outer chamber; a rotatable holding mechanism configured to hold a substrate horizontally and installed in the inner chamber; a fluid supply unit configured to supply a plating solution to a preset position on the substrate; a gas supply device configured to generate a nonreactive gas and control a temperature of the nonreactive gas; a gas supply hole configured to supply the nonreactive gas into the outer chamber and provided in a top surface of the outer chamber; a plurality of gas inlet openings provided at a sidewall of the inner chamber and spaced apart at equal distances; and a rectifying plate disposed above the substrate and below the plurality of gas inlet openings inside the inner chamber, the rectifying plate having a plurality of rectifying holes uniformly disposed in the rectifying plate. | 04-09-2015 |
| 20150140209 | PRE-TREATMENT METHOD FOR PLATING AND STORAGE MEDIUM - A pre-treatment method for plating can form a plating layer having sufficient adhesivity on an inner surface of a recess and on a surface of a substrate at an outside of the recess even when the recess has a high aspect ratio. The pre-treatment method for plating includes a preparation process of preparing the substrate having the recess; a first coupling layer forming process of forming a first coupling layer 21 | 05-21-2015 |
| 20150140816 | PRE-TREATMENT METHOD FOR PLATING AND STORAGE MEDIUM - Catalytic metal nanoparticles can be attached on a base. A pre-treatment method for plating includes a catalytic particle-containing film forming process of forming a catalytic particle-containing film on a surface of a substrate by supplying, onto the substrate, a catalytic particle solution which is prepared by dispersing the catalytic metal nanoparticles and a dispersing agent in a solvent containing water; a first heating process of removing moisture contained at least in the catalytic particle-containing film by heating the substrate to a first temperature; and a second heating process of polymerizing the dispersing agent to have a sheet shape by heating the substrate to a second temperature higher than the first temperature after the first heating process and fixing the catalytic metal nanoparticles on a base layer by covering the catalytic metal nanoparticles with the sheet-shaped dispersing agent. | 05-21-2015 |
| 20150218702 | ELECTROLESS PLATING METHOD, ELECTROLESS PLATING APPARATUS AND STORAGE MEDIUM - A multiple number of accurately-patterned metal layers can be formed on a substrate. On a substrate | 08-06-2015 |
| Patent application number | Description | Published |
|---|
| 20090219345 | METHOD OF MANUFACTURING A LIQUID JET HEAD AND A LIQUID JET APPARATUS - A method of manufacturing a liquid jet head includes depositing a lower electrode film on a passage forming substrate and patterning the lower electrode film into a predetermined pattern, forming a piezoelectric layer on the passage forming substrate, forming an intermediate film made of a conductive material on the piezoelectric layer, forming a protective film on the intermediate film and, using the protective film as a mask, patterning by etching the piezoelectric layer together with the intermediate film into a predetermined pattern, peeling off the protective film, and depositing an upper electrode film on the passage forming substrate and patterning the upper electrode film into a predetermined pattern. | 09-03-2009 |
| 20120026250 | METHOD OF MANUFACTURING A LIQUID JET HEAD AND A LIQUID JET APPARATUS - A method of manufacturing a liquid jet head includes depositing a lower electrode film on a passage forming substrate and patterning the lower electrode film into a predetermined pattern, forming a piezoelectric layer on the passage forming substrate, forming an intermediate film made of a conductive material on the piezoelectric layer, forming a protective film on the intermediate film and, using the protective film as a mask, patterning by etching the piezoelectric layer together with the intermediate film into a predetermined pattern, peeling off the protective film, and depositing an upper electrode film on the passage forming substrate and patterning the upper electrode film into a predetermined pattern. | 02-02-2012 |
| 20140078215 | METHOD OF MANUFACTURING A LIQUID JET HEAD AND A LIQUID JET APPARATUS - A method of manufacturing a liquid jet head includes depositing a lower electrode film on a passage forming substrate and patterning the lower electrode film into a predetermined pattern, forming a piezoelectric layer on the passage forming substrate, forming an intermediate film made of a conductive material on the piezoelectric layer, forming a protective film on the intermediate film and, using the protective film as a mask, patterning by etching the piezoelectric layer together with the intermediate film into a predetermined pattern, peeling off the protective film, and depositing an upper electrode film on the passage forming substrate and patterning the upper electrode film into a predetermined pattern. | 03-20-2014 |
| 20140290725 | PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOVOLTAIC CELL - A photoelectric conversion element includes a ferroelectric layer; a first electrode provided on a surface or a surface layer portion of the ferroelectric layer; a second electrode provided on a surface or a surface layer portion of the ferroelectric layer, and allowing a voltage to be applied between the first electrode and the second electrode, and a pair of lead-out electrodes that extract electric power from the ferroelectric layer, in which the first electrode and the second electrode are arranged alternately in a predetermined direction. | 10-02-2014 |
| 20140290733 | PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOVOLTAIC CELL - A photoelectric conversion element includes a ferroelectric layer as a photoelectric conversion layer. The ferroelectric layer is formed from a polycrystalline ferroelectric material and includes a plurality of domains. Adjacent two of the plurality of domains have different polarized states. | 10-02-2014 |
| 20140290734 | PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOVOLTAIC CELL - A photoelectric conversion element includes a ferroelectric layer; a first electrode and a second electrode provided on a surface or a surface layer portion of the ferroelectric layer; a common electrode provided on a surface or a surface layer portion of an opposite side to a side of the ferroelectric layer on which the first electrode and the second electrode are provided; and a pair of lead-out electrodes extracting electric power from the ferroelectric layer, in which the first electrode and the second electrode are arranged alternately in a predetermined direction. | 10-02-2014 |
| Patent application number | Description | Published |
|---|
| 20100025571 | SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND CAMERA - A solid-state image pickup device includes a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide. | 02-04-2010 |
| 20110248146 | SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND CAMERA - A solid-state image pickup device including a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide. | 10-13-2011 |
| 20110267512 | SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND CAMERA - A solid-state image pickup device includes a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide. | 11-03-2011 |
| Patent application number | Description | Published |
|---|
| 20110085247 | ZOOM LENS SYSTEM, IMAGING DEVICE AND CAMERA - A zoom lens system, in order from an object side to an image side, comprising a first lens unit having positive optical power, a second lens unit having negative optical power, a third lens unit having positive optical power, and subsequent lens units including a fourth lens unit having optical power, wherein any one of the first lens unit, the second lens unit, the third lens unit, and the subsequent lens units includes a lens element having a reflecting surface that bends a light beam incident from an object, wherein in zooming from a wide-angle limit to a telephoto limit at the time of image taking, the first lens unit and the third lens unit do not move along an optical axis, and wherein the condition is satisfied: 1.42| 04-14-2011 | |
| 20120154524 | Zoom Lens System, Imaging Device and Camera - A zoom lens system comprising a plurality of lens units including, in order from an object side to an image side, at least a positive first lens unit, a negative second lens unit, and a positive third lens unit, wherein any one of the plurality of lens units includes a lens element having a reflecting surface that bends a light beam incident from an object, in zooming from a wide-angle limit to a telephoto limit at the time of image taking, the first lens unit and the third lens unit do not move along an optical axis, and the conditions: 4.25<√(f | 06-21-2012 |
| 20120162497 | Zoom Lens System, Imaging Device and Camera - A zoom lens system comprising: a negative first lens unit; a positive second lens unit; and a positive third lens unit, wherein the first to third lens units are individually moved along an optical axis to vary magnification in zooming, the first lens unit is composed of two lens elements and includes a positive lens element having at least one aspheric surface, the third lens unit is composed of one lens element, and the condition: 1.74| 06-28-2012 | |
| 20120162768 | Zoom Lens System, Imaging Device and Camera - A zoom lens system comprising: a first lens unit having negative optical power; a second lens unit having positive optical power; and a third lens unit having positive optical power, wherein the first to third lens units are individually moved along an optical axis to vary magnification in zooming, each lens unit includes at least one lens element that satisfies the conditions: nd≦1.67, vd<59 and 0.000| 06-28-2012 | |
| 20150124127 | ZOOM LENS SYSTEM, IMAGING DEVICE AND CAMERA - A zoom lens system comprising a plurality of lens units each being composed of at least one lens element, and comprising, in order from an object side to an image side, a first lens unit having positive optical power, a second lens unit having negative optical power, a third lens unit having positive optical power, a fourth lens unit having positive optical power, and a fifth lens unit having negative optical power, wherein the first lens unit is composed of two or less lens elements, the third lens unit is composed of five or more lens elements, and the condition: 5.0| 05-07-2015 | |
| Patent application number | Description | Published |
|---|
| 20100264867 | CONTROL DEVICE FOR MACHINE TOOL - A control device for a machine tool including a feed axis driving motor; a first power consumption calculating portion calculating power consumption of the feed axis driving motor; a second power consumption calculating portion calculating power consumption of equipment adapted to be operated by constant power; and a motor control portion determining a target time constant correlated with at least one of acceleration time and deceleration time of the feed axis driving motor, based on a summation of the power consumption calculated by the first power consumption calculating portion and the power consumption calculated by the second power consumption calculating portion, and controlling the feed axis driving motor based on the target time constant. | 10-21-2010 |
| 20110046773 | TOOL VECTOR DISPLAY APPARATUS FOR A MACHINE TOOL WITH ROTATIONAL AXES - Time information t and positional information about each axis are obtained, and the three-dimensional coordinates of tool center point Pe at time t are calculated to display the path of the tool center point Pe at time t. Then, whether a fixed time has elapsed or not is decided. If the fixed time has elapsed, the coordinates of the tool vector start point Ps at time t are calculated to display a line segment connecting between tool vector start point Ps and tool center point Pe, which is the end point of the tool vector. This display enables the orientation of the tool at each tool center point to be grasped at a glance. | 02-24-2011 |
| 20110095716 | MOTOR DRIVER FOR MACHINE TOOL WITH FAN MOTOR - A motor driver for a machine tool, which comprises a fan motor, configured to drive a cooling fan for cooling a radiator or the interior of the motor driver, estimates a rate of heat release within a heating element or the motor driver, based on information obtained from a motor current detector used for motor control or from an input current detector of the motor driver, and adjusts a fan motor power supply voltage to control a rotational speed of the fan motor in accordance with the estimated heat release value. | 04-28-2011 |
| 20120007536 | TOOL PATH DISPLAY APPARATUS WITH DECELERATION FACTOR IDENTIFICATION MEANS FOR MACHINE TOOL - A numerical controller calculates a first position command from a machining program, converts the first position command into a second position command for restricting a tangential speed of a tool, and delivers the second position command and a status signal indicative of the achievement of the conversion of the first position command into the second position command to a tool path display apparatus. The tool path display apparatus displays the path of the tool in a color corresponding to the status signal and can thereby determine the point on the tool path at which the speed restriction is performed. | 01-12-2012 |
| 20130026959 | CONTROL DEVICE THAT DETECTS WHETHER OR NOT IRREVERSIBLE DEMAGNETIZATION HAS OCCURRED IN PERMANENT MAGNET OF PERMANENT MAGNET SYNCHRONOUS MOTOR - An estimated torque constant calculation unit calculates an estimated torque constant relating to the permanent magnet synchronous motor from a current representative value and an acceleration representative value acquired from a plurality of current values and a plurality of acceleration values in the same operation state over a plurality of periods of a sinusoidal command signal and a predetermined inertia relating to the permanent magnet synchronous motor. A demagnetization detection unit detects whether or not irreversible demagnetization has occurred in the permanent magnet of the permanent magnet synchronous motor based on a difference between the estimated torque constant and a predetermined torque constant relating to the permanent magnet synchronous motor. | 01-31-2013 |
| 20130110278 | CONTROL DEVICE OF GEAR PROCESSING MACHINE | 05-02-2013 |
| 20130271048 | SYNCHRONOUS MOTOR CONTROL DEVICE FOR CONTROLLING SYNCHRONOUS MOTOR TO CARRY OUT POWER REGENERATIVE OPERATION AND STOP SYNCHRONOUS MOTOR AT THE TIME OF POWER FAILURE - A second q-axis current command value, which is set by a q-axis current command value setting unit when an alternating-current power source fails at the time of driving of a synchronous motor, and a second d-axis current command value, which is set by a d-axis current command value setting unit when the alternating-current power source fails at the time of the driving of the synchronous motor, are set so that an absolute value of power per unit time of the synchronous motor is equal to loss per unit time of the synchronous motor. | 10-17-2013 |
| 20130278197 | MOTOR CONTROL APPARATUS EQUIPPED WITH DELTA-SIGMA MODULATION AD CONVERTER - A motor control apparatus includes a power conversion unit which supplies drive power to a motor, a current detection unit which detects the value of a current flowing from the power conversion unit to the motor, a delta-sigma modulation AD converter to which the current value detected by the current detection unit is input as analog data, and which includes a modulator and a plurality of digital low-pass filters and outputs digital data in accordance with the filter characteristics of the respective digital low-pass filters, and a command generating unit which is connected to the digital low-pass filter to be used for motor drive control among the plurality of digital low-pass filters, and which generates a drive command to the power conversion unit by using the digital data output from the motor drive controlling digital low-pass filter. | 10-24-2013 |
| 20130342143 | CONTROLLER AND CONTROL METHOD OF SYNCHRONOUS MOTOR WITH AMPLIFIER PROTECTION FUNCTION - The controller of the synchronous motor of the present invention includes: an allowable energy value acquisition unit ( | 12-26-2013 |
| 20140121818 | SERVO CONTROL DEVICE FOR PERFORMING CORRECTION BASED ON AMOUNT OF STRETCH OR CONTRACTION OF BALL SCREW - A servo control device in the present invention corrects a position command to a feed axis, so as to compensate for an amount of stretch or contraction of a ball screw during operation, by taking into account an influence of tension applied to the ball screw. The amount of stretch or contraction of the ball screw is calculated, based on the tension acting on the ball screw on the side farther from the servo motor, a distance between two fixed units supporting the ball screw at its opposite ends, a distance from the fixed unit situated closer to the servo motor to a moving body, and a torque command to the servo motor. An amount of position correction of the feed axis is calculated, based on the calculated amount of stretch or contraction of the ball screw. | 05-01-2014 |
| 20140156080 | SERVO CONTROL SYSTEM WITH POSITION COMPENSATION FUNCTION FOR DRIVEN MEMBER - A servo control system including a servo motor, a driven member driven, a coupling mechanism coupled with the servo motor and the driven member, and a motor control part controlling the servo motor. The motor control part includes a position command generating part generating a position command value of the driven member, a force estimating part estimating the drive force acting on the driven member, a compensating part compensating the position command value based on the drive force estimated by the force estimating part, and a control signal output part outputting a control signal to the servo motor based on a position command value compensated by the compensating part. | 06-05-2014 |
