Itokazu
Atsushi Itokazu, Tokyo JP
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20120312787 | ELECTRICAL DISCHARGE MACHINING APPARATUS AND ELECTRICAL DISCHARGE MACHINING METHOD - An electrical discharge machining apparatus includes a machining electrode that is one wire and includes a plurality of opposing sections with respect to a workpiece by being wound around a plurality of guide rollers, driving units that change a relative distance between the workpiece and the opposing sections, and a plurality of pulse generating units that apply electrical discharge machining pulses between the workpiece and the opposing sections, respectively, in which the pulse generating units are controlled such that application start times of electrical discharge machining pulses for adjacent opposing sections do not coincide with each other. | 12-13-2012 |
20130043217 | WORKPIECE RETAINER, WIRE ELECTRIC DISCHARGE MACHINING DEVICE, THIN-PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR-WAFER MANUFACTURING METHOD - A workpiece retainer retains a workpiece at a time of a cutting process by a wire electric discharge machining device that cuts a workpiece by electric discharge from wire electrodes that are spaced from each other and are arranged in parallel. The workpiece retainer is formed with a fitting portion, into which the workpiece is fitted substantially without any gap, and has an external shape such that at a time of cutting the workpiece retainer together with the workpiece fitted in the fitting portion, a length along the wire electrodes of a portion where the workpiece retainer and the workpiece face the wire electrodes becomes substantially constant during the cutting process of the workpiece. | 02-21-2013 |
20130140277 | WIRE ELECTRIC DISCHARGE MACHINING APPARATUS, WIRE ELECTRIC DISCHARGE MACHINING METHOD, THIN PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD - A wire electric discharge machining apparatus includes a wire electrode, a guide roller that arranges wire electrodes in parallel by winding the wire electrode therearound, a plurality of slidable contact conductors that are in slidable contact with the wire electrodes arranged in parallel, respectively, and a power feeding jig that holds the slidable contact conductors individually and feeds power individually to the wire electrodes arranged in parallel via each of the slidable contact conductors, in which the power feeding jig includes a plurality of reference surfaces that determine a fixing interval between the slidable contact conductors. | 06-06-2013 |
20150053650 | WIRE DISCHARGE MACHINING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR WAFERS USING THE SAME - A wire discharge machining apparatus including a plurality of main guide rollers disposed in parallel at intervals, one wire that is wound between the guide rollers while being spaced apart from one another at a fixed pitch to form cutting wire sections between a pair of guide rollers and travels according to the rotation of the main guide rollers, and power feed terminal units that feed electric power to wires of the cutting wire sections. The wire discharge machining apparatus performs cutting of a work piece with the cutting wire sections, suspends cut-out of semiconductor wafers from the work piece in a state in which a part of the semiconductor wafers is connected to the work piece, brings the wires of the cutting wire sections close to one cut surfaces, and scans the cut surfaces in a discharge-machined state. | 02-26-2015 |
Atsushi Itokazu, Chiyoda-Ku JP
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20140332503 | WIRE ELECTRIC-DISCHARGE MACHINING DEVICE, WIRE ELECTRIC-DISCHARGE MACHINING METHOD, THIN-PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD - A wire electric-discharge machining device includes a control unit that selects a cutting wire to which a pulse voltage is applied by a pulse-voltage generation unit on a basis of an angle formed between an end face of a workpiece and a plane including a plurality of cutting wires, which are not parallel to the end face, an interval between parallel cutting wires, and a relative distance between the cutting wires and the workpiece. A drive unit drives a workpiece in a direction not vertical to the plane including the cutting wires, and the workpiece is cut by electric-discharge machining by applying a pulse voltage. | 11-13-2014 |
Ryunosuke Itokazu, Tokyo-To JP
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20100123033 | Biomass mill - The invention provides a biomass mill, comprising a rotatable pulverizing table | 05-20-2010 |
Ryunosuke Itokazu, Koto-Ku JP
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20150176840 | Burner - A burner comprises a nozzle main body ( | 06-25-2015 |
Yoshihiko Itokazu, Tokyo JP
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20100286210 | Carbazole derivative, solvate thereof, or pharmaceutically acceptable salt thereof - An object of the present invention is to provide novel carbazole derivatives, solvates thereof, or pharmaceutically acceptable salts thereof having an excellent adipose tissue weight reducing effect, hypoglycemic effect, and hypolipidemic effect, which are useful as a preventive and/or therapeutic agent for fatty liver, obesity, lipid metabolism abnormality, visceral adiposity, diabetes, hyperlipemia, impaired glucose tolerance, hypertension, non-alcoholic fatty liver disease, non-alcoholic steatohepatitis, and the like. | 11-11-2010 |