Patent application number | Description | Published |
20120307466 | COMPONENT-EMBEDDED SUBSTRATE - In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors. | 12-06-2012 |
20130033836 | CHIP-COMPONENT STRUCTURE - A chip-component structure includes an interposer and a multilayer capacitor mounted thereon. The interposer includes a substrate, a component connecting electrode, an external connection electrode, and a side electrode. The component connecting electrode and the external connection electrode are electrically connected by the side electrode. The component connecting electrode is joined to an external electrode of the multilayer capacitor. The substrate includes a communication hole that communicates between opposite spaces opening in both principal surfaces of the substrate. | 02-07-2013 |
20130037911 | CHIP-COMPONENT STRUCTURE AND METHOD OF PRODUCING SAME - In a chip-component structure, a monolithic ceramic capacitor is a structure including a predetermined number of substantially flat internal electrodes stacked on each other. An interposer includes a substrate larger than the outer shape of the monolithic ceramic capacitor. The substrate includes a first major surface on which first front electrodes for use in mounting the monolithic ceramic capacitor are disposed and a second major surface on which first back electrodes for use in connecting to an external circuit board are disposed. The interposer includes a depression in its side surface. The depression includes a wall surface on which a connection conductor is disposed. The front surface of the substrate is overlaid with resist films extending along its edges. | 02-14-2013 |
20130242517 | COMPONENT ASSEMBLY - A component assembly that can be easily built in a main substrate with high accuracy is formed such that a glass transition temperature of a built-in-component layer of an assembly substrate in which multiple capacitors are embedded is higher than a glass transition temperature of a built-in-component layer of a built-in-component substrate. Thus, thermal deformation of the component assembly is prevented when the built-in-component substrate in which the component assembly is built is heated during reflow, for example. The component assembly can thus be highly accurately built in the built-in-component substrate. Moreover, when the component assembly in which the multiple capacitors are embedded is built in the built-in-component substrate, electrode pads of the component assembly in which the multiple capacitors are embedded can be electrically connected to wiring layers of the built-in-component substrate by soldering despite the variation in height among the capacitors. | 09-19-2013 |
20130265025 | POWER SUPPLY APPARATUS - In a power supply apparatus that supplies direct current power to a load with a power supply unit, since a load power supply current is detected by a current detector from a voltage between both ends of a through electrode of a three-terminal capacitor provided on a power feed line extending from a power supply unit to a load, the three-terminal capacitor serving as a filter to reduce ripple noise can be used also as a detection resistor for detecting the load power supply current. Accordingly, it is possible to detect the load power supply current with a simple configuration that does not require a resistance element to detect the load power supply current, unlike in the related art. Consequently, it is not necessary to ensure an area where the resistance element for current detection can be mounted to reduce a power supply apparatus in size. | 10-10-2013 |
20130284507 | ELECTRONIC COMPONENT - In an electronic component, upper surface electrodes are located on one main surface of an insulating substrate of an interposer on which a multilayer ceramic capacitor is mounted. The insulating substrate has substantially the same shape as that of the multilayer ceramic capacitor, viewed from a direction perpendicular or substantially perpendicular to the main surface, and has the multilayer ceramic capacitor mounted thereon so that the length direction of the multilayer ceramic capacitor substantially coincides with the length direction of the insulating substrate. The insulating substrate includes cutouts that include connection electrodes, respectively, and that are located at the four corners viewed from the direction perpendicular or substantially perpendicular to the main surface. The upper surface electrodes on the one main surface are connected via the connection electrodes to lower surface electrodes, respectively, that are located on the other main surface and are connected to a circuit board. | 10-31-2013 |
20130299215 | ELECTRONIC COMPONENT, ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT - An electronic component includes a body and first and second external electrodes arranged on an external surface of the body. An edge portion of the first external electrode and an edge portion of the second external electrode face each other on the body. The first and second external electrodes each include a copper-metal-containing layer and a protective copper oxide layer covering the copper-metal-containing layer within the edge portion of the first and second external electrodes, respectively. | 11-14-2013 |
20130299224 | CERAMIC ELECTRONIC COMPONENT AND ELECTRONIC DEVICE - In an electronic component, a first outer electrode is provided on a first side surface and a second outer electrode is provided on a second side surface. Each of the first and second outer electrodes includes first and second electrode portions that are arranged at positions other than end portions and a center of the first or second side surface in a first direction. | 11-14-2013 |
20130329389 | CHIP-COMPONENT STRUCTURE - A chip-component structure includes an interposer on which a multilayer capacitor is mounted. The interposer includes component connecting electrodes, external connection electrodes, side electrodes, and in-hole electrodes. The component connecting electrodes and the external connection electrodes are electrically connected by the side electrodes and the in-hole electrodes. Outer electrodes of the capacitor are joined to the component connecting electrodes. | 12-12-2013 |
20140016242 | ELECTRONIC COMPONENT - A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate. | 01-16-2014 |
20140041914 | MOUNTING LAND STRUCTURE AND MOUNTING STRUCTURE FOR LAMINATED CAPACITOR - A mounting land structure and a mounting structure include land patterns to be bonded to outer electrodes of a laminated ceramic capacitor. Each of the land patterns includes a first conductor pattern and a second conductor pattern separated from each other in a width direction and a third conductor pattern connecting the first conductor pattern and the second conductor pattern. The first conductor pattern and the second conductor pattern include respective portions to be bonded to first ridgeline portions of the laminated ceramic capacitor provided with the outer electrodes. The third conductor pattern is arranged at a position overlapping the corresponding outer electrode as viewed in a height direction, when the laminated ceramic capacitor is mounted. | 02-13-2014 |
20140041915 | MONOLITHIC CAPACITOR MOUNTING STRUCTURE AND MONOLITHIC CAPACITOR - In a monolithic capacitor mounting structure, assuming that a portion of a first outer electrode joined with a first bonding material is a first bonding portion and a portion of a second outer electrode joined with a second bonding material is a second bonding portion, a length of each of the first and second bonding portions in a lengthwise direction of the monolithic capacitor is about 0.2 times to about 0.5 times a length of an elementary body in the lengthwise direction, and a center of each of the first and second bonding portions in the lengthwise direction is located at a position different from a center of the elementary body in the lengthwise direction. Vibration noise is changed depending on positions of outer electrodes of the monolithic capacitor, the outer electrodes being used to bond the monolithic capacitor to a mounting substrate. | 02-13-2014 |
20140043723 | CAPACITOR COMPONENT AND CAPACITOR COMPONENT MOUNTING STRUCTURE - Laminated ceramic capacitors include ceramic layers and inner electrodes that are alternately laminated. The inner electrodes are laminated in the same lamination direction, and a first outer electrode and a second outer electrode are electrically connected to the inner electrodes. In a mounting process, the laminated ceramic capacitors are mounted on a mounting surface such that the inner electrodes are perpendicular or substantially perpendicular to the mounting surface. | 02-13-2014 |
20140060192 | QUALITY EVALUATION APPARATUS, QUALITY EVALUATION METHOD, AND EVALUATION SUBSTRATE - In a quality evaluation method, an evaluation substrate that includes a mounting region, in which a multilayer capacitor is to be mounted, in a center portion of the evaluation substrate is fixed in place using a plurality of fixed portions at corner portions of the evaluation substrate, each of which is a same distance from the mounting region. A voltage is applied to the multilayer capacitor mounted on the mounting region of the evaluation substrate. Sound is collected using a microphone that is near the multilayer capacitor mounted on the evaluation substrate. | 03-06-2014 |
20140110161 | METHOD OF MANUFACTURING MOUNTING SUBSTRATE ON WHICH MONOLITHIC CERAMIC CAPACITORS ARE MOUNTED AND MOUNTING STRUCTURE - A method of manufacturing a mounting substrate in which a pair of monolithic ceramic capacitors each of which includes a multilayer body in which a plurality of dielectric ceramic sheets and a plurality of substantially planar inner electrodes are stacked on top of one another and at least a pair of outer electrodes electrically connected to the inner electrodes and provided on a surface of the multilayer body are mounted on a circuit board includes a process of joining the outer electrodes to lands formed on the front rear surfaces of the circuit board, the lands formed on the front surface being formed at positions that are plane-symmetrical to positions of the corresponding lands formed on the rear surface while being electrically connected to the corresponding lands formed on the rear surface, such that surface directions of planes of the inner electrodes match each other. | 04-24-2014 |
20140116768 | ELECTRONIC COMPONENT - An electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially parallel to each other. Two first mounting electrodes and two second mounting electrodes are located on the front surface of the substrate, on opposite end portions in the longitudinal direction. Recesses are located in the longitudinal side surface of the insulating substrate. Connecting conductors are each provided in the side wall surface of each of the recesses. The connecting conductors connect a first external connection electrode and a second external connection electrode that are located on the back surface of the substrate, and first mounting electrodes and second mounting electrodes. | 05-01-2014 |
20140124256 | ELECTRONIC COMPONENT - A multilayer ceramic capacitor includes flat inner electrodes that are laminated on each other. An interposer includes a substrate that is larger than the multilayer ceramic capacitor. A first mounting electrode to mount the multilayer ceramic capacitor is located on a first principal surface of the substrate, and a first external connection electrode for connection to an external circuit board is located on a second principal surface. A recess is located in a side surface of the interposer. A connecting conductor is located in the wall surface of the recess. The connecting conductor is located at a position spaced apart by a predetermined distance from the side surface of the interposer. | 05-08-2014 |
20140268486 | ELECTRONIC COMPONENT - An electronic component includes a laminated capacitor and a substrate-type terminal on which the laminated capacitor is mounted, with an viscoelastic resin located in a space between the laminated capacitor and the substrate-type terminal. The substrate-type terminal includes a substrate body, component connecting electrodes to mount the laminated capacitor are located on a component mounting surface of the substrate body, and external connecting electrodes to be connected to a circuit board are located on a substrate mounting surface of the substrate body. | 09-18-2014 |
20140268488 | MONOLITHIC CAPACITOR - A monolithic capacitor includes a multilayer body including a plurality of stacked dielectric layers, first and second capacitor electrodes inside the multilayer body, and outer electrodes on at least one surface of the multilayer body. The first and second capacitor electrodes are arranged perpendicularly or substantially perpendicularly to first and second surfaces of the multilayer body. The first capacitor electrode includes a capacitor portion opposed to the second capacitor electrode with the dielectric layer interposed therebetween, a lead portion connected to one outer electrode, and an intermediate portion not opposed to the second outer electrode. The second capacitor electrode includes a capacitor portion opposed to the first capacitor electrode with the dielectric layer interposed therebetween, and a lead portion connected to the other outer electrode. The intermediate portion is arranged in a gap area that is surrounded, when viewed in a stacking direction of the dielectric layers, by imaginary lines extending from inner exposed ends of the lead portions in a direction interconnecting the first and second surfaces of the multilayer body, by the capacitor portions, and by the first surface. | 09-18-2014 |
20140284089 | ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PACKAGE - An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces or prevents vibration being transmitted to a circuit substrate on which it is mounted. | 09-25-2014 |
20140332261 | CAPACITOR ELEMENT MOUNTING STRUCTURE AND CAPACITOR ELEMENT MOUNTING METHOD - A circuit board includes a wiring board on which is mounted first and second laminated ceramic capacitors near or adjacent to each other, arranged along a direction parallel or substantially parallel to a main surface of the wiring board, and electrically connected in series or in parallel via a conductive pattern provided on the wiring board. One width direction side surface of the first laminated ceramic capacitor and one length direction end surface of the second laminated ceramic capacitor oppose each other perpendicularly or approximately perpendicularly. | 11-13-2014 |