Ikegami, Kanagawa
Fumihiko Ikegami, Kanagawa JP
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20110063082 | WIRELESS TAG READER AND WIRELESS TAG READING METHOD - According to one embodiment, a wireless tag reader includes a receiver, a memory, a reader, and a transmitter. The receiver configured to receive an instruction from a host. The memory configured to store a dummy identifier, when the receiver received a set instruction for setting the dummy identifier from the host. The reader configured to read information stored in a wireless tag, when the receiver received a read instruction from the host. The transmitter configured to add the dummy identifier to the information, and to transmit the information, to which the dummy identifier is added, to the host. | 03-17-2011 |
Katsuhiro Ikegami, Kanagawa JP
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20110014062 | CONTROL DEVICE OF HYDRAULICALLY DRIVEN FAN - Disclosed is a control device of a hydraulically driven fan. The control device of a hydraulically driven fan is characterized by comprising first command value calculation means for calculating a fan speed command by a proportional term only while a difference between a target valve controlled variable and an actual valve controlled variable is not smaller than a predetermined threshold, second command value calculation means for calculating a fan speed command by the proportional term and an integral term while a difference between a target valve controlled variable and an actual valve controlled variable is smaller than a predetermined threshold, target valve controlled variable calculation means for calculating a target valve controlled variable of a control valve based on the calculated fan speed command, and control means for outputting a valve controlled variable to a control valve such that the control valve reaches the target valve controlled variable. | 01-20-2011 |
Kazutaka Ikegami, Kanagawa JP
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20130246818 | CACHE DEVICE, CACHE SYSTEM AND CONTROL METHOD - According to an embodiment, a cache device includes a cache memory, an access controller, and a power controller. The cache memory includes a plurality of memory areas associated with a plurality of ways, respectively. The access controller controls access to the memory areas. The power controller controls power supplied to each of the memory areas individually such that power supplied to a memory area that has not been accessed for a predetermined time is standby power that is lower than operating power that enables the memory area to operate. The power controller controls power supplied to a memory area such that standby power for a memory area that is highly likely to be accessed has a value closer to the operating power than a value of standby power for a memory area that is less likely to be accessed. | 09-19-2013 |
Masakazu Ikegami, Kanagawa JP
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20080232009 | Semiconductor device having an ESD protection circuit - When a manufacturing process becomes finer and a threshold value drops, a leakage current generates in a MOS transistor that is normally in an off-state. In order to suppress an influence of a leakage current that is generated in a protection transistor that constitutes a protection circuit on the internal circuit, an adjustor circuit that forms a transit path of the leakage current is disposed within the protection circuit, and a monitor circuit having the same circuit configuration as a configuration of the protection circuit is disposed to control an impedance of the transit path in the protection circuit and the monitor circuit so as to allow the leakage current to flow through the transit path. | 09-25-2008 |
20110043295 | Semiconductor device having an ESD protection circuit - A semiconductor integrated circuit, includes an operational amplifier including a first input terminal, a second input terminal, and an output terminal, a first transistor which has a source-drain route connected between an external terminal and a first voltage, and a gate terminal connected to the output terminal of the operational amplifier; and a second transistor which has a source-drain route connected between the first input terminal of the operational amplifier and the first voltage, and a gate terminal connected to the output terminal of the operational amplifier. | 02-24-2011 |
Masashi Ikegami, Kanagawa JP
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20110041915 | DYE-SENSITIZED PHOTOELECTRIC CONVERSION ELEMENT - A dye-sensitized photoelectric conversion device of the present invention has high energy conversion efficiency, even if the amount of iodine added into the electrolyte solution is significantly reduced. The dye-sensitized photoelectric conversion device has a porous photoelectrode layer comprising dye-sensitized semiconductor particles, an electrolyte solution layer, and a counter electrode layer in order. The electrolyte solution layer comprises an electrolyte solution containing 0.05 to 5 M of an aliphatic quarternary ammonium ion, 0.05 to 5 M of an imidazolium ion, and 0.1 to 10 M of iodide ion. The ions are dissolved in an organic solvent. Consequently, the amount of iodine added into the electrolyte solution can be reduced significantly. | 02-24-2011 |
Masato Ikegami, Kanagawa JP
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20130257196 | MOTOR - A motor includes: a rotor including an output shaft; a stator provided with a coil wound around the stator; and a casing configured to accommodate the rotor and the stator and to contain a coolant liquid therein, wherein skews are formed in at least one of the rotor and the stator. A hollow portion extending an axial direction is formed in the output shaft. The hollow portion includes an opening that opens in the casing at an end surface of the output shaft where a liquid surface of the coolant liquid is relatively higher due to rotation of the rotor and that communicates with the casing near an end opposite to the end surface. | 10-03-2013 |
20140265691 | MOTOR FRAME - A motor frame comprising four side surfaces, built-up portions and leg members is provided. The four side surfaces define the outer circumference of the motor frame. The four side surfaces include a terminal box mounting surface on which a terminal box is provided and two side surfaces located on respective sides of the terminal box mounting surface. The built-up portions are provided on each of the two side surfaces, wherein two or more bolt holes can be formed on the built-up portions. The built-up portions are configured such that any of hanging bolts or the leg members can be fastened to the built-up portions. The hanging bolts are screwed into bolt holes formed on one of the two side surfaces and the leg members are fastened to bolt holes formed on the other of the two side surfaces. | 09-18-2014 |
Shinpei Ikegami, Kanagawa JP
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20110019973 | EDITING APPARATUS, EDITING METHOD AND PROGRAM - In an editing apparatus; overwriting data used for insertion editing on base data, which is segmented into each picture including data having a predetermined unit of data amount X, and includes variable-length encoded real data, is variable-length encoded; each picture is sequentially obtained as a target picture, and regarding the target picture, if an amount of the overwriting data is equal to X, the overwriting data is handled as insertion data as it is, otherwise, insertion data is created by adding stuffing data to the overwriting data so that the amount of the overwriting data can be equal to X; a filler having the same amount as a filler of the base data is added to the insertion data having the same total amount as the real data; and the resultant insertion data is added onto the base data. | 01-27-2011 |
20110222606 | INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM - Disclosed herein is an information processing apparatus including: a computation block configured, so as to make an error of a VBV occupation amount of a VBV occupation amount target picture next to base data that is variable-length encoded data to be replaced by replacing data greater than an actual value, to compute the VBV occupation amount of the VBV occupation amount target picture from a VBV delay of the VBV occupation amount target picture; and an encoding block configured to variable-length encode the replacing data on the basis of the VBV occupation amount of the VBV occupation amount target picture computed by the computation block. | 09-15-2011 |
Syuji Ikegami, Kanagawa JP
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20090281187 | ANTI-ALLERGIC AGENT - The inventors have found that vitamin K3 and vitamin K5 which may be used in pharmaceuticals and foods or ACNQ, DHNA, or the like which can stimulate the growth of bifidobacteria can inhibit degranulation of basophil-like cells, exhibit a potent degranulation-inhibiting effect, and are useful anti-allergic agents or foods. The present invention provides an anti-allergic agent containing, as an active ingredient, one or more species selected from among 2-amino-3-carboxy-1,4-naphthoquinone, 1,4-dihydroxy-2-naphthoic acid, 1,4-naphthoquinone, 4-amino-2-methyl-1-naphthol, 2-methyl-1,4-naphthoquinone, 2-amino-3-chloro-1,4-naphthoquinone, and a salt thereof. | 11-12-2009 |
Takashi Ikegami, Kanagawa JP
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20120287067 | ELECTRONIC DEVICE, CONTROL METHOD, AND CONTROL PROGRAM - An electronic device includes a display unit, a detection unit, and a control unit. The display unit displays a character string or an image. The detection unit detects contact with the display unit. In a state where a character string or a image is displayed on the display unit, in a case in which the detection unit detects contact with the character string or the image, the control unit causes at least a part of the character string or the image to be selected in accordance with such detection. The control unit activates a different function in accordance with a condition of contact with the character string or the image when the character string or the image is selected. Furthermore, the control unit causes the character string or the image thus selected to be utilized in the function thus activated. | 11-15-2012 |
Takehiko Ikegami, Kanagawa JP
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20110101544 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device permitting the reduction of cost is disclosed. In a semiconductor package wherein electrode pads of a semiconductor chip and corresponding inner leads are electrically coupled with each other through a plurality of bonding wires, sensing wires (second and fourth bonding wires) are made thinner than other bonding wires (first and third bonding wires) coupled to inner leads same as those with the sensing wires coupled thereto, thereby reducing the cost of gold wires to attain the reduction in cost of the semiconductor package. | 05-05-2011 |
20130171776 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device permitting the reduction of cost is disclosed. In a semiconductor package wherein electrode pads of a semiconductor chip and corresponding inner leads are electrically coupled with each other through a plurality of bonding wires, sensing wires (second and fourth bonding wires) are made thinner than other bonding wires (first and third bonding wires) coupled to inner leads same as those with the sensing wires coupled thereto, thereby reducing the cost of gold wires to attain the reduction in cost of the semiconductor package. | 07-04-2013 |
20130237014 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Disclosed is a technique in which an excessive resin can be stably cut and removed in a molding step. In a step for separating part of a runner leading to a resin-sealing body from the resin-sealing body, the runner is formed by a first runner and a second runner coupled to the first runner and the resin-sealing body. The runner is separated from a middle of the second runner by supporting, with a first supporting portion, the second runner from the side of the second surface of a lead frame, and by pushing down, with a break pin, the first runner in the direction from the side of the first surface of the lead frame toward the side of the second surface thereof, while the resin-sealing body is in a condition of floating in the air. | 09-12-2013 |
20140363926 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device permitting the reduction of cost is disclosed. In a semiconductor package wherein electrode pads of a semiconductor chip and corresponding inner leads are electrically coupled with each other through a plurality of bonding wires, sensing wires (second and fourth bonding wires) are made thinner than other bonding wires (first and third bonding wires) coupled to inner leads same as those with the sensing wires coupled thereto, thereby reducing the cost of gold wires to attain the reduction in cost of the semiconductor package. | 12-11-2014 |
Tomoaki Ikegami, Kanagawa JP
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20130087881 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - An interconnect plug which connects a first circuit metal interconnect to a second circuit metal interconnect provided above the first circuit metal interconnect is disposed near a feeding plug which connects a first feeding metal interconnect to a second feeding metal interconnect provided above the first feeding metal interconnect. The feeding plug and the interconnect plug are displaced relative to each other in a direction in which the first feeding metal interconnect extends. | 04-11-2013 |
20130105936 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING IMPROVED INTERCONNECT ACCURACY NEAR CELL BOUNDARIES | 05-02-2013 |
20130154009 | SEMICONDUCTOR DEVICE - A standard cell has gate patterns extending in Y direction and arranged at an equal pitch in X direction. End portions of the gate patterns are located at the same position in Y direction, and have an equal width in X direction. A diode cell is located next to the standard cell in Y direction, and includes a plurality of opposite end portions formed of gate patterns that are opposed to the end portions, in addition to a diffusion layer which functions as a diode. | 06-20-2013 |
20140077307 | SEMICONDUCTOR DEVICE - A standard cell has gate patterns extending in Y direction and arranged at an equal pitch in X direction. End portions of the gate patterns are located at the same position in Y direction, and have an equal width in X direction. A diode cell is located next to the standard cell in Y direction, and includes a plurality of opposite end portions formed of gate patterns that are opposed to the end portions, in addition to a diffusion layer which functions as a diode. | 03-20-2014 |
Yohei Ikegami, Kanagawa JP
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20140232341 | CHARGING STAND - Provided is a charging stand which, with a simple structure, prevents a force applied to a power cord from being transmitted directly to a connecting portion between the charging stand and the power cord. | 08-21-2014 |
Yuji Ikegami, Kanagawa JP
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20110286879 | HIGH-Mn AUSTENITIC STAINLESS STEEL AND METAL PARTS FOR CLOTHING ORNAMENT - As a stainless steel for a metal part for clothing ornament capable of working into a complicated form part and having such nonmagnetic properties that the worked part can cope with the detection through needle detecting device is provided a high-Mn austenitic stainless steel having a chemical composition comprising C: 0.02-0.12 mass %, Si: 0.05-1.5 mass %, Mn: 10.0-22.0 mass %, S: not more than 0.03 mass %, Ni: 4.0-12.0 mass %, Cr: 14.0-25.0 mass % and N: 0.07-0.17 mass %, provided that these components are contained so that δ cal (mass %) represented by the following equation (1) is not more than 5.5 mass %: | 11-24-2011 |
Yuta Ikegami, Kanagawa JP
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20130207158 | SEMICONDUCTOR DEVICE - To improve a manufacture yield of semiconductor devices each including an IGBT, an active region defined by an insulating film and where an element of an IGBT is formed has a first long side and a second long side spaced at a predetermined distance apart from each other and extended in a first direction in a planar view. One end of the first long side has a first short side forming a first angle with the first long side, and one end of the second long side has a second short side forming a second angle with the second long side. The other end of the first long side has a third short side forming a third angle with the first long side, and the other end of the second long side has a fourth short side forming a fourth angle with the second long side. The first angle, the second angle, the third angle, and the fourth angle are in a range larger than 90 degrees and smaller than 180 degrees. | 08-15-2013 |