Patent application number | Description | Published |
20140116385 | DEVICE AND METHOD FOR DETERMINING AND CONTROLLING COMBUSTION MISFIRE OF VEHICLE ENGINE - A method of determining and controlling misfire in an engine. The method and device sense combustion pressure in a combustion chamber of an engine while the engine is operated; calculate MFB (a ratio of the amount of combustion heat at a specific point of time to the total amount of combustion heat), MFB50 (a point of time at which the amount of combustion heat is 50% of the total amount of combustion heat), MFB50 COV (Coefficient of Variation), IMEP (Indicated Mean Effective Pressure) and IMEP COV, from the combustion chamber; set a desired MFB50; and determine that there is misfire when a crank angle is delayed at 5 degrees or more, the MFB50 COV is 20% or more, or the IMEP COV is 20% or more, by comparing the calculated MFB50 with the desired MFB50; and then advance an injection time such that the MFB follows the desired MFB. | 05-01-2014 |
20160108841 | APPARATUS AND METHOD FOR CONTROLLING COLD STARTING OF DIESEL ENGINE VEHICLE - A method for controlling a cold starting of a diesel engine vehicle may include determining whether a cold starting condition is satisfied by detecting data for controlling a diesel engine, determining torque generated by combustion for starting the diesel engine when the cold starting condition is satisfied, determining a combustion delay and a combustion phase based on the torque and detected data, determining a main injection timing according to the determined combustion delay and combustion phase, determining a latent heat of fuel based on the torque and detected data, determining a pilot injection amount according to the determined latent heat of fuel, determining a total amount of heat by combustion based on the torque and detected data, determining a main injection amount according to the determined total amount of heat, and controlling an operation of an injector based on the main injection timing, pilot injection amount and main injection amount. | 04-21-2016 |
Patent application number | Description | Published |
20110101512 | Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate - A semiconductor package has a first conductive via formed through a substrate. The substrate with first conductive via is mounted to a first carrier. A first semiconductor die is mounted to a first surface of the substrate. A first encapsulant is deposited over the first die and first carrier. The first carrier is removed. The first die and substrate with the first encapsulant is mounted to a second carrier. A second semiconductor die is mounted to a second surface of the substrate opposite the first surface of the substrate. A second encapsulant is deposited over the second die. The second carrier is removed. A bump is formed over the second surface of the substrate. A conductive layer can be mounted over the first die. A second conductive via can be formed through the first encapsulant and electrically connected to the first conductive via. The semiconductor packages are stackable. | 05-05-2011 |
20110278707 | Semiconductor Device and Method of Forming Prefabricated Multi-Die Leadframe for Electrical Interconnect of Stacked Semiconductor Die - A prefabricated multi-die leadframe having a plurality of contact pads is mounted over a temporary carrier. A first semiconductor die is mounted over the carrier between the contact pads of the leadframe. A second semiconductor die is mounted over the contact pads of the leadframe and over the first die. An encapsulant is deposited over the leadframe and first and second die. The carrier is removed. A first interconnect structure is formed over the leadframe and the first die and a first surface of the encapsulant. A channel is cut through the encapsulant and leadframe to separate the contact pads. A plurality of conductive vias can be formed through the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive vias. | 11-17-2011 |
20110278721 | Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate - A semiconductor device includes a wafer level substrate having a plurality of first conductive vias formed through the wafer level substrate. A first semiconductor die is mounted to the wafer level substrate. A first surface of the first semiconductor die includes contact pads oriented toward a first surface of the wafer level substrate. A first encapsulant is deposited over the first semiconductor die. A second semiconductor die is mounted to the wafer level substrate. A first surface of the second semiconductor die includes contact pads oriented toward a second surface of the wafer level substrate opposite the first surface of the wafer level substrate. A second encapsulant is deposited over the second semiconductor die. A plurality of bumps is formed over the plurality of first conductive vias. A second conductive via can be formed through the first encapsulant and connected to the first conductive via. The semiconductor packages are stackable. | 11-17-2011 |
20130037936 | Semiconductor Device and Method of Forming a Stackable Semiconductor Package with Vertically-Oriented Discrete Electrical Devices as Interconnect Structures - A semiconductor device has a substrate and first semiconductor die to the substrate. A plurality of vertically-oriented discrete electrical devices, such as a capacitor, inductor, resistor, diode, or transistor, is mounted over the substrate in proximity to the first semiconductor die. A first terminal of the discrete electrical devices is connected to the substrate. A plurality of bumps is formed over the substrate adjacent to the discrete electrical devices. An encapsulant is deposited over and between the first semiconductor die and substrate. A portion of the bumps and a second terminal of the discrete electrical devices is exposed from the encapsulant. An interconnect structure is formed over a surface of the substrate opposite the first semiconductor die. The semiconductor devices are stackable and electrically connected through the substrate, discrete electrical devices, and bumps. A heat spreader or second semiconductor die can be disposed between the stacked semiconductor devices. | 02-14-2013 |
20130087898 | Semiconductor Device and Method of Forming Prefabricated Multi-Die Leadframe for Electrical Interconnect of Stacked Semiconductor Die - A prefabricated multi-die leadframe having a plurality of contact pads is mounted over a temporary carrier. A first semiconductor die is mounted over the carrier between the contact pads of the leadframe. A second semiconductor die is mounted over the contact pads of the leadframe and over the first die. An encapsulant is deposited over the leadframe and first and second die. The carrier is removed. A first interconnect structure is formed over the leadframe and the first die and a first surface of the encapsulant. A channel is cut through the encapsulant and leadframe to separate the contact pads. A plurality of conductive vias can be formed through the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive vias. | 04-11-2013 |
20140110860 | Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate - A semiconductor device includes a wafer level substrate having a plurality of first conductive vias formed through the wafer level substrate. A first semiconductor die is mounted to the wafer level substrate. A first surface of the first semiconductor die includes contact pads oriented toward a first surface of the wafer level substrate. A first encapsulant is deposited over the first semiconductor die. A second semiconductor die is mounted to the wafer level substrate. A first surface of the second semiconductor die includes contact pads oriented toward a second surface of the wafer level substrate opposite the first surface of the wafer level substrate. A second encapsulant is deposited over the second semiconductor die. A plurality of bumps is formed over the plurality of first conductive vias. A second conductive via can be formed through the first encapsulant and connected to the first conductive via. The semiconductor packages are stackable. | 04-24-2014 |
Patent application number | Description | Published |
20150067511 | SOUND VISUALIZATION METHOD AND APPARATUS OF ELECTRONIC DEVICE - A method and an apparatus are provided for audio data playback in an electronic device. Pieces of color information, included in an image that is matched to audio data, are acquired, when the audio data is requested. At least one of the pieces of color information is mapped to at least one sound level range of predetermined audible sound according to a percentage of a respective color in the image. A predetermined object pattern is displayed using the at least one of the pieces of color information mapped to the at least one sound level range of the audio data, when the audio data is played. | 03-05-2015 |
20160042723 | ELECTRONIC DEVICE AND METHOD OF CONTROLLING DISPLAY THEREOF - An electronic device and a method of controlling a display of the electronic device are provided. The method includes arranging a first image and a second image vertically on different layers; measuring a tilt of the electronic device; and displaying at least one of the first image and second image by controlling transparency of the first image based on the measured tilt. | 02-11-2016 |
20160048316 | ELECTRONIC DEVICE AND METHOD FOR PROVIDING USER INTERFACE - Disclosed is a method for providing a user interface, in which an electronic device divides a display region into a main region and a sub-region and displays default information or event information on the sub-region. The electronic device determines whether there is a user input on the sub-region. If the user input moves more from the sub-region than a first distance, the electronic device extends the sub-region and displays detailed default information or detailed event information. | 02-18-2016 |
20160077607 | ELECTRONIC DEVICE AND METHOD OF CONTROLLING DISPLAY OF SCREEN THEREOF - A method of controlling a display of a screen is provided. The method includes selecting a first image and a second image, selecting a masking pattern including at least one first area and at least one second area, measuring an inclination of the electronic device, and determining a part of the first image displayed in a screen corresponding to the at least one first area and a part of the second image displayed in a screen corresponding to the at least one second area, based on the measured inclination of the electronic device, and outputting the determined parts of the first image and the second image on a display unit. | 03-17-2016 |