Patent application number | Description | Published |
20100141037 | POWER SUPPLY DEVICE AND METHOD OF CONTROLLING THE SAME - Provided are a power supply device and a method of controlling the same. The power supply device includes: a power factor corrector which corrects a power factor of an initial power; a standby power supply unit which is connected to the power factor corrector, the standby power supply unit including a transformer which converts an input power received from the power factor corrector to a predetermined level of a standby power and comprises first and second coils; a sensor which is coupled to the second coil of the transformer and detects a level of an induced power corresponding to the input power; and a power supply controller which determines whether the level of the induced power exceeds a critical value when a system-on signal is received, activates the power factor corrector to correct the power factor of the initial power if the level of the induced power exceeds the critical value, and supplies a driving power to the system based on the level of the induced power detected after the power factor corrector is activated. | 06-10-2010 |
20110075057 | BACKLIGHT ASSEMBLY, AND DISPLAY APPARATUS AND TELEVISION COMPRISING THE SAME - A backlight assembly including: a power unit which outputs a current whose polarity is changed on a regular basis; a plurality of balancing units which is connected in parallel to the power unit; a plurality of light emitting diode (LED) modules each of which individually receives each current output by a corresponding balancing unit of the plurality of balancing units; and a driver which is connected between the plurality of balancing units and the plurality of LED modules, and forms a current route for each balancing unit included in the plurality of balancing units to balance a current supplied to two different LED modules during a single period where a polarity of a current output by the power unit is changed. | 03-31-2011 |
20110090259 | LIGHT EMITTING MODULE, BACKLIGHT UNIT AND DISPLAY APPARATUS - A light emitting module, a backlight unit (BLU) and a display apparatus are provided. The display apparatus includes a light emitting module including a light emitting unit including one or more light emitting elements which are electrically connected to each other; and a board on which the light emitting unit is disposed. The board includes a first terminal which is connected to a first end of the light emitting unit, and a ground portion which connects a second end of the light emitting unit to a ground. Therefore, it is possible to design a thinner BLU, thereby making a display device slimmer. | 04-21-2011 |
20110090261 | BACKLIGHT UNIT FOR STABLY DRIVING VARIOUS LIGHT SOURCE MODULES AND DISPLAY APPARATUS USING THE SAME - A backlight unit (BLU) capable of stably driving various light source modules, and a display apparatus using the same are provided. A display apparatus includes a display and a BLU. The BLU includes a light source module, a converter, a light source driving unit which drives the light source module using the output voltage of the converter, and a control unit which controls the output voltage of the converter based on the output voltage of the light source driving unit. Therefore, the ratio of the input voltage to the output voltage of the light source driving element may be maintained uniformly for various light source modules, so the light source modules can be stably driven. | 04-21-2011 |
20120038290 | METHOD AND APPARATUS FOR COMMON USE OF POWER SUPPLY AND DISPLAY APPARATUS USING THE SAME - An apparatus and a method for common use of a power supply and a display apparatus using the same are provided. The display apparatus includes a display panel, a backlight unit which provides backlight to the display panel, and a power supply unit for common use which comprises an adjusting circuit unit comprising a plurality of resistances, and provides a current of a magnitude corresponding to a combination state of the plurality of resistances to the backlight unit. Accordingly, the power supply apparatus for common use adjusts an output current easily and is commonly used for diverse display apparatuses, and thus a manufacturing process is efficiently improved. | 02-16-2012 |
20120120692 | APPARATUS AND METHOD FOR SWITCH MODE POWER SUPPLY - A switch mode power supply (SMPS) is capable of reducing standby power consumption, and includes a power factor capacitor (PFC) bulk capacitor which supplies power in a standby mode to constant loads by repeatedly charging and discharging a voltage, a PFC controller which controls the voltage to be charged in the PFC bulk capacitor, a first resistor and a second resistor which divide the voltage of the PFC bulk capacitor and output a reference voltage, and a control unit which controls the charging and discharging of the voltage of the PFC bulk capacitor in accordance with the reference voltage. | 05-17-2012 |
20120126925 | INDUCTOR AND TRANSFORMER - An inductor and a transformer, each of which includes a first bobbin on which a first coil is wound and a second bobbin on which a second coil is wound, are provided. The first bobbin includes a first bobbin part on which the first coil is wound and a first support part provided at one end of the first bobbin part. The second bobbin includes a second bobbin part on which the second coil is wound and a second support part provided at one end of the second bobbin part. Another end of the first bobbin part is coupled to the second support part and another end of the second bobbin part is coupled to the first support part. | 05-24-2012 |
20130033194 | APPARATUS AND METHOD FOR CONTROLLING LED DRIVING CIRCUIT AND APPARATUS AND METHOD FOR DRIVING LED - An apparatus for driving a light-emitting diode (LED) is provided. The apparatus includes an LED, a voltage sensing unit which senses a voltage applied to the LED, a current sensing unit which senses a current flowing into the LED, a DC-to-DC converter which converts an input voltage into an LED driving voltage and provides the LED driving voltage to the LED, an LED driving unit which drives the LED according to a dimming-on signal and a dimming-off signal; and a control unit which controls the DC-to-DC converter such that the current sensed by the current sensor follows a reference current, if the dimming-on signal is received, and controls the DC-to-DC converter to maintain the voltage sensed by the voltage sensor at a same voltage as a voltage of the LED at a dimming-off time, if the dimming-off signal is received. | 02-07-2013 |
Patent application number | Description | Published |
20130168871 | SEMICONDUCTOR PACKAGE WITH PACKAGE ON PACKAGE STRUCTURE - A semiconductor package of a package on package structure reducing an overall thickness of the package and simplifying design complexity of wiring paths is provided. The package includes a first package including a first substrate and a first semiconductor chip portion mounted thereon, a second package disposed on the first package and including a second substrate and a second semiconductor chip portion mounted thereon, and a connection member connecting the first and second substrates. The second semiconductor chip portion includes at least one semiconductor chip including a group of chip pads corresponding to one channel, and the group of chip pads is concentrated on a first edge of the semiconductor chip. An intellectual property core corresponding to the one channel is formed on an edge of the first semiconductor chip portion and the IP core corresponds to the edge on which the group of chip pads is concentrated. | 07-04-2013 |
20130315004 | SEMICONDUCTOR DEVICE, A METHOD FOR MANUFACTURING THE SAME, AND A SYSTEM HAVING THE SAME - A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other. | 11-28-2013 |
20140138851 | SEMICONDUCTOR MEMORY CHIPS AND STACK-TYPE SEMICONDUCTOR PACKAGES INCLUDING THE SAME - Provided are semiconductor memory chips and semiconductor packages with the same. The semiconductor package may include a memory chip including first data pads and first command/address pads arranged adjacent to a first side region thereof and second data pads and second command/address pads arranged adjacent to a second side region thereof arranged opposite to the first side region, and a package substrate including first CA connection pads and second CA connection pads. The memory chip may be mounted on a top surface of the package substrate, the first CA connection pads may be connected to the first command/address pads, and the second CA connection pads may be provide to be opposite to the first CA connection pads and be connected to the second command/address pads. | 05-22-2014 |
20140217586 | PACKAGE-ON-PACKAGE DEVICE - A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package. Further, data and command pads of a logic chip may be located to be adjacent to data and command pads of the memory chips. Accordingly, a routing distance between pads can be contracted and thus signal delivery speed can be improved. This makes it possible to improve an operation speed of the device. | 08-07-2014 |
20140319701 | SEMICONDUCTOR CHIP AND A SEMICONDUCTOR PACKAGE HAVING A PACKAGE ON PACKAGE (POP) STRUCTURE INCLUDING THE SEMICONDUCTOR CHIP - A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate. | 10-30-2014 |