Huang, Tianjin
Bingyuan Huang, Tianjin CN
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20110192824 | LASER WELDING OF HIGHLY REFLECTIVE MATERIALS - The invention concerns a method of welding two metal parts together. The first part and the second part are made of metal or metal alloys and the reflectivity of the first part is lower than or equal to the reflectivity of the second part. Typically the first part is made of brass and the second part is made of copper. In the common welding zone, the less reflective part covers the most reflective part, so the laser beam is directed only against the less reflective part. The advantage of this is that the laser beam is not directly in contact with the high reflective part so less energy is reflected away from the welding zone. | 08-11-2011 |
Changjiang Huang, Tianjin CN
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20130072521 | THIENOPYRIDINE ESTER DERIVATIVE CONTAINING CYANO GROUP, PREPARATION METHOD, USE AND COMPOSITION THEREOF - A compound with the structure of the formula (I) or a pharmaceutically acceptable salt, a preparation method and use thereof are disclosed in the present invention, wherein R is cyano group. The compound provided by the present invention has an antiplatelet aggregation activity and can be used in preparing a medicament for preventing or treating cardiac and cerebral vascular diseases such as coronary artery syndromes, myocardial infarction and myocardial ischemia which are caused by platelet aggregation. | 03-21-2013 |
Huai Zhou Huang, Tianjin CN
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20150093202 | DEEPWATER JACKET DESIGN METHOD - A new jacket design method is disclosed, especially for deepwater water heavy jacket applications. The method utilizes a special type of air bags, called Ship Launching Air Bags (SLAB), to provide low cost temporary buoyancy used for jacket installation purpose only. A designer only needs to satisfy the jacket stiffness for the resistance of environmental and gravity loads without the consideration of jacket reserve buoyancy. The required jacket reserve buoyancy could be increased with the utilization of temporally attached SLABs during the jacket installation. | 04-02-2015 |
Meiquan Huang, Tianjin CN
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20110175212 | DUAL DIE SEMICONDUCTOR PACKAGE - A dual die semiconductor package has a grid array of electrical contacts on a bottom surface of a substrate. There is a first semiconductor die with a base surface mounted to an upper surface of the substrate and the first semiconductor die has first die upper surface external electrical connection pads on an upper surface that are electrically connected to respective electrical contacts of the grid array. There is also a second semiconductor die with a base surface mounted to an upper surface of a lead frame flag. There are second die upper surface external electrical connection pads on an upper surface of the second semiconductor die. The dual die semiconductor package includes leads and at least some of the leads are electrically connected to respective pads that provide the second die upper surface external electrical connection pads. A package body at encloses the first semiconductor die and the second semiconductor die. The electrical contacts of the grid array and part of each of the leads protrude from the package body to form external package electrical connections. Also, at least part of a base surface of the lead frame flag directly under the second semiconductor die is left exposed by the package body and provides a heat sink. | 07-21-2011 |
20120077316 | BRACE FOR WIRE BOND - An electrical connection includes a first wire having one end stitch bonded to a surface, such as the lead finger of a lead frame or the connection pad of a substrate. A second wire has a first end attached to the surface on a first side of the first wire and a second end attached to the surface on a second, opposing side of the first wire. The second wire acts as a brace that prevents the first wire from lifting off of the surface. If necessary, a third wire can be added that, like the second wire, acts as a brace to prevent the first wire from lifting off of the surface. | 03-29-2012 |
20120326288 | METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE - A method of assembling a semiconductor device includes providing a conductive lead frame panel and selectively half-etching a top side of the lead frame panel to provide a pin pads. A flip chip die is attached and electrically connected to the pin pads and then the lead frame panel and die are encapsulated with molding compound. A second selective half etching step is performed on a backside of the lead frame panel to form a plurality of separate input/output pins. The side walls of each input/output pin include arcuate surfaces in cross-section. | 12-27-2012 |
20130119114 | METHOD AND APPARATUS FOR MONITORING FREE AIR BALL (FAB) FORMATION IN WIRE BONDING - A method for monitoring free air ball (FAB) formation during a wire bonding process includes attaching a dummy bond wire to an unused location on a first surface of a semiconductor chip carrier, extending the dummy bond wire a predetermined distance from the first surface such that a tip of the dummy bond wire is spaced from the first surface, and forming a dummy FAB at the tip of the bond wire. A profile of the dummy FAB is inspected with an imaging unit to identify any defects in the dummy FAB. An alarm is triggered and the wire bonding process is halted if the dummy FAB is defective so that bonding parameters may be adjusted. The wire bonding process is restarted after the bonding parameters have been adjusted. | 05-16-2013 |
20140070388 | SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME - A semiconductor device has a die support and external leads formed integrally from a single sheet of electrically conductive material. A die mounting substrate is mounted on the die support, with bonding pads coupled to respective external connection pads on an external connector side of the substrate. A die is attached to the die mounting substrate with die connection pads. Bond wires selectively electrically couple the die connection pads to the external leads and the bonding pads and electrically conductive external protrusions are mounted to the external connection pads. An encapsulant covers the die and bond wires. The external protrusions are located at a central region of a surface mounting side of the package and the external leads project outwardly from locations near the die support towards peripheral edges of the package. | 03-13-2014 |
Pingzhong Huang, Tianjin CN
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20150299153 | Continuous Processing Method of 2-methyltetrahydrofuran - The disclosure claims a continuous processing method of 2-Methyltetrahydrofuran (2-MeTHF), including the steps as follows: introducing gasification furfural and hydrogen into a first reaction zone and processing a first catalytic hydrogenation reaction; introducing the gas which is output from the first reaction zone to a second reaction zone to implement a secondary catalytic hydrogenation reaction; and condensing the gas output from the second reaction zone to obtain the 2-MeTHF; wherein, the first reaction zone is filled with a catalyst which is used for aldehyde group reduction, and the second reaction zone is filled with the catalyst for aromatic saturation hydrogenation. By adopting the low-toxicity catalyst which is cheap and easy to get, the high-purity 2-MeTHF can be produced by implementing the gas-phase continuous reaction by the furfural under low pressure or ambient pressure, the traditional process which has high pressure, high investment and high risk can be changed. | 10-22-2015 |
Qinglin Huang, Tianjin CN
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20140311968 | Preparation method of perfluorinated polymer hollow fiber membrane - A preparation method of a perfluorinated polymer hollow fiber membrane comprises: evenly mixing a first mixture that is mixed by a perfluorinated polymer, PS, a polymer additive, and a composite pore-forming agent; evenly mixing a second mixture that is mixed by the first mixture and an organic liquid; under 300° C.-350° C., processing the second mixture with a melt to spin by a twin-screw extruder; extruding a hollow fiber by a hollow fiber spinneret; dipping the hollow fiber membrane into deionized water for 48 hours; putting the hollow fiber membrane aired into a concentrated sulfuric acid to process with a sulfonation; washing the hollow fiber membrane by deionized water; and drying the hollow fiber membrane; in such a manner that the hydrophilic perfluorinated polymer hollow fiber membrane is obtained. | 10-23-2014 |
20150096934 | Preparation method of homogeneous-reinforced PVDF hollow fiber membrane - A preparation method of a homogeneous-reinforced PVDF hollow fiber membrane includes steps of: a) preparing a reinforced matrix membrane, wherein a PVDF hollow fiber membrane is utilized as the reinforced matrix membrane; b) preparing a PVDF casting solution, wherein mass fractions of the PVDF casting solution are: PVDF 6˜20 wt %; hydrophilic polymers or hydrophilic inorganic particles 0.6˜2 wt %; pore-forming agent 6˜10 wt %; and solvent 68˜87.4 wt %; mixing the above solutes in a water bath with a temperature of 70˜90° C., dissolving for 3˜4 h with stirring, then deaerating under vacuum for obtaining the uniform PVDF casting solution; and c) preparing the homogeneous-reinforced membrane; wherein the PVDF casting solution is uniformly coated on an outer surface of the reinforced matrix membrane through a spinning spinneret, then the reinforced matrix membrane is towed by a filament guide roller in such a manner that the hollow fiber forms a membrane, then the membrane passes through an air gap with a length of 5˜20 cm and is immersed in ultrafiltered water for coagulation, in such a manner that the homogeneous-reinforced membrane is obtained; wherein a traction speed is 5˜25 cm/(r·min). | 04-09-2015 |
Weihai Huang, Tianjin CN
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20140152289 | Reference Voltage Generator Circuit - Various embodiments of the present invention relate to a reference voltage generator circuit. Specifically, the circuit may for example comprise: a mirror constant current source having a first branch and a second branch, wherein a first current on the first branch is proportional to a second current on the second branch; wherein the first branch has a first resistive element, and the second branch has two second resistive elements connected in series; and a power supply terminal located between said two second resistive elements on the second branch. A high-precision reference voltage relative to the voltage source can be provided at the power supply terminal by using the circuit provided by various embodiments of the present invention. | 06-05-2014 |
Yanyan Huang, Tianjin CN
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20130118522 | METHOD OF CLEANING MULTILAYER COPPER WIRINGS IN ULTRA LARGE SCALE INTEGRATED CIRCUITS AFTER CHEMICAL-MECHANICAL POLISHING - A method of cleaning multilayer copper wirings in ultra large scale integrated circuits after chemical-mechanical polishing, the method including: a) preparing a cleaning solution, the cleaning solution including between 0.1 and 5 wt. % of a nonionic surfactant, between 0.1 and 7 wt. % of a corrosion inhibitor, and between 0.1 and 0.6 wt. % of a chelating agent in deionized water; b) adjusting the pH value of the cleaning solution to between 7 and 8 using triethanolamine; c) during the production of ULSI, after the chemical-mechanical polishing step, washing the multilayer copper wirings with the cleaning solution at a flow rate of between 500 and 5000 mL/min for between 0.5 and 1 min; d) ultrasonic washing in the presence of deionized water under following conditions: 60 Hz frequency of ultrasound, 50° C. temperature, and between 0.5 and 1 min ultrasonic time; and e) drying the multilayer copper wirings. | 05-16-2013 |
Zhigang Huang, Tianjin CN
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20150050175 | SCROLL COMPRESSOR, AND SEALING METHOD AND SEALING ARRANGEMENT FOR MID-PRESSURE CHAMBER THEREOF - A scroll compressor and a sealing method and sealing arrangement for a mid-pressure chamber thereof are provided. The scroll compressor includes: a scroll compressor shell; a housing, mounted inside the scroll compressor shell; a fixed scroll, fixed onto the housing; an orbiting scroll, supported on the housing and cooperating with the fixed scroll; a driving mechanism, located between the orbiting scroll and the housing and connected to the orbiting scroll to drive the orbiting scroll to orbit; and a mid-pressure chamber, which is a cavity surrounded by a hub of the orbiting scroll and a part of the housing and which is sealed by two sealing members. | 02-19-2015 |
Zhijuan Huang, Tianjin CN
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20120315328 | CAPSULE OF COMPOUND DANSHEN DRIPPING PILLS - A capsule of compound danshen dripping pills are disclosed. The color of the capsule's shell is orange, yellow, green or blue and all of these colors are in the wavelength range of 446-620 nm. | 12-13-2012 |