Hsuan-Cheng
Hsuan-Cheng Huang, Taipei City TW
Patent application number | Description | Published |
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20100105103 | ALCOHOL TOLERANT ESCHERICHIA COLI AND METHODS OF PREPARATION THEREOF - The present invention relates to | 04-29-2010 |
Hsuan-Cheng Lin, Taipei City TW
Patent application number | Description | Published |
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20150254404 | AUTOMATIC STOCK AND REQUISITION ADMINISTRATION SYSTEM AND METHOD FOR MEDICAL AND NURSING APPLICATION - The present invention discloses an automatic stock and requisition administration system and method for medical and nursing application. The system comprises a cloud platform, at least one intelligent handheld device, and at least one automatic material supply machine. The automatic material supply machine links to the cloud platform through a network. The cloud platform generates requisition forms automatically according to nursing requirements or physician orders and provides the requisition forms for the automatic material supply machine and the intelligent handheld devices according to nursing schedules in user information. The users confirmed by a user recognition process can fast pick required materials from the automatic material supply machine in correct types and quantities. The information of the picked materials is transmitted to the cloud platform, and the cloud platform undertakes statistics and administration of materials. Thus can be improved inefficient medical material administration resulting from overstocking or undersupplying medical materials. | 09-10-2015 |
Hsuan-Cheng Wang, Taipei City TW
Patent application number | Description | Published |
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20090173475 | HEAT PIPE STRUCTURE AND FLATTENED HEAT PIPE STRUCTURE - A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity. | 07-09-2009 |
20120301281 | FAN MODULE - A fan module suitable for an electronic apparatus is provided. The fan module includes a bottom plate, a top cover. a sidewall, a heat-dissipating fan and a housing. The sidewall is assembled between the top cover and the bottom plate. The sidewall, the top cover and the bottom plate together form an accommodating space. The heat-dissipating fan is disposed on the bottom plate and located in the accommodating space. The housing is stacked on the top cover. | 11-29-2012 |