Patent application number | Description | Published |
20130021219 | RADIO-FREQUENCY MODULES HAVING TUNED SHIELDING-WIREBONDS - Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding-wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement. | 01-24-2013 |
20130324069 | VIA DENSITY AND PLACEMENT IN RADIO FREQUENCY SHIELDING APPLICATIONS - Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data. | 12-05-2013 |
20130335288 | SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER - Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s). | 12-19-2013 |
20140002188 | POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS | 01-02-2014 |
20140016277 | RACETRACK DESIGN IN RADIO FREQUENCY SHIELDING APPLICATIONS - Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area. | 01-16-2014 |
20140091813 | SYSTEMS AND METHODS RELATED TO NEAR-FIELD ELECTROMAGNETIC SCANNERS - Disclosed are systems, devices and methods related to scanners that can be utilized for multiple electrical and/or magnetic field measurements at different locations of a radio-frequency (RF) module. In some embodiments, a scanning system can include a miniature probe such as a magnetic probe, a fixture system configured to hold a device under test (DUT) such as an RF module, an operating system configured to operate the DUT, and a measurement system configured to obtain field strength measurements through the miniature probe at different locations of the DUT. Such measurements can yield a near-field distribution over a plurality of selected areas of the DUT, with each of the selected areas being smaller than an overall lateral area of the DUT. In some implementations, such a scanning system can be utilized to facilitate applications such as electromagnetic (EM) shielding designs. | 04-03-2014 |
20140175621 | SYSTEMS AND METHODS FOR PROVIDING INTRAMODULE RADIO FREQUENCY ISOLATION - A radio frequency (RF) module comprises RF-shielding structure for providing three-dimensional electromagnetic interference shielding with respect to one or more RF devices disposed on the module. The RF-shielding may comprise wirebond structures disposed adjacent to or surrounding an RF device. Two or more intramodule devices may have wirebond structures configured to at least partially block certain types of RF signals disposed between the devices, thereby reducing effects of cross-talk between the devices. | 06-26-2014 |
20140175622 | SEGMENTED CONDUCTIVE TOP LAYER FOR RADIO FREQUENCY ISOLATION - A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation. | 06-26-2014 |
20140307394 | APPARATUS AND METHODS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOUNT DEVICES - Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection. | 10-16-2014 |
20140308907 | APPARATUS AND METHODS RELATED TO GROUND PATHS IMPLEMENTED WITH SURFACE MOUNT DEVICES - Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a module can include a packaging substrate configured to receive a plurality of components. The module can further include an RF component mounted on the packaging substrate and configured to facilitate processing of an RF signal. The module can further include an RF shield disposed relative to the RF component, with the RF shield being configured to provide shielding for the RF component. The RF shield can include at least one shielding-component configured to provide one or more electrical paths between a conductive layer on an upper surface of the module and a ground plane of the packaging substrate. The shielding-component can include a surface-mount device such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). | 10-16-2014 |