Patent application number | Description | Published |
20090282921 | Method for evaluating fastening state of threaded joint of pipes or tubes and method for fastening threaded joint of pipes or tubes using the method - There is provided a method capable of evaluating a fastening state of a threaded joint that is used as a joint of pipes or tubes such as OCTG with a high degree of accuracy even after being fastened and a method for fastening a threaded joint of pipes or tubes using the evaluating method. The present invention provides a method for evaluating a fastening state of a threaded joint of pipes or tubes including a pin having an external thread part, a metal seal part, and a shoulder part on an outer peripheral surface, and a box having an internal thread part, a metal seal part, and a shoulder part corresponding to each part of the pin on an inner peripheral surface and being fastened with the pin. The evaluating method according to the present invention is characterized by transmitting and receiving an ultrasonic wave to and from a plurality of locations along an axial direction of the threaded joint in at least one of the internal thread part, the metal seal part, and the shoulder part of the box; detecting echo intensities for the plurality of locations; and comparing the echo intensities detected for the plurality of locations to determine whether the fastening state of the threaded joint is good or bad. | 11-19-2009 |
20100107766 | Ultrasonic testing method of threaded joint of pipes or tubes - There is provided a method for detecting an abnormal portion (defect, non-adhering portion, and seized portion) lying at a contact region between each part of a pin and each part of a box forming a threaded joint to be used as a joint of pipe or tubes such as OCTG. This invention provides an ultrasonic testing method of a threaded joint of pipes or tubes including a pin having an external thread part, a metal seal part, and a shoulder part on an outer peripheral surface, and a box having an internal thread part, a metal seal part, and a shoulder part corresponding to each part of the pin on an inner peripheral surface and being fastened with the pin by way of a lubricant. The method according to the present invention comprising the steps of: transmitting and receiving ultrasonic waves to and from a plurality of locations along an axial direction of the threaded joint in at least one of the internal thread part, the metal seal part, and the shoulder part of the box; detecting echo intensities and reception times of echoes for the plurality of locations; and detecting an abnormal portion in the threaded joint based on axial directional distribution of the echo intensities and axial directional distribution of reception times of the echoes. | 05-06-2010 |
20120067127 | METHOD OF EVALUATING FASTENING STATE OF THREADED JOINT OF PIPES OR TUBES, METHOD FOR FASTENING THREADED JOINT OF PIPES OR TUBES, AND APPARATUS FOR EVALUATING FASTENING STATE OF THREADED JOINT OF PIPES OR TUBES - The present invention provides a method which allows simply, easily and accurately evaluating the fastening state of shoulder parts of a threaded joint for use as a joint of pipes or tubes, such as OCTG, during fastening or after fastening. The fastening state evaluation method for a threaded joint | 03-22-2012 |
Patent application number | Description | Published |
20110143552 | HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE FABRICATION, ADHESIVE USED FOR THE SHEET, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SHEET - The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %. | 06-16-2011 |
20110151625 | HEAT-RESISTANT ADHESIVE SHEET FOR SUBSTRATELESS SEMICONDUCTOR PACKAGE FABRICATION AND METHOD FOR FABRICATING SUBSTRATELESS SEMICONDUCTOR PACKAGE USING THE ADHESIVE SHEET - The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength. | 06-23-2011 |
20130005928 | OPTICAL DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, TOUCH PANEL, IMAGE DISPLAY DEVICE, AND SEPARATING METHOD - The present invention provides an optical double-sided pressure-sensitive adhesive sheet excellent in reworkability, step absorbability and anti-foaming release property. The invention relates to an optical double-sided pressure-sensitive adhesive sheet including an acrylic pressure-sensitive adhesive layer which contains an acrylic polymer (X), wherein: the acrylic polymer (X) is formed from a monomer component including an alkyl(meth)acrylate having a linear or branched alkyl group having 1 to 14 carbon atoms in an amount of 50 to 100 wt % based on a total amount of the monomer component (100 wt %) forming the acrylic polymer (X), and a content of a polar group-containing monomer is 0 to 15.0 wt % based on the total amount thereof; and a gel fraction of the acrylic pressure-sensitive adhesive layer is from 20 to 74 wt %. | 01-03-2013 |
20130020031 | METHOD AND APPARATUS FOR DETACHING PLATES JOINED TO EACH OTHER - A workpiece composed of a glass plate and a display panel joined to each other via an adhesive sheet is suction-held on both surfaces thereof by a pair of upper and lower holding members. The glass plate is detached from the display panel through swinging downward one end of the lower holding member around a support shaft provided on the other end side thereof with an entire surface of the glass plate being held in a planar state with a suction surface of the lower holding member. | 01-24-2013 |
20130186572 | METHOD OF SEPARATING TWO ADHERED PLATES - A method of reusably separating two plates adhered to each other via an adhesive sheet or a curable resin layer, including
| 07-25-2013 |
20130186575 | METHOD OF SEPARATING TWO ADHERED PLATES - A method of separating two plates adhered to each other via an adhesive sheet or a curable resin layer, comprising
| 07-25-2013 |
20130237017 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD FOR PRODUCING RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE - The present invention provides a pressure-sensitive adhesive tape for resin encapsulation in production of a resin encapsulation type semiconductor device, which includes a base material layer which does not have a glass transition temperature in a temperature region of 260° C. or lower and a pressure-sensitive adhesive layer laminated on the base material layer, and a method for producing a resin encapsulation type semiconductor device using the pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape according to the present invention highly prevents resin leakage even under severe conditions as in MAP-QFN production process, does not affect certainty of wire bonding and has excellent peelability after resin encapsulation. | 09-12-2013 |
20130240141 | HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE FOR PRODUCTION OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE TAPE - The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame. | 09-19-2013 |
Patent application number | Description | Published |
20080277696 | Lateral Junction Field Effect Transistor and Method of Manufacturing The Same - A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties. | 11-13-2008 |
20090315082 | LATERAL JUNCTION FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME - A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties. | 12-24-2009 |
Patent application number | Description | Published |
20080297286 | Position detector and positioning device - There is provided a position detector by which output having linearity can be obtained in a wide range, which has a movable member | 12-04-2008 |
20090039875 | Position Detector and Positioning Device - A position detector ( | 02-12-2009 |
20090196151 | OPTICAL PICKUP DEVICE, OPTICAL PICKUP CONTROLLER AND OPTICAL PICKUP CONTROL METHOD - An optical pickup device such that the driving force of the drive unit provided on the same optical base as that of the objective lens exerts no adverse influence on controlling of the objective lens is provided. The optical pickup device | 08-06-2009 |
20100302386 | COMPOSITE LOW FREQUENCY CUTOFF FILTER AND IMAGING APPARATUS USING THE SAME - An imaging apparatus includes a composite low frequency cutoff filter. The composite low frequency cutoff filter includes a first low frequency cutoff filter, a second low frequency cutoff filter, and an adder-subtractor. The second low frequency cutoff filter receives an output of the first low frequency cutoff filter. The adder-subtractor subtracts an output of the second low frequency cutoff filter from an input to the composite low frequency cutoff filter, and outputs a result of the subtraction to the first low frequency cutoff filter. An output of the first low frequency cutoff filter is outputted as an output of the composite low frequency cutoff filter. | 12-02-2010 |
20130222622 | IMAGE CAPTURING APPARATUS - An image capturing apparatus having a camera shake correction function, includes an optical system, a movable member that is movable on a plane perpendicular to an optical axis of the optical system to achieve the camera shake correction function, an angular velocity detector configured to detect an angular velocity of shake of the image capturing apparatus and generate a detection signal, and a controller configured to drive the movable member based on the output from the angular velocity detector. The controller includes a time change rate limiter configured to limit a time rate of change of angular velocity indicated by the detection signal output from the angular velocity detector to be no greater than a predetermined limiting value, and drive the movable member based on the detection signal output through the time change rate limiter. | 08-29-2013 |
Patent application number | Description | Published |
20110012460 | PERMANENT MAGNET FOR MOTOR, AND METHOD FOR MANUFACTURING THE PERMANENT MAGNET FOR MOTOR - The present invention relates to a permanent magnet for a motor, to be buried in a permanent magnet motor, including: a plurality of sheet magnets for lamination, and an insulating layer arranged between the plurality of sheet magnets for lamination. Since the invention has the above-mentioned constitution, the permanent magnets are free from the problems of temperature elevation and coercive force depression, therefore making it possible to provide a high-power small-sized motor. Furthermore, it is unnecessary to perform the conventional correcting processing after sintering, which can simplify the production steps, and therefore, it becomes possible to mold the permanent magnet with a high degree of dimension accuracy. | 01-20-2011 |
20110012700 | PERMANENT MAGNET AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a permanent magnet obtained by sintering a green sheet which is produced by mixing a magnet raw material with a resin binder and molding the resulting mixture, and a method for producing the same. Since the present invention has such a constitution, the contraction due to sintering becomes uniform, whereby the deformations such as warpage and depressions do not occur after sintering. Further, it is unnecessary to perform the conventional correcting processing after sintering, which can simplify the production steps, because the pressure unevenness at the time of pressing disappears. Therefore, it becomes possible to mold the permanent magnet with a high degree of dimension accuracy. Furthermore, even when the permanent magnet is reduced in film thickness, the magnetic characteristics are not deteriorated by the processing-deteriorated layer on the surface. | 01-20-2011 |
20110018664 | PERMANENT MAGNET AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a permanent magnet obtained by wet-mixing a Dy compound or a Tb compound with a magnet raw material to coat a surface of the magnet raw material with the Dy compound or the Tb compound, and sintering a green sheet obtained by mixing the resulting magnet raw material with a resin binder and molding the resulting mixture. Since the present invention has the above-mentioned constitution, it becomes possible to sufficiently improve coercive force by Dy or Tb while decreasing the amount of Dy or Tb used. Further, it can be prevented that Dy or Tb is solid-solutionized in magnet particles to decrease residual magnetization. | 01-27-2011 |
20110037548 | PERMANENT MAGNET AND PROCESS FOR PRODUCING PERMANENT MAGNET - The present invention relates to a permanent magnet manufactured by steps of: wet-pulverizing a high-melting metal element-containing organic compound or a precursor of a high-melting ceramic in a solvent together with a magnet raw material to pulverize the magnet raw material into fine particles having a grain size of 3 μm or less and to coat a surface of the pulverized magnet raw material with the high-melting metal element-containing organic compound or the precursor of the high-melting ceramic; adding a resin binder to the magnet raw material coated with the high-melting metal element-containing organic compound or the precursor of the high-melting ceramic; producing a slurry by kneading the magnet raw material and the resin binder; molding the slurry into a sheet form to prepare a green sheet; and sintering the green sheet. | 02-17-2011 |
20110043311 | PERMANENT MAGNET AND PROCESS FOR PRODUCING PERMANENT MAGNET - The present invention relates to a permanent magnet manufactured by steps of: pulverizing a magnet raw material; mixing the pulverized magnet raw material with a rust preventive oil in which a Dy compound or a Tb compound is dissolved, thereby preparing a slurry; compression molding the slurry to form a molded body; and sintering the molded body. | 02-24-2011 |
20110267160 | PERMANENT MAGNET AND PROCESS FOR PRODUCING PERMANENT MAGNET - The present invention relates to a permanent magnet manufactured by steps of: pulverizing a magnet raw material into fine particles having a grain size of 3 μm or less; mixing the pulverized magnet raw material with a rust preventive oil in which a high-melting metal element-containing organic compound or a precursor of a high-melting ceramic is dissolved, thereby preparing a slurry; compression molding the slurry to form a molded body; and sintering the molded body. | 11-03-2011 |