Patent application number | Description | Published |
20120222892 | WIRE BOND PAD SYSTEM AND METHOD - To reduce the RF losses associated with high RF loss plating, such as, for example, Ni/Pd/Au plating, the solder mask is reconfigured to prevent the edges and sidewalls of the wire-bond areas from being plated in some embodiments. Leaving the edges and sidewalls of the wire-bond areas free from high RF loss plating, such as Ni/Pd/Au plating, provides a path for the RF current to flow around the high resistivity material, which reduces the RF signal loss associated with the high resistivity plating material. | 09-06-2012 |
20120223422 | APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING - To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad. | 09-06-2012 |
20130344825 | PROCESS-COMPENSATED HBT POWER AMPLIFIER BIAS CIRCUITS AND METHODS - The present disclosure relates to a system for biasing a power amplifier. The system can include a first die that includes a power amplifier circuit and a passive component having an electrical property that depends on one or more conditions of the first die. Further, the system can include a second die including a bias signal generating circuit that is configured to generate a bias signal based at least in part on measurement of the electrical property of the passive component of the first die. | 12-26-2013 |
20140002188 | POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS | 01-02-2014 |
20140175629 | APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING - To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad. | 06-26-2014 |
20150044863 | SYSTEMS AND METHODS TO FABRICATE A RADIO FREQUENCY INTEGRATED CIRCUIT - To reduce radio frequency (RF) losses during operation of a radio frequency integrated circuit (RFIC) module, the RFIC module is fabricated such that at least one of an edge of the wirebond pad on the copper trace and a sidewall of the copper trace is free from high-resistivity plating material. The unplated portion provides a path for the RF current to flow around the high-resistivity material, which reduces the RF signal loss associated with the high resistivity plating material. | 02-12-2015 |
20150061092 | APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING - To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad. | 03-05-2015 |
20150124552 | SYSTEM AND METHOD FOR MIXING A GAS AND A LIQUID - A system and method for mixing a gas and a liquid includes, receiving a liquid at a liquid inlet of a convergent nozzle and ejecting the liquid at a predetermined output velocity from a liquid outlet of the convergent nozzle into a mixing chamber, the mixing chamber comprising a cantilevered reed positioned within the mixing chamber. The ejection of the liquid from the liquid outlet causes the cantilevered reed to vibrate at an intrinsic frequency. The vibration of the cantilevered reed induces resonance between the liquid and the cantilevered reed and the resonance results in an ultrasound wave within the liquid. Upon the introduction of a gas into the liquid within the mixing chamber, the mixing of the gas into the liquid is effected by the ultrasound wave generated by the cantilevered reed. | 05-07-2015 |