Patent application number | Description | Published |
20140092563 | HEAT RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer. | 04-03-2014 |
20140110156 | HEAT RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer. | 04-24-2014 |
20140110830 | SEMICONDUCTOR PACKAGE - Disclosed herein is a semiconductor package, including: a first heat radiating plate; a second heat radiating plate formed below the first heat radiating plate; a heat radiating lead formed above the first heat radiating plate and having both ends contacted with the second heat radiating plate; an insulating layer formed above the heat radiating lead; at least one power device formed above the insulating layer; and at least one control device formed above the insulating layer. | 04-24-2014 |
20140117522 | SEMICONDUCTOR PACKAGE - There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate. | 05-01-2014 |
20140118961 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a base substrate; a post having one end and the other end, the one end being formed on the base substrate; and a case formed on the base substrate such that it covers a lateral surface and an upper surface of the base substrate, and spaced apart from the upper surface of the base substrate. | 05-01-2014 |
20140124182 | COOLING SYSTEM OF POWER SEMICONDUCTOR DEVICE - Disclosed herein is a cooling system of a power semiconductor device. The cooling system of a power semiconductor device, which improves a cooling structure according to the related art to deprive heat generated from power devices while moving a working fluid introduced through an inlet to one direction and discharge the working fluid to an outlet, forms a branch inlet in a direction crossing a main inlet and additionally introduce the low-temperature working fluid through the branch inlet so as to be supplied to a channel to mix the working fluid supplied through the main inlet via the channel with the working fluid additionally introduced through the branch inlet around power devices, thereby improving a cooling effect. | 05-08-2014 |
20140285972 | HOUSING AND POWER MODULE HAVING THE SAME - There are provided a housing capable of evenly distributing stress generated at the time of assembly thereof and a power module having the same. The housing for a power module according to an embodiment of the invention includes: a body part having a space formed therein, the space receiving a module substrate having electronic devices mounted thereon; a plurality of fastening parts protruded from sides of the body part; and a fastening member having a leaf spring form and having both ends coupled to two of the fastening parts, respectively, wherein the fastening member includes: a coupling portion coupled to a fixing member; and elastic portions extending from both edges of the coupling portion to be coupled to the fastening parts and elastically deformed when the coupling portion is fastened to a heat radiating substrate to provide elastic force to the fastening parts. | 09-25-2014 |
20140285973 | HOUSING AND POWER MODULE HAVING THE SAME - There are provided housing, capable of preventing a fastening part from being damaged by stress generated at the time of assembly thereof, and a power module having the same. The housing for the power module includes a body part having a space formed therein, the space accommodating a module substrate on which electronic elements are mounted, a plurality fastening parts formed to be protruded from side surfaces of the body part, and an elastic member coupled to the fastening parts in a plate spring manner and elastically supporting lower portions of the fastening parts. | 09-25-2014 |
Patent application number | Description | Published |
20140154479 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD - Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature. | 06-05-2014 |
20150027763 | INORGANIC FILLER, AND INSULATING RESIN COMPOSITION, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler. | 01-29-2015 |
20150053469 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. | 02-26-2015 |
20150102886 | COMMON MODE FILTER - A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil pattern formed on the magnetic substrate; a dielectric layer formed on the magnetic substrate so as to cover an upper part, a lower part and a side surface of the coil pattern; and a first coupling agent interposed between the magnetic substrate and the dielectric layer so as to prevent the magnetic substrate and the dielectric layer from being separated. | 04-16-2015 |
Patent application number | Description | Published |
20130243941 | METHOD OF MANUFACTURING CORELESS SUBSTRATE HAVING FILLED VIA PAD - A method of manufacturing a coreless substrate having filled via pads, including: forming a first insulating layer on one side of a carrier forming a build-up layer including a build-up insulating layer and a build-up circuit layer having a build-up via on the first insulating layer, and forming a second insulating layer on the build-up layer; removing the carrier, and forming via-holes in the first and second insulating layers; and conducting a filled plating process in the via-holes of the first and second insulating layers thus forming first and second filled via pads therein. | 09-19-2013 |
20130313004 | PACKAGE SUBSTRATE - A package substrate includes a solder resist layer having a level surface, a circuit pattern buried in the solder resist layer, and a bump protruding from the solder resist layer. | 11-28-2013 |
20140102770 | CORE SUBSTRATE, MANUFACTURING METHOD THEREOF, AND STRUCTURE FOR METAL VIA - The present invention relates to a core substrate, a manufacturing method thereof, and a structure for a metal via. In accordance with an embodiment of the present invention, a core substrate including: an insulation layer; a plurality of metal vias passing through the insulation layer and formed to become wider from upper and lower surfaces to a middle part of the insulation layer; and a conductive layer formed on the upper and lower surfaces of the insulation layer and connected to the plurality of metal vias. Further, a manufacturing method thereof and a structure for a metal via are provided. | 04-17-2014 |
20140144693 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There is provided a printed circuit board, including: a core layer, a conductive via formed in a via hole of the core layer, an upper land formed on an upper surface of the conductive via, and a lower land formed on a lower surface of the conductive via, wherein a center of the upper land and a center of the lower land do not coincide with each other on a plane, so that the center of the upper land and the center of the lower land formed in the printed circuit board are arranged so as not to coincide with each other, thereby increasing durability of an insulating region against pressure in a wet process, and thus damage to the printed circuit board can be reduced. | 05-29-2014 |
20140174798 | METAL CORE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a metal core substrate and a method of manufacturing the same. The method of manufacturing a metal core substrate includes: forming a metal layer into which connection bridges are inserted; laminating an insulating layer and a copper foil on an upper surface and a lower surface of the metal layer en bloc; and removing the connection bridges. | 06-26-2014 |
Patent application number | Description | Published |
20110278962 | LINEAR VIBRATOR - There is provided a linear vibrator including: a housing having an internal space formed therein; a magnetic field unit including a yoke disposed in the internal space and a magnet mounted on one surface of the yoke, and interacting with a coil to which power is applied to thereby generate vibrations in the internal space; an elastic member configured of a housing fixing part fixed to an inner surface of the housing, a yoke fixing part surface-contacting the other surface of the yoke, and a plurality of connecting strip parts disposed such that an elastic space is formed between the housing fixing part and the yoke fixing part; and a clearance part formed between the yoke and the yoke fixing part, and preventing the connecting strip parts from contacting the yoke during the vibrations of the magnetic field unit. | 11-17-2011 |
20120133219 | APPARATUS FOR GENERATING VIBRATIONS - There is provided an apparatus for generating vibrations, including: a housing forming an internal space; a flexible member disposed in the internal space of the housing and made of a soft material; a magnetic field unit disposed to be opposite to the flexible member and including a yoke having a magnet mounted therein to be moved, the magnet electromagnetically interacting with a coil; and a damper provided in the internal space of the housing to be disposed outside the coil and reducing movement sound generated due to the tilting of the yoke during upward and downward movement of the yoke. | 05-31-2012 |
20120133220 | APPARATUS FOR GENERATING VIBRATIONS - Disclosed is an apparatus for generating vibrations. The apparatus for generating vibrations includes a housing forming an internal space; a flexible member mounted in the internal space of the housing and made of a soft material, a magnetic field unit disposed to be opposite to the flexible member and including a yoke having a magnet mounted therein to be moved, the magnet electromagnetically interacting with the coil, and a damper suppressing generation of movement sound during movement of the yoke together with the flexible member. | 05-31-2012 |
20130093266 | LINEAR VIBRATOR AND METHOD OF MANUFACTURING THE SAME - There is provided a linear vibrator including a case including a cylindrical sidewall part forming a sidewall thereof and a cover coupled to one end of the sidewall part, and an elastic member including at least one connection protrusion and connected to the case while the connection protrusion is interposed between the sidewall part and the cover. | 04-18-2013 |
20130154401 | VIBRATOR - There is provided a vibrator, including: a case having an inner space; a coil fixedly mounted on a side wall of the case; an elastic member fixedly mounted on the case so as to be disposed within the coil; a weight body fixedly mounted on the elastic member; and a magnet fixedly mounted on the weight body so as to face the coil. | 06-20-2013 |
20130154403 | VIBRATOR - There is provided a vibrator, including: a case having an inner space; a vibration generating part mounted in the case and generating vibrations by power supplied thereto; and a resonance part resonated by the vibrations generated in the vibration generating part. | 06-20-2013 |
20140001889 | LINEAR VIBRATION MOTOR | 01-02-2014 |
20140265651 | VIBRATOR AND ELECTRONIC DEVICE INCLUDING THE SAME - There are provided a vibrator and an electronic device including the same, the vibrator including a housing having an internal space; a shaft included in the internal space; a vibrating part suspended in the internal space by elastic members at both ends thereof, including a magnetic field part, and having a bearing member slidably and movably installed on the shaft; and a coil generating vibrations of the vibrating part through electromagnetic interaction with the magnetic field part and provided on an outer peripheral surface of the shaft while facing the magnetic field part. | 09-18-2014 |
20140306556 | HOUSING AND VIBRATING DEVICE INCLUDING THE SAME - There is provided a housing, including: a case formed in a longitudinal direction, having an opening on one side, and having an internal space; and a bracket coupled to the opening on the one side of the case; wherein the case has a protrusion formed at the opening and protruding in the longitudinal direction of the case. | 10-16-2014 |
Patent application number | Description | Published |
20080290479 | Wafer level device package with sealing line having electroconductive pattern and method of packaging the same - Provided are wafer level package with a sealing line that seals a device and includes electroconductive patterns as an electrical connection structure for the device, and a method of packaging the same. In the wafer level package, a device substrate includes a device region, where a device is mounted, on the top surface. A sealing line includes a plurality of non-electroconductive patterns and a plurality of electroconductive patterns, and seals the device region. A cap substrate includes a plurality of vias respectively connected to the electroconductive patterns and is attached to the device substrate by the sealing line. Therefore, a simplified wafer level package structure that accomplishes electric connection through electroconductive patterns of a sealing line can be formed without providing an electrode pad for electric connection with a device. | 11-27-2008 |
20090085134 | Wafer-level image sensor module, method of manufacturing the same, and camera module - Provided is a wafer-level image sensor module including a wafer; an image sensor mounted on the wafer; a transparent member installed above the top surface of the wafer so as to seal the image sensor; a plurality of vias formed in the wafer so as to be positioned outside the transparent member; a plurality of upper pads formed on the upper ends of the respective vias; an encapsulation portion formed on the top surface of the wafer so as to be positioned outside the transparent member; and a plurality of external connection members that are electrically connected to the lower ends of the respective vias. | 04-02-2009 |
20110012220 | Wafer-level image sensor module, method of manufacturing the same and camera module - A wafer-level image sensor module including: a wafer having an image sensor and a plurality of upper pads provided thereon, the wafer having an inclined surface on either side thereof; a transparent member installed above the top surface of the wafer so as to seal the image sensor; a plurality of lead portions having one ends connected to the respective upper pads, the lead portions being formed to extend to the bottom surface of the wafer along the inclined surface of the wafer; an encapsulation portion formed on the top surface of the wafer so as to be positioned outside the transparent member; and a plurality of external connection members that are electrically connected to the other ends of the respective lead portions | 01-20-2011 |
20110198749 | Semiconductor chip package and method of manufacturing the same - Provided are a semiconductor chip package and a method of manufacturing the same. The semiconductor chip package includes a semiconductor chip comprising a chip pad, and a rerouting layer disposed on the semiconductor chip and including a metal interconnection electrically connected to the chip pad and a partial oxidation region formed by the oxidation of metal and insulating the metal interconnection. | 08-18-2011 |
Patent application number | Description | Published |
20120018193 | Multi layer circuit board and method of manufacturing the same - There are provided a multi layer circuit board and a method of manufacturing the same. The multi layer circuit board includes each of ceramic boards having wiring patterns formed and stacked thereon; and via electrodes connecting in series the wiring patterns formed in the each of the ceramic boards, wherein one of the via electrodes is formed as a via group including a plurality of via units which connect in parallel one catch pad formed on one ceramic board and another catch pad formed on ceramic boards adjacent to the one ceramic board. Since the ceramic boards are connected through the plurality of via units, the reliability of the electrical connectivity of the via electrode may be improved, and the formation of a void and the protrusion of the via electrode may be prevented. | 01-26-2012 |
20120037408 | METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME - There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof. | 02-16-2012 |
20120040125 | METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE USING THE SAME - A method for manufacturing a ceramic substrate, and a ceramic substrate using the same are disclosed. The method for manufacturing a ceramic substrate includes: forming a first adhesive layer on a blister formed on a substrate; filling the blister having the first adhesive layer formed thereon with a filler; and hardening the ceramic substrate. A blister formed on the ceramic substrate can be removed to make the substrate have a smooth surface, thus improving reliability. | 02-16-2012 |
20130088251 | PROBE CARD AND MANUFACTURING METHOD THEREOF - There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin. | 04-11-2013 |
20130162278 | PROBE PIN, PROBE CARD USING THE PROBE PIN, AND METHOD OF MANUFACTURING THE PROBE CARD - There is provided a probe card, including: a substrate having a plurality of grooves formed in one surface thereof; and at least one probe pin having a plurality of substrate combining protrusions formed on one surface thereof and corresponding to the plurality of grooves, the plurality of substrate combining protrusions having heights corresponding to the plurality of grooves. | 06-27-2013 |
20130162280 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - There are provided a probe card and a method of manufacturing the same, in which an electrode pad having a probe pin bonded thereto may be prevented from being delaminated from a substrate. The probe card according to embodiments of the present invention may include a ceramic substrate including at least one pad groove formed in one surface thereof and an electrode pad embedded in the pad groove; and a probe pin bonded to the electrode pad. | 06-27-2013 |
20140318838 | METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME - There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof. | 10-30-2014 |
Patent application number | Description | Published |
20130285975 | TOUCH SCREEN PANEL AND TOUCH SCREEN APPARATUS - There are provided a touch screen panel and a touch screen apparatus. The touch screen panel includes a plurality of first electrodes formed on a substrate and extending in a first axis direction; and a plurality of second electrodes formed on the substrate and extending in a second axis direction perpendicular to the first axis direction, wherein a plurality of first slits are provided in a diagonal direction with respect to the first axis direction and the second axis direction between the plurality of first electrodes and the plurality of second electrodes, and at least one second slit is formed within each of the plurality of second electrodes. | 10-31-2013 |
20140009216 | CAPACITANCE SENSING APPARATUS AND METHOD, AND TOUCH SCREEN APPARATUS - There is provided a capacitance sensing apparatus including: a driving circuit unit applying a driving signal to a first capacitor; a first integrating circuit unit including a second capacitor charged by a change in capacitance generated in the first capacitor based on the driving signal to generate a first output voltage; and a second integrating circuit unit including a third capacitor charged by a change in capacitance generated in the second capacitor to generate a second output voltage, wherein a level of the second output voltage is changed at least twice during a single period of the driving signal applied to the first capacitor. | 01-09-2014 |
20140009431 | CAPACITANCE SENSING APPARATUS AND METHOD, AND TOUCH SCREEN APPARATUS - There is provided a capacitance sensing apparatus including: a driving circuit unit sequentially applying a driving signal to each of a plurality of first electrodes; a sensing circuit unit including a first integrating circuit detecting a first change in capacitance generated in a plurality of second electrodes by the driving signal and a second integrating circuit connected to another first electrode adjacent to the first electrode to which the driving signal is applied; and an operating unit connected to the sensing circuit unit to determine a touch input, wherein the second integrating circuit detects a second change in capacitance generated due to noise in the another first electrode, and the operating unit determines the touch input based on the first and second changes in capacitance. | 01-09-2014 |
20140035862 | CAPACITANCE SENSING APPARATUS AND TOUCH SCREEN APPARATUS - There is provided a capacitance sensing apparatus including a driving circuit unit applying a driving signal to a first capacitor at a predetermined interval; and a sensing circuit unit sensing a change in capacitance generated by the first capacitor based on the driving signal, in which a portion of a plurality of switches included in the sensing circuit unit operate at a first interval, the same as the interval of the driving signal, and remaining switches among the plurality of switches operate at a second interval, different from the first interval. | 02-06-2014 |
20140043252 | TOUCHSCREEN PANEL AND TOUCHSCREEN DEVICE - There is provided a touchscreen panel including: a plurality of first electrodes formed on a substrate and including a plurality of first unit electrodes connected in a first axial direction; and a plurality of second electrodes formed on the substrate and including a plurality of second unit electrodes connected in a second axial direction perpendicular to the first axial direction, wherein a plurality of slits having a curved shape are formed between the plurality of first and second electrodes, part of the first unit electrodes and part of the second unit electrodes are included in a unit sensing cell having a rectangular shape, and a virtual slit obtained by rotating a slit formed in a direction toward a corner of the unit sensing cell from a center of the unit sensing cell by 90 degrees is identical to a slit formed in a direction toward another corner adjacent thereto. | 02-13-2014 |
20140104226 | APPARATUS AND METHOD OF CONTROLLING CAPACITANCE DETECTION, AND TOUCHSCREEN APPARATUS - There are provided an apparatus and a method of controlling capacitance detection, and a touchscreen apparatus. The apparatus includes: a driving circuit unit providing driving signals including a preset number of driving pulses to a plurality of respective driving electrodes of a panel unit; a detecting circuit unit removing electrical noise from a first voltage corresponding to a capacitance change in the panel unit when the electrical noise is included in the first voltage; and a controlling unit controlling the driving circuit unit to generate an additional driving pulse when the electrical noise is included in the first voltage. | 04-17-2014 |
20140184527 | TOUCH PANEL - Disclosed herein is a capacitive touch panel having a single layer electrode structure capable of securing uniformity of capacitance distribution by decreasing capacitive coupling which may be caused by a generation of undesirable parasitic capacitance between short-range electric field lines by a sensing electrode and a ground electrode adjacent to the sensing electrode employing a mutually inclined concave and convex part toward the sensing electrode and by the sensing electrode and an adjacent driving electrode having a interdigit structure formed in the same method, in a mutual capacitive type touch panel that configures together the driving electrode and the sensing electrode on a single electrode layer having a matrix structure in which a plurality of electrodes are arranged to be intersected with each other on a base substrate. | 07-03-2014 |
Patent application number | Description | Published |
20130294006 | CONDUCTIVE RESIN COMPOSITION, MULTILAYER CERAMIC CAPACITOR HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME - There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners. | 11-07-2013 |
20140192453 | CONDUCTIVE RESIN COMPOSITION, MULTILAYER CERAMIC CAPACITOR HAVING THE SAME, AND METHOD OF MANUFACTURING THE MULTILAYER CERAMIC CAPACITOR - There is provided a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS), and 50 to 90 wt % of conductive metal powder particles. | 07-10-2014 |
20140204502 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm. | 07-24-2014 |
20140233147 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles. | 08-21-2014 |
20150022940 | CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof. | 01-22-2015 |
Patent application number | Description | Published |
20130250190 | BACK LIGHT UNIT INTEGRATED DIGITIZER - Disclosed herein is a back light unit integrated digitizer. The back light unit integrated digitizer includes a cover disposed on one surface of the back light unit to protect the back light unit; and a loop coil formed on the cover, wherein the loop coil is directly formed on the cover of the back light unit to integrally form the digitizer in the back light unit, thereby reducing the overall thickness to implement slimness and saving manufacturing costs to secure price competitiveness. | 09-26-2013 |
20140035841 | SENSOR FOR DIGITIZER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a sensor for a digitizer and a method for manufacturing the same. The sensor for a digitizer includes a magnetic layer having insulation property, a first coil formed on one surface of the magnetic layer, an insulating layer formed on one surface of the magnetic layer while covering the first coil, and a second coil formed on one surface of the insulating layer. By this configuration, the coil is directly formed on the magnetic layer to simplify a structure and improve stability of a signal transmitted and received from and to a coil by the magnetic layer. | 02-06-2014 |
20140048315 | TOUCH PANEL - Disclosed herein is a touch panel including: a transparent substrate; conductive patterns formed on the transparent substrate such that wavy lines thereof are spaced apart from each other and arranged in parallel with each other, each of the wavy lines having a sine wave form where first peaks and second peaks alternately continue along a length direction thereof; and connecting patterns formed on the transparent substrate, each of the connecting patterns electrically connecting between the wave lines, so that good visibility can be achieved even though electrodes and wirings are disposed in an active area of the transparent substrate, by forming uniform pattern of electrodes and wirings on the transparent substrate. | 02-20-2014 |
20140062921 | DIGITIZER - Disclosed herein is a digitizer, including: a transparent substrate that is partitioned into an active area and an inactive area at an outside of the active area; an electrode that is formed in the active area on one surface of the transparent substrate; a coil that is formed in the active area on one surface of the transparent substrate; and a magnetic sheet that is formed in the inactive area on the other surface of the transparent substrate corresponding to the coil. | 03-06-2014 |
20140071083 | DIGITIZER - Disclosed herein is a digitizer including: a transparent substrate; an electrode formed on the transparent substrate to sense a change in capacitance; and a coil formed on the transparent substrate to receive a signal transmitted from the outside. As the touch input unit, various units such as an electronic pen and user's finger, and the like, can be used. | 03-13-2014 |
20140083750 | RAW GLASS PLATE FOR MANUFACTURING TOUCH PANEL AND METHOD OF MANUFACTURING TOUCH PANEL USING RAW GLASS PLATE - Disclosed herein are a raw glass plate for manufacturing a touch panel and a method of manufacturing a touch panel using the raw glass plate. The raw glass plate includes a unit substrate region divided into an active region and a non-active region that is an edge portion of the active region; electrodes formed on the active region of the unit substrate region; wirings that are formed on the non-active region of the unit substrate region and are electrically connected to the electrodes; and a guard line that is formed outside a position at which the wirings are formed, on the non-active region of the unit substrate region in a longitudinal direction of the wirings. | 03-27-2014 |
20140176486 | TOUCH SCREEN AND METHOD FOR DRIVING THE SAME - Disclosed herein are a touch screen and a method for driving the same. The touch screen includes: a switching unit including a plurality of switches connected to traces of driving lines and sensing lines of the touch screen, respectively; a sensing unit sensing capacitance and electromagnetic resonance (EMR) according to a switching operation of the switching unit; and a main controlling unit controlling the switching operation of the switching unit according to an operation mode of the touch screen. Therefore, it is possible to improve sensitivity of sensing without increasing a bezel region of the touch screen. In addition, the EMR and the capacitance may be sensed using the same trace structure, and an antenna pattern may be formed and operated as an antenna. | 06-26-2014 |
20140176821 | TOUCH PANEL AND FABRICATING METHOD THEREOF - Disclosed herein are a touch panel and a fabricating method thereof. In the touch panel according to an embodiment of the present invention, a noise shielding layer may be separately formed between a transparent substrate and an electrode pattern, thereby shielding noise that occur from a display coupled to the touch panel. In addition, through a bridge electrode pattern formed by patterning the noise shielding layer and a bridge insulating pattern patterned on an insulating layer formed on the noise shielding layer, a first electrode pattern and a second electrode pattern may be formed on the same plane of the transparent substrate so as to intersect with each other, thereby ensuring reliability of electrical connection between each electrode pattern. | 06-26-2014 |
20140253822 | DISPLAY DEVICE INCLUDING TOUCH PANEL - Disclosed herein is a display device including a touch panel including: a touch panel including a window substrate and an electrode pattern formed on one surface of the window substrate and a display unit bonded to one surface of the touch panel, wherein a stopper is formed in a spaced space between the display unit and the electrode pattern facing each other. | 09-11-2014 |