Patent application number | Description | Published |
20090301762 | OLIGOMERIC HALOGENATED CHAIN EXTENDERS FOR PREPARING EPOXY RESINS - An oligomeric halogenated chain extender composition comprising the reaction product of: (a) an excess of a halogenated phenolic compound; and (b) a halogenated epoxy resin; in the presence of (c) a solvent; and a halogenated epoxy resin composition comprising the reaction product of the oligomeric halogenated chain extender composition with an epoxy resin. | 12-10-2009 |
20100294429 | EPOXY RESIN FORMULATIONS - A curable halogen-free epoxy resin composition comprising from 40 to 80 percent by weight of a phenol aldehyde condensation product, from 10 to 40 percent by weight of a phosphorous-containing phenolic epoxy resin, and from 10 to 40 percent by weight of an aromatic hardening agent having a sulphone group and an amine group. A prepreg and laminate can be formed from this composition. | 11-25-2010 |
20100311891 | THERMOSETTING COMPOSITIONS COMPRISING SILICONE POLYETHERS, THEIR MANUFACTURE, AND USES - Thermosetting compositions comprising (a) at least a first thermosetting resin, and (b) at least one silicone polyether, methods of making such thermosetting compositions, and thermoset products made from the compositions. | 12-09-2010 |
20110009527 | THERMOSETTING COMPOSITIONS COMPRISING SILICONE POLYETHERS, THEIR MANUFACTURE, AND USES - Thermosetting compositions comprising a) at least a first thermosetting resin, b) at least one silicone polyether, and c) at least one filler or fibrous reinforcement, methods of making such thermosetting compositions, and thermoset products made from the compositions. | 01-13-2011 |
20110037028 | FLAME RETARDANT COMPOSITION - A curable epoxy resin composition comprising at least one oxazolidone-modified epoxy resin which is the reaction product of an epoxy resin and an isocyanate, at least one maleimide, at least one cyanate ester, and optionally at least one non-oxazolidone containing epoxy resin, wherein at least one component of the composition comprises halogen or phosphorous to provide flame retardancy to the cured composition, a method of making the composition and methods of making a prepreg and an electrical laminate using the composition. | 02-17-2011 |
20120172493 | CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM - A curable epoxy resin composite composition including a reinforcing material and an epoxy resin composition, and a process for preparing a composite from such composition; wherein a combination of at least one alkanolamine and at least one styrenated phenol are present in the epoxy resin composition in a sufficient amount to increase the rate of reaction of the at least one epoxy resin and the at least one alkanolamine curing agent while maintaining the thermal and mechanical properties of the composite upon curing of the epoxy resin composition. | 07-05-2012 |
20120238668 | COATING COMPOSITIONS - A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption. | 09-20-2012 |
20120238709 | EPOXY RESIN COMPOSITIONS - An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates. | 09-20-2012 |
20120289624 | COMPOSITE COMPOSITIONS - A curable resin composition for composites and electrical laminates including (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material; wherein the composite or electrical laminate has a balance of properties including a combination of (a) a Tg of at least about 150° C.; and (b) a water uptake of less than about 2.5 wt %. | 11-15-2012 |
20130023605 | CURABLE COMPOSITIONS - A curable composition comprising (A) a resin component, comprising (i) an epoxy compound, (ii) a diluent, and (Hi) a first filler and (B) a hardener component, comprising (iv) a curing agent, (v) a second filler, and (vi) a non-reactive polyether block copolymer additive. The resin component and hardener component each having a viscosity of no greater than 30 Pascal-second under an applied shear of 10 reciprocal seconds at 25 degrees Celsius and the curable composition after 120 seconds of mixing the resin component and hardener component together under an applied shear of 10 reciprocal seconds has a viscosity of at least 100 Pascal-second at 25 degrees Celsius. | 01-24-2013 |
20130115440 | COMPOSITES - Embodiments include methods of forming a composite. The methods can include providing a foam core, wherein the foam core includes a foam having a softening point of 90° C. to 110° C., covering a portion of the foam core with a prepreg, contacting the prepreg that covers the portion of the foam core with a curable composition, and curing the prepreg and the curable composition to form the composite, wherein the prepreg insulates the foam core during the curing so that the foam maintains a temperature that is below the softening point. Embodiments include a composite obtained by curing the prepreg and the curable composition. Embodiments include B-stageable formulation having a resin component and a hardener component. | 05-09-2013 |
20150065613 | EPOXY ADHESIVE COMPOSITION - A curable epoxy adhesive composition including (a) at least one first epoxy resin; (b) at least one first diluent; (c) at least one first hardener; (d) at least a first hydrophilic filler that has a predetermined aspect ratio; (e) at least a second hydrophobic filler that is different from the first filler and that has a predetermined aspect ratio; and (f) at least a third filler that is different from the first and second fillers; wherein the third filler has a predetermined aspect ratio higher than the first filler and the second filer; and wherein the volume ratio of the third filler to the combination of the first filler and second filler is in the range of from 1:1 to 10:1 such as to minimize the thermal residual stresses of the cured product made from the curable composition. | 03-05-2015 |
20150099831 | COATING COMPOSITIONS - A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption. | 04-09-2015 |