Patent application number | Description | Published |
20130008705 | CORELESS PACKAGE SUBSTRATE AND FABRICATION METHOD THEREOF - A coreless package substrate is provided, including: a circuit buildup structure including at least a dielectric layer, at least a circuit layer and conductive elements; first electrical contact pads embedded in the lowermost dielectric layer of the circuit buildup structure; a plurality of metal bumps formed on the uppermost circuit layer of the circuit buildup structure; a dielectric passivation layer disposed on a top surface of the circuit buildup structure and the metal bumps; and second electrical contact pads embedded in the dielectric passivation layer and electrically connected to the metal bumps. With the second electrical contact pads being engaged with the metal bumps and having top surfaces thereof completely exposed, the bonding strength between the second electrical contact pads and a chip to be mounted thereon and between the second electrical contact pads and the metal bumps can be enhanced. | 01-10-2013 |
20130008706 | CORELESS PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME - A coreless packaging substrate is provided which includes: a circuit buildup structure having at least a dielectric layer, at least a wiring layer and a plurality of conductive elements, a plurality of electrical pads embedded in the lowermost one of the at least a dielectric layer, a plurality of metal bumps formed on the uppermost one of the at least a wiring layer, and a dielectric passivation layer formed on the surface of the uppermost one of the circuit buildup structure and the metal bumps, with the metal bumps exposed from the dielectric passivation layer. The metal bumps each have a metal column portion and a wing portion integrally connected to the metal column portion, such that the bonding force between the metal bumps and a semiconductor chip is enhanced by the entire top surface of the wing portions of the metal bumps being completely exposed. | 01-10-2013 |
20130009293 | PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME - A packaging substrate includes a first dielectric layer; a plurality of first conductive pads embedded in and exposed from a first surface of the first dielectric layer; a first circuit layer embedded in and exposed from a second surface of the first dielectric layer; a plurality of first metal bumps disposed in the first dielectric layer, each of the first metal bumps having a first end embedded in the first circuit layer and a second end opposing the first end and disposed on one of the first conductive pads, a conductive seedlayer being disposed between the first circuit layer and the first dielectric layer and between the first circuit layer and the first metal bump; a built-up structure disposed on the first circuit layer and the first dielectric layer; and a plurality of second conductive pads disposed on the built-up structure. The packaging substrate has an over-warpage problem improved. | 01-10-2013 |
20130009306 | PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A packaging substrate includes a first dielectric layer, a first circuit layer, a first metal bump, and a built-up structure. The first metal bump and the first circuit layer are embedded in and exposed from two surfaces of the first dielectric layer. The end of the first metal bump is embedded in the first circuit layer and between the first circuit layer and the first dielectric layer. In addition, a conductive seedlayer is disposed between the first circuit layer and the first metal bump. The built-up structure is disposed on the first circuit layer and the first dielectric layer. The outmost layer of the built-up structure has a plurality of conductive pads. Compared to the prior art, the present invention can effectively improve the warpage problem of the conventional packaging substrate. | 01-10-2013 |
20130335928 | CARRIER AND METHOD FOR FABRICATING CORELESS PACKAGING SUBSTRATE - A fabrication method of a coreless packaging substrate is provided, including the steps of: forming an inner built-up circuit board on a carrier; removing the carrier; and symmetrically forming a first outer built-up structure and a second outer built-up structure on top and bottom surfaces of the inner built-up circuit board, respectively. The present invention effectively increases the product yield, saves the fabrication cost, and reduces wastes. | 12-19-2013 |
20140090794 | METHOD OF FABRICATING PACKAGING SUBSTRATE - A packaging substrate includes a first dielectric layer; a plurality of first conductive pads embedded in and exposed from a first surface of the first dielectric layer; a first circuit layer embedded in and exposed from a second surface of the first dielectric layer; a plurality of first metal bumps disposed in the first dielectric layer, each of the first metal bumps having a first end embedded in the first circuit layer and a second end opposing the first end and disposed on one of the first conductive pads, a conductive seedlayer being disposed between the first circuit layer and the first dielectric layer and between the first circuit layer and the first metal bump; a built-up structure disposed on the first circuit layer and the first dielectric layer; and a plurality of second conductive pads disposed on the built-up structure. The packaging substrate has an over-warpage problem improved. | 04-03-2014 |
20150068033 | METHOD OF FABRICATING PACKAGING SUBSTRATE - A packaging substrate includes a first dielectric layer, a first circuit layer, a first metal bump, and a built-up structure. The first metal bump and the first circuit layer are embedded in and exposed from two surfaces of the first dielectric layer. The end of the first metal bump is embedded in the first circuit layer and between the first circuit layer and the first dielectric layer. In addition, a conductive seedlayer is disposed between the first circuit layer and the first metal bump. The built-up structure is disposed on the first circuit layer and the first dielectric layer. The outmost layer of the built-up structure has a plurality of conductive pads. Compared to the prior art, the present invention can effectively improve the warpage problem of the conventional packaging substrate. | 03-12-2015 |
Patent application number | Description | Published |
20140131179 | Multi-Level Rotary Switch - The present invention relates to a rotary switch with multi-level, the rotary base drives the first conductive sheet to rotate with the second conductive sheet when the rotary shaft is rotated, and the second conductive sheet leaves one of the conductive contact elements; the position end of the second conductive sheet is pressed by one positioning surface during the rotation, and the second spring stores energy; the second spring then releases the energy to the fourth end of the second conductive sheet, and the position end of the second conductive sheet slides on one positioning surface until the position end of the second conductive sheets is positioned solidly between two positioning surfaces; so that, the material cost in production can be lower down, and life time of the rotary switch can be increased. | 05-15-2014 |
20140131187 | Heat-Spot Distant Type Push Switch Structure - Heat-spot distant type push switch structure comprises: a supporting terminal, a compression spring, a switching spring, an electrical terminal, and a sliding lever assembly. Compression spring, switching spring and the switching member of the sliding lever assembly are stacked for connection and facilitate the occupied space of the heat-spot distant type push switch structure capable of being reduced; moreover, the supporting terminal, the compression spring, the switching spring, the electrical terminal, and the sliding lever assembly are designed to particular structures for forming a specific distant between the switching member and the touch point of two contact points of the heat-spot distant type push switch structure, such that the switching member is away from the heat-spot produced by the two contact points; therefore the switching member can still not be fused after the heat-spot distant type push switch structure is long-term used. | 05-15-2014 |
20140166449 | Forward/Backward Rotation Switching Mechanism - The present invention relates to a forward/backward rotation switching mechanism, comprising: a cover, a turntable, a terminal-fixing body, a first contact terminal, and a second contact terminal. In the present invention, a plurality of dust-off trenches are especially formed on the peripheral edges of the turntable for preventing from the dust accumulation between the turntable and a cover; therefore, even if the forward/backward rotation switching mechanism is used in an environment having a lot of dust, the turntable can still be turned around because the dust is ruled out by the dust-off trenches. | 06-19-2014 |