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| 20120319881 | SIGMA-DELTA MODULATOR - A sigma-delta modulator includes a front portion and a hybrid portion to form a loop filter. The front portion includes integrator(s) and feed-forward path(s), and is arranged to provide a front signal by combining signals of the integrator(s) and feed-forward path(s). The hybrid portion is coupled to the front portion, and arranged to provide a filtered signal by combining an integration of the front signal and a weighting of the front signal. The filtered signal is quantized, converted from digital to analog, and fed back to the loop filter. | 12-20-2012 |
| 20130154863 | AMPLIFIER, FULLY-DIFFERENTIAL AMPLIFIER AND DELTA-SIGMA MODULATOR - An amplifier, a fully-differential amplifier and a delta-sigma modulator are disclosed. The disclosed amplifier includes a front-end gain stage, an AC-coupled push-pull output stage and a compensation circuit. The compensation circuit is coupled between the front-end gain stage and an output terminal of the amplifier. The AC-coupled push-pull output stage uses an AC-coupled capacitor (which is a passive two terminal electrical component rather than a stray or parasitic capacitance of a transistor) to couple the front-end gain stage to a gate of a top or bottom transistor of a push-pull structure introduced in the AC-coupled push-pull output stage, and uses a resistance component to couple a gate of the top or bottom transistor (depending on which one is coupled to the AC-coupled capacitor) to a bias voltage level. | 06-20-2013 |
| 20130200953 | OPERATIONAL AMPLIFIER CIRCUITS - An operational amplifier circuit includes a first stage amplifier circuit, a second stage amplifier circuit and a first feedforward circuit. The first stage amplifier circuit is coupled to a first input node for receiving a first input signal and amplifying the first input signal to generate a first amplified signal. The second stage amplifier circuit is coupled to the first stage amplifier circuit for receiving the first amplified signal and amplifying the first amplified signal to generate a first output signal at a first output node. The first feedforward circuit is coupled between the first input node and the second stage amplifier circuit for feeding the first input signal forward to the second stage amplifier circuit. | 08-08-2013 |
| 20130207718 | FILTERS WITH ORDER ENHANCEMENT - A filter is provided. The filter receives an input signal and generates an output signal according to the input signal. The filter includes an input network, a high-pass network, and an operational circuit. The first input network provides a first normal path for the input signal to generate a first normal signal. The first high-pass network provides a first high-pass path for the input signal to generate a first high-pass signal. The operational circuit has first and second input terminals. The polarity of the second input terminal is inverse to that of the first input terminal. The operational circuit receives the first normal signal by the first input terminal and the first high-pass signal by the second input terminal such that a subtraction operation is performed on the first normal signal and the first high-pass filter to accomplish a low-pass filtering operation for generating the output signal. | 08-15-2013 |
| 20130214951 | SIGMA-DELTA MODULATORS WITH EXCESS LOOP DELAY COMPENSATION - A sigma-delta modulator is provided for generating a digital output signal. The sigma-delta modulator includes a multi-stage loop filter, a quantizer, and a digital-to-analog converter. The multi-stage loop filter receives an analog input signal and generates an integrated output signal according to the analog input signal. Each stage of the multi-stage loop filter includes a feedback network. The quantizer receives the integrated output signal and quantizes the integrated output signal to generate the digital output signal. The digital-to-analog converter receives the digital output signal and converts the digital output signal to a compensation signal. The digital-to-analog converter provides the compensation signal to a plurality of internal nodes in the feedback network of the last stage of the multi-stage loop filter. | 08-22-2013 |
| 20140103999 | AMPLIFIER, FULLY-DIFFERENTIAL AMPLIFIER AND DELTA-SIGMA MODULATOR - An amplifier includes a front-end gain stage and an AC-coupled push-pull output stage. The AC-coupled push-pull output stage includes a first transistor, having a source, a drain and a gate, wherein the source of the first transistor is coupled to a first voltage level; a second transistor, having a source, a drain and a gate, wherein the source of the second transistor is coupled to a second voltage level, the gate of the second transistor is coupled to the front-end gain stage, and the drain of the second transistor is coupled to the drain of the first transistor to form an output terminal of the amplifier; an AC-coupled capacitor, which is a passive two terminal electrical component coupled between the front-end gain stage and the gate of the first transistor; | 04-17-2014 |
| 20140159930 | SIGMA-DELTA MODULATORS WITH HIGH SPEED FEED-FORWARD ARCHITECTURE - A sigma-delta modulator is provided for generating a digital output signal. The sigma-delta modulator is used to generate a digital output signal. The sigma-delta modulator includes a multi-stage loop filter and a quantizer. The multi-stage loop filter receives an analog input signal and generates an integrated output signal according to the analog input signal. The quantizer is coupled to the multi-stage loop filter. The quantizer receives the integrated output signal and quantizes the integrated output signal to generate the digital output signal. Different feed-forward paths of the sigma-delta modulator are available for different frequency bands. | 06-12-2014 |
| 20150028951 | OPERATIONAL AMPLIFIER CIRCUITS - An implementation of an operational amplifier circuit includes a first stage amplifier circuit, a second stage amplifier circuit and a first feedforward circuit. The first stage amplifier circuit is coupled to a first input node for receiving a first input signal and amplifying the first input signal to generate a first amplified signal. The second stage amplifier circuit is coupled to the first stage amplifier circuit for receiving the first amplified signal and amplifying the first amplified signal to generate a first output signal at a first output node. The first feedforward circuit is coupled between the first input node and the second stage amplifier circuit for feeding the first input signal forward to the second stage amplifier circuit. | 01-29-2015 |
| 20150180420 | AMPLIFIER, FULLY-DIFFERENTIAL AMPLIFIER AND DELTA-SIGMA MODULATOR - An amplifier includes a front-end gain stage and an AC-coupled push-pull output stage. The AC-coupled push-pull output stage includes a first transistor, having a source, a drain and a gate, wherein the source of the first transistor is coupled to a first voltage level. The AC-coupled push-pull output stage further includes a second transistor, having a source, a drain and a gate, wherein the source of the second transistor is coupled to a second voltage level, the gate of the second transistor is coupled to the front-end gain stage, and the drain of the second transistor is coupled to the drain of the first transistor to form an output terminal of the amplifier. Further, the AC-coupled push-pull output stage includes an AC-coupled capacitor, which is a passive two terminal electrical component coupled between the front-end gain stage and the gate of the first transistor. | 06-25-2015 |
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| 20140022737 | POWER SYSTEM AND MODULAR POWER DEVICE THEREOF - A modular power device is used for mounting on a main plate. The modular power system includes a first substrate, a driving module and a converting module. The first substrate having a first axial direction and a second axial direction substantially perpendicular to the first axial direction is inserted into the main plate, such that the second axial direction is substantially perpendicular to the main plate. The driving module is located on one side of the first substrate and electrically connected thereon. The converting module is located on the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction. | 01-23-2014 |
| 20140098498 | POWER SYSTEM AND POWER CONVERTING DEVICE THEREOF - A power converting device includes a first substrate, a driving module, and a converting module. The first substrate is inserted into a main plate. The first substrate has a first axial direction and a second axial direction perpendicular to the first axial direction, the second axial direction is perpendicular to the main plate. The driving module is located at one side of the first substrate and electrically connected to the first substrate. The converting module is located at the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to a length of the first substrate in the first axial direction, and a width of the converting module is smaller than the length of the first substrate in the first axial direction. | 04-10-2014 |
| 20140202726 | POWER SUPPLY ENCLOSURE AND METHOD OF MANUFACTURING THE SAME - In a power supply enclosure and a method of manufacturing the same, the power supply enclosure is divided into an independent top cover, an independent bottom base, as well as two independent side panels. The top cover, the bottom base, and the side panels are formed by blanking After extruded hole, punching or bending processes by using a change core method, the top cover and the bottom base were made, followed by assembling the two side panels on the two sides between the top cover and the bottom base to form the power supply enclosure group. | 07-24-2014 |
| 20160037670 | MODULAR POWER DEVICE - A modular power device is used for mounting on a main plate. The modular power device includes a first substrate, a driving module, and a converting module. The first substrate having a first axial direction and a second axial direction perpendicular to the first axial direction is inserted into the main plate to make the second axial direction be perpendicular to the main plate. The driving module is located on one side of the first substrate, and the converting module is located on the other side of the first substrate and includes a second substrate, wherein the second substrate is inserted into the main plate. A length of the converting module is substantially equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction. | 02-04-2016 |
| 20160037671 | MODULAR POWER DEVICE - A modular power device is used for mounting on a main plate. The modular power device includes a first substrate, a driving module, and a converting module. The first substrate has a first axial direction and a second axial direction perpendicular to the first axial direction. The driving module is located on one side of the first substrate, the converting module is located on the other side of the first substrate, and includes a second substrate parallel to the main plate, wherein two opposite sides of the first substrate are inserted into the main plate and the second substrate. A length of the converting module is equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction. | 02-04-2016 |
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| 20140204507 | TOUCH PAD MODULE AND ELECTRONIC DEVICE - A touch pad module suitable for assembling in a casing of an electronic device is provided. The touch pad module includes a switch, a triggering element, a fixing element and an elastic element. The switch is disposed in the casing. The triggering element is disposed in the casing and corresponds to the switch. The fixing element fixes the triggering element to the casing. The elastic element is leaned between the casing and the triggering element, and the elastic element permanently drives the triggering element lean against the fixing element. The touch pad module is subjected to an external force to make the triggering element and switch to lean against each other, and compress the elastic element. An electronic device including a casing and a touch pad module assembled in the casing is also provided. | 07-24-2014 |
| 20150062810 | CUSHION STRUCTURE AND ELECTRONIC DEVICE - A cushion structure suitable for an electronic device is provided. The cushion structure includes cushions and at least one channel. Each cushion has a first surface and a second surface that are flexible and opposite to each other. Each cushion is combined to a body of the electronic device through its second surface, and the electronic device is placed on and in contact with a platform through the first surfaces of the cushions. The channel is in the body and communicated with the second surfaces. The channel is filled with a fluid that is in contact with the second surfaces of the cushions. When the first surface of at least one of the cushions sustains a force and deforms toward the second surface, the fluid in the channel is compressed to drive the second surfaces of the other cushions to deform toward the first surfaces to support the electronic device. | 03-05-2015 |
| 20150234435 | Electronic Device and Component-Positioning Module Thereof - A component-positioning module comprises an elastic member, a plurality of fastening members, a plurality of adjustment elements and a positioning element. The elastic member is secured to a first component of the electronic device by the plurality of fastening members, and an operative portion of the elastic member is movable in a linear extension direction substantially perpendicular to an outer surface of the first component. The plurality of adjustment elements are secured between the elastic member and the first component by the fastening members respectively; the positioning element is combined with the operative portion to position a second component of the electronic device, and the positioning element at least partially protrudes from the outer surface. Manipulation of the plurality of fastening members deforms the plurality of adjustment elements and changes a distance of the positioning element protruding from the outer surface. | 08-20-2015 |
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| 20130174677 | RELATIVE-ROTATION SYNCHRONOUS MOVEMENT-AID DEVICE - A relative-rotation synchronous movement-aid device, which has a simple structure and is easy to assemble. The synchronous movement-aid device includes a linking arm and a rotational wheel assembled with the linking arm. The linking arm has a pivoted end and a free end mounted on the rotational wheel. The pivoted end is mounted on a rail. When an external force is applied to the linking arm, the pivoted end can freely move along the rail. The free end serves to make the rotational wheel relatively rotate along with the movement of the linking arm to achieve better synchronous movement effect than the conventional slide mechanism. | 07-11-2013 |
| 20130174681 | SYNCHRONOUS MOVEMENT-AID DEVICE FOR SLIDE MODULE - A synchronous movement-aid device for slide module includes at least one aid device. The aid device includes a first arm, a second arm connected with the first arm and a rotational wheel connected with the second arm and rotatable with the movement of the second arm. The first arm has a pivoted end mounted on a rail. When an external force is applied to the first arm, the pivoted end can freely move along the rail relative to the second arm. The second arm has a fixed end connected to the rotational wheel. When the first arm moves along the rail, the rotational wheel is driven to rotate so as to achieve better synchronous movement effect than the conventional slide mechanism. | 07-11-2013 |
| 20130241383 | SLIDE AND ROTATION MODULE FOR EXECUTABLE MULTIPLE OPERATION MODE ELECTRONIC DEVICE - The present invention discloses a slide and rotation module for an executable multiple operation mode electronic device, providing a structure with inclination-adjustable, movable, rotational and bidirectional folding functions. The slide and rotation module includes a steering arm and a slide seat disposed between the first machine body and the second machine body. The steering arm includes a first end pivoted to a first machine body and a second end pivoted to a second machine body, in which the second end of the steering arm is rotated and translated within a limiting part in response to a motion of the first machine body. | 09-19-2013 |
| 20130272632 | LINKAGE-TYPE SYNCHRONOUS SLIDE STRUCTURE OF RELATIVE SLIDE ASSEMBLY - A linkage-type synchronous slide structure of relative slide assembly includes a slide member and a relative slide member slidably connected to the slide member. The relative slide member is formed with a slide guide section. The slide member is slidable relative to the relative slide member along the slide guide section. Two extensible/retractable assemblies with a variable length are respectively oppositely disposed on two sides of the slide guide section. Second ends of the extensible/retractable assemblies are respectively pivotally connected to corresponding sections of two sides of the slide member. First ends of the extensible/retractable assemblies are pivotally connected with each other and slidable along the slide guide section. A restriction mechanism is disposed between the extensible/retractable assemblies and the relative slide member to serve as a pivotal center of the extensible/retractable assemblies for restricting axial slide thereof and synchronizing the moves of two sides of the slide member. | 10-17-2013 |
| 20130276267 | LINKAGE-TYPE SYNCHRONIZATION MODULE STRUCTURE - A linkage-type synchronization module structure includes a slide member, a relative slide member and two extensible/retractable assemblies connected therebetween. Second ends of the extensible/retractable assemblies are respectively pivotally connected to corresponding sections of two sides of the slide member. First ends of the extensible/retractable assemblies are slidably pivotally connected with each other and restricted by a middle slide guide section disposed between the slide member and the relative slide member. Two fixed support sections are respectively oppositely disposed on two lateral sides of the middle slide guide section. The extensible/retractable assemblies are formed with slide guide sections in which the fixed support sections are fitted. A restriction slide guide mechanism is disposed between each extensible/retractable assembly and the relative slide member for cooperatively guiding the extensible/retractable assemblies to pivotally rotate and extend/retract so as to synchronize the moves of two sides of the slide member. | 10-24-2013 |
| 20130285475 | WIRING STRUCTURE BETWEEN MAIN BODY AND COVER BODY OF ELECTRONIC DEVICE - A wiring structure between main body and cover body of electronic device includes a support connection member. The support connection member has a first pivoted section pivotally connected to the cover body and a second pivoted section pivotally connected to the main body. The first pivoted section is formed with a first pivot hole communicating with outer side. The second pivoted section is formed with a second pivot hole communicating with outer side. The support connection member is formed with a recessed receiving space between the first and second pivoted sections in communication with the first and second pivot holes. At least one conductive body is disposed in the receiving space. The conductive body has a first connection end and a second connection end respectively outward extending from the first and second pivot holes. A protection cover board is disposed in the receiving space for covering the conductive body. | 10-31-2013 |
| 20140002962 | ELECTRONIC DEVICE OPENING/CLOSING CONTROL MECHANISM | 01-02-2014 |
| 20140002963 | ELECTRONIC DEVICE LOCKING/UNLOCKING MECHANISM | 01-02-2014 |
| 20140055938 | SLIDING-TYPE ELECTRONIC APPARATUS WITH STRENGTHENING FORCE STRUCTURE - A sliding-type electronic apparatus with a strengthening force structure includes a body served as a system terminal and an upper cover disposed on the body and having a surface configured with a touch screen. A sliding and cover-lifting member constituted by a sliding rail, a sliding member and a pivot shaft device is at least disposed between the body and the upper cover. In a normal state, a supporting device, together with the sliding and cover-lifting member, is horizontally and supportively placed in a preset concave chamber space of the body. The auxiliary supporting devices can be formed as an inclined auxiliary support structure on the rear surface of the upper cover when the upper cover is lifted, thereby effectively increasing the screen touch resistance to inhibit screen wobble in an operation process and to promote the support effect and operation stability of the screen. | 02-27-2014 |
| 20140097316 | AUXILIARY SUPPORT DEVICE FOR FLIP TOUCH SCREEN - An auxiliary support device for flip touch screen includes a main body and an upper cover having a touch panel. The main body is preformed with a cavity for assembling with a base seat. The upper cover is preformed with an elongated recess corresponding to the cavity. A slide rail is assembled in the elongated recess. One end of a link member is movably pivotally connected with an outer end of the base seat. A bottom end of a slide member is movably pivotally connected with an inner end of the base seat. The slide member is assembled in the slide rail. The other end of the link member is slidably connected with of a surface of the slide member. When the upper cover is turned upward, the link member is turned upward with the slide member to obliquely support the upper cover. | 04-10-2014 |
| 20140376902 | SHIELD MODULE TRAVEL ENLARGING STRUCTURE - A shield module travel enlarging structure includes a front cover and a rear cover formed with opposite windows. The front and rear covers are assembled to form a module main body having an internal operation space. A shield is mounted in the operation space and movable between a position in alignment with the opposite windows and a position misaligned from the opposite windows. A transmission gear is mounted in the internal operation space of the module main body to cooperate with the shield. The transmission gear at least has a large-gear-ratio gear and a small-gear-ratio gear. The large-gear-ratio gear is drivingly engaged with the shield. A push member is drivingly engaged with the small-gear-ratio gear. When the push member is moved, via the transmission gear, the shield is slid by an enlarged travel. | 12-25-2014 |
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| 20130056795 | FinFET Design Controlling Channel Thickness - System and method for controlling the channel thickness and preventing variations due to formation of small features. An embodiment comprises a fin raised above the substrate and a capping layer is formed over the fin. The channel carriers are repelled from the heavily doped fin and confined within the capping layer. This forms a thin-channel that allows greater electrostatic control of the gate. | 03-07-2013 |
| 20130113042 | MULTI-GATE SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME - A multi-gate semiconductor device and method for forming the same. A multi-gate semiconductor device is formed including a first fin of a first transistor formed on a semiconductor substrate having a first dopant type. The first transistor has a doped channel region of the first dopant type. The device also includes a second fin of a second transistor formed on the first dopant type semiconductor substrate. The second transistor has a doped channel region of a second dopant type. The device further includes a gate electrode layer of the second dopant type formed over the channel region of the first fin and a gate electrode layer of the first dopant type formed over the channel region of the second fin. | 05-09-2013 |
| 20130126981 | MULTI-GATE SEMICONDUCTOR DEVICES - A multi-gate semiconductor device is formed including a semiconductor substrate. The multi-gate semiconductor device also includes a first transistor including a first fin portion extending above the semiconductor substrate. The first transistor has a first channel region formed therein. The first channel region includes a first channel region portion doped at a first concentration of a first dopant type and a second channel region portion doped at a second concentration of the first dopant type. The second concentration is higher than the first concentration. The first transistor further includes a first gate electrode layer formed over the first channel region. The first gate electrode layer may be of a second dopant type. The first dopant type may be N-type and the second dopant type may be P-type. The second channel region portion may be formed over the first channel region portion. | 05-23-2013 |
| 20140103438 | MULTI-GATE SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME - A multi-gate semiconductor device and method for forming the same. A multi-gate semiconductor device is formed including a first fin of a first transistor formed on a semiconductor substrate having a first dopant type. The first transistor has a doped channel region of the first dopant type. The device also includes a second fin of a second transistor formed on the first dopant type semiconductor substrate. The second transistor has a doped channel region of a second dopant type. The device further includes a gate electrode layer of the second dopant type formed over the channel region of the first fin and a gate electrode layer of the first dopant type formed over the channel region of the second fin. | 04-17-2014 |
| 20140151761 | Fin-Like Field Effect Transistor (FinFET) Channel Profile Engineering Method And Associated Device - A FinFET device and method for fabricating a FinFET device are disclosed. An exemplary method includes providing a substrate; forming a fin over the substrate; forming an isolation feature over substrate; forming a gate structure including a dummy gate over a portion of the fin, the gate structure traversing the fin, wherein the gate structure separates a source region and a drain region of the fin, a channel being defined in the portion of the fin between the source region and the drain region; and replacing the dummy gate of the gate structure with a metal gate, wherein during the replacing the dummy gate, a profile of the portion of the fin is modified. In an example, modifying the profile of the portion of the fin includes increasing a height of the portion of the fin and/or decreasing a width of the portion of the fin. | 06-05-2014 |
| 20150079752 | FinFET Design Controlling Channel Thickness - System and method for controlling the channel thickness and preventing variations due to formation of small features. An embodiment comprises a fin raised above the substrate and a capping layer is formed over the fin. The channel carriers are repelled from the heavily doped fin and confined within the capping layer. This forms a thin-channel that allows greater electrostatic control of the gate. | 03-19-2015 |
| 20150162334 | MULTI-GATE SEMICONDUCTOR DEVICES - A multi-gate semiconductor device is formed including a semiconductor substrate. The multi-gate semiconductor device also includes a first transistor including a first fin portion extending above the semiconductor substrate. The first transistor has a first channel region formed therein. The first channel region includes a first channel region portion doped at a first concentration of a first dopant type and a second channel region portion doped at a second concentration of the first dopant type. The second concentration is higher than the first concentration. The first transistor further includes a first gate electrode layer formed over the first channel region. The first gate electrode layer may be of a second dopant type. The first dopant type may be N-type and the second dopant type may be P-type. The second channel region portion may be formed over the first channel region portion. | 06-11-2015 |
| 20150372083 | SEMICONDUCTOR DEVICE INCLUDING A SEMICONDUCTOR SHEET INTERCONNECTING A SOURCE REGION AND A DRAIN REGION - A semiconductor device includes a substrate, a first source/drain (S/D) region, a second S/D region, and a semiconductor sheet. The first S/D region is disposed on the substrate. The second S/D region is disposed above the first S/D region. The semiconductor sheet interconnects the first and second S/D regions and includes a plurality of turns. A method for fabricating the semiconductor device is also disclosed. | 12-24-2015 |
| 20160079239 | SERIES-CONNECTED TRANSISTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A series-connected transistor structure includes a first source, a first channel-drain structure, a second channel-drain structure, a gate dielectric layer, a gate, a first drain pad and a second drain pad. The first source is over a substrate. The first channel-drain structure is over the first source and includes a first channel and a first drain thereover. The second channel-drain structure is over the first source and substantially parallel to the first channel-drain structure and includes a second channel and a second drain thereover. The gate dielectric layer surrounds the first channel and the second channel. The gate surrounds the gate dielectric layer. The first drain pad is over and in contact with the first drain. The second drain pad is over and in contact with the second drain, in which the first drain pad and the second drain pad are separated from each other. | 03-17-2016 |
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| 20130176372 | FIXING MECHANISM FOR FIXING A THERMAL PRINT HEAD MODULE IN DIFFERENT POSITIONS AND THERMAL SUBLIMATION PRINTER THEREWITH - A fixing mechanism for fixing a thermal print head module is disclosed. The thermal print head module is pivoted to a casing. The fixing mechanism includes a base, a linkage member and a plurality of positioning structures. The base is disposed on the casing. The linkage member is pivoted to the base and the thermal print head module. The linkage member is driven by the thermal print head module when the thermal print head module is rotated relative to the casing, such that the linkage member is pivoted to different positions relative to the base. The plurality of the positioning structures is disposed on the linkage member for fixing the linkage member, so as to position the thermal print head module in corresponding positions. | 07-11-2013 |
| 20140251171 | DEVICE FOR POSITIONING PLATEN ROLLER - A device for positioning a platen roller is provided, the device including a body, a first clip, a second clip, a first rotating arm, a second rotating arm, a first linkage, a second linkage and a first elastic element. The first clip and the second clip are disposed movably on the body; the first and the second rotating arm are disposed rotatably on the body; the first linkage couples the first rotating arm and the first clip; the second linkage couples the second rotating arm and the second clip; the first elastic element connects the first clip and the second clip, wherein when the first clip and the second clip move toward a first moving direction and a second moving direction respectively, the first elastic element provides elasticity so that the first clip and the second clip restore. | 09-11-2014 |
| 20140251549 | PEEL-OFF MODULE OF PRINTING DEVICE - A peel-off module of a printing device is provided for peeling off consumables from a consumable tape. The peel-off module is located on a cover of the printing device and comprises at least a main body, a peeling bar, and a peeling roller module. The main body has at least two guiding slots. The peeling bar is connected to the main body for peeling off the consumables from the consumable tape. The peeling roller module is movably assembled to the at least two guiding slots. When an user wants to use the printing device, the peeling roller module is pushed along the at least two guiding slots to a first stop point of the at least two guiding slots and then is pressed down to a second stop point on one of the at least two guiding slots to have the peeling roller module steadily clamping the consumable tape. | 09-11-2014 |
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| 20130134652 | MULTI-FUNCTION PERIPHERAL - A multi-function peripheral (MFP) suited for printing/scanning a paper or a business card is provided. The MFP includes a body and a printing/scanning unit, a feeding roller, and a plurality of idle rollers disposed in the body. The body has a feeding path that the printing/scanning unit, the feeding roller, and the idle rollers are located thereon. The printing/scanning unit used for printing/scanning the paper or the business card on the feeding path. The idle rollers lean against the feeding roller respectively. A path length between two leaning points of any two adjacent idle rollers contacting the feeding roller is shorter than a size of the business card. | 05-30-2013 |
| 20130134666 | PAPER FEEDING DEVICE AND MULTI-FUNCTION PRINTER USING THE SAME - A paper feeding device and a multi-function printer using the same are provided. The paper feeding device includes a frame, a top cover, a set of gear chains, a power unit and a set of driving gears. The set of gear chains and the power unit are disposed on a side of the frame. The set of driving gears is disposed on the top cover. When the top cover is closed relatively to the frame, the set of driving gears interferes with the power unit, and the power unit provides a power to enable the set of driving gears to rotate, so as to drive the set of gear chains. When the top cover is opened relatively to the frame, the set of driving gears releases interference with the power unit and the set of gear chains, and the set of gear chains is at a free rotation status. | 05-30-2013 |
| 20130148175 | SCANNING DEVICE - A scanning device includes a body, a paper-feeding module, a scanning module and two transmission modules. The body has a paper-feeding area and a scanning area stacked with each other. The paper-feeding module is disposed at the paper-feeding area in the body and the scanning module is disposed at the scanning area in the body. One of the transmission modules is disposed within the paper-feeding area and electrically connected to the paper-feeding module so as to convey a document from the paper-feeding area to the scanning area, while another of the transmission modules is disposed within the scanning area and electrically connected to the scanning module so as to drive the scanning module for scanning images on the document. | 06-13-2013 |
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| 20140117800 | LASER-WELDED JOINT STRUCTURE BETWEEN INSULATION FRAME AND BEARING CUP OF FAN AND METHOD OF FORMING SAME - A laser-welded joint structure between insulation frame and bearing cup of fan includes a base having a bearing cup and a stator having at least one insulation frame. The insulation frame includes a sleeve portion defining a bore axially extending therethrough. The sleeve portion is provided on an inner wall surface with at least one pressing section that radially projects into the bore to press a lower side against an upper end of the bearing cup and a bearing received therein. A portion of at least one lateral side of each pressing section that is in contact with the upper end of the bearing cup is melted by laser beam to form a laser-welded joint, so that the insulation frame and the bearing cup are integrally connected together at reduced manufacturing cost and have increased structural strength. A method of forming the laser-welded joint structure is also disclosed. | 05-01-2014 |
| 20140175954 | BASE STRUCTURE FOR COOLING FAN - A base structure for cooling fan includes a seat, a circuit board and a motor assembly. The seat has an inner side served as a supporting surface. The circuit board has a first side attached to a top of the supporting surface and an opposite second side having a plurality of electronic elements provided thereon. The motor assembly includes a plurality of stacked silicon steel plates located on the circuit board and above the electronic elements. With the first side of the circuit board being attached to the supporting surface of the seat and the electronic elements on the second side of the circuit board being located in spaces between the motor assembly and the circuit board, more silicon steel plates can be stacked in the motor assembly to enable upgraded motor working efficiency and reduced electric current needed by the cooling fan to operate. | 06-26-2014 |
| 20140356054 | CONNECTION STRUCTURE APPLIED TO A FAN FOR CONNECTING A METAL MEMBER WITH A SHAFT BY MEANS OF LASER - A connection structure applied to a fan for connecting a metal member with a shaft by means of laser. The connection structure includes a metal member and a shaft. The metal member has an opening, a first side and a second side. The opening is formed through a center of the metal member. The shaft is inserted in the opening. An outer circumference of the shaft is welded with a circumference of the opening on the first side to form at least one first welding section between the contact sections of the outer circumference of the shaft and the circumference of the opening on the first side. The first welding section is connected between the outer circumference of the shaft and the circumference of the opening on the first side to integrally connect the metal member with the shaft. The connection structure applied to the fan can lower cost. | 12-04-2014 |
| 20140356170 | OIL RETURN STRUCTURE FOR FAN - An oil return structure for fan includes a base, a bearing, a retaining ring and a rotor. The base has a bearing cup internally defining a receiving space for receiving the bearing therein. The bearing has a centered and axially extended shaft hole. The retaining ring is located at a front end of the bearing and has a central hole. The rotor includes a hub and a shaft. The shaft is extended through the central hole of the retaining ring into the shaft hole of the bearing, and is provided with an annular groove corresponding to the retaining ring. Oil in the bearing flowing to the annular groove during fan operation is centrifugally pulled out of the shaft and then caught by the retaining ring, from where the oil returns to the bearing. Therefore, loss of oil from the bearing is largely reduced to ensure extended fan service life. | 12-04-2014 |
| 20150233444 | FAN VIBRATION ABSORBING STRUCTURE AND FAN USING SAME - A fan vibration absorbing structure includes a bearing cup and a vibration absorbing element. The bearing cup includes a first section, a second section and a bearing holding hole. The first and the second section are connected end-to-end to enclose a receiving space therein, which communicates with the bearing holding hole. The vibration absorbing element is fitted between the first and the second section. With the fan vibration absorbing structure included in a fan, it is able to largely reduce the vibration occurred during fan operation. | 08-20-2015 |
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| 20140003036 | DISPLAY DEVICE FOR LIGHTING OBJECTS | 01-02-2014 |
| 20140268674 | LIQUID MOTION LAMP HOLDER COMBINED LIGHTING - The invention relates to a liquid motion lamp holder combined lighting, comprising: a holder having a base, a first mounted seat, a second mounted seat, a support bracket, and a transparent bottle having at least two immiscible substances therein and arranged between the first mounted seat and second mounted seat. Whereby the transparent bottle turns into liquid motion lamp visual effect through a projected light of an LED bulb at a bottom of the first containing room and required lighting is available through the lighting bulb. Due to the design of the containing height of the second containing room, an end of the transparent bottle can be moved in the containing height along the vertical axis of the base up and down for the transparent bottle to be easily installed and removed between the first mounted seat and second mounted seat. | 09-18-2014 |
| 20140268675 | LIQUID MOTION LAMP HOLDER IMPROVEMENT - The invention relates to a liquid motion lamp holder improvement, comprising: a holder having a base, a first mounted seat, a second mounted seat, a support bracket connecting to a lower end of the holder and the second mounted seat, transparent bottle having at least two immiscible substances therein and arranged between the first mounted seat and second mounted seat; and at least a joint sleeve mounted on an end of the transparent bottle for securely positioning on the vertical axis of the base. Whereby the transparent bottle turns into liquid motion lamp visual effect through a projected light of an LED bulb at a bottom of the first containing room and can be moved along the vertical axis of the base up and down for easily installed and removed between the first mounted seat and second mounted seat. | 09-18-2014 |
| 20150233553 | POSITIONING STRUCTURE FOR LAMP SHADE - A positioning structure for lamp shade comprises a bracket; a main lamp holder having a lighting bulb mounted thereon; and a lamp shade covering the main lamp holder; wherein the bracket is a hollow tube having a thread section an upper end; a screw nut is provided for screwing the thread section; an LED bulb is arranged at the upper end of the bracket; at least a wire passes through the hollow tube of the bracket, and has an end connected to the power and the other end electrically connected to the main lamp holder and the LED bulb. Further, the positioning portion has a notch in a C-shaped. Whereby the notch of the positioning portion is combined with the thread section from a side of the bracket, and the screw nut is upward rotated for fixing the lamp shade on the bracket for easily removed. | 08-20-2015 |
| 20150345732 | REFINED LAMPSHADE STRUCTURE - A refined lampshade structure includes a supporting stand, a bulb holder, a lampshade covering the bulb holder, which has a hollow extension tube with a threaded section arranged on top edge thereof, a LED lighting module engaging with an opening on the top of the extension tube, and a light transmissive protection shell fixed on the threaded section. The light transmissive protection shell integrates the LED lighting module with the bulb holder by fixing the lampshade on the extension tube. With lampshade being easily disassembled for cleaning or replacing, the present invention features enhanced practicability and durability. | 12-03-2015 |
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| 20130063892 | Portable Electronic Device - A portable electronic device comprises a first handheld device and a second handheld device, wherein the first handheld device and the second handheld device can be combined through the connection of a locking unit and a corresponding locking unit and the connection of an electrical-connecting unit and a corresponding electrical-connecting unit, so that the resources in one handheld device can be shared with the other handheld device, whereby the portable electronic device can be carried and operated with ease, scaled with flexibility, and comprised of various functions. | 03-14-2013 |
| 20130102359 | SMART PHONE-COMBINABLE OTOLOGIC INSPECTION DEVICE - A smart phone-combinable otologic inspection device is composed of a smart mobile phone combined with an otologic inspection device. The otologic inspection device includes an optic inspection device and a light projection module. The optic inspection device includes at least one lens module for observation of interior of an ear. The image pickup module picks up at least one image through the optic inspection device and displays the image on the smart mobile phone. The light projection module is arranged in the optic inspection device and corresponds to the light source module. As such, an otologic inspection device is provided, which realizes integration of traditional optics and digitalization through combination with a smart mobile phone and allows of expansion of functionality. | 04-25-2013 |
| 20150114210 | INFLATABLE ELECTRONIC DRUM SET - An inflatable electronic drum set includes an inflatable bladder, which when inflated, forms a three-dimensional outer configuration of a combination of a drum set and including multiple structural sections of drums and cymbals. The interior is filled up with air and each drum surface or cymbal surface is provided with a pressure detection film, so that through settings made with a control module, when a drummer hits, a corresponding drum sound or cymbal sound is generated. The inflated music instruments are set at positions corresponding to those of a traditional drum set. Due to high resiliency and flexibility, percussion can be made with perfect hand perception and no concern about collision and tumbling may be caused. Another advantage is that the sound volume can be adjusted. In addition, after air is completely discharged, the drum set can be stowed in a very limited space. | 04-30-2015 |
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| 20150206963 | METAL GATE STRUCTURE AND MANUFACTURING METHOD THEREOF - The present disclosure provides a semiconductor structure includes a semiconductor layer having a first surface, and an interlayer dielectric (ILD) defining a metal gate over the first surface of the semiconductor layer. The metal gate includes a high-k dielectric layer, a barrier layer, and a work function metal layer. A thickness of a first portion of the barrier layer at the sidewall of the metal gate is substantially thinner than a thickness of the barrier layer at the bottom of the metal gate. The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming a metal gate trench in an ILD, forming a barrier layer in a bottom and a sidewall of the metal gate trench, removing a first portion of the barrier layer at the sidewall of the metal gate trench, and forming a work function metal layer conforming to the barrier layer. | 07-23-2015 |
| 20150221743 | SEMICONDUCTOR DEVICE WITH GATE STACKS AND METHOD OF MANUFACTURING THE SAME - Embodiments of mechanisms for forming a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a first gate stack. The first gate stack includes a gate dielectric layer, a first work function metal layer and a second work function metal layer directly on the first work function metal layer. The second work function metal layer and the first work function metal layer have the same metal element. The semiconductor device also includes a second gate stack. The second gate stack includes a gate dielectric layer, a barrier layer and a second work function metal layer. The second work function metal layer and the barrier layer do not have the same metal element. A first thickness of the second work function metal layer of the first gate stack is larger than a second thickness of the second work function metal layer of the second gate stack. | 08-06-2015 |
| 20150228646 | GATE STRUCTURES WITH VARIOUS WIDTHS AND METHOD FOR FORMING THE SAME - Embodiments of a semiconductor device structure and a method for forming the same are provided. The semiconductor device structure includes a substrate and a first metal gate structure formed over the substrate. The first metal gate structure has a first width. The semiconductor device structure further includes a first contact formed adjacent to the first metal gate structure and a second metal gate structure formed over the substrate. The second metal gate structure has a second width smaller than the first width. The semiconductor device structure further includes an insulating layer formed over the second metal gate structure and a second contact self-aligned to the second metal gate structure. | 08-13-2015 |
| 20150228746 | MODIFIED SELF-ALIGNED CONTACT PROCESS AND SEMICONDUCTOR DEVICE - Methods of modifying a self-aligned contact process in a semiconductor fabrication and a semiconductor device are provided. A method includes forming a transistor over a substrate, including depositing a high-k dielectric layer over the substrate; depositing a work function metal layer over the high-k dielectric layer; forming a metal gate over the work function metal layer; forming two spacers sandwiching the work function metal layer and the metal gate; and forming a doped region in the substrate; etching the work function metal layer and the metal gate to leave a metal residue over inner walls of the two spacers exposing the work function metal layer and the metal gate; modifying the metal residue and the exposed work function metal layer and metal gate to form a metal compound; depositing an insulator covering the metal compound; and forming contact pads respectively electrically connected to the metal gate and the doped region. | 08-13-2015 |
| 20160056262 | METAL GATE AND MANUFUACTURING PROCESS THEREOF - Some embodiments of the present disclosure provide a semiconductor device including a semiconductive substrate, a metal gate including a metallic layer proximal to the semiconductive substrate. A dielectric layer surrounds the metal gate. The dielectric layer includes a first surface facing the semiconductive substrate and a second surface opposite to the first surface. A sidewall spacer surrounds the metallic layer with a greater longitudinal height. The sidewall spacer is disposed between the metallic layer and the dielectric layer. An etch stop layer over the metal gate comprises a surface substantially coplanar with the second surface of the dielectric layer. The etch stop layer has a higher resistance to etchant than the dielectric layer. A portion of the etch stop layer is over the sidewall spacer. | 02-25-2016 |
| 20160056292 | METAL GATE STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure includes a substrate including a first active region, a second active region and an isolation disposed between the first active region and the second active region; a plurality of gates disposed over the substrate and including a first gate extended over the first active region, the isolation and the second active region, and a second gate over the first active region and the second active region; and an inter-level dielectric (ILD) disposed over the substrate and surrounding the plurality of gates, wherein the second gate is configured not to conduct current flow and includes a first section disposed over the first active region and a second section disposed over the second active region, a portion of the ILD is disposed between the first section and the second section. | 02-25-2016 |
| 20160064567 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Embodiments of the present disclosure relate generally to a semiconductor device and method of fabricating the same, the semiconductor device includes a semiconductor substrate and a gate stack disposed over a channel region of the semiconductor device, the gate stack includes an oxidation layer, a gate dielectric and a gate electrode, the oxidation layer at least covers a portion of the channel region of the semiconductor device and may act as a barrier to prevent damage to the underlying features, such as the source and drain regions, during removal of a dummy gate in a gate last process. | 03-03-2016 |
