Patent application number | Description | Published |
20110069464 | Memory module, memory system having the memory module, and method for manufacturing the memory module - Provided is a memory module, a system using the memory module, and a method of fabricating the memory module. The memory module may include a printed circuit board and a memory package on the printed circuit board. The printed circuit board may include an embedded optical waveguide and a first optical window extending from the optical waveguide to a first surface of the printed circuit board. The memory package may also include a memory die having an optical input/output section and a second optical window. The optical input/output section, the second optical window, and the first optical window may be arranged in a line and the first optical window and the second optical window may be configured to at least one of transmit an optical signal from the optical waveguide to the optical input/output section and transmit an optical signal from the optical input/output section to the optical waveguide. | 03-24-2011 |
20110133063 | Optical waveguide and coupler apparatus and method of manufacturing the same - Optical waveguide and coupler devices and methods include a trench formed in a bulk semiconductor substrate, for example, a bulk silicon substrate. A bottom cladding layer is formed in the trench, and a core region is formed on the bottom cladding layer. A reflective element, such as a distributed Bragg reflector can be formed under the coupler device and/or the waveguide device. Because the optical devices are integrated in a bulk substrate, they can be readily integrated with other devices on a chip or die in accordance with silicon photonics technology. Specifically, for example, the optical devices can be integrated in a DRAM memory circuit chip die. | 06-09-2011 |
20110134679 | MEMORY MODULE HAVING OPTICAL BEAM PATH, APPARATUS INCLUDING THE MODULE, AND METHOD OF FABRICATING THE MODULE - A memory module may include at least one memory package including an optical signal input/output (I/O) unit and a first optical beam path and a printed circuit board (PCB) on which the memory package is mounted. The PCB may have a second optical beam path configured to transmit an optical signal to the optical signal I/O unit. The memory module may further include a connecting body configured to mount the memory package on the PCB and match a refractive index of the first optical beam path with a refractive index of the second optical beam path. | 06-09-2011 |
20110194803 | OPTICAL MODULATOR FORMED ON BULK-SILICON SUBSTRATE - An optical modulator comprises a bulk-silicon substrate comprising a trench having a predetermined width and a predetermined depth. A bottom cladding layer is formed in the trench, and a plurality of waveguides and a phase modulation unit are formed on the bottom cladding layer. A top cladding layer is formed on the plurality of waveguides and the phase modulation unit. | 08-11-2011 |
20110206381 | OPTICAL SERIALIZING/DESERIALIZING APPARATUS AND METHOD AND METHOD OF MANUFACTURING SAME - An optical serializer/deserializer (SERDES) includes serializing circuitry which includes a source of a plurality of unmodulated optical signals, a modulation unit for generating a plurality of modulated optical signals using a plurality of electrical signals to modulate the plurality of unmodulated optical signals, and a coupling unit for delaying the plurality of modulated optical signs to generate a plurality of delayed modulated optical signals and combines the delayed modulated optical signals to generate a serialized modulated optical signal. Deserializing circuitry of the SERDES includes an optical splitter for splitting a serialized modulated optical signal into a plurality of modulated split optical signals, a demodulation unit for demodulating the modulated split optical signals and generating a respective plurality of demodulated split optical signals, and a delay unit for delaying each of the plurality of demodulated split optical signals by a respective delay amount such that the serialized modulated optical signal is converted into a respective plurality of parallel demodulated split optical signals. | 08-25-2011 |
20110243492 | SILICON BASED OPTICAL MODULATORS AND METHODS OF FABRICATING THE SAME - A silicon based optical modulator apparatus can include a lateral slab on an optical waveguide, the lateral slab protruding beyond side walls of the optical waveguide so that a portion of the optical waveguide protrudes from the lateral slab towards a substrate. | 10-06-2011 |
20120025265 | PHOTODETECTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a photodetector structure is provided. The method includes forming a structural layer by making a trench in a bulk silicon substrate and filling the trench with a cladding material, forming a single-crystallized silicon layer on the structural layer, and forming a germanium layer on the single-crystallized silicon layer. | 02-02-2012 |
20120070111 | SILICON BASED OPTICAL MODULATORS INCLUDING VERTICAL SLABS AND METHODS OF FORMING - An optical modulator structure can include a core region that comprises an optical transmission path having a refractive index that is modulated via electric charge introduced into the core region. A plurality of first vertical slabs comes into contact with and is spaced along a first side of the core region to provide a first path for the electric charge to/from the core region. A plurality of second vertical slabs come into contact with and is spaced along a second side of the core region, that is opposite to the first side, to provide a second path for the electric charge to/from the core region. Other structures and methods are disclosed. | 03-22-2012 |
20120070151 | Optical Modulators for Generating De-Emphasis Formatted Optical Signals and Methods of Operating the Same - A de-emphasis format signal generator can be configured to combine first and second electrical non-de-emphasis formatted signals provided to first and second optical modulators, coupled in parallel with one another, to provide a combined optical signal having a de-emphasis format. Accordingly, three aspects of a de-emphasis formatted signal, including a de-emphasis delay aspect, a de-emphasis attenuation aspect, and a de-emphasis combining aspect, can provided separately and in different domains (such as in the electrical domain and in the optical domain) which can be combined with one another to provide an output de-emphasis formatted optical signal. | 03-22-2012 |
20120155888 | OPTICAL MODULATOR WITH REDUCED SIZE AND OPTICAL TRANSMITTER INCLUDING THE SAME - An optical modulator includes a light input/output unit receiving an incident optical signal which has not been modulated, splitting the incident optical signal into a first optical signal and a second optical signal, and transmitting the first and second optical signals to a first path and a second path, respectively, of an optical waveguide. A phase shifter is positioned in at least one of the first and second paths and modulates a phase of at least one of the first and second optical signals, which have been received through the first and second paths, respectively, in response to an electrical signal. A phase-modulated signal is output. A reflective grating coupler reflects signals respectively received through the first and second paths back along the first and second paths respectively. | 06-21-2012 |
20130092980 | PHOTODETECTOR STRUCTURES INCLUDING CROSS-SECTIONAL WAVEGUIDE BOUNDARIES - A photodetector structure can include a silicon substrate and a silicon layer on the silicon substrate, that can include a first portion of an optical transmission medium that further includes a silicon cross-sectional transmission face. A germanium layer can be on the silicon substrate and can include a second portion of the optical transmission medium, adjacent to the first portion can include a germanium cross-sectional transmission face butt-coupled to the silicon cross-sectional transmission face. | 04-18-2013 |
20130308942 | OPTICAL MEMORY SYSTEM INCLUDING AN OPTICALLY CONNECTED MEMORY MODULE AND COMPUTING SYSTEM INCLUDING THE SAME - An optical memory system according to example embodiments includes a plurality of memory modules, each memory module including a plurality of memory devices; a light source; a light distribution unit connected to the light source through a first optical transmission line; a plurality of second optical transmission lines connected between the light distribution unit and the plurality of memory modules; a plurality of electrical to optical converters, each connected to at least one of the second optical transmission lines; and a plurality of output optical transmission lines connected to the plurality of electrical to optical converters, each output optical transmission line for outputting an electrical to optical converted signal. | 11-21-2013 |
20130330035 | Semiconductor Package and Semiconductor Device Including the Same - A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection | 12-12-2013 |
20140139900 | WAVELENGTH TUNABLE OPTICAL TRANSMITTER - A wavelength tunable optical transmitter includes a first waveguide receiving incident light through an input port and outputting the incident light to a first output port, a resonant modulator adjacent to the first waveguide and whose resonant wavelength is variable, and a second waveguide disposed optically in parallel to the first waveguide and outputting emitted light to a second output port. The resonant modulator includes a silicon resonator constituted by a crystallized silicon film in the form of a closed loop between the first and second waveguides, a first electrode within the silicon resonator and constituted by a silicon film of a first conductivity type, and a second electrode extending alongside part of the outer circumferential surface of the silicon resonator and constituted by a silicon film of a second conductivity type. | 05-22-2014 |
20140270632 | INTEGRATED CIRCUIT DEVICE PACKAGES INCLUDING OPTICAL ELEMENTS - Integrated circuit device packages including optical elements are provided. The integrated circuit device package may include an integrated circuit device and a conductive pad on a first surface of the integrated circuit device. The conductive pad may be electrically connected to the integrated circuit device and may be configured to transmit an electrical signal. The integrated circuit device package may also include an optical element in the integrated circuit device and the optical element may be configured to transmit an optical signal through a second surface of the integrated circuit device that is opposite the first surface of the integrated circuit device. | 09-18-2014 |