Patent application number | Description | Published |
20090027158 | Stacked electronic part and method of manufacturing the same - Provided are a stacked electronic part that can sufficiently suppress plating deposition on the surface of a porous green body when a terminal electrode is formed on an external electrode, thereby enabling a decrease in the reliability of products to be prevented, and a method of manufacturing the stacked electronic part. The stacked electronic part | 01-29-2009 |
20090053853 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions. | 02-26-2009 |
20100178737 | Semiconductor IC and Its Manufacturing Method, and Module with Embedded Semiconductor IC and Its Manufacturing Method - A semiconductor IC includes a semiconductor IC main body having a predetermined circuit formed on a main surface, a metal layer selectively provided on substantially the whole back surface of the semiconductor IC main body excluding the periphery. According to the present invention, the metal layer provided on the semiconductor IC main body can dissipate heat at a high level. Because the metal layer is selectively provided, even when the semiconductor IC main body is thinned by polishing, warpage does not occur easily in a wafer state. The metal layer is selectively provided at the center of the back surface of the semiconductor IC. Therefore, a laminate of a semiconductor wafer and a thick metal does not need to be diced. As a result, chipping on the disconnected surface can be prevented effectively. | 07-15-2010 |
20100202098 | CERAMIC ELECTRONIC PART - A ceramic electronic part | 08-12-2010 |
20110048774 | PLATING FILM, PRINTED WIRING BOARD, AND MODULE SUBSTRATE - The present invention provides a plating film | 03-03-2011 |
20110051314 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode | 03-03-2011 |
20110056744 | TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELECTRONIC DEVICE - The present invention provides a terminal structure | 03-10-2011 |
20110171378 | METHOD FOR PRODUCING COVERED PARTICLES - A method for producing covered particles, comprising: a mixing step of mixing a fluid containing particles comprising at least one type of substance selected from among metals, metal oxides and ceramics, a silsesquioxane having a functional group with an affinity for carbon dioxide, and supercritical carbon dioxide; and a covering step of reducing pressure of the fluid to gasify the supercritical carbon dioxide, while adhering the silsesquioxane onto the particles, and thereby obtaining covered particles comprising the particles and silsesquioxane covering the particles. | 07-14-2011 |
20110182041 | LEAD-FREE SOLDER AND ELECTRONIC COMPONENT BUILT-IN MODULE - First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy. | 07-28-2011 |
20110227424 | RARE-EARTH SINTERED MAGNET, ROTATOR, AND RECIPROCATING MOTOR - The present invention relates to a rare-earth sintered magnet | 09-22-2011 |
20110317328 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An array-type ceramic electronic component C | 12-29-2011 |
20120007709 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component | 01-12-2012 |
20120018191 | COATING AND ELECTRONIC COMPONENT - The present invention provides a coating | 01-26-2012 |
20130135834 | TERMINAL STRUCTURE, PRINTED CIRCUIT BOARD, MODULE BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING TERMINAL STRUCTURE - The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E | 05-30-2013 |
20140041913 | ELECTRONIC CIRCUIT MODULE COMPONENT - One aspect of an electronic circuit module component is an electronic circuit module component formed by joining a board and an electronic component comprising an element body having a mounting surface and a plurality of side faces to each other with solder; the electronic component comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces; wherein mounting parts of the first and second terminal electrodes formed on the mounting surface are joined to the board with the solder. | 02-13-2014 |
20140041930 | ELECTRONIC COMPONENT - One aspect of an electronic component is an electronic component comprising an element body having a mounting surface and a plurality of side faces, the electronic component further comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, a metal film disposed on a surface of a mounting part of the first and second terminal electrodes formed on the mounting surface, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces. | 02-13-2014 |
20140054767 | TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE - The present invention relates to a terminal structure comprising; a base material | 02-27-2014 |
20140054768 | TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE - The present invention relates to a terminal structure comprising: a base material | 02-27-2014 |
20140054769 | TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE COMPRISING THE SAME - A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, filling the opening on the electrode; and a dome-shaped bump containing Sn and Ti, covering the under bump metal layer, wherein at least part of the under bump metal layer has a portion sandwiched between the external electrode and the insulating covering layer. | 02-27-2014 |
20140054770 | TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE COMPRISING THE SAME - A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, formed in a region in the opening on the electrode so that an upper surface of the metal layer is at a position lower than an upper surface of the insulating covering layer in a peripheral edge portion of the opening; and a dome-shaped bump containing Sn and Ti, formed in a region in the opening on the under bump metal layer, wherein an end portion of a boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening portion in the insulating covering layer. | 02-27-2014 |
20140291021 | JUNCTION STRUCTURE FOR AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A junction structure for electronic device having an excellent bonding strength is provided. A junction structure for electronic device in accordance with one aspect of the present invention includes a first metal layer containing nickel and a second metal layer containing gold, tin, and nickel, while the second metal layer includes an AuSn eutectic phase. | 10-02-2014 |