Patent application number | Description | Published |
20110057228 | RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING DEVICE OBTAINED USING THE SAME - The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.3 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler. | 03-10-2011 |
20110058776 | RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL-SEMICONDUCTOR-DEVICE LEAD FRAME OBTAINED USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - The present invention relates to a resin composition for optical semiconductor devices, the resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a polyorganosiloxane; and (D) a white pigment. | 03-10-2011 |
20110309384 | SEMICONDUCTOR LIGHT EMITTING DEVICE - The present invention relates to a semiconductor light emitting device including: a substrate for element mounting; a wiring provided on the substrate; an LED element provided on the substrate and electrically connected to the wiring; an encapsulating resin layer for encapsulating the LED element; and a wavelength conversion layer which contains a phosphor material and converts a wavelength of light emitted by the LED element, in which the wavelength conversion layer is provided on an upper side of the LED element, and a diffusive reflection resin layer is provided in a state that side faces of the LED element are surrounded therewith, and an area at the LED element face side of the wavelength conversion layer is at least twice larger by area ratio than an area of light emitting area on an upper surface of the LED element. | 12-22-2011 |
20110309398 | COMPOSITE FILM AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME - The present invention relates to a composite film including a wavelength conversion layer and a diffusive reflection resin layer in a laminated state and being used in a semiconductor light emitting device, in which the wavelength conversion layer contains a phosphor material which absorbs a part or all of excitation light and is excited to emit visible light in a wavelength region longer than a wavelength of the excitation light, the diffusive reflection resin layer is selectively formed with patterning on one surface of the wavelength conversion layer, and a region on the one surface of the wavelength conversion layer where the diffusive reflection resin layer is not formed with patterning is a path of the excitation light which excites the phosphor material in the wavelength conversion layer. | 12-22-2011 |
20120012875 | COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF - A component for a light-emitting device includes a fluorescent layer that is capable of emitting fluorescent light and a housing that is connected to the fluorescent layer for housing a light-emitting diode. | 01-19-2012 |
20120014088 | COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF - A component for a light-emitting device includes a fluorescent layer capable of emitting fluorescent light, and a lens connected onto the fluorescent layer. | 01-19-2012 |
20120015463 | METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE - The present invention relates to a method for manufacturing a light-emitting device, the method including applying resin encapsulation to a lead frame having mounted and packaged thereon a plurality of light-emitting elements, in which the following lead frame portion (A) is used as the lead frame portion: (A) a lead frame portion that is obtained by cutting and separating a lead frame, in which the lead frame has a lattice form including a plurality of rows and a plurality of columns with a plurality of intersection points formed thereby and has a plurality of light-emitting elements disposed and packaged between the adjacent intersection points in each row, into individual column to produce a lead frame portion for each column, and that is passed a light emission test performed by flowing a current to the lead frame portion. | 01-19-2012 |
20120025247 | COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF - A component for a light-emitting device includes a sealing resin layer that is capable of sealing in a light emitting diode, a fluorescent layer that is formed on one face of the sealing resin layer and is capable of emitting fluorescent light, and a reflection layer that is provided on the other face of the sealing resin layer so as to avoid a region where the sealing resin layer seals in the light emitting diode and is capable of reflecting the light. | 02-02-2012 |
20120028375 | INSPECTION METHOD OF LIGHT-EMITTING DEVICE AND PROCESSING METHOD AFTER INSPECTION OF LIGHT-EMITTING DEVICE - The present invention relates to a method for inspecting a light-emitting device, the method including performing a light emission test of (A) a light-emitting device including a lead frame having mounted and packaged thereon a plurality of light-emitting elements or (B) a light-emitting device obtained by resin encapsulating and packaging the light-emitting device (A), by applying a current to the plurality of light-emitting elements and judging each light-emitting element as passed or failed, in which arrangement of the plurality of light-emitting elements in the light-emitting device is set as in the following (α): (α) In a lead frame having a lattice form including a plurality of rows and a plurality of columns with a plurality of intersection points formed thereby, a plurality of light-emitting elements are disposed between the adjacent intersection points in each row, the adjacent light-emitting elements in each row are connected to each other so that positive electrode terminals or negative electrode terminals thereof face each other, and a positive-side power supply channel or a negative-side power-supply channel in the lead frame works as a common channel between a certain column and a column adjacent thereto. | 02-02-2012 |
20120032219 | LIGHT-EMITTING DEVICE - A light-emitting device includes a circuit board to which external electric power is supplied, a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board, a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode, and a fluorescent laminate provided on the housing. The fluorescent laminate includes a first fluorescent layer that emits fluorescent light and a second fluorescent layer that emits fluorescent light having a wavelength that is longer than that of the first fluorescent layer. The second fluorescent layer is disposed on the housing and the first fluorescent layer is laminated on the second fluorescent layer. | 02-09-2012 |
20120039064 | LIGHT-EMITTING DEVICE - A light-emitting device includes a circuit board to which external electric power is supplied; a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board; a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode; an adhesive layer that is provided on the housing, the adhesive layer being provided entirely in the circumferential direction of the housing, and the adhesive layer having a length from the inner circumferential edge to the outer circumferential edge of mainly 0.3 mm or more and a thickness of 200 μm or less; and a phosphor ceramic that is allowed to adhere onto the housing with the adhesive layer interposed therebetween. | 02-16-2012 |
20120160412 | SEALING MEMBER, SEALING METHOD, AND METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE - A sealing member includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween. | 06-28-2012 |
20120217527 | LIGHT-EMITTING DIODE ELEMENT AND LIGHT-EMITTING DIODE DEVICE - A light-emitting diode element includes an optical semiconductor layer, an electrode unit to be connected to the optical semiconductor layer, and an encapsulating resin layer that encapsulates the optical semiconductor layer and the electrode unit, the encapsulating resin layer containing a light reflection component. | 08-30-2012 |
20120220059 | METHOD FOR PRODUCING LIGHT-EMITTING DIODE DEVICE - A method for producing a light-emitting diode device includes the steps of: preparing a light-emitting laminate including an optical semiconductor layer, and an electrode unit formed on the optical semiconductor layer; forming an encapsulating resin layer on the optical semiconductor layer so as to cover the electrode unit, the encapsulating resin layer containing a light reflection component; partially removing the encapsulating resin layer so as to expose the top face of the electrode unit, thereby producing a light-emitting diode element; and disposing the light-emitting diode element and a base substrate provided with terminals so that the light-emitting diode element and the base substrate face each other, and that the electrode unit and the terminals are electrically connected, thereby flip chip mounting the light-emitting diode element on the base substrate. | 08-30-2012 |
20120248484 | LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF - A method for producing a light emitting diode device includes the steps of preparing a base board; allowing a light semiconductor layer where an electrode portion is provided at one side in a thickness direction to be disposed in opposed relation to the base board, and the electrode portion to be electrically connected to a terminal, so that the light semiconductor layer is flip-chip mounted on the base board; forming an encapsulating resin layer containing a light reflecting component at the other side of the base board so as to cover the light semiconductor layer and the electrode portion; removing the other side portion of the encapsulating resin layer so as to expose the light semiconductor layer; and forming a phosphor layer formed in a sheet state so as to be in contact with the other surface of the light semiconductor layer. | 10-04-2012 |
20120248485 | PRODUCING METHOD OF LIGHT EMITTING DIODE DEVICE AND LIGHT EMITTING DIODE ELEMENT - A method for producing a light emitting diode device includes the steps of preparing a phosphor layer formed in a sheet state; forming a light semiconductor layer on one surface in a thickness direction of the phosphor layer; forming an electrode portion on one surface of the light semiconductor layer; forming an encapsulating resin layer containing a light reflecting component so as to cover the light semiconductor layer and the electrode portion; producing the light emitting diode element by partially removing the encapsulating resin layer so as to expose one surface of the electrode portion; and allowing the electrode portion to be electrically connected to the terminal, so that the light emitting diode element is flip-chip mounted on the base board. | 10-04-2012 |
20120261699 | REFLECTING RESIN SHEET, LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF - A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element. The reflecting resin sheet includes a release substrate and the reflecting resin layer provided on one surface in a thickness direction of the release substrate. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be capable of being in close contact with the light emitting diode element. | 10-18-2012 |
20120261700 | PHOSPHOR REFLECTING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF - A phosphor reflecting sheet provides a phosphor layer on one side in a thickness direction of a light emitting diode element and provides a reflecting resin layer at the side of the light emitting diode element. The phosphor reflecting sheet includes the phosphor layer and the reflecting resin layer provided on one surface in the thickness direction of the phosphor layer. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be disposed in opposed relation to the side surface of the light emitting diode element. | 10-18-2012 |
20120262054 | REFLECTING RESIN SHEET, LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF - A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element and includes a first release substrate and the reflecting resin layer provided on one surface in a thickness direction of the first release substrate. In the first release substrate and the reflecting resin layer, a through hole extending therethrough in the thickness direction is formed corresponding to the light emitting diode element so as to allow an inner circumference surface of the through hole in the reflecting resin layer to be disposed in opposed relation to a side surface of the light emitting diode element. | 10-18-2012 |
20120305969 | REFLECTING MATERIAL AND LIGHT EMITTING DIODE DEVICE - A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component. | 12-06-2012 |
20130229805 | LIGHT-EMITTING DEVICE ASSEMBLY AND LIGHTING DEVICE - A light-emitting device assembly includes a plurality of light-emitting devices. The plurality of light-emitting devices each includes a circuit board including a pair of electrodes to be connected to an external power source, and to which an electric power is supplied from the power source through the electrodes; a semiconductor element supported on and electrically connected to the circuit board; and an encapsulating layer that encapsulates the semiconductor element on the circuit board. The plurality of light-emitting devices are disposed so as to be continuous in one direction. The encapsulating layer is disposed so that the encapsulating layers of the light-emitting devices next to each other are in contact with each other when viewed from the top. | 09-05-2013 |
20130329397 | LIGHT SOURCE APPARATUS AND LIGHTING APPARATUS - A laser lighting module includes a base part, a laser diode which is a blue laser device, a substrate with which the laser diode is in contact, a ceramic phosphor which reflects light entering from the laser diode to thereby change a direction of the light and is excited by the light to generate yellow fluorescence, and a lens for adjusting luminous intensity distribution of light emitted from the ceramic phosphor. The substrate is formed of a material which is thin and has excellent thermal conductivity, and is in surface contact with the laser diode and the base part. In the laser lighting module, since the substrate serves as a device heat radiator, it is possible to easily remove the heat generated by the laser diode. | 12-12-2013 |
20130329416 | LIGHTING APPARATUS - A lighting apparatus includes a laser lighting module, an LED lighting module, and a sensor module. The laser lighting module includes a base part, a laser diode mounted on a substrate fixed on the base part, a ceramic phosphor upon which a blue laser light from the laser diode is incident, and a lens for adjusting luminous intensity distribution of light emitted from the ceramic phosphor, and is mounted on a module mount part of a mount body part. The LED lighting module and the sensor module are also mounted on other module mount parts of the mount body part, respectively. Thus, by mounting various combinations of the laser lighting modules and the LED lighting modules on the mount body part provided with a plurality of module mount parts, it is possible to manufacture lighting apparatuses for various uses at low cost. | 12-12-2013 |
20140091346 | PHOSPHOR ADHESIVE SHEET, OPTICAL SEMICONDUCTOR ELEMENT-PHOSPHOR LAYER PRESSURE-SENSITIVE ADHESIVE BODY, AND OPTICAL SEMICONDUCTOR DEVICE - A phosphor adhesive sheet includes a phosphor layer containing a phosphor and an adhesive layer laminated on one surface in a thickness direction of the phosphor layer. The adhesive layer is formed from a silicone pressure-sensitive adhesive composition. A percentage of the peel strength of the phosphor adhesive sheet is 30% or more. | 04-03-2014 |
20140091347 | PHOSPHOR LAYER ATTACHING KIT, OPTICAL SEMICONDUCTOR ELEMENT-PHOSPHOR LAYER ATTACHING BODY, AND OPTICAL SEMICONDUCTOR DEVICE - A phosphor layer attaching kit includes a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package. A percentage of the peel strength of the silicone pressure-sensitive adhesion composition is 30% or more. | 04-03-2014 |
20140178678 | ENCAPSULATING SHEET - An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element and a gas barrier layer provided at one side in a thickness direction of the embedding layer, having a thickness of 50 μm or more and 1,000 μm or less, and for suppressing the passing of a gas in the thickness direction. | 06-26-2014 |
20140183593 | ENCAPSULATING LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE - A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element. | 07-03-2014 |
20140199795 | SEALING MEMBER, SEALING METHOD, AND METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE - A sealing member includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween. | 07-17-2014 |
20140367725 | COMPOSITE FILM AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME - The present invention relates to a composite film including a wavelength conversion layer and a diffusive reflection resin layer in a laminated state and being used in a semiconductor light emitting device, in which the wavelength conversion layer contains a phosphor material which absorbs a part or all of excitation light and is excited to emit visible light in a wavelength region longer than a wavelength of the excitation light, the diffusive reflection resin layer is selectively formed with patterning on one surface of the wavelength conversion layer, and a region on the one surface of the wavelength conversion layer where the diffusive reflection resin layer is not formed with patterning is a path of the excitation light which excites the phosphor material in the wavelength conversion layer. | 12-18-2014 |
Patent application number | Description | Published |
20090272995 | RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION, AND OPTICAL SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME - An epoxy resin composition for optical semiconductor element encapsulation includes an epoxy resin (Component (A)) mainly containing an epoxy compound represented by a specific structural formula (1), a curing agent (Component (B)), and at least one of an oxynitride phosphor and a nitride phosphor (Component (C)). Therefore, the phosphor component (C) is uniformly dispersed in the epoxy resin composition without segregation. Thus, the resin composition serves as an excellent optical semiconductor element encapsulation material which has an adequate light diffusion property and a high light transmittance and permits a reduction in internal stress. Therefore, a light emitting diode element encapsulated with the epoxy resin composition is capable of stably emitting light, and satisfactorily performs its functions. | 11-05-2009 |
20090295003 | RESIN COMPOSITION FOR OPTICAL COMPONENTS, OPTICAL COMPONENT USING THE SAME AND PRODUCTION METHOD OF OPTICAL LENS - The present invention relates to a resin composition for optical components, which is an ultraviolet-curable transparent resin composition used as a material for an optical component, in which the resin composition includes (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an oxetane compound having one or more oxetanyl groups in one molecule thereof and (C) a photo-acid generator, and in which the component (C) is contained in an amount of 0.01 to 2.0 parts by weight based on 100 parts by weight of a total amount of the components (A) and (B). The present invention also relates to an optical component obtained by using the resin composition for optical components, and a production method thereof. | 12-03-2009 |
20090311630 | PROCESS FOR PRODUCING OPTICAL COMPONENT - The present invention relates to a process for producing an optical component, the process including: disposing a transparent stamp tool on a substrate or an imaging element through a transparent ultraviolet-curable resin composition layer; and irradiating the resin composition layer with an ultraviolet ray through the transparent stamp tool to thereby cure the resin composition layer, in which a resin composition contained in the resin composition layer contains a thermosetting resin as a main component and a photo-acid generator, and the ultraviolet ray passing through the transparent stamp tool is an ultraviolet ray having a wavelength of 320 nm or more. | 12-17-2009 |
20100019271 | EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): | 01-28-2010 |
20100041799 | Epoxy Resin Composition for Optical-Semiconductor Encapsulation, Cured Resin Thereof, and Optical Semiconductor Device Obtained with the same - The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the invention transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin. | 02-18-2010 |
20100292358 | RESIN COMPOSITION FOR OPTICAL COMPONENTS AND OPTICAL COMPONENT USING THE SAME - The present invention relates to a resin composition for optical components, the resin composition being an ultraviolet-curable transparent resin composition to be used as a material for an optical component, in which the resin component includes the following component (A) as a main component and the following component (B) being a photo-cationic polymerization initiator: (A) an epoxy resin having two or more epoxy groups in one molecule thereof; and (B) an onium salt containing a hexafluorophosphate ion as an anion component. | 11-18-2010 |
20110316031 | TRANSFER SHEET FOR PHOSPHOR LAYER AND LIGHT-EMITTING DEVICE - A transfer sheet for a phosphor layer includes a release substrate, a phosphor layer formed on the release substrate, and an adhesive layer formed on the phosphor layer. | 12-29-2011 |
20110316032 | PHOSPHOR LAYER AND LIGHT-EMITTING DEVICE - A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed. | 12-29-2011 |
20120001214 | PHOSPHOR CERAMIC AND LIGHT-EMITTING DEVICE - A phosphor ceramic includes at least one fluorescent layer that is capable of emitting fluorescent light; and at least one non-fluorescent layer that does not emit fluorescent light and is laminated onto the fluorescent layer. | 01-05-2012 |
20120083056 | LIGHT EMITTING DIODE SEALING MEMBER AND METHOD FOR PRODUCING LIGHT EMITTING DIODE DEVICE - A light emitting diode sealing member includes a light emitting diode sealing layer, and a lens mold layer laminated on the light emitting diode sealing layer. | 04-05-2012 |
20120217532 | RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING DEVICE OBTAINED USING THE SAME - The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.26 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler. | 08-30-2012 |