Patent application number | Description | Published |
20090040655 | Thin-film magnetic head structure, method of manufacturing the same, and thin-film magnetic head - A method of manufacturing a thin-film magnetic head structure comprises the steps of preparing an insulating layer | 02-12-2009 |
20090042143 | Thin-film magnetic head structure, method of manufacturing the same, and thin-film magnetic head - A method of manufacturing a thin-film magnetic head structure comprises the steps of preparing an insulating layer | 02-12-2009 |
20090279207 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film coil has a plurality of turn parts arranged at respective positions having different distances from the medium-opposing surface, while a non-expandable part made of an insulating material having a coefficient of thermal expansion smaller than that of a photosensitive resin is formed between the turn parts. | 11-12-2009 |
20090296275 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film magnetic head has an equidistant two-stage structure in which a first turn part of a first conductor layer and a second turn part of a second conductor layer overlap vertically along the medium-opposing surface while having the same front distance from respective front side faces closer to the medium-opposing surface to the medium-opposing surface. | 12-03-2009 |
20090315189 | Layered chip package and method of manufacturing same - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. The insulating portion has an end face located at the side surface of the main body on which the wiring is disposed. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed. To manufacture the layered chip package, a layered chip package substructure is fabricated by: processing a semiconductor wafer to form a plurality of pre-semiconductor-chip portions aligned; forming at least one groove extending to be adjacent to at least one of the pre-semiconductor-chip portions; forming an insulating layer to fill the groove; and forming the electrodes. | 12-24-2009 |
20090321956 | Layered chip package and method of manufacturing same - A layered chip package includes a plurality of layer portions stacked, each layer portion including a semiconductor chip having a first surface with a device formed thereon and a second surface opposite thereto. The plurality of layer portions include at least a pair of layer portions disposed such that the first surfaces of the respective semiconductor chips face toward each other. A manufacturing method for the layered chip package includes the steps of: fabricating a layered substructure by stacking a plurality of substructures each including a plurality of layer portions corresponding to the plurality of layer portions of the layered chip package; and fabricating a plurality of layered chip packages by using the layered substructure. The step of fabricating the layered substructure includes: fabricating a first and a second pre-polishing substructure each having a first surface and a second surface; bonding the pre-polishing substructures to each other such that their respective first surfaces face toward each other; and forming a first and a second substructure by polishing the second surfaces. | 12-31-2009 |
20090321957 | Layered chip package and method of manufacturing same - A layered chip package includes: a main body including a plurality of layer portions; wiring disposed on a side surface of the main body; a plurality of first terminals disposed on a top surface of the main body; and a plurality of second terminals disposed on a bottom surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed. The wiring is connected to the end faces of the plurality of electrodes of the plurality of layer portions, and to the plurality of first and second terminals. | 12-31-2009 |
20090325345 | Method of manufacturing layered chip package - A manufacturing method for a layered chip package including a stack of a plurality of layer portions includes the steps of: fabricating a layered substructure by stacking a plurality of substructures each including a plurality of layer portions corresponding to the plurality of layer portions of the layered chip package; and fabricating a plurality of layered chip packages by using the layered substructure. The step of fabricating the layered substructure includes: fabricating a first and a second pre-polishing substructure; bonding the first pre-polishing substructure to a jig such that a first surface of the first pre-polishing substructure faces the jig; forming a first substructure by polishing a second surface of the first pre-polishing substructure; bonding the second pre-polishing substructure to the first substructure such that a first surface of the second pre-polishing substructure faces the polished surface of the first substructure; and forming a second substructure by polishing a second surface of the second pre-polishing substructure. | 12-31-2009 |
20100044879 | Layered chip package and method of manufacturing same - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. The plurality of layer portions include at least one layer portion of a first type and at least one layer portion of a second type. The layer portions of the first and second types each include a semiconductor chip. The layer portion of the first type further includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the layer portion of the second type does not include any electrode connected to the semiconductor chip and having an end face located at the side surface of the main body on which the wiring is disposed. The wiring is connected to the end face of each of the plurality of electrodes. | 02-25-2010 |
20100109137 | Layered chip package with heat sink - A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top surface, a bottom surface, and four side surfaces. The heat sink has at least one first portion, and a second portion coupled to the at least one first portion. The at least one first portion is adjacent to the top surface or the bottom surface of at least one of the layer portions. The second portion is adjacent to one of the side surfaces of each of at least two of the plurality of layer portions. | 05-06-2010 |
20100118438 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE - A thin-film magnetic head is manufactured as follows. First, a base insulating layer having a magnetic pole forming depression sunken into a form corresponding to the main magnetic pole layer is formed, a stop film for CMP is formed such as to fill the magnetic pole forming depression, and then a magnetic layer is formed on the stop film. Next, the magnetic layer is separated by forming a separation groove substantially surrounding the magnetic pole forming depression on the outside thereof, and thus separated magnetic layer is formed with a cover insulating film adapted to cover the whole upper face. The surface is polished by CMP until the stop film is exposed, so that the part of magnetic layer remaining on the inside of the magnetic pole forming depression is used as the main magnetic pole layer. Further, a recording gap layer, a write shield layer, and a thin-film coil are formed. | 05-13-2010 |
20100149687 | Magnetic head that suppresses protrusion of medium facing surface caused by heat of coil - A magnetic head includes a coil, a pole layer, and a coil adjacent layer. The coil includes a winding portion having two side surfaces. The coil adjacent layer is adjacent to at least part of the whole of the two side surfaces of the winding portion. The coil adjacent layer is formed of a nonmagnetic material having a linear thermal expansion coefficient of 5×10 | 06-17-2010 |
20100165517 | Magnetic head for perpendicular magnetic recording having side shield layer and method of manufacturing same - A magnetic head includes a side shield layer and an encasing layer. The side shield layer has a first end face located in the medium facing surface, a second end face opposite to the first end face, and a first groove accommodating a portion of a pole layer. The first end face includes two portions located on both sides of an end face of the pole layer that are opposite to each other in a track width direction. The encasing layer is formed of a nonmagnetic material and disposed on a side of the side shield layer opposite to a medium facing surface. The encasing layer has a front end face touching the second end face of the side shield layer, and a second groove accommodating another portion of the pole layer. The distance from the medium facing surface to an arbitrary point on the second end face of the side shield layer decreases with decreasing distance from the arbitrary point to the top surface of a substrate. | 07-01-2010 |
20100200959 | SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE, SEMICONDUCTOR PLATE AND METHOD OF MANUFACTURING THE SAME - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a rectangular unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode including an extended terminal portion extended from the unit region to the inside of the groove portion. The semiconductor substrate is manufactured by forming a plurality of groove portions along scribe lines; embedding an insulating material in the plurality of groove portions and planarizing a surface to form insulating layers; and forming a wiring electrode including an extended terminal portion extended from a rectangular unit region in contact with at least any one of the plurality of groove portions to the inside of the groove portion. | 08-12-2010 |
20100200977 | Layered chip package and method of manufacturing same - A layered chip package has a main body including a plurality of pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The plurality of pairs of layer portions include at least one specific pair of layer portions consisting of a first-type layer portion and a second-type layer portion. The first-type layer portion includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. A layered substructure formed of a stack of two substructures each of which includes a plurality of preliminary layer portions aligned is used to fabricate a stack of a predetermined two or greater number of pairs of layer portions, and the main body is fabricated by stacking an additional first-type layer portion together with the stack, the number of the additional first-type layer portion being equal to the number of the specific pair(s) of layer portions included in the stack. | 08-12-2010 |
20100260015 | Heat-assisted magnetic recording head with near-field light generating element - A heat-assisted magnetic recording head includes a magnetic pole, a waveguide, a near-field light generating element, and a substrate on which they are stacked. The near-field light generating element and the waveguide are disposed farther from the top surface of the substrate than is the magnetic pole. The near-field light generating element has an outer surface including: a first end face located in the medium facing surface; a second end face farther from the medium facing surface; and a coupling portion coupling the first and second end faces to each other. The first end face includes a near-field light generating part. The waveguide has an outer surface including an opposed portion opposed to a part of the coupling portion. The head further includes a mirror that reflects light emitted from a light source disposed above the waveguide, so as to let the light travel through the waveguide toward the medium facing surface. | 10-14-2010 |
20100301007 | Method of manufacturing magnetic head for perpendicular magnetic recording including two side shields - A magnetic head includes a pole layer, first and second side shields, and an encasing layer having first to third grooves that accommodate the pole layer and the first and second side shields. A manufacturing method for the magnetic head includes the step of forming the first to third grooves in a nonmagnetic layer by using an etching mask layer having first to third openings. This step includes the steps of forming the first groove by etching the nonmagnetic layer using the first opening, with the second and third openings covered with a first mask; and forming the second and third grooves by etching the nonmagnetic layer using the second and third openings, with the first opening covered with a second mask. | 12-02-2010 |
20100304531 | Method of manufacturing layered chip package - A layered chip package includes a plurality of layer portions stacked, each layer portion including a semiconductor chip having a first surface with a device formed thereon and a second surface opposite thereto. The plurality of layer portions include at least a pair of layer portions disposed such that the first surfaces of the respective semiconductor chips face toward each other. A manufacturing method for the layered chip package includes the steps of: fabricating a layered substructure by stacking a plurality of substructures each including a plurality of layer portions corresponding to the plurality of layer portions of the layered chip package; and fabricating a plurality of layered chip packages by using the layered substructure. The step of fabricating the layered substructure includes: fabricating a first and a second pre-polishing substructure each having a first surface and a second surface; bonding the pre-polishing substructures to each other such that their respective first surfaces face toward each other; and forming a first and a second substructure by polishing the second surfaces. | 12-02-2010 |
20100327464 | Layered chip package - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. The insulating portion has an end face located at the side surface of the main body on which the wiring is disposed. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed. | 12-30-2010 |
20100328806 | Near-field light generating device that includes near-field light generating element accommodated in a groove of an encasing layer - A near-field light generating element accommodated in a groove of an encasing layer has an outer surface that includes a first end face including a near-field light generating part, a second end face opposite to the first end face, and a coupling portion that couples the first and second end faces. The coupling portion includes a top surface, and first and second side surfaces that decrease in distance from each other with increasing distance from the top surface. The first end face includes a first side located at an end of the first side surface, and a second side located at an end of the second side surface. Each of the first and second sides includes an upper part and a lower part continuous with each other. An angle formed between the respective lower parts of the first and second sides is smaller than that formed between the respective upper parts of the first and second sides. | 12-30-2010 |
20110013497 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror provided outside the slider. The slider includes a magnetic pole, a waveguide, a near-field light generating element, and a substrate. The substrate has a top surface facing toward the magnetic pole, the near-field light generating element and the waveguide. The slider has a top surface that lies above the top surface of the substrate, at an end of the slider farther from the top surface of the substrate. The laser diode includes: an active layer; an emitting end face that lies at an end in a direction parallel to the plane of the active layer and includes an emission part for emitting laser light; and a bottom surface that lies at an end in a direction perpendicular to the plane of the active layer. The laser diode is arranged so that the bottom surface faces the top surface of the slider. The external mirror reflects the laser light emitted from the emission part toward the waveguide. | 01-20-2011 |
20110041322 | Method of manufacturing magnetic head for perpendicular magnetic recording including two side shields - A magnetic head includes a pole layer, first and second side shields, and an encasing layer having a pole groove that accommodates the pole layer and first and second side shield grooves that accommodate the first and second side shields. In a manufacturing method for the magnetic head, the pole groove and first and second initial side shield grooves are formed in a nonmagnetic layer using an etching mask layer having first to third openings. In the manufacturing method, a wall face of the first initial side shield groove that is closer to the pole groove and a wall face of the second initial side shield groove that is closer to the pole groove are etched by dry etching to thereby complete the first and second side shield grooves. | 02-24-2011 |
20110058273 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror provided outside the slider. The slider includes a magnetic pole, a waveguide, and a near-field light generating element. The laser diode includes: an emitting end face that lies at an end in a direction parallel to the plane of an active layer and includes a laser-light emission part; and a mounting surface that lies at an end in a direction perpendicular to the plane of the active layer and faces the slider. The external mirror includes: a first reference surface that is parallel to the emitting end face and faces the emitting end face; a second reference surface that is parallel to the mounting surface and faces toward the same direction as the mounting surface does; and a reflecting surface that connects the first and second reference surfaces to each other and reflects the laser light emitted from the emission part toward the waveguide. | 03-10-2011 |
20110068456 | Layered chip package and method of manufacturing same - A layered chip package includes a plurality of layer portions that are stacked, each of the layer portions including a semiconductor chip. The plurality of layer portions include at least one first-type layer portion and at least one second-type layer portion. The semiconductor chip has a circuit, a plurality of electrode pads electrically connected to the circuit, and a plurality of through electrodes. In every vertically adjacent two of the layer portions, the plurality of through electrodes of the semiconductor chip of one of the two layer portions are electrically connected to the respective corresponding through electrodes of the semiconductor chip of the other of the two layer portions. The first-type layer portion includes a plurality of wires for electrically connecting the plurality of through electrodes to the respective corresponding electrode pads, whereas the second-type layer portion does not include the wires. | 03-24-2011 |
20110095289 | Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package - In a laminated chip package, a plurality of semiconductor plates each having a semiconductor device and a wiring electrode connected to the semiconductor device are laminated. On a side surface for wiring of the laminated chip package, an end face of an inner electrode for examination formed inside the side surface for wiring in the semiconductor plate is formed. The laminated chip package further has an outer electrode for examination connecting the end faces of the inner electrodes for examination along a lamination direction of the semiconductor plates, only for two adjacent semiconductor plates among the semiconductor plates. | 04-28-2011 |
20110095414 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a device region in contact with at least any one of the plurality of groove portions and having a semiconductor device formed therein; a surface insulating layer formed to cover the device region and constituting a surface layer of the semiconductor substrate; and a wiring electrode connected to the semiconductor device and formed in a protruding shape rising above a surface of the surface insulating layer. The semiconductor substrate can be manufactured by forming a plurality of groove portions along scribe lines; applying an insulating material to a surface on a side where the plurality of groove portions are formed to form a surface insulating layer; and forming a wiring electrode connected to the semiconductor device and in a protruding shape rising above a surface of the surface insulating layer, after the formation of the surface insulating layer. | 04-28-2011 |
20110096435 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror fixed to the laser diode. The laser diode has an emitting end face that includes an emission part for emitting laser light; a mounting surface that lies at an end in a direction perpendicular to the plane of an active layer and faces the slider; and a rear surface opposite to the mounting surface. The external mirror includes: a first to-be-fixed part disposed along the emitting end face; a second to-be-fixed part disposed along the rear surface; and a coupling part that couples the first and second to-be-fixed parts to each other. The first to-be-fixed part has a reflecting surface that reflects the laser light emitted from the emission part toward the waveguide. | 04-28-2011 |
20110147343 | Method of manufacturing magnetic head for perpendicular magnetic recording - A magnetic head includes: a pole layer including a track width defining portion and a wide portion; and an accommodation layer disposed on a bottom forming layer and having a groove that accommodates the pole layer. The groove includes a first portion for accommodating at least part of the track width defining portion, and a second portion for accommodating at least part of the wide portion. A manufacturing method for the magnetic head includes the steps of; forming a groove defining layer on a nonmagnetic layer that is intended to later become the accommodation layer; forming a mask that covers an area of the nonmagnetic layer where to form the first portion of the groove; etching the nonmagnetic layer so that the second portion of the groove is formed in the nonmagnetic layer; removing the mask; and taper-etching the nonmagnetic layer so that the first portion of the groove is formed in the nonmagnetic layer and the groove is thereby completed. | 06-23-2011 |
20110149426 | Heat-assisted magnetic recording head with internal mirror - A heat-assisted magnetic recording head has an internal mirror that includes a reflecting film support body and a reflecting film. The internal mirror reflects light that comes from above a waveguide so that the reflected light travels through the waveguide toward a medium facing surface. The reflecting film support body includes first and second inclined surfaces. The reflecting film includes first and second portions that are located on the first and second inclined surfaces, respectively. The step of forming the reflecting film support body includes two-taper etching operations to be performed on an initial support body. | 06-23-2011 |
20110164333 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a near-field light generating part in a triangle shape with the generating end part being one vertex, and is formed in a triangle pole shape. The optical waveguide is formed to be opposed to a ridge part of the near-field light generating layer via an interposed layer. The main magnetic pole layer is formed to be opposed to the generating end part via the interposed layer. The thermally assisted magnetic head further includes a heat radiating layer in contact with an opposite side of the near-field light generating layer from the optical waveguide. | 07-07-2011 |
20110180932 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of semiconductor chips stacked, and a plurality of electrodes that electrically connect the semiconductor chips to the wires. A method of manufacturing the layered chip package includes the steps of: fabricating a substructure that includes an array of a plurality of pre-separation main bodies and a plurality of holes for accommodating a plurality of preliminary wires, the holes being formed between two adjacent pre-separation main bodies; forming the preliminary wires in the plurality of holes by plating; and cutting the substructure so that the plurality of pre-separation main bodies are separated from each other and the preliminary wires are split into two sets of wires of two separate main bodies, whereby a plurality of layered chip packages are formed. | 07-28-2011 |
20110186985 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof. | 08-04-2011 |
20110188354 | HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH CONVERGENT LENS - A heat-assisted magnetic recording head includes a magnetic pole, a waveguide that allows light to propagate therethrough, a near-field light generating element that generates near-field light based on the light propagating through the waveguide, a convergent lens, and a laser diode disposed above the waveguide. The convergent lens transmits light that is emitted from the laser diode, so that the light transmitted through the convergent lens is incident on the waveguide. | 08-04-2011 |
20110189820 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - In a method of manufacturing a layered chip package, a layered substructure is fabricated and used to produce a plurality of layered chip packages. The layered substructure includes first to fourth substructures stacked, each of the substructures including an array of a plurality of preliminary layer portions. In the step of fabricating the layered substructure, initially fabricated are first to fourth pre-polishing substructures each having first and second surfaces. Next, the first and second pre-polishing substructures are bonded to each other with the first surfaces facing each other, and then the second surface of the second pre-polishing substructure is polished to form a first stack. Similarly, the third and fourth pre-polishing substructures are bonded to each other and the second surface of the third pre-polishing substructure is polished to form a second stack. Then, the first and second stacks are bonded to each other. | 08-04-2011 |
20110189822 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body and wiring. The main body includes a plurality of layer portions stacked. The wiring is disposed on at least one side surface of the main body. In the method of manufacturing the layered chip package, first, a plurality of substructures each of which includes an array of a plurality of preliminary layer portions are used to fabricate a layered substructure that includes a plurality of pre-separation main bodies arranged in rows. Next, the layered substructure is cut into a plurality of blocks each of which includes a row of a plurality of pre-separation main bodies, and the wiring is formed on the plurality of pre-separation main bodies included in each block simultaneously. The plurality of pre-separation main bodies are then separated from each other. Each of the plurality of blocks includes a row of three, four, or five pre-separation main bodies. | 08-04-2011 |
20110201137 | Method of manufacturing layered chip package - A method of manufacturing a layered chip package that includes a main body, and wiring disposed on a side surface of the main body. The main body includes a plurality of layer portions. The method includes fabricating a plurality of substructures, and completing the layered chip package by fabricating the main body using the plurality of substructures and by forming the wiring on the main body. Each substructure is fabricated through the steps of: fabricating a pre-substructure wafer including a plurality of pre-semiconductor-chip portions aligned; distinguishing between a normally functioning pre-semiconductor-chip portion and a malfunctioning pre-semiconductor-chip portion among the plurality of pre-semiconductor-chip portions included in the pre-substructure wafer; and forming electrodes connected to the normally functioning pre-semiconductor-chip portion and having respective end faces located in the side surface of the main body on which the wiring is disposed, without forming any electrode connected to the malfunctioning pre-semiconductor-chip portion. | 08-18-2011 |
20110210095 | METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATING ELEMENT AND METHOD OF MANUFACTURING HEAT-ASSISTED MAGNETIC RECORDING HEAD - A near-field light generating element has an outer surface including first and second inclined surfaces and an edge part that connects the first and second inclined surfaces to each other. In a method of manufacturing the near-field light generating element, a polishing stopper layer is initially formed on a metal layer, and the polishing stopper layer and the metal layer are etched so that the metal layer is provided with the first inclined surface. Next, a coating layer is formed to cover the metal layer and the polishing stopper layer. The coating layer is made of a non-metallic inorganic material that has an etching rate lower than that of the metal layer in a second etching step to be performed later. Next, the coating layer is polished until the polishing stopper layer is exposed. Next, the second etching step is performed to etch the polishing stopper layer and the metal layer using the coating layer as the etching mask. This provides the metal layer with the second inclined surface and the edge part, and thereby makes the metal layer into the near-field light generating element. | 09-01-2011 |
20110221073 | Layered chip package with wiring on the side surfaces - A layered chip package has a main body including pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The pairs of layer portions include specific pairs of layer portions. Each of the specific pairs of layer portions includes a first-type layer portion and a second-type layer portion. The first-type layer portion includes electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. The specific pairs of layer portions are provided in an even number. | 09-15-2011 |
20110228416 | A METHOD OF MANUFACTURING A THERMALLY ASSISTED MAGNETIC HEAD - A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step. | 09-22-2011 |
20110228417 | HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH NEAR-FIELD LIGHT GENERATING ELEMENT - A near-field light generating element has an outer surface. The outer surface includes a bottom surface, first and second inclined surfaces, an edge part that connects the first and second inclined surfaces to each other, and a front end face located in a medium facing surface. The front end face includes a first side that lies at an end of the first inclined surface, a second side that lies at an end of the second inclined surface, and a tip that is formed by contact of the first and second sides with each other and forms a near-field light generating part. Each of the first side and the second side has a lower part and an upper part that are continuous with each other. An angle formed between the upper part of the first side and the upper part of the second side is smaller than that formed between the lower part of the first side and the lower part of the second side. | 09-22-2011 |
20110228418 | HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH NEAR-FIELD LIGHT GENERATING ELEMENT - A near-field light generating element has an outer surface including a bottom surface that lies at an end closer to a top surface of a substrate, a waveguide facing surface that lies at an end farther from the top surface of the substrate and faces a waveguide, a front end face located in a medium facing surface, and a side surface that connects the bottom surface, the waveguide facing surface and the front end face to each other. The front end face includes a first side that lies at an end of the bottom surface, a tip that lies at an end farther from the top surface of the substrate and forms a near-field light generating part, a second side that connects an end of the first side to the tip, and a third side that connects the other end of the first side to the tip. The waveguide facing surface includes a width changing portion that has a width in a direction parallel to the bottom surface and the front end face, the width decreasing with decreasing distance to the front end face. | 09-22-2011 |
20110242703 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The thermally assisted magnetic head includes a base layer which a base groove part having a width gradually getting smaller along a depth direction and extending in an intersecting direction intersecting with the medium-opposing surface is formed. The near-field light generating layer has an in-groove generating layer formed inside of the base groove part. The in-groove generating layer is formed along an inner wall surface of the base groove part and has a thin-film like structure. | 10-06-2011 |
20110266692 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and a plurality of through electrodes. The main body includes a plurality of layer portions stacked and a plurality of through holes that penetrate all the plurality of layer portions. The plurality of through electrodes are provided in the plurality of through holes of the main body and penetrate all the plurality of layer portions. Each of the plurality of layer portions includes a semiconductor chip. At least one of the plurality of layer portions includes wiring that electrically connects the semiconductor chip to the plurality of through electrodes. The wiring includes a plurality of conductors that make contact with a through electrode that is exposed in the wall faces of any one of the plurality of through holes and passes through the through hole. | 11-03-2011 |
20110303637 | METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATOR INCLUDING WAVEGUIDE AND PLASMON GENERATOR - A near-field light generator includes: a waveguide; a clad layer having a penetrating opening and disposed on the waveguide; a plasmon generator accommodated in the opening; and a dielectric film interposed between the plasmon generator and each of the waveguide and the clad layer. In a method of manufacturing the near-field light generator, an initial clad layer is initially formed on the waveguide, and then the initial clad layer is taper-etched by RIE to form a recess that does not reach the top surface of the waveguide. Subsequently, the recess is etched by wet etching until the top surface of the waveguide is exposed in part. Next, the dielectric film is formed in the opening, and the plasmon generator is formed on the dielectric film. | 12-15-2011 |
20110316123 | Laminated semiconductor substrate, laminated chip package and method of manufacturing the same - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein, a first wiring electrode and a second wiring electrode extend to the inside of a interposed groove part from a first device region and a second device region respectively, and are separated from each other. In the laminated semiconductor substrate, a through hole which the first wiring electrode appears is formed. The laminated semiconductor substrate has a through electrode. The through electrode is contact with all of the first wiring electrodes appearing in the through hole. The laminated semiconductor substrate has a plurality of laminated chip regions. | 12-29-2011 |
20110316141 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions stacked; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. The plurality of layer portions include a first-type layer portion and a second-type layer portion. The first-type layer portion includes a conforming semiconductor chip, and a plurality of first-type electrodes that are connected to the semiconductor chip and the wiring. The second-type layer portion includes a defective semiconductor chip, and a plurality of second-type electrodes that are connected to the wiring and not to the semiconductor chip. | 12-29-2011 |
20120013024 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip, and a plurality of electrodes that are electrically connected to the wires. The electrodes include a plurality of first electrodes that are intended to establish electrical connection to the semiconductor chip, and a plurality of second electrodes that are not in contact with the semiconductor chip. In at least one of the layer portions, the first electrodes are in contact with and electrically connected to the semiconductor chip. | 01-19-2012 |
20120013025 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip. The plurality of wires include a plurality of common wires and a plurality of layer-dependent wires. In at least one of the layer portions, the semiconductor chip is electrically connected to the plurality of common wires and is selectively electrically connected to only the layer-dependent wire that the layer portion uses, among the plurality of layer-dependent wires. | 01-19-2012 |
20120025355 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have electromagnetic shielding layer formed in regions other than the scribe-groove parts using a ferromagnetic body. Further, in the laminated semiconductor substrate, a through hole which penetrates the plurality of semiconductor substrates laminated in a laminated direction is formed in the scribe-groove part, and the laminated semiconductor substrate has a through electrode penetrating the plurality of semiconductor substrates through the through hole. | 02-02-2012 |
20120032318 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. Each layer portion includes a semiconductor chip. The plurality of second terminals are positioned to overlap the plurality of first terminals as viewed in a direction perpendicular to the top surface of the main body. A plurality of pairs of first and second terminals that are electrically connected via the wires include a plurality of pairs of a first terminal and a second terminal that are positioned not to overlap each other. | 02-09-2012 |
20120056333 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. Each layer portion includes a semiconductor chip having a first surface and a second surface opposite thereto, and includes a plurality of electrodes. The electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the electrodes of the first layer portion, and the second terminals are formed by using the electrodes of the second layer portion. | 03-08-2012 |
20120080782 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. The first and second terminals are formed by using electrodes of the first and second layer portions. The layered chip package is manufactured by fabricating a layered substructure by stacking two substructures each of which includes an array of a plurality of preliminary layer portions, and then cutting the layered substructure. The layered substructure includes a plurality of preliminary wires that are disposed between two adjacent pre-separation main bodies and are to become the plurality of wires. | 04-05-2012 |
20120086130 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body. The main body includes a main part, and further includes first terminals and second terminals disposed on the top and bottom surfaces of the main part, respectively. The main part includes first and second layer portions, and through electrodes penetrating them. The through electrodes are electrically connected to the first and second terminals. Each of the layer portions includes a semiconductor chip having a first surface and a second surface opposite thereto, and further includes surface electrodes. The surface electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the surface electrodes of the first layer portion. The second terminals are formed by using the surface electrodes of the second layer portion. | 04-12-2012 |
20120087217 | THERMALLY ASSISTED MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step. | 04-12-2012 |
20120126427 | MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip. | 05-24-2012 |
20120140358 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING WITH SHIELD AROUND MAIN MAGNETIC POLE - A magnetic head includes a main magnetic pole, a shield having an end face located in a medium facing surface to wrap around an end face of the main magnetic pole, and a gap part provided between the main magnetic pole and the shield. The shield includes a bottom shield, two side shields, and a top shield. The gap part includes first and second gap layers. In a manufacturing method of the magnetic head, a mold is formed on the top surface of the bottom shield, the mold having a shape determined by photolithography and being intended to be removed later. Next, the two side shields are formed on the top surface of the bottom shield by performing plating without forming a seed layer. Next, the mold is removed and then the first gap layer, the main magnetic pole, the second gap layer, and the top shield are formed in succession. | 06-07-2012 |
20120142146 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of stacked layer portions. A method of manufacturing the layered chip package includes the step of fabricating a layered substructure and the step of cutting the layered substructure. The layered substructure includes: a plurality of arrayed pre-separation main bodies; a plurality of accommodation parts disposed between two adjacent pre-separation main bodies; and a plurality of preliminary wires accommodated in the accommodation parts. The accommodation parts are formed in a photosensitive resin layer by photolithography. In the step of cutting the layered substructure, the plurality of pre-separation main bodies are separated from each other, and the wires are formed by the preliminary wires. | 06-07-2012 |
20120147499 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING WITH SHIELD AROUND MAIN POLE - A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section is magnetically connected to the bottom shield and is greater than the bottom shield in length in a direction perpendicular to the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other. The coil includes a first portion that passes through a space defined by the main pole and the first return path section, and a second portion that passes through a space defined by the main pole and the second return path section. | 06-14-2012 |
20120147500 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A TAPERED MAIN POLE - A bottom end of a main pole includes first, second, and third portions that are contiguously arranged in order of increasing distance from the medium facing surface. A top surface of the main pole includes fourth, fifth, and sixth portions that are contiguously arranged in order of increasing distance from the medium facing surface. A distance from the top surface of the substrate to any given point on each of the first and second portions decreases with increasing distance from the given point to the medium facing surface. The second portion has an angle of inclination greater than that of the first portion with respect to a direction perpendicular to the medium facing surface. A distance from the top surface of the substrate to any given point on each of the fourth and fifth portions increases with increasing distance from the given point to the medium facing surface. The fifth portion has an angle of inclination greater than that of the fourth portion with respect to the direction perpendicular to the medium facing surface. | 06-14-2012 |
20120147501 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING WITH SHIELD AROUND MAIN POLE - A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section includes a yoke layer, and first and second coupling layers that magnetically couple the bottom shield and the yoke layer to each other. The first coupling layer is magnetically connected to the bottom shield. The second coupling layer magnetically couples the first coupling layer to the yoke layer. No end faces of the second coupling layer are exposed in the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other. | 06-14-2012 |
20120170154 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film coil has a coil-layer. The coil-layer has a turn part arranged closer to an ABS than is a rear end part of the main magnetic pole layer farthest from the ABS. Regarding a substrate side coil-layer, arranged between the main magnetic pole layer and the substrate, of the coil-layer, a thickness of a non-corresponding magnetic pole part other than a magnetic pole corresponding part corresponding to an arrangement space of the main magnetic pole layer is larger than a thickness of the magnetic pole corresponding part. | 07-05-2012 |
20120170156 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND TWO SHIELDS - A magnetic head includes: a coil; a main pole; a first shield disposed backward of the main pole along a direction of travel of a recording medium; a first return path section connecting the first shield to the main pole; a second shield disposed forward of the main pole along the direction of travel of the recording medium; and a second return path section connecting the second shield to the main pole. An interface between the first return path section and the main pole has an end closest to a medium facing surface, and an interface between the second return path section and the main pole has an end closest to the medium facing surface, the latter being closer to the medium facing surface than the former. The second return path section includes a yoke layer located away from the medium facing surface and in contact with the main pole. The coil includes at least one coil element that passes between the second shield and the yoke layer. | 07-05-2012 |
20120187574 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller plate. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller plate. A plurality of opposing wiring electrodes are formed at an opposing surface of the controller plate. A plurality of outside wiring electrodes are formed on the rear side of the opposing surface. Connection electrodes connecting the opposing wiring electrodes and the outside wiring electrodes are formed on the side surface of the controller plate. The interposed chip has a plurality of interposed wiring electrodes. The plurality of interposed wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of the plurality of opposing wiring electrodes. The controller plate is laid on the interposed chip. | 07-26-2012 |
20120187575 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A layered chip package includes a main body and wiring. The main body includes a main part including a plurality of stacked layer portions, and a plurality of terminals disposed on the top and bottom surfaces of the main part. The wiring includes a plurality of lines electrically connected to the plurality of terminals. The plurality of lines include a plurality of common lines and a plurality of layer-dependent lines. Each of the plurality of layer portions includes a plurality of common electrodes electrically connected to the plurality of common lines, and a selective connection electrode selectively electrically connected to only the layer-dependent line that the layer portion uses among the plurality of layer-dependent lines. The selective connection electrode varies in shape depending on which of the layer-dependent lines it is electrically connected to. | 07-26-2012 |
20120188666 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND A SHIELD - A magnetic head includes: a main pole; a coil; a first shield with an end face located in a medium facing surface at a position forward of an end face of the main pole along a direction of travel of a recording medium; a gap part including a portion located between the main pole and the first shield; and a first return path section disposed forward of the main pole along the direction of travel of the recording medium. The first return path section connects the first shield and the main pole to each other so that a first space is defined by the main pole, the gap part, the first shield, and the first return path section. The coil includes a plurality of first coil elements extending to pass through the first space and aligned in a row in the direction of travel of the recording medium. | 07-26-2012 |
20120218662 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A SENSOR FOR DETECTING CONTACT WITH A RECORDING MEDIUM - A magnetic head for perpendicular magnetic recording includes a read head unit, a write head unit disposed forward of the read head unit along the direction of travel of a recording medium, a heater that generates heat for causing the medium facing surface to protrude in part, an expansion layer that makes part of the medium facing surface protrude, and a sensor that detects contact of the part of the medium facing surface with the recording medium. The write head unit includes a main pole, a write shield, and a return path section. The return path section includes a yoke layer located backward of the main pole along the direction of travel of the recording medium, a first coupling part that couples the yoke layer and the write shield to each other, and a second coupling part that is located away from the medium facing surface and couples the yoke layer and the main pole to each other. | 08-30-2012 |
20120218663 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A SENSOR FOR DETECTING CONTACT WITH A RECORDING MEDIUM - A magnetic head includes a main pole, a write shield, a return path section, a heater that generates heat for making part of a medium facing surface protrude, and a sensor that detects contact of the part of the medium facing surface with a recording medium. The return path section includes: a yoke layer located backward of the main pole along the direction of travel of the recording medium; a first coupling part coupling the yoke layer and the write shield to each other; and a second coupling part located away from the medium facing surface and coupling the yoke layer and the main pole to each other. The first coupling part has an end face facing toward the yoke layer. This end face includes a middle portion spaced from the yoke layer and facing the yoke layer, and two side portions located on opposite sides of the middle portion in a track width direction and in contact with the yoke layer. The sensor is located between the middle portion and the yoke layer. | 08-30-2012 |
20120256321 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and wiring. The main body includes a main part including a plurality of stacked layer portions, and a plurality of terminals disposed on the top and bottom surfaces of the main part. The wiring includes a plurality of lines electrically connected to the plurality of terminals. The plurality of lines include a plurality of common lines and a plurality of layer-dependent lines. Each of the plurality of layer portions includes: a plurality of common electrodes electrically connected to the plurality of common lines; a plurality of non-contact electrodes that are electrically connected to the layer-dependent lines and are not in contact with the semiconductor chip in the layer portion; and a selective connection electrode selectively electrically connected to only the layer-dependent line that the layer portion uses among the plurality of layer-dependent lines. The layer-dependent lines are greater than the common lines in maximum width. | 10-11-2012 |
20120257304 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND A SHIELD - A magnetic head includes a coil, a main pole, a write shield, and first and second yoke layers. The first and second yoke layers are magnetically connected to the write shield and aligned along the direction of travel of a recording medium such that the main pole is interposed therebetween. The coil includes a winding portion of planar spiral shape that is formed in one or more layers. The magnetic head further includes: a first coupling part located away from the medium facing surface and magnetically coupling the main pole and the second yoke layer to each other; and a second coupling part located away from the medium facing surface and magnetically coupling the first yoke layer and the second yoke layer to each other without touching the main pole. The winding portion is wound around the first coupling part, and a part of the winding portion passes between the first and second coupling parts. | 10-11-2012 |
20120269048 | METHOD OF MANUFACTURING HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH INTERNAL MIRROR - A manufacturing method for a heat-assisted magnetic recording head includes the step of forming an internal mirror that includes a reflecting film support body and a reflecting film. The reflecting film support body includes first and second inclined surfaces. The reflecting film includes first and second portions that are located on the first and second inclined surfaces, respectively. The step of forming the internal mirror includes the step of forming the reflecting film support body and the step of forming the reflecting film. The step of forming the reflecting film support body forms an initial support body, and performs two taper-etching processes on the initial support body so that the initial support body is provided with the first and second inclined surfaces. | 10-25-2012 |
20120282492 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head includes a return magnetic pole layer and a connecting magnetic layer. The return magnetic pole layer is formed at a position distanced from the medium-opposing surface on the side opposite to the write shield layer with the main magnetic pole layer intervening therebetween. The connecting magnetic layer is formed using a magnetic material so as to connect the return magnetic pole layer to the write shield layer on the side closer to the medium-opposing surface than is the thin-film coil. The thin-film coil is wound as a flat spiral around the write shield layer. A part of the thin-film coil wound as the flat spiral is disposed only at a position distanced from the substrate than is the main magnetic pole layer. | 11-08-2012 |
20120292287 | METHOD OF FORMING MAIN POLE OF THERMALLY-ASSISTED MAGNETIC RECORDING HEAD - In a method of forming a main pole, an initial accommodation layer is etched by RIE using a first etching mask having a first opening, whereby a groove is formed in the initial accommodation layer. Next, a part of the initial accommodation layer including the groove is etched by RIE using a second etching mask having a second opening, so that the groove becomes an accommodation part. The main pole is then formed in the accommodation part. The first etching mask has first and second sidewalls that face the first opening and are opposed to each other at a first distance in a track width direction. The second etching mask has third and fourth sidewalls that face the second opening and are opposed to each other at a second distance greater than the first distance. | 11-22-2012 |
20120313259 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and wiring. The main body has a main part. The main part has a top surface and a bottom surface and includes a plurality of layer portions that are stacked. The wiring includes a plurality of lines passing through all the plurality of layer portions. Each layer portion includes a semiconductor chip and a plurality of electrodes. The semiconductor chip has a first surface, and a second surface opposite thereto. The plurality of electrodes are disposed on a side of the first surface of the semiconductor chip. The plurality of layer portions include two or more pairs of first and second layer portions in each of which the first and second layer portions are arranged so that the first or second surfaces of the respective semiconductor chips face each other. The plurality of electrodes include a plurality of first connection parts and a plurality of second connection parts. In the first layer portion, the plurality of first connection parts are in contact with the plurality of lines. In the second layer portion, the plurality of second connection parts are in contact with the plurality of lines. | 12-13-2012 |
20120313260 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface and including three or more layer portions stacked on one another; a plurality of first terminals disposed on the top surface of the main part; and a plurality of second terminals disposed on the bottom surface of the main part. Each layer portion includes a semiconductor chip having first and second surfaces, and a plurality of electrodes electrically connected to the wiring. The plurality of electrodes are disposed on a side of the first surface of the semiconductor chip. A first layer portion located closest to the top surface of the main part and a second layer portion located closest to the bottom surface of the main part are arranged so that the second surfaces of their respective semiconductor chips face toward each other. The plurality of first terminals are formed by using the plurality of electrodes of the first layer portion. The plurality of second terminals are formed by using the plurality of electrodes of the second layer portion. | 12-13-2012 |
20120314323 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDINGHAVING A MAIN POLE AND A SHIELD AND SPECIFICALLY STRUCTURED AND LOCATED COIL ELEMENTS AND MAGNETIC COUPLING LAYERS - A magnetic head includes a coil, a main pole, a gap part, a write shield, and a return path section. The return path section includes a yoke part and first and second coupling layers. The first coupling layer is connected to the write shield. The second coupling layer magnetically couples the first coupling layer to the yoke part, and has an end face facing toward a medium facing surface and located away from the medium facing surface. The coil includes a first coil element and a plurality of second coil elements that each extend to pass through a space defined by the main pole, the gap part, the write shield, and the return path section. The first coil element is disposed with the first coupling layer interposed between the medium facing surface and the first coil element. The second coil elements are disposed with the second coupling layer interposed between the medium facing surface and the second coil elements, and with the first coil element interposed between the main pole and the second coil elements. The second coil elements are aligned perpendicularly to the medium facing surface. | 12-13-2012 |
20120315716 | TAPER-ETCHING METHOD AND METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATOR - A method of taper-etching a layer to be etched that is made of SiO | 12-13-2012 |
20130020723 | COMPOSITE LAYERED CHIP PACKAGE - A composite layered chip package includes a plurality of subpackages stacked on each other. Each subpackage includes a main body and wiring. The main body includes a main part including a plurality of layer portions, and further includes first terminals and second terminals that are disposed on top and bottom surfaces of the main part, respectively. The wiring is electrically connected to the first and second terminals. The number of the plurality of layer portions included in the main part is the same for all the plurality of subpackages, and the plurality of layer portions in every subpackage include at least one first-type layer portion. In each of at least two of the subpackages, the plurality of layer portions further include at least one second-type layer portion. The first-type layer portion includes a semiconductor chip connected to the wiring, whereas the second-type layer portion includes a semiconductor chip not connected to the wiring. | 01-24-2013 |
20130038966 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDINGHAVING A MAIN POLE, A SHIELD AND A COIL CORE PART SETBACK AWAY FROM THE MEDIUM FACING SURFACE A SPECIFIED DISTANCE - A magnetic head includes: a main pole; a coil; a first shield having an end face that is located in a medium facing surface at a position forward of an end face of the main pole along a direction of travel of a recording medium; and a first return path section disposed forward of the main pole along the direction of travel of the recording medium. The first return path section connects part of the main pole away from the medium facing surface to the first shield so that a first space is defined. The coil includes a first portion having a planar spiral shape and wound around a core part of the first return path section. The first portion includes first and second coil elements that each extend through the first space. No part of the coil other than the first and second coil elements exists in the first space. | 02-14-2013 |
20130068722 | METHOD OF MANUFACTURING PLASMON GENERATOR - A method of manufacturing the plasmon generator includes the steps of: forming a base part made of a dielectric material; forming a metal film that is to later become the plasmon generator; and forming a filler layer made of a dielectric material. The base part includes a base surface and a protruding part that protrudes from the base surface. The protruding part has a top surface that is different in level from the base surface, and a first sidewall connecting the top surface of the protruding part to the base surface. The metal film includes an adhesion part adhering to the first sidewall. The filler layer has a second sidewall disposed such that the adhesion part is interposed between the first sidewall and the second sidewall. | 03-21-2013 |
20130075935 | COMPOSITE LAYERED CHIP PACKAGE - A composite layered chip package includes first and second subpackages that are stacked. Each subpackage includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface; first terminals disposed on the top surface of the main part; and second terminals disposed on the bottom surface of the main part. The first and second terminals are electrically connected to the wiring. The first and second subpackages are arranged in a specific relative positional relationship, different from a reference relative positional relationship, with each other. | 03-28-2013 |
20130105949 | LAMINATED SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME | 05-02-2013 |
20130107681 | PLASMON GENERATOR INCLUDING TWO PORTIONS MADE OF DIFFERENT METALS | 05-02-2013 |
20130155550 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a shield magnetic layer. The shield magnetic layer has a leading shield part. The leading shield part is disposed on a substrate side of the main magnetic pole layer. The leading shield part has a variable distance structure in which a rearmost part most distanced from the medium-opposing surface is distanced more from the main magnetic pole layer than is a foremost part on the main magnetic pole layer side. | 06-20-2013 |
20130176644 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, a thin-film coil and a shield magnetic layer are laminated on a substrate. The thin-film magnetic head has a shield magnetic layer. This thin-film magnetic head has a hard guard frame layer surrounding an equidistant coil part, disposed at a position equidistant from the substrate, from outside and being in direct contact with almost a whole outside surface defining an outer shape of the equidistant coil part. | 07-11-2013 |
20130186854 | TAPER-ETCHING METHOD AND METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATOR - A method of taper-etching a layer to be etched that is made of a dielectric material and has a top surface. The method includes the steps of: forming an etching mask with an opening on the top surface of the layer to be etched; and taper-etching a portion of the layer to be etched, the portion being exposed from the opening, by reactive ion etching so that a groove having two wall faces intersecting at a predetermined angle is formed in the layer to be etched. The step of taper-etching employs an etching gas containing a first gas contributing to the etching of the layer to be etched and a second gas contributing to the deposition of a sidewall protective film, and changes, during the step, the ratio of the flow rate of the second gas to the flow rate of the first gas so that the ratio increases. | 07-25-2013 |
20130241081 | COMBINATION FOR COMPOSITE LAYERED CHIP PACKAGE - A main package includes a plurality of stacked semiconductor chips and a plurality of first terminals associated with different ones of the semiconductor chips. An additional package includes an additional semiconductor chip and at least one second terminal electrically connected to the additional semiconductor chip. The additional semiconductor chip is to substitute for one of the plurality of semiconductor chips in the main package. The main package and the additional package are arranged in one of a plurality of relative positional relationships that is selected according to which one of the plurality of semiconductor chips in the main package is to be substituted with the additional semiconductor chip. | 09-19-2013 |
20130283601 | METHOD OF MANUFACTURING MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A RETURN PATH SECTION - A method of manufacturing a magnetic head includes the step of forming an accommodation part and the step of forming a return path section. The return path section lies between a main pole and a top surface of a substrate, and connects a shield and part of the main pole away from a medium facing surface to each other so that a space through which part of a coil passes is defined. The accommodation part accommodates at least part of the return path section. The step of forming the return path section forms first to third portions simultaneously. The first portion is located closer to the top surface of the substrate than is the space. The second portion is located closer to the medium facing surface than is the space. The third portion is located farther from the medium facing surface than is the space. | 10-31-2013 |
20130308227 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND A SHIELD - A magnetic head includes a magnetic structure incorporating a write shield. The magnetic structure is formed to include a first magnetic layer, a second magnetic layer stacked on the first magnetic layer, and a seed layer. The first magnetic layer has a front end face located in the medium facing surface and a top surface. The second magnetic layer has a front end face located in the medium facing surface and a bottom surface. The top surface of the first magnetic layer includes a first region including an end located in the medium facing surface and a second region farther from the medium facing surface than the first region. The seed layer is not present on the first region of the top surface of the first magnetic layer but is present on the second region. | 11-21-2013 |
20130329319 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A RETURN PATH SECTION - A magnetic head includes first and second coils, a main pole, a write shield, a return path section, and a core part. The return path section includes a yoke part magnetically connected to the write shield, and a coupling part located away from a medium facing surface and magnetically coupling the yoke part and the main pole to each other. The first coil is located on the front side in the direction of travel of a recording medium relative to the main pole and wound around the coupling part. The core part is located farther from the medium facing surface than is the coupling part, and is magnetically connected to the main pole. The second coil is located on the front side in the direction of travel of the recording medium relative to the main pole and wound around the core part. | 12-12-2013 |
20140080259 | MANUFACTURING METHOD FOR LAYERED CHIP PACKAGES - In a manufacturing method for layered chip packages, a layered substructure with at least one additional package joined thereto is used to produce a plurality of layered chip packages. The layered substructure includes a plurality of main bodies to be separated from each other later. Each main body includes: a main part having top and bottom surfaces and including a plurality of layer portions stacked on each other; and a plurality of main terminals disposed on at least one of the top and bottom surfaces of the main part. The additional package includes an additional semiconductor chip and at least one additional terminal that is electrically connected to the additional semiconductor chip and in contact with at least one of the plurality of main terminals. | 03-20-2014 |
20140124959 | MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip. | 05-08-2014 |
20140175053 | TAPER-ETCHING METHOD AND METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATOR - A method of taper-etching a layer to be etched that is made of a dielectric material and has a top surface. The method includes the steps of: forming an etching mask with an opening on the top surface of the layer to be etched; and taper-etching a portion of the layer to be etched, the portion being exposed from the opening, by reactive ion etching so that a groove having two wall faces intersecting at a predetermined angle is formed in the layer to be etched. The step of taper-etching employs an etching gas containing a first gas contributing to the etching of the layer to be etched and a second gas contributing to the deposition of a sidewall protective film, and changes, during the step, the ratio of the flow rate of the second gas to the flow rate of the first gas so that the ratio increases. | 06-26-2014 |
20140177099 | MAGNETIC HEAD FOR PERPENDICULAR RECORDING HAVING A PLURALITY OF MAGNETIC PATH PORTIONS - A magnetic head includes a coil, a main pole, a write shield, and a return path section. The return path section includes a yoke layer located on the front side in the direction of travel of a recording medium relative to the main pole, and a coupling part coupling the main pole and the yoke layer to each other. The coupling part includes a plurality of magnetic path portions that separate a magnetic flux into a plurality of fluxes and allow the fluxes to pass therethrough in parallel. The coil includes a plurality of winding portions disposed around the plurality of magnetic path portions, respectively. | 06-26-2014 |
20140247706 | PLASMON GENERATOR INCLUDING TWO PORTIONS MADE OF DIFFERENT METALS - A plasmon generator has a front end face located in a medium facing surface of a magnetic head. The plasmon generator includes a first portion formed of a first metal material and a second portion formed of a second metal material. The first portion has an inclined surface facing toward the front end face. The second portion is located between the inclined surface and the front end face, and includes a first end face located in the front end face and a second end face in contact with the inclined surface. The second metal material is higher in Vickers hardness than the first metal material. The first portion has a plasmon exciting part. The front end face generates near-field light. | 09-04-2014 |
20140269232 | NEAR-FIELD LIGHT GENERATOR AND THERMALLY-ASSISTED MAGNETIC RECORDING HEAD - A near-field light generator includes a multilayer structure having a front end face. The multilayer structure includes a first dielectric layer, a second dielectric layer, a third dielectric layer, a first metal layer, and a second metal layer. The first metal layer is interposed between the first dielectric layer and the second dielectric layer. The second metal layer is interposed between the second dielectric layer and the third dielectric layer. Each of the first to third dielectric layers and the first and second metal layers has an end located in the front end face. The dielectric material used to form the first dielectric layer, the dielectric material used to form the second dielectric layer, and the dielectric material used to form the third dielectric layer have the same permittivity. | 09-18-2014 |
20140269237 | MULTILAYER PLASMON GENERATOR - A plasmon generator has a front end face, a first metal layer, a second metal layer, and an intermediate layer. The front end face generates near-field light based on a surface plasmon. The intermediate layer is interposed between the first metal layer and the second metal layer. Each of the first metal layer, the second metal layer and the intermediate layer has an end located in the front end face. Each of the first and second metal layers is formed of a metal material. The intermediate layer is formed of a material higher in Vickers hardness than the metal material used to form the first metal layer and the metal material used to form the second metal layer. | 09-18-2014 |
20140291284 | METHOD OF MANUFACTURING A NEAR-FIELD LIGHT GENERATOR INCLUDING A WAVEGUIDE AND A PLASMON GENERATOR - In a method of manufacturing a near-field light generator, a structure including a core and a polishing stopper layer disposed on the top surface of the core is formed on a first cladding layer. Next, a cladding material layer is formed to cover the first cladding layer and the structure. The cladding material layer is then polished until the polishing stopper layer is exposed. Next, the polishing stopper layer is removed so that the cladding material layer has a protruding portion protruding upward to a higher level than the top surface of the core. The cladding material layer is then polished so as to remove the protruding portion and thereby make the cladding material layer into a second cladding layer. Then, a third cladding layer and a plasmon generator are formed. | 10-02-2014 |
20140298644 | METHOD OF MANUFACTURING PLASMON GENERATOR - A method of manufacturing a plasmon generator includes the steps of: an initial film made of a metal polycrystal and including a pre-plasmon-generator portion that later becomes the plasmon generator; heating the initial film with heating light so that a plurality of crystal grains constituting the metal polycrystal grow at least in the pre-plasmon-generator portion; stopping the heating of the initial film; and forming the plasmon generator by processing the initial film after the step of stopping the heating. The step of forming the plasmon generator includes the step of providing the pre-plasmon-generator portion with a front end face that generates near-field light. | 10-09-2014 |
20150071044 | THERMALLY-ASSISTED MAGNETIC RECORDING HEAD HAVING A PLASMON GENERATOR - A return path section includes first and second yoke portions and first, second and third columnar portions. The first and second yoke portions and the first columnar portion are located on the same side in the direction of travel of the recording medium relative to a wave guide core. The second and third columnar portions are located on opposite sides of a plasmon generator and connected to a shield. The first yoke portion connects a main pole to the first columnar portion. The second yoke portion connects the first columnar portion to the second and third columnar portions. A coil is wound around the first columnar portion. | 03-12-2015 |
20150085629 | THERMALLY ASSISTED MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a laminated structure in which a first thin-film metal layer formed in a thin film form along a direction intersecting the medium-opposing surface and a second thin-film metal layer formed in a thin film form and formed using a second metal larger in hardness than a first metal forming the first thin-film metal layer are alternately laminated. Further, in the second thin-film metal layer, a defect part is formed, the defect part is a part smaller in thickness than another part or is a hole part, and a flat layer part other than the defect part surrounds the defect part. | 03-26-2015 |