Patent application number | Description | Published |
20080251387 | Wiring Board and Production Method Thereof - It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film. | 10-16-2008 |
20080290067 | MICROSTRUCTURE, PATTERN MEDIUM AND PROCESS FOR PRODUCING SAME - It is an object to provide a microstructure having cylindrical microdomains oriented in the film thickness direction and arranged in a regular pattern, for which a microphase separation phenomenon of a block copolymer is utilized. The process for producing the microstructure includes 2 steps; the first step for arranging, on a substrate ( | 11-27-2008 |
20090085255 | PHOTO NANOIMPRINT LITHOGRAPHY - The present invention is directed to providing a photo nanoimprint lithography which can form a more uniform base layer. A photo nanoimprint lithography according to the present invention includes the steps of discretely applying a photo-curable resist drop-wise onto a substrate, filling an asperity pattern of a mold with the photo-curable resist by bringing the mold having the asperity pattern formed therein into contact with the photo-curable resist, curing the photo-curable resist by irradiating the resist with a light and releasing from the mold the photo-curable resist which has been photo-cured, wherein an intermediary layer is formed on a surface of the substrate for maintaining a discrete placement of the photo-curable resist that has been instilled drop-wise on the substrate until the mold is brought into contact with the photo-curable resist that has been instilled drop-wise on the substrate. | 04-02-2009 |
20090199897 | GLASS COMPOSITION AND ITS APPLICATIONS - A glass composition substantially free from lead and bismuth and containing vanadium oxide and phosphor oxide as main ingredients, wherein the sintered glass of the glass composition exhibits 10 | 08-13-2009 |
20100159214 | HIGH-MOLECULAR THIN FILM, PATTERN MEDIUM AND MANUFACTURING METHOD THEREOF - The present invention provides a method of manufacturing a high-molecular thin film having a fine structure from a block-copolymer compound containing a block copolymer A as a main constituent composed of at least a block chain A | 06-24-2010 |
20100181100 | COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A copper wiring board having fine wiring, and a method for manufacturing the same are provided. The copper wiring board of the present invention is a wiring board comprising an insulating substrate, a plurality of wire trenches formed in the insulating substrate, and wires filled in the wire trenches, wherein when any two of the wires are selected, and cross sections are taken perpendicular to a direction of current flow in the wires, a wire width in one wire cross section is narrower than a wire width in the other wire cross section, and a wire thickness in the one wire cross section is thicker than a wire thickness in the other wire cross section. | 07-22-2010 |
20100310773 | Fine Metal Structure, Process for Producing the Same, Fine Metal Mold and Device - A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern. | 12-09-2010 |
20110135814 | FUNCTIONING SUBSTRATE WITH A GROUP OF COLUMNAR MICRO PILLARS AND ITS MANUFACTURING METHOD - A functioning substrate with a group of columnar micro pillars characterized in that a first matrix of organic polymer and a group of columnar micro pillars of organic polymer extending from this matrix are provided. This group of columnar micro pillars has an equivalent diameter of 10 nm through 500 μm and a height of 50 nm through 5000 μm; and the ratio (H/D) of the equivalent diameter (D) to the height (H) of the group of columnar micro pillars is 4 or more. | 06-09-2011 |
20110143095 | MICROFINE STRUCTURE AND PROCESS FOR PRODUCING SAME - A process for producing a microfine structure which comprises: a first stage of disposing a polymer layer comprising a block copolymer ( | 06-16-2011 |
20110281085 | POLYMER THIN FILM, PATTERNED MEDIA, PRODUCTION METHODS THEREOF, AND SURFACE MODIFYING AGENTS - The objects of the present invention are to provide a polymer thin film having finer structure than the conventional product, excellent regularity over a wide range and only limited defects, patterned media, methods for producing the thin film and patterned media, and surface modifying agent used in these production methods. | 11-17-2011 |
20120130050 | BIOMOLECULE FIXING BOARD AND METHOD OF MANUFACTURING THE SAME - This invention provides a biomolecule modifying substrate comprising biomolecules selectively fixed to given regions thereon. The biomolecule modifying substrate comprises: a substrate at least comprising a first surface and a second surface; a first linker molecule comprising a hydrocarbon chain and a functional group capable of selectively binding to the first surface at one end of the hydrocarbon chain, which is bound to the first surface via such functional group; a second linker molecule comprising a reactive group capable of binding to the hydrocarbon chain of the first linker molecule, which is bound to the first linker molecule via a bond between the reactive group and the hydrocarbon chain; and a biomolecule bound thereto via the second linker molecule. | 05-24-2012 |
20130194693 | MAGNETIC MEDIA AND MAGNETIC RECORDING DEVICES USING FLUORINE COMPOUNDS - According to one embodiment, a lubricant includes a perfluoropolyether having a chemical structure of | 08-01-2013 |
20130248378 | ELECTRODE FOR ELECTROCHEMICAL MEASUREMENT, ELECTROLYSIS CELL FOR ELECTROCHEMICAL MEASUREMENT, ANALYZER FOR ELECTROCHEMICAL MEASUREMENT, AND METHODS FOR PRODUCING SAME - Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal. | 09-26-2013 |