Patent application number | Description | Published |
20100178180 | Fuel supply device - A male terminal is provided in a terminal hole formed in a flange unit. A female terminal and a grommet having a sealing portion to be fitted into the terminal hole are provided to a harness. A distance from an end of the sealing portion to a fore-end of the female terminal is set smaller than a distance from a fore-end of the male terminal to an opening of the terminal hole. With such setting, the grommet is retained in the terminal hole even if the female terminal is disconnected from the male terminal, thereby ensuring support of the female terminal. Moreover, a stopper is attached so as to cover the terminal hole to prevent the grommet from slipping out of the terminal hole. | 07-15-2010 |
20110073396 | SCOOTER-TYPE VEHICLE - A scooter-type vehicle can freely set a capacity of a fuel filter without being restricted by swing of a unit-swing type engine. A fuel supply device includes a fuel tank and a fuel supply passage for supplying fuel to an engine. A pump-anterior filter for purifying the fuel in the fuel tank, a fuel pump, a fuel filter disposed on the downstream side of the fuel pump, and an injector for injecting fuel are arranged on the fuel supply passage in this order. The fuel filter is disposed between the upper surface of the fuel tank and the step floor. The size of the fuel filter can freely be set without being restricted by swing of the engine located rearward of the fuel tank. | 03-31-2011 |
20110073397 | SCOOTER-TYPE VEHICLE - A scooter-type vehicle can freely set a capacity of a fuel filter without being restricted by swing of a unit-swing type engine. A cross pipe is spanned between a pair of left and right lower frames and a lower end of a down frame is connected to a central portion of the cross pipe. A fuel filter is disposed so that its lower end is higher by distance than the lower end of cross pipe. The fuel filter is disposed between the down frame and the fuel tank. Since the fuel filter is disposed in front of the fuel tank, it is not restricted by the swing of an engine located rearward of the fuel tank. Therefore, a capacity of the fuel filter can freely be set. | 03-31-2011 |
20110073400 | MOTORCYCLE - A motorcycle has a large accommodating space and an enlarged capacity of a fuel filter. The motorcycle includes: a fuel tank disposed on the upper side of the rear wheel and on the rear side of the luggage box; a rear fender provided between the rear frames and, disposed between the luggage box and the rear wheel, and covering the rear wheel on the front and upper sides of the rear wheel; a fuel supply path; and a fuel secondary filter. The rear fender is so disposed that its front portion faces a rear wall of the luggage box, the front portion is inclined rearwardly upward so that the distance thereto from the rear wall increases along an upward direction, and the fuel secondary filter is disposed between the rear wall of the luggage box and the front portion of the rear fender. | 03-31-2011 |
20120074139 | FUEL TANK STRUCTURE - A fuel tank structure including a fuel tank, a fuel filler port device formed in a cylindrical shape and arranged in the fuel tank, and a flame arrester arranged in the fuel filler port device and disposed inside the fuel tank. A fuel bleeding opening is formed in a peripheral wall part of the fuel filler port device and an arrester peripheral wall part. A cylindrical ring disposed so as to urge itself against the peripheral wall part and block the fuel bleeding opening. | 03-29-2012 |
Patent application number | Description | Published |
20100285994 | GOLD NANOPARTICLE COMPOSITION, DNA CHIP, NEAR INFRARED ABSORBENT, DRUG CARRIER FOR DRUG DELIVERY SYSTEM (DDS), COLORING AGENT, BIOSENSOR, COSMETIC, COMPOSITION FOR IN VIVO DIAGNOSIS AND COMPOSITION FOR THERAPEUTIC USE - A gold nanoparticle composition is provided that includes a spherical gold nanoparticle and an organic ligand molecule. The organic ligand molecule bonds to the gold nanoparticle. Thus, the gold nanoparticle composition has at least one absorption peak wavelength (plasmon absorption wavelength) within the region of 600-1000 nm. Consequently, the gold nanoparticle composition self-heats when irradiated with electromagnetic waves having a wavelength of 600-1000 nm. | 11-11-2010 |
20110177230 | MEDICAL GUIDE WIRE AND PROCESS FOR PRODUCTION THEREOF - A medical guide wire ( | 07-21-2011 |
20140011089 | POLYIMIDE PRECURSOR SOLUTION, POLYIMIDE PRECURSOR, POLYIMIDE RESIN, MIXTURE SLURRY, ELECTRODE, MIXTURE SLURRY PRODUCTION METHOD, AND ELECTRODE FORMATION METHOD - The invention addresses the problem of providing a polyimide precursor, a polyimide precursor solution, and a mixture slurry, each capable of more firmly binding active material particles to a current collecting body. The polyimide precursor solution according to the invention contains a tetracarboxylic acid ester compound, a diamine compound having an anionic group, and a solvent. The solvent dissolves the tetracarboxylic acid ester compound and the diamine compound. As the tetracarboxylic acid ester compound, a 3,3′,4,4′-benzophenonetetracarboxylic acid diester is particularly preferred. Examples of the “diamine compound having an anionic group” include 3,4-diaminobenzoic acid, 3,5-diaminobenzoic acid, and m-phenylenediamine-4-sulfonic acid. Further, the mixture slurry according to the invention contains active material particles in the polyimide precursor solution. | 01-09-2014 |
20140094840 | NASAL CAVITY INSERTION DEVICE FIXTURE AND NASAL CAVITY INSERSION DEVICE SET INCLUDING THE SAME - A nasal cavity insertion device fixture, whereby the displacement or detachment of a nasal cavity insertion tube is prevented during the sleep of a patient of sleep disorder. A nasal cavity insertion device fixture makes contact with the inner surface of a nasal passage in order to fix an insertion device inserted into the nasal cavity. The nasal cavity insertion device fixture preferably includes a tubular contact portion with an outer peripheral surface thereof which makes contact with the inner surface of the nasal passage. Further, the fixture for the tubular nasal cavity insertion device is preferably capable of accommodating the nasal cavity insertion tube in the inside thereof | 04-03-2014 |
Patent application number | Description | Published |
20080318356 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME - It is made possible to provide a highly integrated, thin apparatus can be obtained, even if the apparatus contains MEMS devices and semiconductor devices. A semiconductor apparatus includes: a first chip comprising a MEMS device formed therein; a second chip comprising a semiconductor device formed therein; and an adhesive layer bonding a side face of the first chip to a side face of the second chip, and having a lower Young's modulus than the material of the first and second chips. | 12-25-2008 |
20090058898 | INKJET PRINTING HEAD SUBSTRATE AND INKJET PRINTING HEAD HAVING THE SUBSTRATE - The present invention provides an inkjet printing head substrate capable of storing a large volume of information by increasing a number of fuses without enlarging a space for arranging fuses capable of storing information according to the cutting or non-cutting of fuses and a selection circuit thereof. For that purpose, two fuses are connected to a set of a drive element and a selection circuit. | 03-05-2009 |
20100103223 | FLEXIBLE PRINTED CIRCUIT BOARD AND LIQUID DISCHARGE HEAD INCLUDING THE SAME - A flexible printed circuit board, included in a liquid discharge head, includes a film having a length in the longitudinal direction, a plurality of connection terminals arranged in a first area of the film adjacent to one side of the film in the longitudinal direction, a contact portion disposed in a second area of the film adjacent to the other side thereof in the longitudinal direction, the contact portion including a plurality of contact pads, and a plurality of wiring lines arranged in the film. The length of the second area of the film in a direction orthogonal to the longitudinal direction is more than two times the length of the first area thereof in that direction. The planar shape of the film is L-shaped. | 04-29-2010 |
20150021748 | SEMICONDUCTOR DEVICE - A semiconductor device of an embodiment includes: a substrate, a high-frequency integrated circuit being provided on the substrate, a cap, and a sealing wall provided between the substrate and the cap. The cap includes a first conductive layer, a second conductive layer, an insulating layer provided between the first conductive layer and the second conductive layer, and a conductive via provided in the insulating layer. The conductive via connects the first conductive layer and the second conductive layer. The first conductive layer or the second conductive layer is connected to a ground potential. The sealing wall surrounds the high-frequency integrated circuit. | 01-22-2015 |
20150022416 | ANTENNA DEVICE - An antenna device of the present embodiment includes: a first conductive layer connected to a ground potential, a semiconductor device provided above the first conductive layer, a second conductive layer provided above the semiconductor device, a first via connecting the second conductive layer and the first conductive layer, a third conductive layer provided above the second conductive layer, a second via passing through the first opening, and an antenna provided above the third conductive layer. A dielectric is provided between the second conductive layer and the semiconductor device, between the third conductive layer and the second conductive layer, and between the antenna and the third conductive layer. The second conductive layer includes a first opening. The second via connects the third conductive layer and the first conductive layer. | 01-22-2015 |
20150343781 | LIQUID EJECTION HEAD - The invention provides a liquid ejection head equipped with an energy generating element generating energy utilized for ejecting a liquid, a liquid supply port provided at a surface on which the energy generating element is provided for supplying the liquid to the energy generating element, a liquid flow path for supplying the liquid to the energy generating element from the liquid supply port and a rib extending from the liquid supply port toward an inlet of the liquid flow path, wherein an end portion of the rib on the side of the liquid flow path is provided at a position deviated from a center line of the liquid flow path. | 12-03-2015 |
Patent application number | Description | Published |
20090212804 | NEEDLE TRACE TRANSFER MEMBER AND PROBE APPARATUS - A needle trace transfer member to which needle traces of probes are transferred is installed at a movable mounting table to align the probes before electrical characteristics of a target object on the mounting table are inspected by bringing the probes into electrical contact with the target object. The needle trace transfer member is made of a shape memory polymer transformed reversibly and rapidly between a glass state with a high modulus elasticity and a rubber state with a low modulus of elasticity near its glass transition temperature. The glass transition temperature is set to a temperature close to a set temperature of the mounting table. The shape memory polymer is mainly made of polyurethane-based resin. | 08-27-2009 |
20090219046 | PROBE CARD INCLINATION ADJUSTING METHOD, INCLINATION DETECTING METHOD AND STORAGE MEDIUM STORING A PROGRAM FOR PERFORMING THE INCLINATION DETECTING METHOD - An inclination adjusting method adjusts an inclination of a probe card installed at a probe apparatus to make the probe card be in parallel with a mounting surface of a movable mounting table for mounting thereon an object to be inspected. The method includes: detecting an average tip height of multiple probes disposed at each of plural locations of the probe card by using a tip position detecting device; obtaining an inclination of the probe card with respect to the mounting table based on differences in the average tip heights detected from the plural locations of the probe card; and adjusting the inclination of the probe card based on the obtained inclination. | 09-03-2009 |
20090251163 | ALIGNMENT METHOD, TIP POSITION DETECTING DEVICE AND PROBE APPARATUS - An alignment method is used in implementation of electric characteristic inspection of an object to be inspected via electric contact between the object disposed on a movable mounting table and probes. The alignment method includes detecting tip positions of the probes by using the tip position detecting device, detecting the tip positions of the probes, previously detected by the tip position detecting device, by using the second imaging unit, transferring needle marks of the probes onto a soft member provided at the tip position detecting device by allowing the probes to come into contact with the soft member, detecting the needle marks of the probes formed on the soft member by using the first imaging unit, and detecting inspection electrodes of the object corresponding to the probes by using the first imaging unit. | 10-08-2009 |
20090284277 | PROBE APPARATUS AND METHOD FOR CORRECTING CONTACT POSITION - A probe apparatus includes a movable mounting table for supporting an object to be tested; a probe card disposed above the mounting table and having a plurality of probes to come into contact with electrodes of the object; a support body for supporting the probe card; and a control unit for controlling the mounting table. Electrical characteristics of the object are tested based on a signal from a tester by bringing the object and the probes into electrical contact with each other by overdriving the mounting table in a state where a test head is electrically connected with the probe card by a predetermined load. Further, one or more distance measuring devices for measuring a current overdriving amount of the mounting table are provided at one or more locations of the test head or the probe card. | 11-19-2009 |
20090315580 | PROBE APPARATUS - A probe apparatus includes a mounting table having a mounting table main body and a chuck top, cylinder mechanisms surrounding a mount of the chuck top, and a connecting mechanism to releasably connect the cylinder mechanisms to a head plate horizontally supporting a probe card. When a semiconductor wafer, mounted on the mount, comes into contact with probes of the probe card, a control unit operates the cylinder mechanisms and the connecting mechanism to connect the cylinder mechanisms to the head plate. Thereafter, the control unit further operates the cylinder mechanisms, to move the chuck top upward from the mounting table main body by a predetermined overdrive amount. Accordingly, the probe apparatus achieves an originally required contact load between the semiconductor wafer and the probes of the probe card while preventing the probe card from being displaced upward during overdriving of the semiconductor wafer, thereby enabling a highly reliable test. | 12-24-2009 |
20100001751 | TRANSFER MECHANISM FOR TARGET OBJECT TO BE INSPECTED - A transfer mechanism for a target object includes at least two insulating wire materials disposed spaced from each other to transverse a mounting table, at least two pairs of supporting bodies horizontally disposed at outsides of the mounting table, for stretching said at least two wire materials in parallel with a mounting surface of the mounting table, and at least two grooves formed on the mounting surface of the mounting table to respectively receive therein said at least two wire materials by said at least two pairs of supporting bodies. The transfer mechanism further includes a first elevation driving mechanism for vertically moving said wire materials between said grooves and above of the mounting surface through said pairs of supporting bodies, wherein the target object is transferred between a carrying mechanism and the mounting table through said at least two wire materials. | 01-07-2010 |
20100079161 | PROBE APPARATUS - A probe apparatus includes a holding frame holding a test head through a biasing unit biasing the test head. An annular member is rotatably mounted in an opening of a ceiling plate of a main body. Cam followers are rotatably provided circumferentially on the annular member. An intermediate connecting member is provided in a lower surface of the test head, for bringing the test head into electrical contact with an upper surface of the probe card. Protrusions for guiding the cam followers are provided corresponding thereto at an outer periphery of the intermediate connecting member, upper surfaces of the protrusions being inclined. The cam followers are moved relatively upward along the respective inclined surfaces of the protrusions by rotating the annular member so that the intermediate connecting member is pushed downward against a biasing force of the biasing unit to bring the test head into press-contact with the probe card. | 04-01-2010 |
20110304348 | Apparatus for Driving Placing Table - Disclosed is an apparatus for driving a placing table that contributes to saving a space and reducing the weight of an inspecting apparatus. The apparatus for driving a placing table according to an exemplary embodiment of the present disclosure includes a horizontal driving mechanism that horizontally moves a placing table in an inspecting chamber, a base that supports horizontal driving mechanism, a placing table lifting mechanism (for example, air bearing) that lifts placing table from support, using compressed air in inspecting chamber, a connecting mechanism that connects horizontal driving mechanism with placing table, and a case that accommodates the horizontal driving mechanism and the base. | 12-15-2011 |
20120062258 | WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - A wafer inspection interface IF comprises a probe card, an adsorption unit configured to adsorb a wafer to the probe card, a wafer adsorption sealing member to which the probe card is adsorbed, and a fixing ring configured to fix the wafer adsorption sealing member to a card holder. The adsorption unit includes an air exhaustion unit, a first air duct whose right end portion is opened in the hermetically closed space and the left end portion is opened at a side of the fixing ring, a second air duct whose right end portion is opened to face an opening of the left end portion of the first air duct and the left end portion is opened to be connected with the air exhaustion unit, and a hole by which the first air duct is in communication with the second air duct. | 03-15-2012 |
20120062259 | WAFER INSPECTION APPARATUS AND METHOD FOR PRE-HEATING PROBE CARD - A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support. | 03-15-2012 |
20120119766 | PROBE APPARATUS AND METHOD FOR CORRECTING CONTACT POSITION - A probe apparatus includes a movable mounting table for supporting an object to be tested; a probe card disposed above the mounting table and having a plurality of probes to come into contact with electrodes of the object; a support body for supporting the probe card; and a control unit for controlling the mounting table. Electrical characteristics of the object are tested based on a signal from a tester by bringing the object and the probes into electrical contact with each other by overdriving the mounting table in a state where a test head is electrically connected with the probe card by a predetermined load. Further, one or more distance measuring devices for measuring a current overdriving amount of the mounting table are provided at one or more locations of the test head or the probe card. | 05-17-2012 |
20120126841 | PROBE APPARATUS AND METHOD FOR CORRECTING CONTACT POSITION - A probe apparatus includes a movable mounting table for supporting an object to be tested; a probe card disposed above the mounting table and having a plurality of probes to come into contact with electrodes of the object; a support body for supporting the probe card; and a control unit for controlling the mounting table. Electrical characteristics of the object are tested based on a signal from a tester by bringing the object and the probes into electrical contact with each other by overdriving the mounting table in a state where a test head is electrically connected with the probe card by a predetermined load. Further, one or more distance measuring devices for measuring a current overdriving amount of the mounting table are provided at one or more locations of the test head or the probe card. | 05-24-2012 |
20120216559 | MOUNTING DEVICE - A mounting device includes a mounting body for mounting thereon a target object to be subjected to a predetermined process; and a cooling mechanism for cooling the target object via the mounting table. The cooling mechanism includes a heat exchanger provided at a bottom surface of the mounting table, and a cooling unit having a heat absorbing unit for absorbing heat from a heat transfer medium of the heat exchanger. Further, the cooling unit is fixed to the heat exchanger through the heat absorbing unit. | 08-30-2012 |
20120223730 | PROBE CARD POSITIONING MECHANISM AND INSPECTION APPARATUS - A probe card positioning mechanism in which, when a probe card used to inspect electrical characteristics of an object to be processed is detachably inserted in a head plate of an inspection apparatus or an insert ring fixed to the head plate, at least three positioning pins placed circumferentially with an interval therebetween on an outer circumference of the probe card are inserted in at least three corresponding positioning long holes formed in the head plate or the insert ring such that the probe card is positioned at a specified position of the head plate or the insert ring, wherein the positioning holes are formed as long holes being elongated in a width-wise direction of the probe card and the entire inner circumferential surface of the long holes is configured as a taper surface which is gradually declined along an insertion direction of the pins. | 09-06-2012 |
20120242359 | PROBE CARD DETECTING APPARATUS, WAFER POSITION ALIGNMENT APPARATUS AND WAFER POSITION ALIGNMENT METHOD - A probe card detecting apparatus includes a probe detecting chamber having a supporting body, a probe card positioned and mounted detachably via a first holder on the predetermined position of the supporting body, a first imaging device movably provided in the probe detecting chamber to detect needle tips of at least two probes of the probe card, a probe correction card positioned and mounted detachably via a second holder to the predetermined position of the supporting body, and a control device. Under the control of the control device, using the first imaging device, a difference between a horizontal position of needle tips of at least two probes and a horizontal position of at least two targets is detected as a correction value for performing a position alignment of the at least two probes with the at least two electrode pads of said semiconductor wafer. | 09-27-2012 |
20130147506 | WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - The wafer inspection interface | 06-13-2013 |
20130234745 | WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - A wafer inspection interface | 09-12-2013 |
20130241588 | WAFER INSPECTION APPARATUS - An inspection chamber | 09-19-2013 |
20130249587 | WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - A wafer inspection interface | 09-26-2013 |
20150219716 | Method for Pre-Heating Probe Card - A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support. | 08-06-2015 |
Patent application number | Description | Published |
20090246065 | ALLOY, SHAFT MADE THEREFROM, AND MOTOR WITH SHAFT - A nonmagnetic austenitic stainless steel consists of, all by weight %, 1.5 to 3.5% of Cu, 8.5 to 9.5% of Mn, 0.18 to 0.22% of C, 0.5 to 1.0% of Si, 16.5 to 17.5% of Cr, 0.15 to 0.2% of N, 0.13 to 0.3% of S, and the balance of Fe and inevitable impurities. | 10-01-2009 |
20100054649 | MARTENSITIC STAINLESS STEEL AND ANTIFRICTION BEARING USING THE SAME - A martensitic stainless steel with high hardness and high corrosion resistance consists of, by weight %, 0.35 to 0.45% of C, not more than 0.2% of Si, not more than 0.3% of Mn, not more than 0.02% of P, not more than 0.02% of S, 15 to 17% of Cr, 1.5 to 2.5% of Mo, 0.001 to 0.003% of B, 0.15 to 0.25% of N, and the balance of Fe and inevitable impurities. | 03-04-2010 |
Patent application number | Description | Published |
20080258258 | SEMICONDUCTOR DEVICE - The invention provides a semiconductor device which has a capacitor element therein to achieve size reduction of the device, the capacitor element having larger capacitance than conventional. A semiconductor integrated circuit and pad electrodes are formed on the front surface of a semiconductor substrate. A second insulation film is formed on the side and back surfaces of the semiconductor substrate, and a capacitor electrode is formed between the back surface of the semiconductor substrate and the second insulation film, contacting the back surface of the semiconductor substrate. The second insulation film is covered by wiring layers electrically connected to the pad electrodes, and the wiring layers and the capacitor electrode overlap with the second insulation film being interposed therebetween. Thus, the capacitor electrode, the second insulation film and the wiring layers form capacitors. | 10-23-2008 |
20080265441 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The invention enhances moisture resistance between a supporting body and an adhesive layer to enhance the reliability of a semiconductor device. A semiconductor device of the invention has a first insulation film formed on a semiconductor element, a first wiring formed on the first insulation film, a supporting body formed on the semiconductor element with an adhesive layer being interposed therebetween, a third insulation film covering the back surface of the semiconductor element onto the side surface thereof and the side surface of the adhesive layer, a second wiring connected to the first wiring and extending onto the back surface of the semiconductor element with the third insulation film being interposed therebetween, and a protection film formed on the second wiring. | 10-30-2008 |
20090050988 | MEMS APPARATUS AND METHOD OF MANUFACTURING THE SAME - A MEMS apparatus includes a MEMS unit formed on a semiconductor substrate and a cover provided with a pore and serving to seal the MEMS unit. The pore is sealed with a sealing material shaped in a sphere or a hemisphere. | 02-26-2009 |
20090206349 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced and a method of manufacturing the same. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A first supporting body | 08-20-2009 |
20090206444 | INTEGRATED SEMICONDUCTOR DEVICE - An integrated semiconductor device includes a plurality of semiconductor elements having different integrated element circuits or different sizes; an insulating material arranged between the semiconductor elements; an organic insulating film arranged entirely on the semiconductor elements and the insulating material; a fine thin-layer wiring that arranged on the organic insulating film and connects the semiconductor elements; a first input/output electrode arranged on an area of the insulating material; and a first bump electrode formed on the first input/output electrode. | 08-20-2009 |
20090321903 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - This invention is directed to offer a semiconductor device in which a cavity space is easily provided in a specific region when a supporting member is bonded to a semiconductor substrate through an adhesive layer, and its manufacturing method. A resist layer is applied to an entire top surface of the semiconductor substrate | 12-31-2009 |
20130234308 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR INTEGRATED DEVICE AND METHOD OF MANUFACTURING THE SAME - A reconfigured wafer of resin-encapsulated semiconductor packages is obtained by supporting with a resin, thereafter, a grinding process is performed on top and backside surfaces to expose only a bump interconnection electrode on a surface of a semiconductor chip. Further, a chip-scale package is obtained by a dicing process along a periphery of the chip. | 09-12-2013 |
20130256009 | EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND PRINTED CIRCUIT BOARD - An EBG structure according to an embodiment includes an electrode unit made of a first conductor and provided with a space, a patch unit provided approximately parallel to the electrode unit and made of a second conductor, an insulating layer provided between the electrode unit and the patch unit, a first via provided between the patch unit and the electrode unit in the insulating layer and connected to the patch unit and the electrode unit, and a second via provided between the patch unit and the space in the insulating layer, connected to the patch unit, and not connected to the electrode unit. | 10-03-2013 |
20130256864 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package according to embodiments includes: a semiconductor chip including a front electrode on a front surface thereof and a back electrode on a back surface thereof; a front-side cap portion including an air gap in a portion between the semiconductor chip and the front-side cap portion and a front-side penetrating electrode, and is positioned to face the front surface of the semiconductor chip; a back-side cap portion bonded with a first cap portion to hermetically seal the semiconductor chip, includes an air gap at least in a portion between the semiconductor chip and the back-side cap portion and a back-side penetrating electrode, and is positioned to face the back surface of the semiconductor chip; a front-side connecting portion which electrically connects the front electrode and the front-side penetrating electrode; and a back-side connecting portion which electrically connects the back electrode and the back-side penetrating electrode. | 10-03-2013 |
20140028412 | EBG STRUCTURE AND CIRCUIT BOARD - An EBG (Electromagnetic Band Gap) structure according to an embodiment includes: an electrode that is made of a first conductor; a first insulating layer that is provided on the electrode; a patch unit that is provided in substantially parallel with the electrode on the first insulating layer, the patch unit including a first gap, the patch unit being made of a second conductor; a second insulating layer that is provided on the patch unit; a first via that is provided between the patch unit in the first insulating layer and the electrode and connected to the patch unit and the electrode; and a second via that is provided in the first and second insulating layers, the second via piercing the first gap and being connected to the electrode. | 01-30-2014 |
20140029227 | ELECTRONIC CIRCUIT AND SEMICONDUCTOR COMPONENT - A circuit board according to an embodiment is one in which a plurality of electronic components is mounted on a printed wiring board. The circuit board includes a semiconductor component that is mounted on the printed wiring board, and the semiconductor component includes a semiconductor device and a first EBG structure formed on or above the semiconductor device. An operating frequency of the semiconductor device exists outside a cutoff band of the first EBG structure, and the first EBG structure is connected to a ground or a power supply of the printed wiring board. | 01-30-2014 |
20140084392 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - After a TEOS oxide film is formed on the surface of a semiconductor device, a PSG film and an SiN film, which have air permeability, are formed on the surface of the TEOS oxide film. Thereafter, a Poly-Si film is formed thereon. A sacrifice layer is removed by a gaseous HF that passes through the PSG film, the SiN film, and the Poly-Si film, and then, the uppermost layer is covered with a Poly-Si/SiC film. A chip scale package having a thin-film hollow-seal structure can be realized on the semiconductor element. | 03-27-2014 |
20140091447 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF - A semiconductor device according to an embodiment includes: a first unit device configured to include a semiconductor chip, a backside electrode that is in contact with a backside of the semiconductor chip, and a bonding wire in which one end is connected to the backside electrode; a second unit device configured to have a function different from that of the first unit device; a resin layer configured to fix the first and second unit devices to each other; and a first wiring that is formed on the resin layer on a surface side of the semiconductor chip and connected to the other end of the bonding wire. | 04-03-2014 |
20140210066 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package of an embodiment includes: a semiconductor chip having a signal input terminal and a signal output terminal; and a cap unit that is formed on the semiconductor chip. The cap unit includes a concave portion forming a hollow structure between the semiconductor chip and the cap unit, a first through electrode electrically connected to the signal input terminal, and a second through electrode electrically connected to the signal output terminal. Of the inner side surfaces of the concave portion, a first inner side surface and a second inner side surface facing each other are not parallel to each other. | 07-31-2014 |
20140240055 | ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE - An electronic circuit according to an embodiment includes a power supply line having a first EBG pattern, the first EBG pattern including a plurality of first linear parts and a first slit, each of the first linear parts extending along a direction in which the power supply line extends and surrounded by the first slit except one end of the first linear part. | 08-28-2014 |
20150123275 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR INTEGRATED DEVICE AND METHOD OF MANUFACTURING THE SAME - A reconfigured wafer of resin-encapsulated semiconductor packages is obtained by supporting with a resin, thereafter, a grinding process is performed on top and backside surfaces to expose only a bump interconnection electrode on a surface of a semiconductor chip. Further, a chip-scale package is obtained by a dicing process along a periphery of the chip. | 05-07-2015 |
Patent application number | Description | Published |
20090061202 | High-Luminosity Stress-Stimulated Luminescent Material Emitting Ultraviolet Light, Manufacturing Method Thereof, and Usage Thereof - One embodiment of the present invention provides (i) a luminant having a unique crystal structure so as to exhibit high luminosity and (ii) a manufacturing method thereof. Further, the present invention discloses (I) a luminant which exhibits ultraviolet luminescence and (II) a manufacturing method thereof. The inventors developed a stress-stimulated luminescent material which exhibits high luminosity by using a compound having a structure obtained by inserting alkali metal ions and alkali earth metal ions into a base material structure constituted of polyhedral-structure molecules and partially substituting the alkali metal ions and alkali earth metal ions by rare earth metal ions, transition metal ions, group-III metal ions, or group-IV metal ions. Further, the inventors developed a stress-stimulated luminescent material which exhibits high-luminosity stress-stimulated ultraviolet luminescence by adding specific metal ions such as Ce as a luminescent center to the aforementioned stress-stimulated luminescent material. | 03-05-2009 |
20090114033 | Stress History Recording System - Provided is a stress history recording system for recording a stress history, which includes a light emitting means including a stress-stimulated luminescent material that emits light in response to a mechanical external force, and a recording means for recording a history of a photoreaction generated due to light emission from the light emitting means. This achieves a technology for recording a stress history by using the stress-stimulated luminescent material. | 05-07-2009 |
20090286076 | Material to be measured for stress analysis, coating liquid for forming coating film layer on the material to be measured, and stress-induced luminescent structure - In one embodiment of the present invention, on the surface of a material to be measured for stress analysis which has a stress-induced luminescent material layer formed thereon, a distortion energy is disclosed which is transmitted from a base material of a stress-induced luminescent material to the stress-induced luminescent material with high efficiency. The material to be measured for stress analysis has, on the surface thereof, a coating film layer, which emits light upon exposure to a change in distortion energy. The coating film layer is formed of a synthetic resin layer containing stress-induced luminescent particles, and the modulus of elasticity of a base material is not less than 1.0 GPa. The thickness of the coating film layer is preferably 1 μm to 500 μm. | 11-19-2009 |
Patent application number | Description | Published |
20080231962 | Projection type zoom lens and projection type display apparatus - Disposed in order from a magnification side are a negative first group which is fixed during zooming to effect focusing, second to fifth groups of positive refractive power which move with mutual relationship during magnification variation, and a fixed sixth group. A negative lens made of a glass material which has an anomalous dispersion property and which has 70 or more in Abbe number is disposed in the first lens group. A positive lens made of a glass material which has an anomalous dispersion property and which has 70 or more in Abbe number is disposed in the third group located closer to a reduction side than a diaphragm. The negative lens and the positive lens are cemented to their adjacent lenses, respectively. Also, bf/fw≧2.7 is satisfied where bf denotes a back focus, and fw denotes a focal length of the entire system at a wide-angle end. | 09-25-2008 |
20090135496 | PROJECTION ZOOM LENS AND PROJECTION TYPE DISPLAY DEVICE - A projection zoom lens is provided and includes: in order from the magnification side, a positive first lens group performing focusing with being fixed during power-varying and having a focusing function; a negative second lens group, a negative third lens group, and a positive fourth lens group, which are moved with correlation during the power-varying; and a positive fifth lens group G | 05-28-2009 |
20090135497 | PROJECTION ZOOM LENS AND PROJECTION TYPE DISPLAY DEVICE - A projection zoom lens is provided and includes: in order from the magnification side, a negative first lens group performing focusing with being fixed during power-varying; a positive second lens group, a positive third lens group, a positive fourth lens group, a positive fifth lens group, which are moved with correlation; and a positive sixth lens group fixed during the power-varying. An aperture diaphragm is moved between the fourth lens group and the fifth lens group during the power-varying to keep Fno constant in the whole power-varying region. In addition, the expression of 1.705-28-2009 | |
20110157716 | ZOOM LENS FOR PROJECTION AND PROJECTION-TYPE DISPLAY APPARATUS - A zoom lens for projection includes a first negative lens group, a second positive lens group, a third positive lens group, a fourth lens group, and a fifth positive lens group, which are sequentially arranged from the magnification side of the zoom lens. The first lens group and the fifth lens group are fixed, and the second lens group, the third lens group and the fourth lens group move along the optical axis of the zoom lens when magnification of the zoom lens is changed. Each of the first lens group and the second lens group is composed of two lenses. Each of the third lens group and the fifth lens group is composed of a positive lens, and the fourth lens group is composed of five lenses. Further, the reduction side of the zoom lens is telecentric. | 06-30-2011 |
Patent application number | Description | Published |
20110149492 | SLIDE TYPE ELECTRONIC APPARATUS - A slide type electronic apparatus which can prevent internal structure such as a slide mechanism from being visually recognized from a gap between two cases and suppress dirt, dust and the like invading from the gap is provided. A slide type electronic apparatus according to the present invention includes: two cases; slide means, which is arranged between the two cases, for connecting the two cases in a manner that the two cases can slide each other; and covering means, which is arranged in one of the cases, for hiding a gap formed between the two cases at least at a time of an opened state in which an overlap of the two cases becomes smallest. | 06-23-2011 |
20110177440 | METHOD OF MANUFACTURING TONER AND TONER MANUFACTURED BY THE METHOD - A method of manufacturing toner including: preparing a first liquid by dissolving or dispersing toner components including a colorant, a release agent, and one or both of a binder resin and a precursor thereof in an organic solvent; preparing a second liquid having a viscosity of from 50 to 800 mPa·sec when measured with a Brookfield viscometer at a revolution of 60 rpm and a temperature of 25° C., by emulsifying the first liquid in an aqueous medium; and evaporating the organic solvent from the second liquid by flowing down the second liquid as a liquid film from a supply part along an inner wall surface of a pipe depressurized to 70 kPa or less in substantially a vertical direction, and heating the liquid film at not higher than a glass transition temperature of the binder resin by contact with the inner wall surface of the pipe in a heating part. A heat insulating part is provided between the supply part and the heating part. | 07-21-2011 |
20110222248 | MOUNTING STRUCTURE OF FLEXIBLE PRINTED CIRCUIT BOARD AND SLIDING-TYPE ELECTRONIC DEVICE - A mounting structure of a flexible printed circuit board and a sliding-type electronic device is provided by which a too large increase in thickness of devices can be avoided and a pair of housings can be slid relatively in a bending and slanting direction. In the mounting structure, an upper housing | 09-15-2011 |
20130130174 | METHOD OF MANUFACTURING TONER - A method of manufacturing toner is provided. The method includes preparing a first liquid by dissolving or dispersing toner components in an organic solvent, preparing a second liquid by emulsifying the first liquid in an aqueous medium, and evaporating the organic solvent from the second liquid. The toner components include a colorant, a release agent, and one or both of a binder resin and a precursor thereof. The evaporating includes flowing down the second liquid as a liquid film in substantially a vertical direction along an inner wall surface of a pipe that is depressurized, heating the liquid film at a temperature not higher than a glass transition temperature of the binder resin, and supplying the pipe with a depressurized water vapor from a supply opening disposed on an upper part of the pipe. | 05-23-2013 |
20140242514 | PARTICULATE MATERIAL PRODUCTION METHOD, AND PARTICULATE MATERIAL PRODUCTION APPARATUS - A particulate material production method is provided. The particulate material production method includes ejecting a particulate material composition liquid, which includes an organic solvent and a particulate material composition including at least a resin and dissolved or dispersed in the organic solvent, from at least one nozzle to form droplets of the particulate material composition liquid in a gas phase; and solidifying the droplets of the particulate material composition liquid to prepare particles of the particulate material composition. The droplet solidifying step includes contacting the droplets with a poor solvent for the particulate material composition. | 08-28-2014 |
20140272695 | TONER, DEVELOPMENT AGENT, AND IMAGE FORMING APPARATUS - Toner contains a binder resin containing one or more kinds of crystalline resin and one or more kinds of non-crystalline resin. The non-crystalline resin located at the surface portion of the toner forms a shell structure of a continuous phase of the non-crystalline resin and the toner has an amount of melting heat of 30 J/g or more in a second temperature rising as measured by differential scanning calorimetry (DSC). | 09-18-2014 |
20140301046 | MOUNTING STRUCTURE OF FLEXIBLE PRINTED CIRCUIT BOARD AND SLIDING-TYPE ELECTRONIC DEVICE - A mounting structure of a flexible printed circuit board and a sliding-type electronic device is provided by which a too large increase in thickness of devices can be avoided and a pair of housings can be slid relatively in a bending and slanting direction. In the mounting structure, an upper housing | 10-09-2014 |
20140342283 | TONER, DEVELOPER, AND IMAGE FORMING APPARATUS - To provide a toner for developing an electrostatic image, the toner including toner particles, wherein the toner particles contain: a non-crystalline resin A; and a crystalline resin, wherein the crystalline resin contains a crystalline resin C containing a urethane bond, or a urea bond, or both thereof, and wherein the toner particles each have a sea-island structure, where the resin C is dispersed in the non-crystalline resin on a cross-section of the toner particle. | 11-20-2014 |
20150245508 | MOUNTING STRUCTURE OF FLEXIBLE PRINTED CIRCUIT BOARD AND SLIDING-TYPE ELECTRONIC DEVICE - A mounting structure of a flexible printed circuit board and a sliding-type electronic device is provided by which a too large increase in thickness of devices can be avoided and a pair of housings can be slid relatively in a bending and slanting direction. In the mounting structure, an upper housing | 08-27-2015 |
20150248070 | ELECTROSTATIC IMAGE DEVELOPING TONER, DEVELOPER, AND IMAGE FORMING APPARATUS - A toner, including: base particles containing a polyester resin, a colorant, and a release agent, wherein the toner has a glass transition temperature (Tg1st) of 20° C. to 50° C. where the glass transition temperature (Tg1st) is measured in first heating of differential scanning calorimetry (DSC) of the toner, wherein tetrahydrofuran (THF) insoluble matter of the toner has a glass transition temperature [Tg2nd (THF insoluble matter)] of 30° C. or lower where the glass transition temperature [Tg2nd (THF insoluble to matter)] is measured in second heating of differential scanning calorimetry (DSC) of the THF insoluble matter, and wherein 50% or less of the colorant is present within a region of 1,000 nm from a surface of each of the base particles toward a center thereof. | 09-03-2015 |
20150253687 | MAGENTA TONER, DEVELOPER, AND IMAGE FORMING APPARATUS - A magenta toner for electrophotography, including:
| 09-10-2015 |
20150261113 | TONER, DEVELOPER, AND IMAGE FORMING APPARATUS - A toner, wherein the toner satisfies a ratio XPS (%)/CIC (ppm) of 1.40×10 | 09-17-2015 |
Patent application number | Description | Published |
20140049835 | WIDE-ANGLE PROJECTION LENS AND PROJECTION DISPLAY DEVICE USING THE SAME - A first lens group including two aspherical lenses, a second lens group consisting of three negative meniscus lenses, each negative meniscus lens having a convex surface facing the enlargement side, a third lens group having a negative refractive power and including at least one cemented lens, and a fourth lens group having a positive refractive power and including at least two cemented lenses and one aspherical lens are arranged in this order from the enlargement side. Predetermined conditional expressions are satisfied. | 02-20-2014 |
20140340563 | WIDE ANGLE LENS AND IMAGING APPARATUS - A wide angle lens includes: a positive first lens group, a second lens group, constituted by two or fewer lenses, that moves during focusing operations, and a third lens group that includes at least one positive lens, provided in this order from the object side. The first lens group includes at least a positive meniscus lens with a convex surface toward the object side, a negative meniscus lens with a convex surface toward the object side, a lens having a concave surface with a radius of curvature having a smaller absolute value toward the image side, a negative lens, a cemented lens formed by a positive lens and a negative lens, and an aperture stop provided adjacent to the cemented lens toward the image side thereof, provided in this order from the object side. The wide angle lens satisfies a predetermined conditional formula. | 11-20-2014 |
20150116848 | IMAGING LENS AND IMAGING APPARATUS - An imaging lens consists of a first lens group, a second lens group, an aperture stop and a third lens group that has positive refractive power in this order from an object side. The first lens group consists of an L11 lens having positive refractive power, an L12 lens having negative refractive power, an L13 meniscus lens having negative refractive power with its concave surface facing an image side, an L14 lens having negative refractive power with its concave surface facing the object side and two or three lenses, each having positive refractive power, in this order from the object side. The second lens group consists of an L2p lens having positive refractive power and an L2n lens having negative refractive power. | 04-30-2015 |
20150234181 | IMAGING LENS AND IMAGING APPARATUS - An imaging lens, consisting of a first lens group, a top, and a second lens group having a positive refractive power, in order from the object side, in which the first lens group is composed of a first front lens group having a negative refractive power and a first rear lens group having a positive refractive power in order from the object side, the first rear lens group is composed of a cemented lens formed of a negative lens and a positive lens, the first front lens group at least includes four negative lenses, and at least two of the negative lenses included in the first front lens group satisfy a conditional expression given below: | 08-20-2015 |
Patent application number | Description | Published |
20130281518 | METHOD OF TREATING INFLAMMATORY LUNG DISEASE WITH SUPPRESSORS OF CPG OLIGONUCLEOTIDES - The present disclosure relates to oligodeoxynucleotides that suppress an immune response. Methods are disclosed for inhibiting or treating inflammatory lung disease by administering a therapeutically effective amount of a suppressive oligodeoxynucleotide. | 10-24-2013 |
20150084167 | EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND CIRCUIT BOARD - An EBG structure of an embodiment includes an electrode plane, a first insulating layer provided on the electrode plane, a first metal patch provided on the first insulating layer, a second metal patch provided on the first insulating layer, a second insulating layer provided on the first and second metal patches, an interconnect layer provided on the second insulating layer, a third insulating layer provided on the interconnect layer, a first via connected to the electrode plane and the first metal patch, and a second via connected to the electrode plane and the second metal patch. The second metal patch is separately adjacent to the first metal patch. The interconnect layer has a first opening and a second opening. The first via penetrates through the first opening. The second via penetrates through the second opening. | 03-26-2015 |
20150084208 | CONNECTION MEMBER, SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE - A connection member according to an embodiment includes a dielectric material, a penetrating via penetrating through the dielectric material, a first metal plane provided in the dielectric material, the first metal plane being perpendicular to an extension direction of the penetrating via, the first metal plane crossing the penetrating via, and a second metal plane provided n or on the dielectric material in parallel with the extension direction of the penetrating via, the second metal plane connected to the first metal plane. | 03-26-2015 |
20150201488 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board of an embodiment includes a through via, a first insulating film disposed around the through via, a second insulating film disposed around the first insulating film, a third insulating film disposed around the second insulating film and a resin disposed around the third insulating film. The resin includes fillers. The second insulating film has a relative permittivity lower than a relative permittivity of the first insulating film. The third insulating film has a relative permittivity higher than a relative permittivity of the second insulating film. | 07-16-2015 |
20150270245 | SEMICONDUCTOR DEVICE AND ELECTRONIC CIRCUIT DEVICE - A semiconductor device according to an embodiment includes a first semiconductor unit including a plurality of first semiconductor chips, an organic resin provided between the first semiconductor chips, a wiring layer provided above the first semiconductor chips to electrically connect the first semiconductor chips to each other, and a plurality of connecting terminals provided on an upper portion of the wiring layer and a second semiconductor unit fixed to a wiring layer side of the first semiconductor unit, the second semiconductor unit fixed to a region sandwiched between the connecting terminals, the second semiconductor unit having a second semiconductor chip, the second semiconductor unit electrically connected to the first semiconductor unit. | 09-24-2015 |
20150279802 | SEMICONDUCTOR DEVICE - A semiconductor device according to an embodiment includes a semiconductor chip, a cap disposed to face the semiconductor chip, and having a through-hole electrode arranged in a through hole, and a bump electrode provided between the semiconductor chip and the cap, wherein the bump electrode is in a protruding shape connecting the semiconductor chip and the through-hole electrode, and wherein at least a portion of the bump electrode is included in the through-hole electrode, and electrically connected thereto, so that the adhesive performance between the cap and the bump electrode can be increased. | 10-01-2015 |
20150348924 | SEMICONDUCTOR DEVICE - According to an embodiment, a semiconductor device comprises an insulative resin, an interconnect, a plurality of semiconductor elements, a first conductive unit, a first connector, and a first metal layer. The insulative resin includes a first region and a second region. At least a portion of the interconnect is arranged with at least a portion of the first region in a first direction. The first conductive unit pierces the second region in the first direction. At least a portion of the first connector is arranged with at least a portion of the first conductive unit in the first direction. At least a portion of the first connector is arranged with at least a portion of the interconnect in a second direction intersecting the first direction. The first metal layer is provided between the first conductive unit and the first connector. The first metal layer contacts the insulative resin. | 12-03-2015 |
20150348937 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor device includes an insulative resin, an interconnect, a plurality of semiconductor elements, and a first metal member. The insulative resin includes a first region and a second region. The interconnect is arranged with the first region in a first direction. The first direction intersects a direction from the first region toward the second region. The plurality of semiconductor elements is provided between the first region and the interconnect. At least one of the plurality of semiconductor elements is electrically connected to the interconnect. The first metal member includes a first through-portion and a first end portion. The first through-portion pierces the second region in the first direction. The first end portion is connected to the first through-portion. A width of the first end portion is wider than a width of the first through-portion in a second direction intersecting the first direction. | 12-03-2015 |
Patent application number | Description | Published |
20130178524 | PROSTAGLANDIN-CONTAINING PRODUCT - A prostaglandin-containing product including an aqueous liquid preparation containing 16-phenoxy-15-deoxy-15,15-difluoro-17,18,19,20-tetranorprostaglandin F2α, or an alkyl ester or salt thereof, and a resin container containing said aqueous liquid preparation, the resin container being formed from a polymer alloy of polyethylene terephthalate and polyarylate, wherein a component ratio of polyethylene terephthalate/polyarylate is 1/2 to 2/1, thereby inhibiting a decrease of the content of the 16-phenoxy-15-deoxy-15,15-difluoro-17,18,19,20-tetranorprostaglandin F2α or an alkyl ester or salt thereof, in the aqueous liquid preparation. | 07-11-2013 |
20150132422 | CLIP FIXING JIG - A clip fixing jig for fixing a clip member in a molding die for molding a seat pad has a wall part erected along a whole outer peripheral edge of a bottom part thereof. The wall part forms, above the bottom part, an accommodation space for accommodating extending parts. The clip fixing jig has fixing parts for detachably fixing a clip member, so that a clip member can be fixed to the clip fixing jig by inserting the clip member in the accommodation space. With a clip fixing jig provided in a molding die, a seat pad can be formed by insert molding, so that workability in clip member fixing work is improved. | 05-14-2015 |
20150328808 | METHOD FOR MANUFACTURING SEAT PAD - To provide a method for manufacturing a seat pad that can maintain the line speed set in accordance with the speed of foam molding without difficulty. In the state where a molding-surface forming member | 11-19-2015 |