Hiroshi Mataki
Hiroshi Mataki, Kanagawa-Ken JP
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20090244144 | Liquid coating method, liquid coating device, and method of manufacturing radiation detector - The liquid coating method includes the step of ejecting droplets from nozzles of a recording head onto an imaging region of a surface of a substrate placed on a support plate, wherein a dot pitch φ that is an interval between landing positions of the droplets on the surface of the substrate satisfies a following condition: | 10-01-2009 |
20100073413 | Pattern forming method - A pattern forming method includes the step of ejecting droplets of a liquid containing a functional component, from nozzles of an inkjet recording head onto a surface of a substrate in one direction in sequence so as to form a linear pattern on the surface of the substrate, wherein: the inkjet recording head is controlled in such a manner that | 03-25-2010 |
20100220131 | Line drawing method - When a linear pattern is drawn on a non-permeable medium by ejecting droplets of liquid onto the non-permeable medium by using an inkjet method, drawing of the linear pattern is started from a middle portion of the linear pattern. | 09-02-2010 |
20110049761 | Pattern transfer apparatus and pattern forming method - The pattern transfer apparatus includes: a liquid ejection device having liquid ejection ports through which droplets of liquid are ejected and deposited onto a substrate surface while the liquid ejection device relatively moves to scan the substrate surface in a relative scanning direction; and a stamp having a stamp surface on which a pattern is formed, the stamp surface being applied to the droplets of the liquid on the substrate surface in a stamp application direction while the stamp is relatively moved with respect to the substrate, wherein when defining, on the substrate surface, strips which are straight and parallel to the stamp application direction and have widths substantially equal to diameters of the droplets deposited on the substrate surface, at least one of the strips includes the droplets which are ejected respectively from at least different two of the liquid ejection ports of the liquid ejection device. | 03-03-2011 |
Hiroshi Mataki, Kyoto JP
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20080287583 | Organic/Inorganic Composite - The present invention provides an organic/inorganic composite containing a rare earth metal or/and Period IV transition metal in which the aforementioned rare earth metal or/and Period IV transition metal is doped at a high concentration, and control of quenching and optical transparency are assured thereby; and an optical amplifier, a light control optical element, and luminescent device utilizing the same. The organic/inorganic composite containing a rare earth metal or/and Period IV transition metal is one in which at least one species of rare earth metal or/and Period IV transition metal is dispersed in an organic polymer, with the aforementioned composite containing an optically transparent organic polymer and an inorganic dispersion phase comprising: (1) a rare earth metal and (2) another element coordinated thereto via an oxygen atom(s). The inorganic dispersion phase in which another metal coordinates to rare earth metal or/and Period IV transition metal via an oxygen atom(s) preferably has an average particle size ranging from 0.1 to 1000 nm. Preferably, the ratio of rare earth metal or/and Period IV transition metal when mathematically converted to solid content is 90 mass % or less of the total mass of the organic polymer and the rare earth metal dispersion phase. | 11-20-2008 |
20100320897 | Organic / inorganic composite - The present invention provides an organic/inorganic composite containing a rare earth metal or/and Period IV transition metal in which the aforementioned rare earth metal or/and Period IV transition metal is doped at a high concentration, and control of quenching and optical transparency are assured thereby; and an optical amplifier, a light control optical element, and luminescent device utilizing the same. The organic/inorganic composite containing a rare earth metal or/and Period IV transition metal is one in which at least one species of rare earth metal or/and Period IV transition metal is dispersed in an organic polymer, with the aforementioned composite containing an optically transparent organic polymer and an inorganic dispersion phase comprising: (1) a rare earth metal and (2) another element coordinated thereto via an oxygen atom(s). The inorganic dispersion phase in which another metal coordinates to rare earth metal or/and Period IV transition metal via an oxygen atom(s) preferably has an average particle size ranging from 0.1 to 1000 nm. Preferably, the ratio of rare earth metal or/and Period IV transition metal when mathematically converted to solid content is 90 mass % or less of the total mass of the organic polymer and the rare earth metal dispersion phase. | 12-23-2010 |
Hiroshi Mataki, Kanagawa JP
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20090244136 | Drawing method, inkjet head, drawing apparatus, method for fabricating printed wiring board and method for manufacturing color filter - A drawing method includes three or more liquid drops are discharged by an inkjet method so as to draw a pattern on a substrate. The plural liquid drops are grouped into a plurality of groups that include at least a group composed of two or more adjacent liquid drops and each of which is composed of one, or two or more liquid drops. In each group composed of two or more liquid drops, each liquid drop hits the substrate so as to overlap an adjacent liquid drop of the same group. Also, a liquid drop disposed at an end of one group hits the substrate to be spaced from an adjacent liquid drop disposed at an end of an adjacent group to be joined to the adjacent liquid drop of the adjacent group when spread on the substrate. | 10-01-2009 |
20090246402 | Layer forming method and layer forming apparatus, and method of manufacturing radiation detector - A layer-forming apparatus coats a solution containing a layer component and a flammable solvent on a surface of a base material, and forms a layer on the surface of the base material. In the layer-forming apparatus, a coating chamber in which the solution is coated on the surface of the base material is closed substantially hermetically, and a clean air is supplied from a clean-air supplier to the coating chamber. Then, ions that are produced by a corona discharger are sprayed to the surface of the base material in a state that a vapor concentration of the solvent in the coating chamber is below a burning lower limit, and dusts are removed from the base material. Then, the solution is coated on the surface of the base material from which the dusts are removed. | 10-01-2009 |
20140020938 | METHOD OF FORMING COPPER WIRING, METHOD OF MANUFACTURING WIRING BOARD, AND WIRING BOARD - A method of forming copper wiring includes: a wiring pattern formation step of depositing a first suspension onto a substrate to form a wiring pattern of the first suspension on the substrate, the first suspension including dispersed first copper particles having an average particle diameter that is not smaller than 100 nm; a drying step of drying the first copper particles at a temperature lower than 150° C.; a second suspension deposition step of depositing a second suspension onto the wiring pattern, the second suspension including dispersed second copper particles having an average particle diameter that is smaller than the average particle diameter of the first copper particles; a compaction step of reducing voids between the first and second copper particles; a heat application step of applying heat to the first and second copper particles; and a reducing treatment step of subjecting the first and second copper particles to a reducing treatment. | 01-23-2014 |
20140083753 | METHOD OF FORMING COPPER WIRING, METHOD OF MANUFACTURING WIRING BOARD, AND WIRING BOARD - Provided are a method of forming copper wiring, a method of manufacturing a wiring board, and a wiring board, which are capable of improving conductivity and suppressing deterioration over a period of time of copper wiring. The method of forming copper wiring includes: a wiring pattern formation step of depositing a suspension onto a substrate to form a wiring pattern of the suspension on the substrate, the suspension including dispersed copper particles having an average particle diameter that is not smaller than 100 nm; a drying step of drying the copper particles at a temperature lower than 150° C.; a pressure application step of applying pressure to the copper particles in the wiring pattern; a heat application step of applying heat to the copper particles in the wiring pattern; and a reducing treatment step of subjecting the copper particles to a reducing treatment. | 03-27-2014 |
Hiroshi Mataki, Ashigarakami-Gun JP
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20090085256 | IMAGE FORMING METHOD AND APPARATUS - The image forming method forms a three-dimensional shape on a medium by stacking up a plurality of droplets of liquid on a same droplet deposition point on the medium. The method includes the steps of: depositing a first droplet of the liquid onto the medium; then solidifying the first droplet while carrying out a process whereby an upper surface of the first droplet assumes a depressed shape; and then depositing a second droplet of the liquid onto the first droplet. | 04-02-2009 |
20120026225 | Line image forming method and apparatus - A line image forming method includes the steps of: ejecting a plurality of droplets of liquid sequentially from an inkjet head, the liquid containing a functional component; and depositing the droplets of the liquid onto a non-permeable medium, the deposited droplets becoming joined together on the non-permeable medium to form a line pattern of the liquid, wherein a receding contact angle of the liquid with respect to the non-permeable medium being not larger than 10°. | 02-02-2012 |
20130004669 | PATTERN TRANSFER METHOD AND APPARATUS - A method of performing pattern transfer includes the steps of: applying liquid to a substrate, while performing relative movement of the substrate and a liquid ejection head having a plurality of nozzles, by performing ejection and deposition of a plurality of droplets of the liquid from the nozzles onto the substrate in a state where a shape of each of the droplets upon the deposition is not a single circular shape and each of the droplets does not combine with adjacent another of the droplets on the substrate; and curing the liquid that has been applied to the substrate in the applying step while pressing a pattern forming surface of a stamper having a prescribed projection-recess pattern against the liquid. | 01-03-2013 |
Hiroshi Mataki, Shiga JP
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20110232752 | Organic-Inorganic Complexes Containing a Luminescent Rare earth-Metal Nanocluster and an Antenna Ligand, Luminescent Articles, and Methods of Making Luminescent Compositions - Luminescent compositions are described comprising lanthanide-containing nanoclusters comprising lanthanide atoms bonded to at least one semimetal or transition metal via an oxygen or sulfur atom. Novel compositions include an antenna ligand complexed with the nanoclusters. The rare earth-metal nanoclusters are in the size range of 1 to 100 nm. Articles, such as solar cells, are described in which the nanoclusters (with or without antenna ligands) are dispersed in a polymer matrix. Novel methods of making luminescent films are also described. | 09-29-2011 |
Hiroshi Mataki, Kyoto-Shi JP
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20120286202 | Organic/Inorganic Composite - The present invention provides an organic/inorganic composite containing an inorganic phase dispersed in an organic polymer, the inorganic phase comprises one or more metal atoms that are coordinated to at least one rare earth metal atom via oxygen. The composite contains at least 5 mass % of rare earth metal. This rare earth metal is dispersed in the inorganic phase. | 11-15-2012 |