Patent application number | Description | Published |
20080291742 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device is disclosed, which includes a plurality of NAND cells each comprising a plurality of series-connected memory cell transistors, and a drain-side select transistor and a source-side select transistor connected to a drain-side end and a source-side end of the series-connected memory cell transistors, respectively, a source line commonly connected to the source-side select transistors in the plurality of NAND cells, a first discharge circuit which is connected between the source line and a reference potential and whose conduction/non-conduction is controlled by a first control signal, and a second discharge circuit which is connected between the source line and the reference potential and whose conduction/non-conduction is controlled by a second control signal different from the first control signal. | 11-27-2008 |
20090109728 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device including memory cells arranged, the memory cell having a stable state with a high resistance value and storing in a non-volatile manner such multi-level data that at least three resistance values, R | 04-30-2009 |
20090168514 | SEMICONDUCTOR MEMORY DEVICE PROVIDED WITH MEMORY CELLS HAVING CHARGE STORAGE LAYER AND CONTROL GATE - A semiconductor memory device includes a memory cell, a source line, and a source line control circuit. The memory cell includes a charge storage layer and a control gate and is capable of holding 2 levels or more levels of data. The source line is electrically connected to a source of the memory cell. The source line control circuit detects a current passed to the source line and controls a potential of the source line in accordance with a detected current amount in a reading operation or a verification operation of the data. | 07-02-2009 |
20090174032 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes: a semiconductor substrate; a three dimensional cell array formed by a plurality of unit cell array blocks of two dimensional arrangement on the semiconductor substrate, the unit cell array block being formed by stacking a plurality of unit cell arrays including a first wiring, a second wiring crossing with the first wiring, and a variable resistance element connected at an intersection of the both wirings; a reading/writing/driving circuit formed on the semiconductor substrate under the three dimensional cell array; a first via region which is arranged in an end portion of the unit cell array block, and in which a via wiring for connecting the first wiring in each layer to the reading/writing/driving circuit is formed; and a second via region which is arranged in an end portion of the unit cell array block, and in which a via wiring for connecting the second wiring in each layer to the reading/writing/driving circuit is formed. When the first wiring is longer than the second wiring, the number of via arrangements in the first via region is set larger than that in the second via region. | 07-09-2009 |
20090207647 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND DATA WRITING METHOD THEREFOR - A nonvolatile semiconductor storage device comprises: a first wire and a second wire intersecting each other; a memory cell which is disposed at each intersection of the first wire and the second wire and electrically rewritable and in which a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires. The control circuit precharges a non-selected second wire up to a standby voltage larger than a reference voltage prior to a set operation for programming only a variable resistor connected to selected first and second wires by supplying the reference voltage to a non-selected first wire and the selected second wire, applying a program voltage necessary for programming of the selected variable resistor based on the reference voltage to the selected first wire and applying a control voltage which prevents the rectifying device from turning ON based on the program voltage to the non-selected second wire. | 08-20-2009 |
20090219750 | NONVOLATILE MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - A nonvolatile memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistive element; a line selector circuit operative to decode an address signal to select the first and second lines; and a control circuit operative to execute control on at least one of data erase, write and read for the memory cell connected between the first and second lines selected at the line selector circuit. The control circuit executes control based on one parameter selected among a plurality of parameters. The line selector circuit specifies the parameter based on a first address portion in the address signal and selects the first and second lines based on a second address portion in the address signal. | 09-03-2009 |
20090219765 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device includes a data circuit and a group of bit line application voltage terminals to which different voltages are applied. The data circuit holds program data to be programmed into a memory cell and changes the data held according to a verify result from the memory cell. Then, the data circuit selects one of the bit line application voltage terminals based on the data held therein and applies voltage of the selected bit line application voltage terminal to a bit line BLe or BLo. | 09-03-2009 |
20090230435 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a semiconductor substrate; a plurality of memory cell arrays stacked on the semiconductor substrate, each memory cell array including a plurality of first lines paralleled with each other, a plurality of second lines paralleled with each other and formed crossing the first lines, and a plurality of memory cells arranged at intersections of the first lines and the second lines, each memory cell having one end connected to the first line and the other end connected to the second line; a first control circuit provided on the semiconductor substrate immediately beneath the memory cell arrays and having one end connected to the first line to select and drive the first line; and a second control circuit provided on the semiconductor substrate immediately beneath the memory cell arrays and having one end connected to the second line to select and drive the second line. | 09-17-2009 |
20090237979 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY SYSTEM - A semiconduct or memory device comprises a memory cell array including a plurality of memory cells arranged at intersections of word lines and bit lines; a read/write circuit operative to execute data read/write to the memory cell; and an operational circuit operative to compare certain length data read out by the read/write circuit from plural ones of the memory cells with certain length data to be written in the plural memory cells to make a decision, and create a flag representing the decision result. The read/write circuit inverts each bit in the certain length data to be written in the memory cells in accordance with the flag, and writes only rewrite-intended data of the certain length data and the flag. The read/write circuit reads the certain length data together with the flag corresponding thereto, and inverts each bit in the certain length data in accordance with the flag. | 09-24-2009 |
20090237992 | SEMICONDUCTOR MEMORY DEVICE HAVING STACKED GATE INCLUDING CHARGE ACCUMULATION LAYER AND CONTROL GATE - A semiconductor memory device includes a memory cell, a bit line, a source line, a detection circuit, and a sense amplifier. The memory cell holds or more levels of data. The bit line is electrically connected to a drain of the memory cell. The source line is electrically connected to a source of the memory cell. The detection circuit detects a current flowing through the source line during a read operation and a verify operation on the data. The sense amplifier reads the data by sensing a current flowing through the bit line during the read operation and the verify operation. Whether or not the sense amplifier reads the same data plural times is determined according to a current amount detected by the detection circuit. | 09-24-2009 |
20090244953 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistive element; a data write circuit operative to apply a voltage required for data write to the memory cell via the first and second lines; and a current limit circuit operative to limit the value of current flowing in the memory cell on the data write at a certain current limit value. | 10-01-2009 |
20090244968 | SEMICONDUCTOR MEMORY DEVICE INCLUDING MEMORY CELL HAVING CHARGE ACCUMULATION LAYER AND CONTROL GATE - A semiconductor memory device includes a select transistor, a memory cell transistor, a select gate line, a word line, and a row decoder. The memory cell transistor includes a charge accumulation layer and a control gate, and a current path one end of which is connected to a current path in the select transistor. The select gate line and word line are connected to a gate and the control gate of the select transistor and memory cell transistor. The row decoder includes a transfer circuit which transfers a voltage to the select gate line and includes a first switch including a first MOS transistor of a depression type. The first MOS transistor includes a current path one end of which is connected to the select gate line, and transfers a first voltage provided to the other end of the current path to the select gate line. | 10-01-2009 |
20090244969 | SEMICONDUCTOR MEMORY DEVICE COMPRISING MEMORY CELL HAVING CHARGE ACCUMULATION LAYER AND CONTROL GATE AND METHOD OF ERASING DATA THEREOF - A semiconductor memory device includes a memory cell, a bit line, a source line, and a sense amplifier. The memory cell has a stacked gate including a charge accumulation layer and a control gate. The bit line is electrically connected to a drain of the memory cell. The source line is electrically connected to a source of the memory cell. The sense amplifier, during erase verification to determine whether or not a threshold voltage of the memory cell in an erased state is at a threshold level, reads the data from the memory cell and senses the data with a first voltage applied to the control gate of the memory cell, with a positive second voltage higher than the first voltage applied to the semiconductor substrate and the source line, and with a third voltage higher than the second voltage applied to the bit line. | 10-01-2009 |
20090267128 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks disposed side by side in a first direction, and a driver disposed on one end of the memory cell array in a second direction orthogonal to the first direction. A source diffusion layer, which is common to the first and second blocks, is disposed in a semiconductor substrate, and a contact plug, which has a lower end connected to the source diffusion layer and an upper end connected to a source line disposed above at least three conductive layers, is interposed between the first and second blocks. | 10-29-2009 |
20090267139 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to examples of the present invention includes a memory cell array comprised of first and second blocks disposed side by side and a driver disposed between the first and second blocks. At least two conductive layers having the same structure as that of the at least two conductive layers in the first and second blocks are disposed on the driver, and select gate lines in the first and second blocks are connected to the driver through the at least two conductive layers on the driver. | 10-29-2009 |
20090268509 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistor operative to nonvolatilely store the resistance thereof as data and a first non-ohmic element operative to switch the variable resistor; and a clamp voltage generator circuit operative to generate a clamp voltage required for access to the memory cell and applied to the first and second lines. The clamp voltage generator circuit has a temperature compensation function of compensating for the temperature characteristic of the first non-ohmic element. | 10-29-2009 |
20090268522 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks disposed side by side in a first direction, and a driver disposed on one end of the memory cell array in a second direction orthogonal to the first direction. First select gate lines in the first block and first select gate lines in the second block are connected to the driver after they are commonly connected in one end in the second direction of the memory cell array in a relation of one to one. | 10-29-2009 |
20090268523 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block. | 10-29-2009 |
20090268524 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - In a three dimensional stacked nonvolatile semiconductor memory according to the present invention, a first block has a selected first cell unit including a memory cell to be read and a non-selected second cell unit not including a memory cell to be read. A read potential or a transfer potential higher than the read potential is applied to the word line in the first block in a state that a ground potential is applied to a channel of a memory cell existing nearer to the bit line side than a memory cell in the second cell unit to which the read potential is applied, after which all the memory cells in the second cell unit are cut off from the bit line, the bit line is set to a precharge potential, and read is performed to the a memory cell to be read in the first cell unit. | 10-29-2009 |
20090278190 | Nonvolatile semiconductor memory - A nonvolatile semiconductor memory according to the present invention includes memory cell units, which include data select lines formed in parallel to each other, data transfer lines crossing the data select lines and aligned in parallel to each other, and electrically rewritable memory cell transistors disposed at intersections of the data transfer lines and the data select lines. It further includes: a memory cell array block in which the memory cell units are disposed along the data select lines; first source lines, connected to one end of the memory cell units, and aligned along the data select lines; and second source lines electrically connected to the first source lines, and disposed along the data select lines. | 11-12-2009 |
20100027308 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes a memory cell array having memory cells positioned at respective intersections between a plurality of first wirings and a plurality of second wirings, each of the memory cells having a rectifier element and a variable resistance element connected in series, and a control circuit selectively driving the first and second wirings. The control circuit applies a first voltage to the selected first wiring and applies a second voltage to the selected second wiring to apply a certain potential difference to a selected memory cell positioned at a intersection between the selected first and second wirings, and brings at least one of nonselected first wirings into a floating state. | 02-04-2010 |
20100046275 | NONVOLATILE SEMICONDUCTOR STORAGE APPARATUS AND DATA PROGRAMMING METHOD THEREOF - The semiconductor storage apparatus includes a memory cell array including memory cells each having a rectifying element and a variable resistive element connected in series, the memory cells being arranged in crossing portions of a plurality of first wires and a plurality of second wires, and a control circuit configured to control charging to the first wire. The control circuit charges the first wire connected to a selected memory cell up to a first potential, and then set the first wire in a floating state. Then it charges another first wire adjacent to the first wire connected to the selected memory cell to a second potential. The potential of the first wire connected to the selected memory cell is thereby caused to rise to a third potential by coupling. | 02-25-2010 |
20100103714 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes: a memory cell array having memory cells positioned at respective intersections between a plurality of first wirings and a plurality of second wirings, each of the memory cells having a rectifier element and a variable resistance element connected in series; and a control circuit selectively driving the first and second wirings. The plurality of first wirings that are specified and selectively driven at the same time by one of a plurality of address signals are separately arranged with other first wirings interposed therebetween within the memory cell array when a certain potential difference is applied to a selected memory cell positioned at an intersection between the first and second wirings by the control circuit. | 04-29-2010 |
20100128508 | SEMICONDUCTOR MEMORY DEVICE - The memory cell array has memory cells each positioned at respective intersections between a plurality of first wirings and a plurality of second wirings. Each of the memory cells has a rectifier element and a variable resistance element connected in series. The resistance element may have at least a first resistance value and a second resistance value higher than the first resistance value. The contact arrangement portion is formed to arrange a plurality of contacts on a plane. The contacts are connected to the first wirings or the second wirings. The probe can move along the plane to electrically contact with either of the contacts. | 05-27-2010 |
20110063910 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks disposed side by side in a first direction, and a driver disposed on one end of the memory cell array in a second direction orthogonal to the first direction. First select gate lines in the first block and first select gate lines in the second block are connected to the driver after they are commonly connected in one end in the second direction of the memory cell array in a relation of one to one. | 03-17-2011 |
20110063913 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - In a three dimensional stacked nonvolatile semiconductor memory according to the present invention, a first block has a selected first cell unit including a memory cell to be read and a non-selected second cell unit not including a memory cell to be read. A read potential or a transfer potential higher than the read potential is applied to the word line in the first block in a state that a ground potential is applied to a channel of a memory cell existing nearer to the bit line side than a memory cell in the second cell unit to which the read potential is applied, after which all the memory cells in the second cell unit are cut off from the bit line, the bit line is set to a precharge potential, and read is performed to the a memory cell to be read in the first cell unit. | 03-17-2011 |
20110069550 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block. | 03-24-2011 |
20110128774 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistor operative to nonvolatilely store the resistance thereof as data and a first non-ohmic element operative to switch the variable resistor; and a clamp voltage generator circuit operative to generate a clamp voltage required for access to the memory cell and applied to the first and second lines. The clamp voltage generator circuit has a temperature compensation function of compensating for the temperature characteristic of the first non-ohmic element. | 06-02-2011 |
20110128775 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND DATA WRITING METHOD THEREFOR - A nonvolatile semiconductor storage device comprises: a first wire and a second wire intersecting each other; a memory cell which is disposed at each intersection of the first wire and the second wire and electrically rewritable and in which a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires. The control circuit precharges a non-selected second wire up to a standby voltage larger than a reference voltage prior to a set operation for programming only a variable resistor connected to selected first and second wires by supplying the reference voltage to a non-selected first wire and the selected second wire, applying a program voltage necessary for programming of the selected variable resistor based on the reference voltage to the selected first wire and applying a control voltage which prevents the rectifying device from turning ON based on the program voltage to the non-selected second wire. | 06-02-2011 |
20110317463 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a semiconductor substrate; a plurality of memory cell arrays stacked on the semiconductor substrate, each memory cell array including a plurality of first lines paralleled with each other, a plurality of second lines paralleled with each other and formed crossing the first lines, and a plurality of memory cells arranged at intersections of the first lines and the second lines, each memory cell having one end connected to the first line and the other end connected to the second line; a first control circuit provided on the semiconductor substrate immediately beneath the memory cell arrays and having one end connected to the first line to select and drive the first line; and a second control circuit provided on the semiconductor substrate immediately beneath the memory cell arrays and having one end connected to the second line to select and drive the second line. | 12-29-2011 |
20120008371 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes: a memory cell array having memory cells positioned at respective intersections between a plurality of first wirings and a plurality of second wirings, each of the memory cells having a rectifier element and a variable resistance element connected in series; and a control circuit selectively driving the first and second wirings. The plurality of first wirings that are specified and selectively driven at the same time by one of a plurality of address signals are separately arranged with other first wirings interposed therebetween within the memory cell array when a certain potential difference is applied to a selected memory cell positioned at an intersection between the first and second wirings by the control circuit. | 01-12-2012 |
20120039128 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks disposed side by side in a first direction, and a driver disposed on one end of the memory cell array in a second direction orthogonal to the first direction. First select gate lines in the first block and first select gate lines in the second block are connected to the driver after they are commonly connected in one end in the second direction of the memory cell array in a relation of one to one. | 02-16-2012 |
20120075915 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes a memory cell array having memory cells positioned at respective intersections between a plurality of first wirings and a plurality of second wirings, each of the memory cells having a rectifier element and a variable resistance element connected in series, and a control circuit selectively driving the first and second wirings. The control circuit applies a first voltage to the selected first wiring and applies a second voltage to the selected second wiring to apply a certain potential difference to a selected memory cell positioned at a intersection between the selected first and second wirings, and brings at least one of nonselected first wirings into a floating state. | 03-29-2012 |
20120099376 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block. | 04-26-2012 |
20120099377 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - In a three dimensional stacked nonvolatile semiconductor memory according to the present invention, a first block has a selected first cell unit including a memory cell to be read and a non-selected second cell unit not including a memory cell to be read. A read potential or a transfer potential higher than the read potential is applied to the word line in the first block in a state that a ground potential is applied to a channel of a memory cell existing nearer to the bit line side than a memory cell in the second cell unit to which the read potential is applied, after which all the memory cells in the second cell unit are cut off from the bit line, the bit line is set to a precharge potential, and read is performed to the a memory cell to be read in the first cell unit. | 04-26-2012 |
20120106230 | SEMICONDUCTOR MEMORY DEVICE - The memory cell array has memory cells each positioned at respective intersections between a plurality of first wirings and a plurality of second wirings. Each of the memory cells has a rectifier element and a variable resistance element connected in series. The resistance element may have at least a first resistance value ant a second resistance value higher than the first resistance value. The contact arrangement portion is formed to arrange a plurality of contacts on a plane. The contacts are connected to the first wirings or the second wirings. The probe can move along the plane to electrically contact with either of the contacts. | 05-03-2012 |
20120140549 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistor operative to nonvolatilely store the resistance thereof as data and a first non-ohmic element operative to switch the variable resistor; and a clamp voltage generator circuit operative to generate a clamp voltage required for access to the memory cell and applied to the first and second lines. The clamp voltage generator circuit has a temperature compensation function of compensating for the temperature characteristic of the first non-ohmic element. | 06-07-2012 |
20120163060 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a semiconductor substrate; a plurality of memory cell arrays stacked on the semiconductor substrate, each memory cell array including a plurality of first lines paralleled with each other, a plurality of second lines paralleled with each other and formed crossing the first lines, and a plurality of memory cells arranged at intersections of the first lines and the second lines, each memory cell having one end connected to the first line and the other end connected to the second line; a first control circuit provided on the semiconductor substrate immediately beneath the memory cell arrays and having one end connected to the first line to select and drive the first line; and a second control circuit provided on the semiconductor substrate immediately beneath the memory cell arrays and having one end connected to the second line to select and drive the second line. | 06-28-2012 |
20120201070 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND DATA WRITING METHOD THEREFOR - A nonvolatile semiconductor storage device includes first and second intersecting wires; a electrically rewritable memory cell disposed at each intersection of the first second wires, including a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires. The control circuit precharges a non-selected second wire to a standby voltage larger than a reference voltage prior to programming a variable resistor connected to selected first and second wires by supplying the reference voltage to a non-selected first wire and the selected second wire, applying to the selected first wire a program voltage for programming of the selected variable resistor and applying to the non-selected second wire a control voltage which prevents the rectifying device from turning ON. | 08-09-2012 |
20120218820 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to examples of the present invention includes a memory cell array comprised of first and second blocks disposed side by side and a driver disposed between the first and second blocks. At least two conductive layers having the same structure as that of the at least two conductive layers in the first and second blocks are disposed on the driver, and select gate lines in the first and second blocks are connected to the driver through the at least two conductive layers on the driver. | 08-30-2012 |
20120243312 | SEMICONDUCTOR MEMORY DEVICE COMPRISING MEMORY CELL HAVING CHARGE ACCUMULATION LAYER AND CONTROL GATE AND METHOD OF ERASING DATA THEREOF - A semiconductor memory device includes a memory cell, a bit line, a source line, and a sense amplifier. The memory cell has a stacked gate including a charge accumulation layer and a control gate. The bit line is electrically connected to a drain of the memory cell. The source line is electrically connected to a source of the memory cell. The sense amplifier, during erase verification to determine whether or not a threshold voltage of the memory cell in an erased state is at a threshold level, reads the data from the memory cell and senses the data with a first voltage applied to the control gate of the memory cell, with a positive second voltage higher than the first voltage applied to the semiconductor substrate and the source line, and with a third voltage higher than the second voltage applied to the bit line. | 09-27-2012 |
20130094296 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks disposed side by side in a first direction, and a driver disposed on one end of the memory cell array in a second direction orthogonal to the first direction. First select gate lines in the first block and first select gate lines in the second block are connected to the driver after they are commonly connected in one end in the second direction of the memory cell array in a relation of one to one. | 04-18-2013 |
20130121076 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block. | 05-16-2013 |
20130121077 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - In a three dimensional stacked nonvolatile semiconductor memory according to the present invention, a first block has a selected first cell unit including a memory cell to be read and a non-selected second cell unit not including a memory cell to be read. A read potential or a transfer potential higher than the read potential is applied to the word line in the first block in a state that a ground potential is applied to a channel of a memory cell existing nearer to the bit line side than a memory cell in the second cell unit to which the read potential is applied, after which all the memory cells in the second cell unit are cut off from the bit line, the bit line is set to a precharge potential, and read is performed to the a memory cell to be read in the first cell unit. | 05-16-2013 |
20130155750 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes: a memory cell array having memory cells positioned at respective intersections between a plurality of first wirings and a plurality of second wirings, each of the memory cells having a rectifier element and a variable resistance element connected in series; and a control circuit selectively driving the first and second wirings. The plurality of first wirings that are specified and selectively driven at the same time by one of a plurality of address signals are separately arranged with other first wirings interposed therebetween within the memory cell array when a certain potential difference is applied to a selected memory cell positioned at an intersection between the first and second wirings by the control circuit. | 06-20-2013 |
20140071758 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks disposed side by side in a first direction, and a driver disposed on one end of the memory cell array in a second direction orthogonal to the first direction. First select gate lines in the first block and first select gate lines in the second block are connected to the driver after they are commonly connected in one end in the second direction of the memory cell array in a relation of one to one. | 03-13-2014 |
20140177337 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block. | 06-26-2014 |
20140355350 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks disposed side by side in a first direction, and a driver disposed on one end of the memory cell array in a second direction orthogonal to the first direction. First select gate lines in the first block and first select gate lines in the second block are connected to the driver after they are commonly connected in one end in the second direction of the memory cell array in a relation of one to one. | 12-04-2014 |