Patent application number | Description | Published |
20100130089 | METHOD FOR MANUFACTURING FLUORESCENT SUBSTRATE AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE - The method for manufacturing a fluorescent paste includes a process of applying a fluorescent paste including a sulfide fluorescent material and a binder resin onto a substrate, a first baking process of baking the substrate for a predetermined time at a first temperature that is equal to or lower than a temperature at which a generated amount of water has a maximum in a case where the fluorescent paste is measured by a TDP-MS method, and a second baking process of baking the substrate for a predetermined time at a second temperature that is equal to or higher than a temperature at which a generated amount of carbon dioxide has a minimum in a case where the fluorescent paste is measured by a TDP-MS method after the first baking process. | 05-27-2010 |
20140132672 | LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE SAME - A liquid discharge head includes a substrate and a flow-path-forming member that forms a plurality of flow paths and discharge ports that are in communication with the flow paths on the substrate. Liquid is to be discharged from the discharge ports. A space is formed between the plurality of flow paths and is filled with a filling material. In the case where a direction in which the liquid is to be discharged from the discharge ports is an upward direction, a top surface of the filling material is positioned at the same height as a face surface of the flow-path-forming member or is positioned higher than the face surface of the flow-path-forming member in the upward direction. | 05-15-2014 |
20150022590 | LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING SAME - A liquid ejection head includes a substrate, an energy-generating element provided on a front surface side of the substrate, the energy-generating element generating energy for ejecting liquid, sidewall members of a liquid flow path, and an ejection port forming member that defines an ejection port from which the liquid is ejected. In the liquid ejection head, sidewalls of the liquid flow path are formed of the sidewall members and a top wall of the liquid flow path is formed of the ejection port forming member, the sidewall members are each formed of a core member that extends from a front surface of the substrate and a covering member that covers the surface of the core member, the covering member covers the front surface of the substrate, and the ejection port forming member is formed of an inorganic material. | 01-22-2015 |
20150062253 | LIQUID EJECTION HEAD AND PRODUCTION PROCESS THEREOF - The invention provides a liquid ejection head including a substrate and a flow path forming member on the substrate, the flow path forming member forming an ejection orifice from which a liquid is ejected and a liquid flow path. The flow path forming member is formed of an inorganic material, contains at least a flow path side wall portion forming a side of the liquid flow path and has a member covering a substrate side end part of an inner wall of the flow path side wall portion. | 03-05-2015 |
20150111321 | METHOD FOR PROCESSING SILICON SUBSTRATE - A method for processing a silicon substrate, comprising the steps of providing a silicon substrate having a first surface and a second surface, forming a non-penetrated hole extending from the first surface toward the second surface side in the silicon substrate, sticking a sealing tape comprising a support member and an adhesive layer on the first surface and filling at least part of the non-penetrated hole with the adhesive layer, performing reactive ion etching from the second surface toward the first surface side to allow the reactive ion etching to reach the adhesive layer filled in the non-penetrated hole and to expose the adhesive layer, and peeling the sealing tape from the silicon substrate to form a through hole in the silicon substrate. | 04-23-2015 |
20150136024 | LIQUID DISCHARGE HEAD - A liquid discharge head has a substrate, an energy generating element which generates energy for discharging liquid, and an orifice plate in which a discharge orifice which discharges liquid is formed, in which the orifice plate contains silicon and carbon and when the content ratio of the silicon is defined as X (atom %) and the content ratio of the carbon is defined as Y (atom %), Y/X is 0.001 or more. | 05-21-2015 |
20150328896 | SUBSTRATE PROCESSING METHOD AND METHOD OF MANUFACTURING SUBSTRATE FOR LIQUID DISCHARGE HEAD - A substrate processing method includes forming a first hole in a first surface of a silicon substrate to have a depth that it does not extend through the substrate and forming a second hole in a second surface to make the second hole to communicate with the first hole, so that a through hole formed of the first and second holes is formed in the substrate. The process of forming the second hole includes forming a communication portion wider than an opening of the first hole between the first and second holes after the second hole has been made to communicate with the first hole by dry etching. | 11-19-2015 |
20150348791 | METHOD OF MAKING SEMICONDUCTOR SUBSTRATE AND METHOD OF MAKING LIQUID EJECTION HEAD SUBSTRATE - A method of making a semiconductor substrate having a through-hole includes a step of forming an etching mask on a semiconductor substrate in accordance with a pattern corresponding to the through-hole, and a step of forming the through-hole by etching the semiconductor substrate, on which the etching mask has been formed, by reactive ion etching. At least a part of the pattern corresponding to the through-hole is formed so that the semiconductor substrate is exposed in a frame-like shape along the inner edge of the through-hole. | 12-03-2015 |