Patent application number | Description | Published |
20090038835 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal. | 02-12-2009 |
20090129039 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7. | 05-21-2009 |
20100065323 | PRINTED WIRING BOARD - A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved. | 03-18-2010 |
20100155129 | PRINTED WIRING BOARD - A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 μm or less. | 06-24-2010 |
20110061232 | PRINTED WIRING BOARD - A method for manufacturing a printed wiring board including providing a structure having a wiring substrate having a conductor circuit, a build-up multilayer structure formed over the wiring substrate and having an outermost conductor circuit and an outermost insulative resin layer, and a solder resist layer formed over the outermost conductor circuit and outermost insulative resin layer and having openings with an opening diameter D for mounting electronic elements, forming conductor pads with a pitch of about 200 pm or less on the outermost conductor circuit in the openings of the solder resist layer, respectively, and forming solder bumps with a height H from a surface of the solder resist layer on the conductor pads on the conductor pads, respectively, such that a ratio H/D is about 0.55 to about 1.0. | 03-17-2011 |
20110214915 | PRINTED WIRING BOARD - A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. | 09-08-2011 |
Patent application number | Description | Published |
20090038830 | SUBSTRATE FOR MOUNTING IC CHIP AND METHOD OF MANUFACTURING THE SAME - A substrate for mounting an IC chip including a printed substrate including a first build-up layer. The first build-up layer including (i) a first conductor layer having first conductor circuits and (ii) a resin insulating layer. The first conductor circuits and the resin insulating layer alternating along a length of the first build-up layer. A low-elasticity resin layer formed on the first build-up layer. A low-thermal-expansion substrate formed of ceramics or silicon, and provided on the low-elasticity resin layer. Through-hole conductors provided through the low-thermal-expansion substrate and the low-elasticity resin layer; and second conductor circuits formed on the low-thermal-expansion substrate. The through-hole conductors electrically connect the first conductor layer and the second conductor circuits provided on the low-thermal-expansion substrate. | 02-12-2009 |
20090064493 | PRINTED CIRCUIT BOARD - A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion. | 03-12-2009 |
20100064512 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7. | 03-18-2010 |
20100200285 | HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF - A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once. | 08-12-2010 |
20110061921 | WIRING BOARD WITH BUILT-IN CAPACITOR - A wiring board with built-in capacitors includes a core substrate, and a high dielectric sheet including a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer made of a sintered ceramic body and sandwiched between the lower electrode layer and the upper electrode layer, the lower electrode layer and/or the upper electrode layer being partitioned into multiple electrodes such that the high dielectric sheet has multiple capacitors. The lower electrode layer and/or the upper electrode layer is connected to a ground line and the other one of the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically connected in parallel. | 03-17-2011 |
20110259629 | HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF - A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once. | 10-27-2011 |
Patent application number | Description | Published |
20090127241 | Thin plate formation method, thin plate and suspension correction apparatus, and correction method - Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area. | 05-21-2009 |
20090128960 | Thin plate formation method, thin plate and suspension correction apparatus, and correction method - Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area. | 05-21-2009 |
20090193335 | DOCUMENT MANAGEMENT DEVICE, DOCUMENT MANAGEMENT METHOD, COMPUTER READABLE RECORDING MEDIUM AND DATA SIGNAL - A document management device, which includes: a document receptor that receives a document; a pattern information generator that generates first information on which a first background pattern image is based; an addition section that adds the first information to the document; a setter that sets, to the document, a prohibition on editing the first information; a document storage that stores the document having the first information added thereto; a printing request receptor that receives a printing request; an prohibition lifting section that lifts the prohibition; an edition section that edits the first information to make second information on which a second background pattern image is based; a printing image generator that generates a printing image having the second background pattern image incorporated thereinto; and a sender that sends, to an image formation device, the printing image having the second background pattern image incorporated thereinto. | 07-30-2009 |
20130083355 | INFORMATION PROCESSING SYSTEM, DATA PROCESSING DEVICE, AND INFORMATION PROCESSING METHOD - An information processing system includes a print server that generates print data and a data processing device that processes the print data. The print server transmits the generated print data to the data processing device. The data processing device generates processed data by processing the print data transmitted from the print server. The data processing device transmits the processed data to the print server. The print server transmits the processed data as new print data to a printer. | 04-04-2013 |
20130163031 | IMAGE FORMING APPARATUS, METHOD, AND COMPUTER READABLE MEDIUM - An image forming apparatus includes an authentication processor, a registration unit, and a print unit. The authentication processor performs a process for user authentication with respect to a user in response to an authentication request from the user. The registration unit registers the image forming apparatus with a print service system on a network as a printer to be used by the user by transmitting, to the print service system, a registration request including user information of the user and information about the image forming apparatus in the case where the user authentication has been successfully performed. The print unit receives, from the print service system, a print instruction to print an electronic document and executes printing in response to the print instruction. | 06-27-2013 |
20130235418 | PRINTING SYSTEM, MANAGEMENT APPARATUS, MANAGEMENT METHOD, IMAGE FORMING APPARATUS, IMAGE FORMING METHOD, AND NON-TRANSITORY COMPUTER READABLE MEDIUM - A printing system includes at least one image forming apparatus and a management apparatus, each of the image forming apparatus and the management apparatus connected to an information system. The management system includes a receiving unit, an association relationship registration unit, and a user setting unit. The image forming apparatus includes a print data retrieval unit, a converter unit, and a control unit. | 09-12-2013 |
20150015908 | IMAGE FORMING APPARATUS AND METHOD, NON-TRANSITORY COMPUTER READABLE MEDIUM, AND IMAGE FORMING SYSTEM - An image forming apparatus that performs printing processing using first identification information for identifying, in a first system in a particular organization that performs first authentication, a user in the first authentication, including an obtaining unit that obtains print data from a logical printer in a second system that is a cloud service system that performs second authentication, wherein information for identifying a user in the second system is second identification information, and the print data includes the second identification information; a reference unit that refers to relationship information between the first and second identification information when the obtained print data includes the second identification information; and a controller that controls printing processing of the obtained print data obtained using the first identification information. Identification information of the user, which is temporarily issued in the first system, is used as the first identification information. | 01-15-2015 |
Patent application number | Description | Published |
20110206068 | OPTICAL FIBER EMISSION CIRCUIT AND FIBER LASER - Object An object of the present invention is to reuse unavailable excitation light without deteriorating reliability of a fiber laser. | 08-25-2011 |
20120206793 | OPTICAL COMBINER AND FIBER LASER DEVICE HAVING THE SAME - An optical combiner | 08-16-2012 |
20130016743 | HOLEY FIBER, AND LASER DEVICE USING THE SAME - The invention aims to provide a holey fiber that can release leak light propagating through the clad at a desired location, and a laser device using the holey fiber. A holey fiber includes: one end and the other end; a core; an inner clad coating the core; a hole layer having a large number of holes formed therein and coating the inner clad; and an outer clad coating the hole layer. In this holey fiber, a collapse region is formed, and the holes in the collapse region are squashed by a predetermined length in the length direction of the fiber. | 01-17-2013 |
20130022326 | OPTICAL FIBER, AND LASER DEVICE USING THE SAME - The invention aims to provide an optical fiber in which light that is input to the clad is easily released to the outside of the clad, and a laser device using the optical fiber. An optical fiber ( | 01-24-2013 |
20150055916 | OPTICAL COMBINER AND LASER DEVICE USING THE SAME - An optical combiner includes a plurality of input optical fibers, an output optical fiber, and a bridge fiber optically coupled to the plurality of input optical fibers and the output optical fiber. The bridge fiber includes a tapered portion whose outer diameter is reduced toward the emission end, and the outer diameter of the emission end face of the bridge fiber is smaller than the cladding outer diameter of the incident end face of the output optical fiber. | 02-26-2015 |