Patent application number | Description | Published |
20090250256 | SOCKET CONTACT TERMINAL AND SEMICONDUCTOR DEVICE - A socket contact terminal for electrical connection between a connection portion formed of a metal conductor on a printed circuit board and a connection terminal of an IC package. The contact terminal comprises a metal terminal composed of a main columnar portion and arm portions on both sides and having an angular U shape and an elastomeric member attached to the metal terminal. A metal surface is exposed from the outer surface of each arm portion. The elastomeric member is firmly held between the arm portions of the metal terminal and exhibits a repulsive force when the arm portions are pressed in the direction that the arm portions approach each other. | 10-08-2009 |
20100307797 | FLEXIBLE PRINTED CIRCUIT AND METHOD OF MANUFACTURING SAME - To improve reliability by preventing separation of a sheet material attached on a flexible printed circuit, provided is a flexible printed circuit including a printed board body and a reinforcing board. A leaked portion of an adhesive agent is formed to leak in an outward direction relative to an end surface of the reinforcing board. The leaked portion adheres to part of the end surface of the reinforcing board to be continuous from a lower end of the end surface to form an inclined surface tapered in the outward direction. The leaked portion is formed such that a portion thereof that covers the end surface has an adhesion height hA, as measured from an adhesive surface of the reinforcing board, of greater than 0% and not greater than 80% of the thickness H1 of the reinforcing board. | 12-09-2010 |
20110247863 | FLEXIBLE PRINTED BOARD AND METHOD OF MANUFACTURING SAME - [Object] To provide a flexible printed board improved in bendability. | 10-13-2011 |
20120205141 | PRINTED WIRING BOARD - The printed wiring board has a conductor of signal line | 08-16-2012 |
20120279050 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - Quickly making changes to etching conditions suppresses the production yield of printed wiring boards from being deteriorated. Disclosed is a method comprising: an etching step that comprises: preparing a conductor-clad base material continuous in a certain direction, the conductor-clad base material ( | 11-08-2012 |
20120292085 | FLEXIBLE PRINTED CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Provided is a flexible printed circuit having a multilayered structure including three conductive layers. The flexible printed circuit includes: a first unit substrate formed of a first insulating layer made of liquid crystal polymer or fluorine resin and having a signal transmission circuit formed on one surface of the first insulating layer and a first conductive layer formed on the other surface thereof; a second unit substrate formed of a second insulating layer made of liquid crystal polymer or fluorine resin and having a second conductive layer formed on one surface of the second insulating layer; and an adhesive layer made of an epoxy thermal curing adhesive for bonding the first unit substrate and the second unit substrate in a state that the one surface of the first insulating layer is faced with the other surface of the second insulating layer. | 11-22-2012 |
20130087370 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board includes: forming a copper layer of an interconnection pattern on a base film; laminating a cover lay on the base film so as to expose a part of the copper layer from the cover lay and cover the copper layer by the cover lay; mechanically polishing at least the exposed portion of the copper layer; and performing a plating process on the exposed portion of the copper layer so as to form a plated layer on the copper layer, and the angles α | 04-11-2013 |
20130093532 | FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board including: a base substrate; a pad formed on one surface side of the base substrate; and a ground plane layer formed on the other surface side of the base substrate, the ground plane layer including a ground-removed portion, the ground-removed portion being formed at a position facing the pad via the base substrate so as to be of similar shape to the pad and have an outer shape extended 100±50 μm outwardly from an outer shape of the pad. | 04-18-2013 |
20130133930 | PRINTED WIRING BOARD - Provided is a printed wiring board capable of inhibiting a reinforcing plate from peeling off even when a bending radius is small. | 05-30-2013 |
20130133931 | PRINTED WIRING BOARD - Provided is a printed wiring board capable of inhibiting a reinforcing plate from peeling off even when a bending radius is small. The printed wiring board includes a wiring board main body, and a reinforcing plate attached to the wiring board main body, the reinforcing plate includes first and second reinforcing portions which are arranged to be mutually spaced apart, and a connecting portion which integrally connects the first reinforcing portion with the second reinforcing portion, and the connecting portion includes a first portion which has a cross-sectional area smaller than a cross-sectional area of the first reinforcing portion and smaller than a cross-sectional area of the second reinforcing portion, and a second portion of which a cross-sectional area increases along a direction from the first portion to at least one of the first reinforcing portion and the second reinforcing portion. | 05-30-2013 |
20130161077 | DIFFERENTIAL SIGNAL TRANSMISSION CIRCUIT AND METHOD FOR MANUFACTURING SAME - A differential signal transmission circuit comprises: an insulating layer; two signal lines provided in parallel on one surface of the insulating layer; a GND line formed on each of outer sides of the two signal lines on the one surface of the insulating layer; and a wiring line layer formed on the other surface of the insulating layer, the differential signal transmission circuit being configured by a double-sided flexible printed circuit board, the signal lines, the GND line and the wiring line layer being formed by a semi-additive method on the insulating layer, and the signal line and the GND line being formed such that a distance S between the two signal lines is greater than a distance D between the signal line and the GND line. | 06-27-2013 |