Patent application number | Description | Published |
20080213231 | Pluripotent Stem Cell Cloned From Single Cell Derived From Skeletal Muscle Tissue - Techniques are provided which can isolate pluripotent stem cells at high purity capable of differentiation into at least a myocardial cell to regenerate the cardiac muscle. The pluripotent stem cells at high purity capable of differentiation into at least a myocardial cell to regenerate the cardiac muscle can be isolated through the following steps: (i) collecting a skeletal muscle tissue from a mammal and enzymatically treating the obtained skeletal muscle tissue to prepare a skeletal muscle tissue-derived cell; (ii) culturing the obtained skeletal muscle tissue-derived cell in a culture medium containing an epidermal growth factor and a fibroblast growth factor; (iii) selecting and separating a colony that is floating in the culture medium. | 09-04-2008 |
20080241111 | Pluripotent Stem Cell Derived from Cardiac Tissue - An object of the present invention is to provide a stem cell applicable to regenerative therapeutic method, and to provide a technique to carry out regenerative therapy using the cell. A collected cardiac tissue fragment is enzymatically treated to prepare a cell suspension. Then using the cell suspension, following steps are carried out: (1) separation of cells by the density gradient method, (2) suspension-culture in a culture medium containing fibroblast growth factor and epidermal growth factor and (3) selection and separation of cells forming a floating sphere to obtain pluripotent stem cells. Thus-obtained pluripotent stem cells are used to carry out regenerative therapy. | 10-02-2008 |
20090051049 | Semiconductor device, substrate and semiconductor device manufacturing method - The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane. | 02-26-2009 |
20100013095 | SEMICONDUCTOR DEVICE, PRODUCTION METHOD FOR THE SAME, AND SUBSTRATE - A semiconductor device is provided in which a semiconductor chip is bonded to a substrate with a sufficiently increased bonding strength and cracking is assuredly prevented which may otherwise occur due to heat shock, heat cycle and the like. The semiconductor device includes a semiconductor chip and a substrate having a bonding area to which the semiconductor chip is bonded via a metal layer. The metal layer includes an Au—Sn—Ni alloy layer and a solder layer provided on the Au—Sn—Ni alloy layer. Undulations are formed in an interface between the Au—Sn—Ni alloy layer and the solder layer. | 01-21-2010 |
20100303909 | PREPARATION FOR TREATING HEART DISEASE USED IN CELL THERAPY - An object of the present invention is to establish a cell transplantation method which can markedly improve the survival of grafted pluripotent stem cells and the efficiency of cardiomyocyte regeneration in cell therapy using pluripotent stem cells derived from heart tissue and can treat heart disease further effectively. Specifically, according to the present invention, enhancement in the survival of grafted pluripotent stem cells and significant improvement in the efficiency of cardiomyocyte regeneration are achieved by using, in combination, pluripotent stem cells derived from heart tissue and a hydrogel containing a basic fibroblast growth factor (bFGF) in cell therapy for heart disease. | 12-02-2010 |
20110115089 | Semiconductor device, production method for the same, and substrate - A semiconductor device is provided in which a semiconductor chip is bonded to a substrate with a sufficiently increased bonding strength and cracking is assuredly prevented which may otherwise occur due to heat shock, heat cycle and the like. The semiconductor device includes a semiconductor chip and a substrate having a bonding area to which the semiconductor chip is bonded via a metal layer. The metal layer includes an Au—Sn—Ni alloy layer and a solder layer provided on the Au—Sn—Ni alloy layer. Undulations are formed in an interface between the Au—Sn—Ni alloy layer and the solder layer. | 05-19-2011 |
20110140256 | SEMICONDUCTOR DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane. | 06-16-2011 |
20130305397 | GENE CAPABLE OF REGULATING OBESITY/INSULIN SENSITIVITY - This invention relates to a cell comprising a reporter gene under control of an ARIA gene promoter, the cell being used for searching for an agent for prevention or treatment of diseases attributed to reduced insulin sensitivity, for searching for an obesity-controlling substance, or for searching for an obesity-inducing substance. | 11-14-2013 |
20140312513 | SEMICONDUCTOR DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane. | 10-23-2014 |