Patent application number | Description | Published |
20100228757 | INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND MEMORY MEDIUM - An information processing system using apparatus data recorded in a database in accordance with a data definition updated as needed, comprises a storage unit configured to store a data definition history that makes a data definition version and a period during which a data definition for the data definition version was used to correspond to each other, a data definition library in which the data definition version and the data definition for the data definition version are registered in correspondence with each other, and a detection unit configured to detect, from the data definition history, a data definition version of a data definition used in a period designated via a user interface, to detect a data definition for the detected data definition version from the data definition library, and to provide the detected data definition version and data definition to the user interface. | 09-09-2010 |
20100235384 | INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM - An information processing system which utilizes apparatus data recorded in a database in conformity with a data definition which can be updated as needed, comprises a storage unit configured to store a data definition history in which a data definition version is associated with a period for which a data definition in the data definition version is used, a data definition library configured to register a data definition version and a data definition in the data definition version in association with each other, an extractor configured to extract, from the database, apparatus data which meets an extraction condition including an extraction period designated via a user interface, and a converter configured to convert an expression of the apparatus data extracted by the extractor into an expression conforming to a data definition designated via the user interface. | 09-16-2010 |
20100248165 | INFORMATION PROCESSING METHOD, EXPOSURE PROCESSING SYSTEM USING SAME, DEVICE MANUFACTURING METHOD, AND INFORMATION PROCESSING APPARATUS - The information processing method of the present invention is provided that specifies an extraction period for extracting apparatus data to be generated by an industrial apparatus and analyzes a state of the industrial apparatus based on the apparatus data having an occurrence time within the extraction period. The information processing method includes a period changing step of changing the extraction period so as to enable the apparatus data required for the analysis of the state to be included, when the apparatus data required for the analysis of the state is not included within the extraction period. | 09-30-2010 |
20110029685 | INFORMATION PROCESSING METHOD AND INFORMATION PROCESSING APPARATUS FOR TRANSMITTING DATA GENERATED BY DEVICE MANUFACTURING APPARATUS - An apparatus which transmits data generated by a device manufacturing apparatus to at least one terminal, comprises a communication unit, a transmission request processor configured to accept or reject a transmission request which the communication unit has received from the terminal, and a transmission controller configured to control the communication unit to transmit, in response to a transmission request accepted by the transmission request processor, data corresponding to the transmission request to a terminal, of the at least one terminal, which has transmitted the transmission request, wherein the transmission request processor accepts a new transmission request if a sum of transmission rates of the respective data concurrently transmitted from the communication unit in response to transmission requests which the transmission request processor has already accepted and a transmission rate at which data is transmitted in response to the new transmission request does not exceed a preset allowable transmission rate. | 02-03-2011 |
Patent application number | Description | Published |
20100044087 | PREPREG, PRINTED WIRING BOARD, MULTILAYER CIRCUIT BOARD, AND PROCESS FOR MANUFACTURING PRINTED WIRING BOARD - The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin(A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 μm or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards. | 02-25-2010 |
20100218982 | EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY RESIN COMPOSITION, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD - It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this object, the epoxy resin composition of the present invention is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant, wherein all of the components (A) to (C) are dissolved in the resin varnish, while the component (E) is dispersed without being dissolved in the resin varnish. | 09-02-2010 |
Patent application number | Description | Published |
20090272562 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process. | 11-05-2009 |
20090272564 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process. | 11-05-2009 |
20110247860 | METHOD OF PRODUCING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING THE MANUFACTURING METHOD - One aspect of the present invention resides in a method of producing a circuit board, including a film-forming step of forming a resin film on a surface of an insulative substrate; a circuit pattern-forming step of forming a circuit pattern portion by forming a recessed portion having a depth equal to or greater than a thickness of the resin film, with an outer surface of the resin film serving as a reference; a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on a surface of the circuit pattern portion and a surface of the resin film; a film-separating step of removing the resin film from the insulative substrate; and a plating step of forming an electroless plating film only in a region where the plating catalyst or the precursor thereof remains after the resin film is separated. | 10-13-2011 |
20110281138 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD,METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - One aspect of the present invention is a method of mounting a semiconductor chip having: a step of forming a resin coating on a surface of a path connecting a bonding pad on a surface of a semiconductor chip and an electrode pad formed on a surface of an insulating base material; a step of forming, by laser beam machining, a wiring gutter having a depth that is equal to or greater than a thickness of the resin coating along the path for connecting the bonding pad and the electrode pad; a step of depositing a plating catalyst on a surface of the wiring gutter; a step of removing the resin coating; and a step of forming an electroless plating coating only at a site where the plating catalyst remains. Another aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, wherein, on the surface of the three-dimensional structure, a recessed gutter for wiring is formed, extending between mutually intersecting adjacent faces of the three-dimensional structure, and wherein at least a part of a wiring conductor is embedded in the recessed gutter for wiring. | 11-17-2011 |
20120285736 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - The present invention relates to a method of producing a multilayer circuit board including: a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the film. | 11-15-2012 |
20120292083 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - The present invention relates to a method of producing a circuit board, comprising: a film-forming step of forming a resin film on the surface of an insulative substrate; a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the resin film on the external surface of the resin film; a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves on the insulative substrate and the surface of the resin film; a film-removing step of removing the resin film; and a plating processing step of electroless-plating the insulative substrate after removal of the resin film, wherein a partial reinforcing structure is formed in a region of the circuit groove in the circuit groove-forming step. | 11-22-2012 |
Patent application number | Description | Published |
20120206891 | CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON CIRCUIT BOARD - A circuit board H | 08-16-2012 |
20130056247 | WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE AND MULTILAYER CIRCUIT BOARD - A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device | 03-07-2013 |
20130096233 | EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD - The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg. | 04-18-2013 |
20130200522 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - A method of mounting a semiconductor chip includes: forming a resin coating on a surface of a path connecting a bonding pad on a surface of a semiconductor chip and an electrode pad formed on a surface of an insulating base material; forming, by laser beam machining, a wiring gutter having a depth that is equal to or greater than a thickness of the resin coating along the path for connecting the bonding pad and the electrode pad; depositing a plating catalyst on a surface of the wiring gutter; removing the resin coating; and forming an electroless plating coating only at a site where the plating catalyst remains. | 08-08-2013 |
20130265729 | ELECTRONIC COMPONENTS ASSEMBLY - The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler. | 10-10-2013 |
20130337188 | RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD - The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film | 12-19-2013 |
20140090876 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - A three-dimensional structure in which a wiring and a pad part are provided on a surface is provided. A recessed gutter for wiring and a hole for the pad part having a depth that is greater than a thickness of the recessed gutter for wiring are provided on the surface of the three-dimensional structure. The hole for the pad part is provided in succession with the recessed gutter for wiring. At least a part of a wiring conductor is embedded in the recessed gutter for wiring and in the hole for the pad part. | 04-03-2014 |
20140097004 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring. | 04-10-2014 |
20140182887 | THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION - One aspect of the present invention is a three-dimensional structure that has a concave-convex form including a gutter for wiring having at least partially a width of 20 μm or less, wherein at least a part of a wiring conductor is embedded in the gutter for wiring, and a wiring that extends in such a manner as to creep along the concave-convex form is provided. | 07-03-2014 |
20140182903 | RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD - An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts. | 07-03-2014 |
20140183751 | THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE - One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring. | 07-03-2014 |
20140191406 | MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR DEVICE - One aspect of the present invention resides in a manufacturing method for a semiconductor package, including a covering step of forming a covering insulating layer that covers the surface of a semiconductor element, a film-forming step of forming a resin film on the surface of the covering insulating layer, a circuit pattern-forming step of forming a circuit pattern portion including recesses reaching the surfaces of electrodes of the semiconductor element and a circuit groove having a desired shape and a desired depth, a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on the surface of the circuit pattern portion, a film-separating step of separating the resin film from the covering insulating layer, and a plating processing step of forming a circuit electrically connected to the electrodes, by applying electroless plating to the covering insulating layer, from which the resin film is separated. | 07-10-2014 |
20150034366 | CIRCUIT BOARD - One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate. | 02-05-2015 |
Patent application number | Description | Published |
20150156873 | CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON CIRCUIT BOARD - A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section. | 06-04-2015 |
20150218326 | MODIFIED POLYPHENYLENE ETHER, METHOD FOR PREPARING SAME, POLYPHENYLENE ETHER RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD - A modified polyphenylene ether according to one aspect of the invention has an intrinsic viscosity, as measured in 25° C. methylene chloride, of from 0.03 to 0.12 dL/g, has on molecular ends thereof an average of 1.5 to 3 groups represented by formula (1) below per molecule, and includes not more than 5 mass % of a high-molecular-weight component having a molecular weight of 13,000 or more. | 08-06-2015 |
20150271924 | WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE, AND MULTILAYER CIRCUIT BOARD - A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device | 09-24-2015 |
20150359093 | EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY RESIN COMPOSITION, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD - It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this, the epoxy resin composition of the present invention is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant, all of the components (A) to (C) are dissolved in the resin varnish, while component (E) is dispersed without being dissolved in the resin varnish. | 12-10-2015 |
20150376338 | METHOD OF CURING THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, RESIN SHEET, PRINTED-WIRING BOARD, AND SEALING MATERIAL IN WHICH THERMOSETTING RESIN COMPOSITION IS USED - A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured. | 12-31-2015 |
20150376444 | RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD - The invention relates to a resin composition which is characterized by including: a reaction product that includes (A) a polyphenylene ether having an average of 1.5 to 2 hydroxyl groups per molecule and (B) an epoxy compound having an average of 2 to 2.3 epoxy groups per molecule, wherein the reaction product is obtained by pre-reacting at least a part of hydroxyl groups on the polyphenylene ether (A) with epoxy groups on the epoxy compound (B) so that the concentration of terminal hydroxyl groups on the polyphenylene ether (A) becomes 700 μmol/g or less; (C) a cyanate ester compound; and (D) an organometallic salt. | 12-31-2015 |
20160060429 | THERMOSETTING RESIN COMPOSITION, PREPREG, METAL CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD - A thermosetting resin composition contains a thermosetting resin, a hardener capable of reacting with the thermosetting resin, and a flame retardant. The flame retardant contains a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture. | 03-03-2016 |