Patent application number | Description | Published |
20100265536 | Image processing method and image processing device - An image processing method for managing output jobs that are output to a plurality of logical devices includes: a storing step for storing the output job in a storing part for each plurality of logical devices; an output job managing step for managing the output job stored in the storing part; a grouped information selecting step for selecting grouped information for grouping the output job; and a display control step for displaying the output job stored in the storing part in a grouped manner based on the grouped information. | 10-21-2010 |
20110216356 | PRINT PROCESSING DEVICE, IMAGE PROCESSING DEVICE AND METHOD FOR SETTING PRINT MODE - A print processing device includes: a display device that displays a print preview of a print document; a plurality of application programs; an application specifying part that specifies the application program which is used to compose the print document; a print mode setting part that stores print mode setting information; an application determining part that determines whether or not the application program specified by the application specifying part is a program that is likely not to provide to the print mode setting part a print orientation information in correspondence with the print document as actually printed; a print preview display method deciding part that determines a display method of the print preview based on a determination result by the application determining part; and a print preview displaying part that displays the print preview according to the display method decided by the print preview display method deciding part. | 09-08-2011 |
20140078522 | IMAGE PROCESSING METHOD AND IMAGE PROCESSING SYSTEM - An information processor includes a first input unit configured to accept designation of an enlargement/reduction rate, an extraction unit configured to extract a first output setting for printout at the designated enlargement/reduction rate and a second output setting different from the first output setting for printout at the designated enlargement/reduction rate, a calculation unit configured to calculate a first fee for the first output setting and a second fee for the second output setting, a display configured to display the first output setting and the first fee in association with each other, and the second output setting and the second fee in association with each other, a second input unit configured to receive a selection of one of the first output setting and the second output setting, and a controller configured to cause the execution of image formation onto a medium with the selected output setting. | 03-20-2014 |
Patent application number | Description | Published |
20080218900 | MULTI-CHANNEL THIN-FILM MAGNETIC HEAD AND MAGNETIC TAPE DRIVE APPARATUS WITH THE MULTI-CHANNEL THIN-FILM MAGNETIC HEAD - A multi-channel thin-film magnetic head has magnetic read head elements, magnetic write head elements, servo magnetic head elements, a plurality of pairs of external connection pads for reading connected with magnetic read head elements, a plurality of pairs of external connection pads for writing connected with magnetic write head elements, a plurality of pairs of external connection pads for servo connected with servo magnetic head elements, and a plurality of connection pads for body grounding or other functions. The connection pads for reading, writing, servo and body grounding or other functions are arranged in lines on a surface of the multi-channel thin-film magnetic head, and lead conductors which are electrically connected with connection pads for reading, writing, servo and body grounding or other functions are different each other in terms of widths, shapes, connection points or existence of a connector among at least two types of connection pads. | 09-11-2008 |
20090086381 | MANUFACTURING METHOD OF THIN-FILM MAGNETIC HEAD WITH DISHING SUPPRESSED DURING POLISHING - A manufacturing method of a thin-film magnetic head with a dishing suppressed in the case of planarizing a magnetic shield which a read head portion has or a magnetic pole which a write head portion has is provided. A manufacturing method of a thin-film magnetic head comprising a read head portion for data reading which has at least two magnetic layers functioning as a magnetic shield and a write head portion for data writing which has two magnetic layers functioning as a magnetic pole is provided, in a process forming at least the lowest magnetic layer in at least the two magnetic layers functioning as the magnetic shield and the two magnetic layers functioning as the magnetic pole in the case of forming a plurality of thin-film magnetic head patterns on an element formation surface of the wafer substrate, which comprises steps of: forming this magnetic layer so as to reach a position which becomes a medium opposed surface at a middle portion to a trick width direction in each thin-film magnetic head pattern, and forming a dishing prevention portion at a position farther than this magnetic layer from the position which becomes the medium opposed surface in both sides or either side along the track width direction of this magnetic layer; forming a nonmagnetic insulating layer so as to cover the magnetic layer and the dishing prevention portion; and planarizing and polishing the magnetic layer, the dishing prevention portion, and the nonmagnetic insulating layer thereafter. | 04-02-2009 |
20100040957 | METHOD OF MEASURING DIMENSION OF PATTERN AND METHOD OF FORMING PATTERN - A method of measuring dimension of a first pattern with a narrow first width, and a second pattern with a second width wider than the first width of the first pattern and formed in a symmetrical appearance with respect to the pattern center, the second pattern having edges opposed to each other defining the second width, includes a step of forming a pair of first dummy patterns each having a narrow width, the pair of first dummy patterns being spaced from the edges of the second pattern respectively by a distance approximate to the first width of the first pattern, a first measurement step of measuring, using a dimension measuring device, a spaced distance of one of the first dummy patterns from the edge of the second pattern and a width of the one of the first dummy patterns within the same field of view of the dimension measuring device, a second measurement step of measuring, using the dimension measuring device, a width of the first pattern under the same measurement condition as that of the first measurement step, and a calculation step of calculating a width of the second pattern from W | 02-18-2010 |
20100237345 | WAFER AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT - The present invention relates to a wafer formed with an evaluation element and capable of improving productivity and a manufacturing method of an electronic component using the same. In a wafer according to the present invention, a plurality of elements connected to electrode films through lead-out conductive films are arranged and a chip area is defined for cutting out the plurality of elements in a given number. In the wafer, at least one evaluation element is formed in an area outside the chip area. The lead-out conductive films extend to the outside area and are connected to the evaluation elements. With this wafer, since the lead-out conductor is shared between the element and the evaluation element, the electrode film connected therewith can be shared, too. Accordingly, evaluation can be performed by using the evaluation element without the need of providing the wafer with a lead-out conductor and an electrode film exclusively for the evaluation element, so that the chip area to be cut out from the wafer can be made larger than before. | 09-23-2010 |
20100321822 | MANUFACTURING METHOD OF THIN-FILM MAGNETIC HEAD, WAFER FOR THIN-FILM MAGNETIC HEAD AND THIN-FILM MAGNETIC HEAD - A manufacturing method of a thin-film magnetic head, includes a step of forming many thin-film magnetic heads arranged along row and column directions on a wafer, each of the thin-film magnetic heads having a read head element, a write head element, and pairs of probe-use pads electrically connected with the read head element and the write head element, respectively, the pairs of probe-use pads being positioned so that at least part of each probe-use pad is removed by a cutting process along the row direction, a step of obtaining a plurality of row-bars by cutting the wafer along the row direction so that the at least part of each probe-use pad is removed, each of the obtained row-bars having the thin-film magnetic heads aligned in the row direction, a step of forming pairs of bonding pads electrically connected with the read head element and the write head element, respectively, on a surface opposite to an ABS of each thin-film magnetic head of each of the row-bars, and a step of cutting each row-bar along the column direction to separate into individual thin-film magnetic heads. | 12-23-2010 |