Patent application number | Description | Published |
20080203584 | Stacked-type semiconductor package - Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission path to a second semiconductor chip and are not formed on the first tape. An electric length of the second signal transmission path is allowed to be adjusted independently of the first tape, so that the electric length of the second signal transmission path can be easily made equal to or substantially equal to that of the first signal transmission path. | 08-28-2008 |
20090001548 | Semiconductor package - A semiconductor package which includes: a semiconductor chip which includes a signal terminal for inputting and outputting electrical signals and a ground terminal; and a package substrate which includes a semiconductor chip mounting surface on which the semiconductor chip is mounted, and a terminal electrode forming surface on which a signal terminal electrode electrically connected to the signal terminal and a ground terminal electrode electrically connected to the ground terminal are arranged in an array pattern, wherein: on the semiconductor chip mounting surface, there is provided a first signal wiring connected to the signal terminal, a ground wiring connected to the ground terminal, and a ground conductive layer connected to the ground wiring and is provided in a planar pattern in an area excluding the forming area of the first signal wiring; on the terminal electrode forming surface, there is provided a second signal wiring connected to the signal terminal electrode, and a ground fine wiring connected to the ground terminal electrode; and the first signal wiring and the second signal wiring are connected via a conductor filled in a signal through hole penetrating the package substrate, and the ground conductive layer and the ground fine wiring are connected via a conductor filled in a ground through hole penetrating the package substrate. | 01-01-2009 |
20090086522 | ADDRESS LINE WIRING STRUCTURE AND PRINTED WIRING BOARD HAVING SAME - An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL | 04-02-2009 |
20090140766 | Signal transmission circuit and characteristic adjustment method thereof, memory module, and manufacturing method of circuit board - A signal transmission circuit comprising: first and second transmission lines connected to each other; a first impedance storage circuit storing an impedance of the first transmission line; and a control circuit that outputs match information between an impedance of the second transmission line and the impedance stored in the first impedance storage circuit. | 06-04-2009 |
20100309706 | Load reduced memory module and memory system including the same - A memory module includes a plurality of memory chips, a plurality of data register buffers, and a command/address/control register buffer mounted on a module PCB. The data register buffers perform data transfers with the memory chips. The command/address/control register buffer performs buffering of a command/address/control signal and generates a control signal. The buffered command/address/control signal is supplied to the memory chips, and the control signal is supplied to the data register buffers. According to the present invention, because line lengths between the data register buffers and the memory chips are shortened, it is possible to realize a considerably high data transfer rate. | 12-09-2010 |
20100312925 | Load reduced memory module - A memory module includes a plurality of data connectors provided along a long side of a module substrate, a plurality of memory chips and a plurality of data register buffers mounted on the module substrate, a data line that connects the data connectors and the data register buffers, and data lines that connect the data register buffers and the memory chips. Each of the data register buffers and a plurality of data connectors and a plurality of memory chips corresponding to the data register buffer are arranged side by side in a direction of a short side of the module substrate. According to the present invention, because each line length of the data lines is considerably shortened, it is possible to realize a considerably high data transfer rate. | 12-09-2010 |
20100312956 | Load reduced memory module - A memory module includes a plurality of memory chips and a plurality of data register buffers mounted on the module substrate. At least two memory chips are allocated to each of the data register buffers. Each of the data register buffers includes M input/output terminals (M is a positive integer equal to or larger than 1) that are connected to the data connectors via a first data line and N input/output terminals (N is a positive integer equal to or larger than 2M) that are connected to corresponding memory chips via second and third data lines, so that the number of the second and third data lines is N/M times the number of the first data lines. According to the present invention, because the load capacities of the second and third data lines are reduced by a considerable amount, it is possible to realize a considerably high data transfer rate. | 12-09-2010 |
20120127675 | APPARATUS HAVING A WIRING BOARD AND MEMORY DEVICES - An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL | 05-24-2012 |
20130135916 | MEMORY MODULE INCLUDING PLURAL MEMORY DEVICES AND DATA REGISTER BUFFER - Disclosed herein is a memory module that includes a module substrate, data connectors, memory devices, and data register buffers. A first main surface of the module substrate has first and second memory mounting areas. One of the first and second main surfaces of the module substrate has a register mounting area located between the first and second memory mounting areas in a planner view. The memory devices include a plurality of first memory devices that are mounted on the first memory mounting area and a plurality of second memory devices that are mounted on the second memory mounting area. The data register buffers are mounted on the register mounting area. The data register buffers transfers write data supplied from the data connectors to the memory devices, and transfers read data supplied from the memory devices to the data connectors. | 05-30-2013 |
20130138898 | MEMORY MODULE INCLUDING PLURAL MEMORY DEVICES AND COMMAND ADDRESS REGISTER BUFFER - Disclosed herein is a memory module that includes a plurality of command address connectors formed on the module substrate, a plurality of memory devices mounted on the module substrate, and a plurality of command address register buffers mounted on the module substrate. The command address connectors receive a command address signal from outside. The memory devices include a plurality of first memory devices and a plurality of second memory devices. The command address register buffers include a first command address register buffer that supplies the command address signal to the first memory devices and a second command address register buffer that supplies the command address signal to the second memory devices. | 05-30-2013 |
20130163353 | SEMICONDUCTOR DEVICE HAVING ODT FUNCTION - Disclosed herein is a device that includes: a data strobe terminal; a data terminal; a first output driver coupled to the data strobe terminal; a second output driver coupled to the data terminal; and a data control circuit configured to enable the first and second output drivers to function as termination resistors in different timings from each other. | 06-27-2013 |
20130215659 | LOAD REDUCED MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME - A device includes a printed circuit board, a clock connector provided on the printed circuit board and configured to be supplied with a first clock signal, a first register buffer provided on the printed circuit board, coupled to the clock connector and, including a first clock generator that produces a second clock signal in response to the first clock signal, a plurality of data connectors, provided on the printed circuit board, a plurality of memory chips each provided on the printed circuit board and including a first data terminal, and a plurality of second register buffers each provided on the printed circuit board independently of the first register buffer. | 08-22-2013 |
20140001639 | SEMICONDUCTOR DEVICE HAVING SILICON INTERPOSER ON WHICH SEMICONDUCTOR CHIP IS MOUNTED | 01-02-2014 |
Patent application number | Description | Published |
20120176385 | DISPLAY CONTROLLER, DISPLAY CONTROL METHOD, AND COMPUTER-READABLE STORAGE MEDIUM - A display controller which displays an electronic book and enables a user to perform intuitive operations when switching between pages to be displayed. A CPU detects a cursor position on the most frontally-displayed one of a plurality of pages in response to a user operation. Further, the CPU extracts respective areas of shapes dependent on the detected cursor position, from an image representing the most frontally-displayed page and an image representing a reverse page with respect to the most frontally-displayed page. Then, the CPU draws the extracted areas on the screen. | 07-12-2012 |
20140149904 | INFORMATION PROCESSING APPARATUS, METHOD FOR CONTROLLING THE SAME, AND STORAGE MEDIUM - An information processing apparatus displays a list of a plurality of objects on a display unit, and, if a first selection instruction to select one of the displayed objects is input, assigns layout order to the selected object. If a second selection instruction to collectively select a plurality of the displayed objects is input, the information processing apparatus assigns layout order to the selected plurality of objects in order continuous with the layout order already assigned to the object and based on a predetermined condition. According to the information processing apparatus, a user can assign specified desired order to each individual object while automatically and collectively assigning order to a plurality of objects based on the predetermined condition. | 05-29-2014 |
20140340714 | BOOKBINDING PRINTING SYSTEM, INFORMATION PROCESSING APPARATUS, METHOD FOR CONTROLLING THE SAME, AND STORAGE MEDIUM - The present invention is directed to, even when dividing an image arranged between a plurality of pages constituting facing pages before bookbinding printing, preventing different results of correction processing of images on the facing pages after bookbinding printing. An editing system lays out images on facing pages, divides an image laid out on facing pages to generate division images for respective single-side pages, and inserts the division images into the respective single-side pages to generate respective document data. Then, a printing control system extracts division images from the document data, combines the division images, performs correction processing on the combined image, divides the corrected combined image, inserts the division images into the respective document data to update it, and performs print processing based on the updated document data. | 11-20-2014 |