Hinata, JP
Kunihiko Hinata, Nirasaki-Shi JP
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20100126668 | PLASMA PROCESSING APPARATUS AND METHOD - An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency is connected to the upper electrode. A second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber while any one of application voltage, application current, and application power from the variable DC power supply to the upper electrode is controlled, to generate plasma of the process gas so as to perform plasma etching. | 05-27-2010 |
20110214815 | PLASMA PROCESSING APPARATUS AND METHOD - An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency, and a second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber to generate plasma of the process gas so as to perform plasma etching. | 09-08-2011 |
20110272097 | PLASMA PROCESSING APPARATUS AND METHOD - A plasma etching apparatus includes an upper electrode and a lower electrode, between which plasma of a process gas is generated to perform plasma etching on a wafer W. The apparatus further comprises a cooling ring disposed around the wafer, a correction ring disposed around the cooling ring, and a variable DC power supply directly connected to the correction ring, the DC voltage being preset to provide the correction ring with a negative bias, relative to ground potential, for attracting ions in the plasma and to increase temperature of the correction ring to compensate for a decrease in temperature of a space near the edge of the target substrate due to the cooling ring. | 11-10-2011 |
20120145324 | PLASMA PROCESSING APPARATUS AND METHOD - An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency is connected to the upper electrode. A second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber while any one of application voltage, application current, and application power from the variable DC power supply to the upper electrode is controlled, to generate plasma of the process gas so as to perform plasma etching. | 06-14-2012 |
20140124139 | PLASMA PROCESSING APPARATUS AND METHOD - A plasma processing apparatus includes a first and second electrodes disposed on upper and lower sides and opposite each other within a process container, a first RF power application unit and a DC power supply both connected to the first electrode, and second and third radio frequency power application units both connected to the second electrode. A conductive member is disposed within the process container and grounded to release through plasma a current caused by a DC voltage applied from the DC power supply. The conductive member is supported by a first shield part around the second electrode and laterally protruding therefrom at a position between the mount face of the second electrode and an exhaust plate for the conductive member to be exposed to the plasma. The conductive member is grounded through a conductive internal body of the first shield part. | 05-08-2014 |
20140326409 | PLASMA PROCESSING APPARATUS AND METHOD - An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency is connected to the upper electrode. A second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber while any one of application voltage, application current, and application power from the variable DC power supply to the upper electrode is controlled, to generate plasma of the process gas so as to perform plasma etching. | 11-06-2014 |
Masato Hinata, Tokyo JP
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20100008808 | SLIDING FACE MODIFICATION MATERIAL, METHOD FOR PRODUCING SLIDING FACE MODIFICATION MATERIAL, METHOD FOR USING SLIDING FACE MODIFICATION MATERIAL, SLIDING MEMBERS HAVING SLIDING FACE MODIFICATION MATERIAL, AND COMPRESSOR COMPRISING SLIDING MEMBERS - A highly reliable sliding face modification material capable of forming a stable film of molybdenum disulfide on the sliding face of a sliding member, the sliding face modification material having a molybdenum disulfide content of 95 wt % or more and an organic material content of 1500 ppm or less in weight ratio, and the sliding face modification material being projected onto the sliding face to form a coating layer. | 01-14-2010 |
20120264355 | POLISHING METHOD BY BLASTING AND NOZZLE STRUCTURE FOR A BLASTING APPARATUS FOR USE IN THE POLISHING METHOD - In a polishing performed by imparting kinetic energy to abrasive using a compressed gas flow, horizontal cutting force is obtained while vertical cutting force acting on a surface of a workpiece is inhibited. A compressed gas containing no abrasive is ejected from an accelerated flow generation nozzle | 10-18-2012 |
20130303053 | METHOD AND DEVICE FOR CUTTING OUT HARD-BRITTLE SUBSTRATE - To cut out a hard-brittle substrate by blasting, laying out substrates | 11-14-2013 |
20140065930 | SCRIBING METHOD AND BLASTING MACHINE FOR SCRIBING - To provide a scribing method by blasting that allows forming a groove at high accuracy without masking, a blasting machine that includes an ejection nozzle having a slit-shaped ejection opening with a width of 10 to 500 μm and a length of 5 to 5000 times the width, and an abrasive with a median diameter equal to or less than one-half of a width of the ejection opening of the ejection nozzle and with a maximum particle diameter smaller than a width of the ejection opening are used; and the abrasive is ejected together with compressed gas on a surface of a workpiece at an ejection distance of 0.1 to 3.0 mm without masking so that an ejection quantity of the abrasive is to be 0.25 cm | 03-06-2014 |
20160023325 | SCRIBING METHOD AND BLASTING MACHINE FOR SCRIBING - To provide a scribing method by blasting that allows forming a groove at high accuracy without masking, a blasting machine that includes an ejection nozzle having a slit-shaped ejection opening with a width of 10 to 500 μm and a length of 5 to 5000 times the width, and an abrasive with a median diameter equal to or less than one-half of a width of the ejection opening of the ejection nozzle and with a maximum particle diameter smaller than a width of the ejection opening are used; and the abrasive is ejected together with compressed gas on a surface of a workpiece at an ejection distance of 0.1 to 3.0 mm and an ejection pressure of 0.2 MPa to 0.6 MPa without masking so that 0.25 cm | 01-28-2016 |
Nae Hinata, Tokyo JP
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20130337501 | CELL ANALYZING APPARATUS AND CELL ANALYZING METHOD - A cell analyzing apparatus includes: a histogram acquirer which is configured to perform measurement of a number of nuclear stained cells, and which, by using a result of the measurement, is configured to acquire a histogram indicating a fluorescence intensity; and an analysis controller which is configured to apply frequency analysis on data of the histogram acquired by the histogram acquirer, and which is configured to determine existence/nonexistence of cancer cells based on a result of the frequency analysis. | 12-19-2013 |
20150078649 | CELL ANALYZING APPARATUS AND CELL ANALYZING METHOD - A cell analyzing apparatus includes: a first histogram acquiring section which is configured to acquire a first histogram of fluorescence intensities by using a result of a measurement of a number of nuclear stained cells; a second histogram acquiring section which is configured to acquire a second histogram that is normalized based on a fluorescence intensity value indicating a maximum value of the first histogram; a determining section which is configured to determine whether cancer cells exist or not, based on one of the first histogram and the second histogram; and an outputting section which is configured to output a result of the determination performed by the determining section. | 03-19-2015 |
Osamu Hinata, Kakuda-Shi JP
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20090090807 | Coil winding system and method for fabricating molded coil - There is provided a system for readily and efficiently fabricating a wound coil composed of a bobbinless coil. The system includes a coil winding device having an upper jig to which an upper plate is attached and a lower jig to which a lower plate is attached which are provided so as to be relatively displaceable and a tension device for applying predetermined tension to a wire rod fed from a wire rod supplying source. The coil winding device is provided with a claw section having first through third split claws that function as a winding section around which the wire rod is wound between the upper and lower plates and that slide in a radial direction when the upper jig is assembled coaxially with the lower jig. | 04-09-2009 |
20120280424 | COIL WINDING SYSTEM AND METHOD FOR FABRICATING MOLDED COIL - There is provided a system for readily and efficiently fabricating a wound coil composed of a bobbinless coil. The system includes a coil winding device having an upper jig to which an upper plate is attached and a lower jig to which a lower plate is attached which are provided so as to be relatively displaceable and a tension device for applying predetermined tension to a wire rod fed from a wire rod supplying source. The coil winding device is provided with a claw section having first through third split claws that function as a winding section around which the wire rod is wound between the upper and lower plates and that slide in a radial direction when the upper jig is assembled coaxially with the lower jig. | 11-08-2012 |
20120286085 | COIL WINDING SYSTEM AND METHOD FOR FABRICATING MOLDED COIL - There is provided a system for readily and efficiently fabricating a wound coil composed of a bobbinless coil. The system includes a coil winding device having an upper jig to which an upper plate is attached and a lower jig to which a lower plate is attached which are provided so as to be relatively displaceable and a tension device for applying predetermined tension to a wire rod fed from a wire rod supplying source. The coil winding device is provided with a claw section having first through third split claws that function as a winding section around which the wire rod is wound between the upper and lower plates and that slide in a radial direction when the upper jig is assembled coaxially with the lower jig. | 11-15-2012 |
Ryousuke Hinata, Osaka-Shi JP
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20130125753 | Method and Apparatus for Cleaning a Filter for Removing Particulate Matter - An apparatus | 05-23-2013 |
Sachiko Hinata, Odawara JP
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20080229118 | Storage apparatus - Provided is a storage apparatus capable of encrypting data without affecting the business performance. This storage apparatus includes a cache memory, a first controller for controlling the writing of data in the cache memory pursuant to the write command, a second controller for controlling the writing of the data written in the cache into the storage devices, and an encryption engine for encrypting data pursuant to the write command. When the second controller reads the data from the cache memory and writes the data in said storage devices, the encryption engine encrypts the data, and the second controller writes the encrypted data in said storage devices. | 09-18-2008 |
20100198987 | STORAGE SYSTEM, PATH MANAGEMENT METHOD AND PATH MANAGEMENT DEVICE - Proposed are a storage system, a path management method and a path management device capable of ensuring the processing performance demanded by a user while seeking to improve the access performance from a host system to a storage apparatus. Path switching control for dynamically switching the path to be used by the host system according to the loaded condition of the respective paths between the host system and the storage apparatus is executed; and a path is selected as needed according to a policy containing path switching rules created by a user, and path switching control for excluding the selected path from the target and dynamically switching the path to be used by the host system is executed. | 08-05-2010 |
Shintaro Hinata, Sendai-Shi JP
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20140104997 | MAGNETIC RECORDING MEDIUM, METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING AND REPRODUCING DEVICE - A magnetic recording medium is disclosed in which, on a non-magnetic substrate | 04-17-2014 |
Shoji Hinata, Nagano JP
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20140001025 | ELECTROSTATIC CAPACITANCE TYPE INPUT APPARATUS AND DISPLAY APPARATUS WITH INPUT FUNCTION INCLUDING THE SAME | 01-02-2014 |
Shoji Hinata, Azumino-Shi JP
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20080220184 | ELECTRO-OPTIC DEVICE AND ELECTRONIC APPARATUS - An electro-optic device includes an electro-optic panel, a transparent protective member disposed at a viewer side of the electro-optic panel, an adhesive provided between the electro-optic panel and the transparent protective member, and a gas barrier film provided on a surface of the transparent protective member at a side opposite to the viewer side. | 09-11-2008 |
Shoji Hinata, Tokyo JP
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20160077389 | LIQUID CRYSTAL DISPLAY DEVICE - According to one embodiment, a liquid crystal display device includes a first substrate including a first insulative substrate, a gate line, a source line, a switching element, a pixel electrode, and a common electrode a second substrate including a second insulative substrate, a light shield layer disposed on that side of the second insulative substrate, which is opposed to the first substrate, and partitioning the pixels, and a shield electrode stacked on that side of the light shield layer, which is opposed to the first substrate, and formed of a metallic material, and a liquid crystal layer held between the first substrate and the second substrate. | 03-17-2016 |
Shoji Hinata, Aichi-Ken JP
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20130201122 | TOUCH PANEL, DISPLAY DEVICE, AND ELECTRONIC APPARATUS - Disclosed herein is a touch panel including: a sensor substrate and a cover substrate stuck to each other. The sensor substrate includes a sensor electrode, and plural signal wirings electrically connected to the sensor electrode and extending along a periphery of the sensor electrode. The cover substrate includes one or plural conductive layers extending along the periphery of the sensor electrode and the plural signal wirings within an area not facing the sensor electrode and the plural signal wirings. | 08-08-2013 |
Shoji Hinata, Matsumoto JP
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20080246741 | INPUT DEVICE, AND ELECTRO-OPTICAL DEVICE - An input device includes an input panel, a cover member that is provided with a housing portion, in which the input panel is housed, and a film member that is disposed over a main surface of the input panel provided in the housing portion and a main surface of the cover member. | 10-09-2008 |
20090096754 | TOUCH PANEL, ELECTRO OPTICAL DEVICE, AND ELECTRONIC APPARATUS - There is provided a touch panel including a first substrate, a second substrate opposing the first substrate, a first electrode film formed on the first substrate, a second electrode film formed on the second substrate, the second electrode film opposing the first electrode film. An openings is formed in each of the first electrode film and the second electrode film, and the opening formed in the first electrode film and the opening formed in the second electrode film are overlapped in plan view and each of the openings has a different opening area. | 04-16-2009 |
20090096762 | INPUT DEVICE, DISPLAY DEVICE WITH INPUT FUNCTION, AND ELECTRONIC APPARATUS - An input device includes: a resistive film type input unit; and a non-contact type input unit that overlaps at least a portion of the resistive film type input unit. The resistive film type input unit includes: first and second substrates each having a first surface and a second surface; a first electrode that is formed on the first surface of the first substrate; and a second electrode that is formed on the first surface of the second substrate. The second substrate is provided on an input operation side of the first substrate, and the first electrode of the first substrate faces the second electrode of the second substrate. The resistive film type input unit is in a standby state that does not perform input detection until an input to the non-contact type input unit is detected. When the input to the non-contact type input unit is detected, the resistive film type input unit is turned on to perform input detection. | 04-16-2009 |
20090096763 | TOUCH PANEL, DISPLAY DEVICE WITH INPUT FUNCTION, AND ELECTRONIC APPARATUS - A touch panel includes: first and second substrates each having a first surface and a second surface, the second substrate being arranged on an input operation side of the first substrate; a first electrode that is formed on the first surface of the first substrate; a second electrode that is formed on the first surface of the second substrate; a resistive film type input area in which the first electrode of the first substrate and the second electrode of the second substrate face each other; and a capacitance type input area in which third electrodes are formed on at least one of the first substrate and the second substrate. The resistive film type input area and the capacitance type input area are separated from each other in plan view. | 04-16-2009 |
20100059293 | RESISTIVE FILM TYPE INPUT DEVICE, DISPLAY DEVICE WITH INPUT FUNCTION, AND ELECTRONIC APPARATUS - A resistive film type input device includes: a resistive film which is formed on a surface of the first insulating substrate opposed to the second insulating substrate; feeding electrodes which apply a voltage to the resistive film on the first insulating substrate; a detecting electrode films which are formed on a surface of the second insulating substrate are in an electrically floating state; and a potential detecting unit which detects a potential of a contact location of the resistive film through the detecting electrode film contacted to the resistive film among the detecting electrode films by pressing against. | 03-11-2010 |
Takao Hinata, Kanagawa-Ken JP
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20090039687 | LOCKING DEVICE FOR SEAT BACK - A locking device for a seat back includes release preventing means for preventing the locking device from being unintendedly released by the fact that a second arm portion of a lift lever abuts on a side edge portion of a guide hole of a lock plate to cause the lift lever to rotate positively when a base plate rotates forward along a horizontal direction about a lock pin in a state where the lock pin engages with a lock hole of the lock plate and the second arm portion of the lift lever is located in the guide hole of the lock plate when the seat back is held at a rising position. | 02-12-2009 |
Tatsuya Hinata, Minami-Alps-Shi JP
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20130008700 | METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD - On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit. | 01-10-2013 |
Toshifumi Hinata, Tokyo JP
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20140253001 | MOTOR ROTATIONAL POSITION DETECTING DEVICE, WASHING MACHINE AND MOTOR ROTATIONAL POSITION DETECTING METHOD - A motor rotational position detecting device includes a control current command output unit configured to generate and supply a torque current command and an excitation current command according to a control command for a permanent magnet motor having magnetic saliency, when receiving a control command. The control current command output unit includes a command value storage unit configured to store a value of the excitation current command supplied so that a rotational position error amount obtained by a rotational position detection unit is rendered zero when the control current command output unit supplies any torque current command value while the motor maintains any rotational position. When generating the torque current command in response to the control command, the control current command output unit is configured to read from the command value storage unit an excitation current command corresponding to the torque current command and to set the read command. | 09-11-2014 |
Tsutae Hinata, Suwa-Shi JP
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20150276499 | CIRCUIT DEVICE, TEMPERATURE DETECTION DEVICE, ELECTRONIC DEVICE, AND TEMPERATURE DETECTION METHOD - A circuit device including: a detection circuit ( | 10-01-2015 |
Yohei Hinata, Yokohama-Shi JP
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20130081942 | Thin Film Formation Method and Thin Film Formation Apparatus - A thin film formation method is provided, by which needless film formation due to trial film formation is omitted and film formation efficiency can be improved. This invention is a method for sputtering targets to form a film A having an intended film thickness of T | 04-04-2013 |
Yohei Hinata, Kanagawa JP
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20120105872 | OPTICAL FILM THICKNESS METER AND THIN FILM FORMING APPARATUS PROVIDED WITH OPTICAL FILM THICKNESS METER - An optical film thickness meter capable of measurement of an optical film thickness and spectroscopic characteristics with high accuracy and a thin film forming apparatus provided with the optical film thickness meter are provided. The optical film thickness meter includes a light projector ( | 05-03-2012 |
Yu Hinata, Osaka JP
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20140194420 | AZABENZIMIDAZOLE DERIVATIVE HAVING AMPK-ACTIVATING ACTIVITY - Disclosed is a compound which is useful as an AMPK activator. | 07-10-2014 |
Yu Hinata, Toyonaka-Shi JP
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20150203450 | INDOLE AND AZAINDOLE DERIVATIVE HAVING AMPK-ACTIVATING ACTIVITY - Disclosed is a compound which is useful as an AMPK activator. A compound represented by formula: | 07-23-2015 |
Yuichi Hinata, Shizuoka JP
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20150035318 | DIVISIONAL COWL-TOP COVER - The present invention is directed to a divisional cowl-top cover. In an upper cowl-top cover, a first engaging claw is formed on a front face side of a supporting portion configured to support a sealing member, and at an upper end of a lower cowl-top cover, a second engaging-receiving portion configured to engage with the first engaging claw from an upper side is formed. If an impact load acts on a hood and then the upper cowl-top cover moves downward, the first engaging claw and the second engaging-receiving portion are disengaged from each other, and the upper cowl-top cover lowers while supporting lowering of the hood, and is capable of absorbing the impact load while lowering. | 02-05-2015 |
Yuichiro Hinata, Nagano JP
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20160126209 | SEMICONDUCTOR DEVICE - A semiconductor device includes: an insulating substrate including an insulating plate and a circuit board on the insulating plate; a semiconductor chip having an electrode on a front surface thereof, a back of the semiconductor chip being fixed to the circuit board; a printed circuit board that faces the circuit board and the front surface of the semiconductor chip; and one or more conductive posts each having one end connected via solder to the circuit board or to the electrode on the semiconductor chip, another end connected to the printed circuit board, and one or more grooves that extend from said one end of the conductive post that contacts the solder to said another end of the conductive post connected to the printed circuit board. | 05-05-2016 |
Yukimasa Hinata, Higashine JP
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20090288678 | METHOD FOR MANUFACTURING DISK - A disk manufacturing method that includes: processing a surface of a disk while rotating the disk; cleaning the surface of the disk after the processing to remove a processing residue from the disk; drying the disk after the cleaning; and end-face cleaning that cleans an end-face of the disk while rotating the disk, the end-face cleaning being performed concurrently with at least one of the processing and the cleaning. | 11-26-2009 |