Patent application number | Description | Published |
20090134073 | Method and device for screening out particles - The invention relates to a method and a device for screening first particles out of a granulate comprised of first and second particles by conveying the granulate along a first screen surface which extends outward from a vibrating device, wherein the first particles have an aspect ratio a | 05-28-2009 |
20090134251 | Method for Recovering and/or Recycling Material - A method for recovering and/or recycling starting silicon material by crushing the starting material. The recovered or recycled material is melted, and crystals, e.g. as a silicon block, tube, or strip, are grown from the obtained melt. To use starting materials that have a high aspect ratio to be able to convey the same without any problem, broken polycrystalline needle-shaped Si material (material I) containing particles having an aspect ratio A | 05-28-2009 |
20100213299 | Method for recovering and/or recycling material - A method for recovering and/or recycling starting silicon material by crushing the starting material. The recovered or recycled material is melted, and crystals, e.g. as a silicon block, tube, or strip, are grown from the obtained melt. To use starting materials that have a high aspect ratio to be able to convey the same without any problem, broken polycrystalline needle-shaped Si material (material I) containing particles having an aspect ratio A | 08-26-2010 |
20110132451 | SOLDER SUPPORTING LOCATION FOR SOLAR MODULES AND SEMICONDUCTOR DEVICE - A soldered connection between an outer surface of a semiconductor device, connected to a substrate by means of an adhesive layer, and a connector in the form of a strip. In order that tensile forces acting on the connector do not cause the semiconductor device to become detached from the substrate or the adhesive layer, it is proposed that a supporting location extends from the outer surface of the semiconductor device, which supporting location is formed of solderable material and makes contact with the outer surface by way of a contact surface A, in or on which the connector is soldered while maintaining a distance a from the outer surface where a≧10μ; and/or that the distance b between the edge of the contact surface between the supporting surface and the outer surface and the entry of the connector into the supporting location or the beginning of contact therebetween is b≧50μ. | 06-09-2011 |
20110272453 | METHOD AND DEVICE FOR INTRODUCING SOLDER ONTO A WORKPIECE - A method and a device for introducing solder onto a solar cell is provided. The method and device employ a solder wire introduced in the molten state onto the solar cell under the action of ultrasonic vibrations applied by a sonotrode. Solder is introduced very precisely onto the solar cell, without subjecting the solar cell to undesirably high temperatures, by introducing the solder wire into a gap running between a heating device and the sonotrode, which applies ultrasonic vibrations and melts and flows through the gap onto the solar cell. | 11-10-2011 |
20120307236 | METHOD AND DEVICE FOR DETECTING CRACKS IN SEMICONDUCTOR SUBSTRATES - The invention relates to a method and an apparatus for detecting cracks in semiconductor substrates, such as silicon wafers and solar cells. The method and apparatus are based on the detection of light deflected at a crack. | 12-06-2012 |
20140060611 | Method for Soldering Solar Cell Contacts on Aluminium Connection-Conductors - The invention relates to a method for connecting solder-coated connection leads ( | 03-06-2014 |
20140138425 | METHOD FOR THE COHESIVE CONNECTION OF ELEMENTS - The invention relates to a method for the cohesive connection of a first element ( | 05-22-2014 |
20140318613 | SOLAR CELL - A solar cell is provided that includes a semiconductor substrate with a front-side contact and a rear-side contact. The front-side contact includes contact fingers running parallel to one another and at least one busbar running transversely with respect thereto. A connector runs along the busbar and is cohesively connected thereto. In order to avoid cracking in the event of forces acting on the connector, the busbar includes sections that have soldering edges and over which the connector extends. | 10-30-2014 |
20140318614 | BACK-CONTACT SOLAR CELL AND METHOD FOR PRODUCING SUCH A BACK-CONTACT SOLAR CELL - A method for producing a solar cell that has a semiconductor substrate of a first conductivity type. The method includes producing a plurality of passage openings, creating a layer of a conductivity type opposite the first conductivity type along a front side, producing a front-side contact in the form of a metallization and a back-side contact. Electrically conductive front-side contact areas bound the passage openings on the front side and are formed when the front-side contact is formed. The passage openings are provided with an electrically insulating first layer on the inside, and an electrically conductive material is subsequently introduced, starting from a back side, through the passage openings up to the front-side contact areas while back-side contact areas are simultaneously formed. | 10-30-2014 |
20150050773 | METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONTACT ON A SOLAR CELL - A method is provided for producing an electrically conductive contact on a rear face and/or front face of a solar cell. The method interconnects solar cells in a cost-effective manner and ensures that cell damage, which leads to a reduction in power, is avoided. The rear face and/or front face of the solar cell is treated in the region of the contact and, after the treatment in the region, a pasty adhesive or an adhesive tape is applied in strips. | 02-19-2015 |