Patent application number | Description | Published |
20080197115 | Electrical Discharge Machine - An electrical discharge machine feeds an electrode wire received within a guide tube to a process region of a machined article. The electrical discharge machine includes a cylindrical hollow driving shaft arranged in a vertical direction, which has a space for receiving the guide tube with the electrode wire along a vertical central axis. A head assembly includes a first holding member for holding the guide tube, and a second holding member for holding the electrode wire extending from a bottom opening of the guide tube. The head assembly is detachably coupled with a bottom portion of the driving shaft. Therefore, the electrode wire can be replaced by replacing the head assembly. | 08-21-2008 |
20110092053 | WIRE DISCHARGE-MACHINING APPARATUS AND WIRE DISCHARGE-MACHINING METHOD, SEMICONDUCTOR WAFER MANUFACTURING APPARATUS AND SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND SOLAR-CELL WAFER MANUFACTURING APPARATUS AND SOLAR-CELL WAFER MANUFACTURING METHOD - A wire machining method includes: a wire electrode set as cutting wires provided in parallel with a distance between the cutting wires of which a predetermined regional part faces a workpiece; a machining power source that generates a pulse-shaped machining voltage; and plural feeder units that are electrically connected to the plural cutting wires respectively of the wire electrode and supply the machining voltage between the cutting wires and the workpiece respectively. The feeder units are arranged such that a direction of a current passed to at least a part of the cutting wires becomes a direction different from a direction of a current passed to other cutting wires. | 04-21-2011 |
20120217224 | WIRE ELECTRIC DISCHARGE MACHINING APPARATUS, WIRE ELECTRIC DISCHARGE MACHINING METHOD, THIN BOARD MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD - A wire electric discharge machining apparatus is constructed in such a manner as to include: a wire electrode having a plurality of cutting wire portions that are separated from one another in parallel and are opposed to a workpiece; a machining power supply that generates a pulsed machining voltage; a plurality of power feed contact units that are electrically connected to the cutting wire portions and apply the machining voltage between the cutting wire portions and the workpiece; and a nozzle that ejects machining liquid from an ejection opening toward an electrode gap along the cutting wire portions. | 08-30-2012 |
20120312787 | ELECTRICAL DISCHARGE MACHINING APPARATUS AND ELECTRICAL DISCHARGE MACHINING METHOD - An electrical discharge machining apparatus includes a machining electrode that is one wire and includes a plurality of opposing sections with respect to a workpiece by being wound around a plurality of guide rollers, driving units that change a relative distance between the workpiece and the opposing sections, and a plurality of pulse generating units that apply electrical discharge machining pulses between the workpiece and the opposing sections, respectively, in which the pulse generating units are controlled such that application start times of electrical discharge machining pulses for adjacent opposing sections do not coincide with each other. | 12-13-2012 |
20130043217 | WORKPIECE RETAINER, WIRE ELECTRIC DISCHARGE MACHINING DEVICE, THIN-PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR-WAFER MANUFACTURING METHOD - A workpiece retainer retains a workpiece at a time of a cutting process by a wire electric discharge machining device that cuts a workpiece by electric discharge from wire electrodes that are spaced from each other and are arranged in parallel. The workpiece retainer is formed with a fitting portion, into which the workpiece is fitted substantially without any gap, and has an external shape such that at a time of cutting the workpiece retainer together with the workpiece fitted in the fitting portion, a length along the wire electrodes of a portion where the workpiece retainer and the workpiece face the wire electrodes becomes substantially constant during the cutting process of the workpiece. | 02-21-2013 |
20130140277 | WIRE ELECTRIC DISCHARGE MACHINING APPARATUS, WIRE ELECTRIC DISCHARGE MACHINING METHOD, THIN PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD - A wire electric discharge machining apparatus includes a wire electrode, a guide roller that arranges wire electrodes in parallel by winding the wire electrode therearound, a plurality of slidable contact conductors that are in slidable contact with the wire electrodes arranged in parallel, respectively, and a power feeding jig that holds the slidable contact conductors individually and feeds power individually to the wire electrodes arranged in parallel via each of the slidable contact conductors, in which the power feeding jig includes a plurality of reference surfaces that determine a fixing interval between the slidable contact conductors. | 06-06-2013 |
20130240487 | WIRE-CUT ELECTRICAL DISCHARGE MACHINING APPARATUS AND SEMICONDUCTOR WAFER MANUFACTURING METHOD - In wire-cut electrical discharge machining apparatuses that simultaneously perform a plurality of cutting processes by engaging a wire between main guide rollers at a plurality of times, a wire-cut electrical discharge machining apparatus is provided that suppresses vibrations at cutting wire sections, to enable the cutting processes under steady-state accuracy. In addition to the main guide rollers, vibration-damping driven guide rollers or vibration-damping guides are included which form a plurality of cutting wire sections where the vibrations are suppressed by guiding the wire into place, and the positions of the cutting wire sections are thereby defined with respect to nozzles. | 09-19-2013 |
20150053650 | WIRE DISCHARGE MACHINING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR WAFERS USING THE SAME - A wire discharge machining apparatus including a plurality of main guide rollers disposed in parallel at intervals, one wire that is wound between the guide rollers while being spaced apart from one another at a fixed pitch to form cutting wire sections between a pair of guide rollers and travels according to the rotation of the main guide rollers, and power feed terminal units that feed electric power to wires of the cutting wire sections. The wire discharge machining apparatus performs cutting of a work piece with the cutting wire sections, suspends cut-out of semiconductor wafers from the work piece in a state in which a part of the semiconductor wafers is connected to the work piece, brings the wires of the cutting wire sections close to one cut surfaces, and scans the cut surfaces in a discharge-machined state. | 02-26-2015 |