Patent application number | Description | Published |
20090298283 | CONDUCTIVE COMPOSITIONS AND PROCESSES FOR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES - ORGANIC MEDIUM COMPONENTS - Embodiments of the invention relate to a silicon semiconductor device, and a conductive paste for use in the front side of a solar cell device. | 12-03-2009 |
20100170567 | CONDUCTIVE PASTE AND GRID ELECTRODE FOR SILICON SOLAR CELLS - A conductive paste for grid electrodes in solar cells includes a conductive component, glass frit, and resin binder, wherein the conductive component is selected from the group consisting of (i) silver particles and metal particles selected from the group consisting of Pd, Ir, Pt, Ru, Ti, and Co, (ii) alloy particles comprising silver and metal selected from the group consisting of Pd, Ir, Pt, Ru, Ti, and Co, and (iii) silver particles and core-shell particles in which a metal selected from the group consisting of Pd, Ir, Pt, Ru, Ti, and Co is coated on the surface of silver or copper. | 07-08-2010 |
20110197963 | PASTE FOR BACK CONTACT-TYPE SOLAR CELL - Disclosed is a back contact-type solar cell wherein both of n | 08-18-2011 |
20110201147 | PASTE FOR BACK CONTACT-TYPE SOLAR CELL - Disclosed is a method for producing a solar cell electrode, comprising the steps of: ( | 08-18-2011 |
20120199192 | CONDUCTIVE COMPOSITIONS AND PROCESSES FOR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES - ORGANIC MEDIUM COMPONENTS - Embodiments of the invention relate to a silicon semiconductor device, and a conductive paste for use in the front side of a solar cell device. | 08-09-2012 |
20130068827 | METHOD OF MANUFACTURING SOLAR CELL ELECTRODE AND CONDUCTIVE PASTE - The present invention relates to a method of manufacturing a solar cell electrode, comprising: preparing a semiconductor substrate having a preformed electrode on a front side, a back side, or both of the front and the back side of the semiconductor substrate; applying a conductive paste onto the preformed electrode, wherein the conductive paste comprises a conductive powder, an amorphous saturated polyester resin with glass transitional temperature (Tg) of 50° C. or lower, and an organic solvent; drying the applied conductive paste; putting a tab electrode on the dried conductive paste; and soldering the tab electrode. | 03-21-2013 |
20130183795 | SOLAR CELL BACK SIDE ELECTRODE - A method of manufacturing a solar cell back side electrode comprising: (a) preparing a substrate comprising a semiconductor layer and a passivation layer formed on the back side of the semiconductor layer, wherein the passivation layer has one or more openings; (b) applying, onto the back side of the substrate, an aluminum paste comprising, (i) an aluminum powder, (ii) a glass frit comprising 30 to 70 cation mole percent of lead, 1 to 40 cation mole percent of silicon and 10 to 65 cation mole percent of boron, and 1 to 25 cation mole percent of aluminum, based on the total mole of cationic components in the glass frit, and (iii) an organic medium, wherein the aluminum paste covers the openings; and (c) firing the aluminum paste in a furnace, wherein the aluminum paste does not fire through the passivation layer during the firing. | 07-18-2013 |
20130273687 | SOLAR CELL AND MANUFACTURING METHOD OF THE SAME - A method for manufacturing a solar cell, comprising steps of: a) providing a semiconductor substrate having a light-receiving side and a back side, wherein a passivation layer is formed on the back side; b) forming a silver conductor pattern on the back side of the semiconductor substrate; c) forming an aluminum conductor pattern on the back side of the semiconductor substrate, at least part of the aluminum conductor pattern being superimposed on at least part of the silver conductor pattern; and d) firing the silver conductor pattern and the aluminum conductor pattern at the same time, thereby forming an electric contact between the semiconductor substrate and the aluminum conductor pattern by way of fire through in a region where the silver conductor pattern and the aluminum conductor pattern are superimposed. | 10-17-2013 |