Patent application number | Description | Published |
20090084590 | CIRCUIT BOARD - A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer. | 04-02-2009 |
20090094824 | METHOD OF PRODUCING SUBSTRATE - The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer. | 04-16-2009 |
20090094825 | METHOD OF PRODUCING SUBSTRATE - The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step. | 04-16-2009 |
20090095509 | CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME - In the core substrate, short circuit between an electrically conductive core section and a plated through-hole section can be securely prevented and cables can be formed in a high dense state. The core substrate comprises: the electrically conductive core section having a pilot hole, through which the plated through-hole section is formed; cable layers being respectively laminated on the both side faces of the core section; a plated layer coating an inner face of the pilot hole; and an insulating material filling a space between the plated layer and an outer circumferential face of the plated through-hole section. | 04-16-2009 |
20090095511 | CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME - The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member. | 04-16-2009 |
20090095521 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as the thermal expansion coefficient of the circuit board. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs which include first fibers that conduct electricity and second fibers that do not conduct electricity, which have the second fibers disposed at positions where plated through holes will pass through, and which are impregnated with resin; a step of forming through holes at positions in the core portion where the second fibers are disposed; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the first fibers and thereby produce a core substrate. | 04-16-2009 |
20090095524 | CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME - The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section. | 04-16-2009 |
20090098391 | CORE MEMBER AND METHOD OF PRODUCING THE SAME - The core member constitutes a core substrate of a circuit board. The core member comprises: a carbon fiber-reinforced core section, in which prepregs including carbon fibers are thermocompression-bonded; and copper foils being respectively thermocompression-bonded on the both side faces of the carbon fiber-reinforced core section with prepregs including glass fibers. The pregregs including glass fibers are composed of resin, whose melting temperature range is higher than that of resin composing the pregregs including carbon fibers. | 04-16-2009 |
20090294056 | METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED CIRCUIT BOARD UNIT - The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other. | 12-03-2009 |
20090294160 | METHOD OF MAKING PRINTED WIRING BOARD AND ELECTRICALLY-CONDUCTIVE BINDER - A thermosetting resin sheet is sandwiched between first and second support bodies so that a first electrically-conductive land on the first support body is opposed to a second electrically-conductive land on the second support body in an opening formed in the sheet. The opening is filled with an electrically-conductive binder. The electrically-conductive binder includes matrix material containing a thermosetting resin and fillers including copper particles dispersed in the matrix material. The copper particles have the surface coated with a tin-bismuth alloy. When heat is applied to the electrically-conductive binder, the tin-bismuth alloy melts. The tin forms an intermetallic compound on the surface of the individual copper particle. The copper-tin alloy layers serve to unit the copper particles together. Electrical connection is established. The bismuth embeds the copper particles. The bismuth is hardened or cured. The matrix material is then hardened or cured. | 12-03-2009 |
20090294161 | CORE SUBSTRATE AND PRINTED WIRING BOARD - The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate. | 12-03-2009 |
20090294166 | PRINTED WIRING BOARD - Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer. | 12-03-2009 |
20100014254 | Printed circuit board unit and semiconductor package - A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism. | 01-21-2010 |
20100018758 | PRINTED WIRING BOARD - A printed wiring board which includes a core substrate and a plurality of buildup layer. The core substrate contains carbon fiber. The plurality of buildup layers is stacked on the core substrate. The buildup layer includes an insulating layer and a conductive wiring layer. The insulating layer contains a resin material having a glass fiber cloth embedded therein. | 01-28-2010 |
20100018762 | BUILDUP PRINTED CIRCUIT BOARD - A printed circuit board includes a first insulation layer that is formed of a resin material into which fiber cloth is embedded. A second insulation layer is formed of a resin material, and is stacked on a front surface of the first insulation layer on which a heating process has been performed. A conductive land is formed on a front surface of the second insulation layer. A via is provided in a through hole penetrating through the first insulation layer and the second insulation layer. The through hole is filled with a conductive material, and the via is connected to the conductive land. | 01-28-2010 |
20100122843 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as strength and thermal expansion coefficient. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs formed by disposing carbon fibers so as to produce openings at positions where plated through holes will pass through and impregnating the carbon fibers with resin; a step of forming through holes that pass inside the openings at positions of the openings in the core portion; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the carbon fibers and thereby produce a core substrate. | 05-20-2010 |
20110100690 | ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF MAKING THE SAME - An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases. | 05-05-2011 |
20110303444 | LAMINATED CIRCUIT BOARD, BONDING SHEET, LAMINATED-CIRCUIT-BOARD PRODUCING METHOD, AND BONDING -SHEET PRODUCING METHOD - A laminated circuit board includes a first wiring board including a first land formed thereon; a second wiring board including a second land formed thereon; and a bonding layer interposed between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land to the second land with a conductive material, wherein the bonding layer has a front-side layer, a rear-side layer, and a middle layer, and the middle layer has a higher viscosity than the front-side layer and the rear-side layer. | 12-15-2011 |
20110303454 | LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD - A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is made of a bonding resin, being laid between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land and the second land via a conducting material; anda plate that has a through-hole into which the conducting material is supplied, wherein the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking. | 12-15-2011 |
20120024586 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT - A printed wiring board including a substrate that includes wiring through-hole portions where wiring through-holes which each penetrate the substrate from a surface on a front side of the substrate to a surface on a back side of the substrate, the wiring through-hole portions being made using a dielectric material having a thermal expansion coefficient different from a thermal expansion coefficient of the substrate; and thermal-expansion adjusting portions produced by filling prepared-holes with the dielectric material, the prepared-holes being produced at a surface of the substrate. The surface is partitioned into predetermined blocks, in each of which the thermal-expansion adjusting portions are placed in a layout that minimizes a difference between a thermal expansion coefficient in the block in a length direction and a thermal expansion coefficient in the block in a width direction according to a placement of the wiring through-hole portions in the block. | 02-02-2012 |
20120067635 | Package substrate unit and method for manufacturing package substrate unit - A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts. | 03-22-2012 |
20120097442 | PRINTED CIRCUIT BOARD INCORPORATING FIBERS - A printed circuit board includes a cell portion which includes cells having a plurality of through bores are arranged in a base material; and a base material portion which exists around an outer edge of the cell portion. The base material is formed of a prepreg, the prepreg includes a fiber material in which fiber threads are oriented in a first direction and in a second direction which is perpendicular to the first direction, and a resin material in which the fiber material is impregnated. The through bores are arranged along a third direction between the first direction and the second direction, wherein one side of the outer edges of the cell extends along the third direction. | 04-26-2012 |
20120132464 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND ELECTRONIC DEVICE - A method for manufacturing a printed wiring board includes filling material in through holes formed in first lands on a first substrate, forming projection portions projecting from the first lands on the surface of the material of the through holes, placing a conductive material on the first lands, and electrically connecting the first lands of the first substrate and second lands of second substrate by pressing the conductive material under melting filled between the first and second lands in the lamination direction of the substrates by the projection portions when laminating the substrates in such a manner that the lands of the other substrate face the lands of the substrate for aggregation of the conductive material. | 05-31-2012 |