Heinrici

Axel Heinrici, Aachen DE

Patent application number	Description	Published
20110210099	METHOD AND ARRANGEMENT FOR FIRM BONDING OF MATERIALS - A method and an arrangement for a firm bonding of a first material with a second material by means of soldering through focused laser radiation impacting on the first material, with the output controlled in dependence on the temperature measured in the area of the impacting focused laser radiation. To assure that surface properties will not lead to a noticeable distortion of the material temperature to be measured so that a reproducible, high quality soldering will be possible, it is provided for the temperature to be measured in an area of the first material that is adjacent to that in which the focused laser radiation impacts on the first material, with the area in which the temperature is measured and the area of impact of the laser radiation lying within the area of the soldering spot.	09-01-2011
20120228275	METHOD FOR EXPOSING AN ELECTRICAL CONTACT - A method for exposing at least one electrical contact, which is covered by at least one layer made of plastic, by means of a laser beam. In order to allow the targeted and reproducible exposing of the electrical contact in an automated process, the location of the at least one electrical contact is determined by means of a sensor, and the at least one layer made of plastic is removed in a flat area, in consideration of the determined location of the electrical contact and according to a pattern stored in a controller of a laser scanner, the projection of said flat area being inside of the contact in the direction of the contact.	09-13-2012

Markus Heinrici, Vikring AT

Patent application number	Description	Published
20150214095	Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process - A method for producing a metal layer on a wafer is described. In one embodiment the method comprises providing a semiconductor wafer including a coating, printing a metal particle paste on the semiconductor wafer thereby forming a metal layer and heating the metal layer in a reductive gas for sintering the metal particle paste or for annealing a sintered metal particle paste in an oven.	07-30-2015

Markus Heinrici, Villach AT

Patent application number	Description	Published
20160082718	Methods with Inkjet Processes and Their Application - A method a described which includes depositing a first component of a multicomponent system by means of an inkjet process, and depositing a second component of the multicomponent system by means of an inkjet process.	03-24-2016