| Patent application number | Description | Published |
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| 20090017579 | METHOD OF MANUFACTURING MICRO ELECTRO MECHANICAL SYSTEMS DEVICE - Provided is a MEMS device which is robust to the misalignment and does not require the double-side wafer processing in the manufacture of a MEMS device such as an angular velocity sensor, an acceleration sensor, a combined sensor or a micromirror. After preparing a substrate having a space therein, holes are formed in a device layer at positions where fixed components such as a fixing portion, a terminal portion and a base that are fixed to a supporting substrate are to be formed, and the holes are filled with a fixing material so that the fixing material reaches the supporting substrate, thereby fixing the device layer around the holes to the supporting substrate. | 01-15-2009 |
| 20090049909 | Hydraulic Controller - A hydraulic controller including a cabinet, a hydraulic pipe block having a passage, a linearly driving actuator having a piston to open and close the passage in the hydraulic pipe block, a printed wiring board having a circuit for driving the linearly driving actuator, and a vibrating angular velocity sensor having two vibrators which can move in a Coriolis force detection direction orthogonal to vibration directions, wherein
| 02-26-2009 |
| 20090056444 | ANGULAR VELOCITY DETECTING DEVICE - A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is levitated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained. | 03-05-2009 |
| 20090126491 | INERTIAL SENSOR - Techniques capable of suppressing fixation between a movable electrode and a fixed electrode in an inertial sensor and preventing the inertial sensor from malfunctioning are provided. The movable electrode, the fixed electrode provided so as to face the movable electrode, a peripheral conductor facing both the movable electrode and the fixed electrode, and a demodulation circuit and a voltage adjustment circuit which adjust the electric potential of the peripheral conductor so that the electric potential of the peripheral conductor becomes the same as the electric potential of the movable electrode are provided, and a change in the capacitance between the movable electrode and the fixed electrode is detected. | 05-21-2009 |
| 20090134459 | Semiconductor device and method of manufacturing the same - As well as achieving both downsizing and thickness reduction and sensitivity improvement of a semiconductor device that has: a MEMS sensor formed by bulk micromachining technique such as an acceleration sensor and an angular rate sensor; and an LSI circuit, a packaging structure of the semiconductor device having the MEMS sensor and the LSI circuit can be simplified. An integrated circuit having MISFETs and wirings is formed on a silicon layer of an SOI substrate, and the MEMS sensor containing a structure inside is formed by processing a substrate layer of the SOI substrate. In other words, by using both surfaces of the SOI substrate, the integrated circuit and the MEMS sensor are mounted on one SOI substrate. The integrated circuit and the MEMS sensor are electrically connected to each other by a through-electrode provided in the SOI substrate. | 05-28-2009 |
| 20100037691 | INERTIAL SENSOR - One inertial sensor detects an acceleration in a driving direction as well as an angular rate about one axis and an acceleration in a detecting direction at the same time. A driving-direction acceleration detecting unit is provided to members vibrating in mass members on the left and right via an elastic body. In this manner, when an acceleration is applied in the driving direction, the mass members on the left and right normally vibrated with a same amplitude and in opposite phases have displacement amounts in a same phase, and the driving-direction acceleration detecting unit detects the displacement amounts in the same phase as a capacitance change, thereby detecting the acceleration in the driving direction. | 02-18-2010 |
| 20100127715 | SEMICONDUCTOR PHYSICAL QUANTITY SENSOR AND CONTROL DEVICE USING THE SAME - A highly reliable semiconductor physical quantity sensor whose performance does not change much over time is provided. In the semiconductor physical quantity sensor, movable electrodes which can be displaced by applying a physical quantity are initially displaced using an electrostatic force, and the movable electrodes are used to detect the direction and magnitude of a physical quantity applied to the semiconductor physical quantity sensor. The semiconductor physical quantity sensor is highly reliable and its performance does not change much over time compared with semiconductor physical quantity sensors using a known method in which movable electrodes are initially displaced using a compressive stress film. | 05-27-2010 |
| 20100269589 | ANGULAR VELOCITY DETECTING DEVICE - A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is leviated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained. | 10-28-2010 |
| 20110048129 | Inertial Sensor and Method of Manufacturing the Same - An inertial sensor capable of making pressure of a space in which an inertial sensor such as an acceleration sensor is placed to be higher than that during a sealing step and improving reliability is provided. The inertial sensor can be achieved by means of making an inertial sensor including a substrate, a movable portion on the substrate, a cap member which seals the movable portion so as to cover the movable portion, wherein a gas-generating material is applied to the movable portion side of the cap. | 03-03-2011 |
| 20110100126 | Capacitance Sensor - A technique in which a false detection and a wrong diagnosis can be suppressed in a capacitance sensor represented by an acceleration sensor is provided. A first capacitative element and a second capacitative element, which configure a capacitance detection unit, and a third capacitative element and a fourth capacitative element, which configure a forced oscillation generation unit, are electrically separated from each other. That is, the diagnosis movable electrode that configures the third capacitative element and the fourth capacitative element is formed integrally with the movable part. On the other hand, the diagnosis fixed electrode and the diagnosis fixed electrode are electrically separated from the detection fixed electrode and the detection fixed electrode. | 05-05-2011 |
| 20110132089 | Inertial Sensor - In order to provide an inertial sensor such as an acceleration sensor which can be downsized and in which a high SNR can be obtained as having a plurality of measurement ranges, an inertial sensor for detecting an inertial force of acceleration based on an electrostatic capacitance change of a detecting unit includes a plurality of detecting units D | 06-09-2011 |
| 20110138912 | MICRO ELECTRO MECHANICAL SYSTEM - In order to provide a technology capable of suppressing degradation of measurement accuracy due to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions | 06-16-2011 |
| 20120038963 | MEMS DEVICE AND METHOD OF MANUFACTURING MEMS DEVICE - A protrusion formation hole is provided so as to pierce a support substrate. A polysilicon film as an electrical conducting material is embedded in the protrusion formation hole through an oxide silicon film. The polysilicon film partially bulges out of the protrusion formation hole toward a movable section to form a protruding section. In other words, the polysilicon film bulges out of the protrusion formation hole toward the movable section to form the protruding section. Thereby, a movable section included in MEMS can be prevented from sticking to other members. | 02-16-2012 |
| 20120291546 | INERTIAL SENSOR - One inertial sensor detects an acceleration in a driving direction as well as an angular rate about one axis and an acceleration in a detecting direction at the same time. A driving-direction acceleration detecting unit is provided to members vibrating in mass members on the left and right via an elastic body. In this manner, when an acceleration is applied in the driving direction, the mass members on the left and right normally vibrated with a same amplitude and in opposite phases have displacement amounts in a same phase, and the driving-direction acceleration detecting unit detects the displacement amounts in the same phase as a capacitance change, thereby detecting the acceleration in the driving direction. | 11-22-2012 |
| 20130098152 | Inertia Sensor - This invention is directed to provision of high-performance inertial sensor that can sustain SNR even in an environment where vibration disturbance exists. A vibration type inertial sensor comprises: two deadweights ( | 04-25-2013 |
| 20130133422 | Inertial Sensor - In order to provide an inertial sensor capable of suppressing a wrong diagnosis even in an adverse environment such that sudden noise occurs, an inertial sensor is provided with a movable part ( | 05-30-2013 |
| 20130152682 | ANGULAR VELOCITY DETECTING DEVICE - A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is levitated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained. | 06-20-2013 |
| 20130241013 | Physical Quantity Detector - Provided is an inertial sensor device comprising a detection part having an MEMS structure, wherein convenience during sensor installation is ensured while erroneous operation caused by the application of external vibration is controlled. To achieve this objective, an anti-vibration structure ( | 09-19-2013 |
| 20130285172 | Combined Sensor - To provide a combined sensor that can detect a plurality of physical quantities. With the combined sensor, it is possible to realize, while maintaining performance, a reduction in size and a reduction in costs by increasing elements that can be shared among respective sensors. A weight M | 10-31-2013 |
| 20130312517 | Combined Sensor - An object of the invention is to provide a combined sensor capable of suppressing the influence of electrostatic force generated by a potential difference and preventing a reduction in the S/N ratio or a variation in the sensitivity of a sensor. | 11-28-2013 |
| 20130319075 | Sensor Module and Sensor System - Reliability and accuracy of a sensor are secured while adjustment cost of a sensor module is suppressed. A signal component analysis part | 12-05-2013 |
| 20130340524 | INERTIAL SENSOR - In an inertial sensor, an acceleration sensor element section includes a first movable section configured to respond to acceleration applied thereto and a diagnosis electrode configured to displace the first movable section with an electrostatic force according to voltage application from a control circuit section. An angular velocity sensor element section includes a second movable section configured to respond to an angular velocity applied thereto and a driving electrode configured to displace the second movable section with an electrostatic force according to voltage application from the control circuit section. A voltage signal input to the driving electrode and a voltage signal input to the diagnosis electrode are the same voltage signal. The voltage signal input to the diagnosis electrode is a signal for detecting a mechanical failure. Carrier signal for detecting displacement of the first movable section has frequency higher than frequency of signal applied to the diagnosis electrode. | 12-26-2013 |
| 20130345901 | Inertial Sensor - An object of the invention is to provide an inertial sensor with small delay and high accuracy. An inertial sensor | 12-26-2013 |
| 20130346015 | Semiconductor Physical Quantity Detecting Sensor - A semiconductor physical quantity detection sensor includes (1) a first electrostatic capacitance formed by the movable electrode, and a first fixed electrode formed in a first conductive layer shared with the movable electrode, (2) a second electrostatic capacitance that is formed by the movable electrode, and a second fixed electrode formed in a second conductive layer different in a height from a substrate surface from the movable electrode, and (3) an arithmetic circuit that calculates the physical quantity on the basis of a change in the first and second electrostatic capacitances generated when the physical quantity is applied. In this configuration, an electric signal from the first electrostatic capacitance, and an electric signal from the second electrostatic capacitance are input to the arithmetic circuit. | 12-26-2013 |
| 20140007685 | Inertial Sensor - A movable part rotates about a rotation axis, which passes through a support, when an inertial force in a detecting direction is applied to an inertial sensor. The movable part includes a first region and a second region displaced in a direction opposite to a direction of the first region when the inertial force is applied. A second substrate includes first and second detection electrodes opposed to the first and second regions, respectively. The first detection electrode and the second detection electrode are provided symmetrically with respect to the rotation axis. A cavity is provided symmetrically with respect to the rotation axis. In a direction perpendicular to the detecting direction and a direction in which the rotation axis extends, a length from the rotation axis to an end of the first region and a length from the rotation axis to an end of the second region are different. | 01-09-2014 |
| 20140174180 | ANGULAR VELOCITY DETECTING DEVICE - A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is leviated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained. | 06-26-2014 |
| 20140174181 | Micro Electro Mechanical System - In order to provide a technology capable of suppressing degradation of measurement accuracy due to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions | 06-26-2014 |
| 20140260612 | Composite Sensor and Method for Manufacturing The Same - The disclosure provides a composite sensor with high reliability and a method for manufacturing the same. A moving body of an acceleration sensor and an oscillator of an angular velocity sensor are provided on the same sensor wafer, while being partitioned by a wall, and a cap wafer is formed to have a gap that corresponds to each of the sensors. A through hole and a bump are formed in a sensor sealing portion, the acceleration sensor is sealed in an air atmosphere in a first sealing process, and in a second sealing process, the angular velocity sensor is sealed by bringing the sensors and the cap into contact with each other and joining the sensors and the cap in a vacuum atmosphere. Thereafter, a composite sensor wafer is cut, a circuit board and a wiring board are mounted thereon, and a composite sensor is formed. | 09-18-2014 |
| 20150036782 | SENSOR DEVICE - In order to provide a suitable sensor device for a sensor system in which a plurality of request sources request the acquisition of information for the same sensor, the sensor device is provided with a physical mass sensing unit ( | 02-05-2015 |
| 20150040670 | Inertial Sensor Module - In a sensor module capable of changing a detection axis to detect a physical quantity, when a pad is provided at a location other than a corner point of an LSI-side, for the purpose of solving problems such as an increase in a chip surface area and an increase in development costs, caused by guide wiring for connecting the pad, the inertial sensor module is provided with: a first sensor element ( | 02-12-2015 |
