Patent application number | Description | Published |
20100102428 | SEMICONDUCTOR PACKAGE - A semiconductor package that includes a first semiconductor device mounted on a package substrate and includes an inactive surface having a cavity and an active surface opposite to the inactive surface, a second semiconductor device that is disposed on the active surface and electrically connected to the first semiconductor device, and a third semiconductor device that is disposed on the inactive surface in the cavity and electrically connected to the first semiconductor device. The first semiconductor device includes at least one first through electrode electrically connecting the first semiconductor device to the third semiconductor device through the first semiconductor device. | 04-29-2010 |
20110018119 | Semiconductor packages including heat slugs - A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate. | 01-27-2011 |
20110141712 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A package substrate includes a main body having an upper surface and a lower surface opposite to the upper surface, a plurality of external terminals attached to the lower surface, and a plurality of grooves formed in regions of the lower surface to which the plurality of external terminals is not attached. The semiconductor package includes a package substrate, a semiconductor chip mounted on the upper surface of the semiconductor substrate, and a board providing a region mounted with the package substrate and being mounted with a plurality of mounting elements which are vertically aligned with the plurality of grooves and are inserted into the plurality of grooves. | 06-16-2011 |
20120063108 | CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME - In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a cross section, such that a first side of the first metal core faces a first side of the second metal core; a first electrode electrically connected to the first side of the first metal core; a second electrode electrically connected to the first side of the second metal core facing the first metal core; and a dielectric layer between the first and second electrodes. | 03-15-2012 |
20130052775 | SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME - A semiconductor package including a package substrate having a chip mounting region and a peripheral region and including a ground layer formed in the peripheral region, first solder balls on the package substrate in the chip mounting region, second solder balls on the ground layer, at least one semiconductor chip stacked on the package substrate in the chip mounting region, and a package cap covering the semiconductor chip and contacting the package substrate in the peripheral region may be provided. The package cap is electrically connected to the second solder balls. Methods of fabricating the semiconductor package are also provided. | 02-28-2013 |
20130221485 | WIRING BOARDS AND SEMICONDUCTOR MODULES INCLUDING THE SAME - A wiring board includes a metal core including a first surface and a second surface facing each other and a first portion and a second portion disposed on the first and second surfaces, respectively. The first and second portions each include a plurality of insulating layers and a plurality of wiring layers stacked in an alternating manner. At least one capacitor is disposed in at least one interior region. The at least one capacitor includes first and second electrodes. The at least one interior region exposes a portion of the metal core and a portion of at least one of the first and second portions adjacent to the metal core and at least one first via electrically connects one of the wiring layers of the first portion with the first and second electrodes. | 08-29-2013 |
20140140026 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - Provided is a package substrate and a semiconductor package. The package substrate includes a main body having an upper surface and a lower surface opposite to the upper surface, a plurality of external terminals attached to the lower surface, and a plurality of grooves formed in regions of the lower surface to which the plurality of external terminals is not attached. The semiconductor package includes a package substrate, a semiconductor chip mounted on the upper surface of the semiconductor substrate, and a board providing a region mounted with the package substrate and being mounted with a plurality of mounting elements which are vertically aligned with the plurality of grooves and are inserted into the plurality of grooves. | 05-22-2014 |
20140239477 | SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME - A semiconductor package including a package substrate having a chip mounting region and a peripheral region and including a ground layer formed in the peripheral region, first solder balls on the package substrate in the chip mounting region, second solder balls on the ground layer, at least one semiconductor chip stacked on the package substrate in the chip mounting region, and a package cap covering the semiconductor chip and contacting the package substrate in the peripheral region may be provided. The package cap is electrically connected to the second solder balls. Methods of fabricating the semiconductor package are also provided. | 08-28-2014 |
20150028477 | SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENING IN SHIELDING CORE PLATE - A semiconductor package includes a first plate having a through hole therein, at least one interconnection layer disposed on a first surface of the first plate, and at least one semiconductor chip disposed on the at least one interconnection layer in a space defined by the through hole and electrically connected to the least one interconnection layer. The package further includes a second plate disposed on the at least one semiconductor chip and a second surface of the first plate on a side of the first plate opposite the first surface, and at least one conductive pad disposed on the second surface of the first plate and electrically connected to the at least one interconnection layer. | 01-29-2015 |
20150035148 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME - A semiconductor package including a lower package including a lower package substrate and a lower semiconductor chip, the lower package substrate including an interconnection part and a core part, the core part including connection vias exposed by openings, the lower semiconductor chip buried in the core part, an upper package including an upper package substrate, an upper semiconductor chip provided on the upper package substrate, and solder balls provided on a bottom surface of the upper package substrate, and an intermetallic compound layer at an interface between the connection vias and the solder balls in the openings may be provided. | 02-05-2015 |
20150130041 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - Provided are semiconductor packages and methods of fabricating the same. The method may include, stacking a lower semiconductor chip on a lower package substrate, forming a lower molding layer on the lower package substrate, forming a connecting through-hole and an element through-hole by performing a laser drilling process on the lower molding layer, and stacking an upper package substrate having a bottom surface to which a passive element is bonded on the lower package substrate to insert the passive element into the element through-hole. | 05-14-2015 |
Patent application number | Description | Published |
20140217373 | FLEXIBLE DISPLAY SUBSTRATE, FLEXIBLE ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A flexible display substrate, a flexible organic light emitting display device, and a method of manufacturing the same are provided. The flexible display substrate comprises a flexible substrate including a display area and a non-display area extending from the display area, a first wire formed on the display area of the flexible substrate, and a second wire formed on the non-display area of the flexible substrate, wherein at least a part of the non-display area of the flexible substrate is curved in a bending direction, and the second wire formed on at least a part of the non-display area of the flexible substrate includes a first portion formed to extend in a first direction and a second portion formed to extend in a second direction. | 08-07-2014 |
20140217382 | ELECTRONIC DEVICES WITH FLEXIBLE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - Embodiments of the present disclosure can significantly reduce the non-display area of a flexible OLED display, which would otherwise be covered by a cosmetic trim such as a bezel or an opaque. As such, an electronic device with a display having minimized border area can be provided. This makes it possible to reduce the overall size of the electronic device without sacrificing the size of the display therein. Such a reduction in size of the bezel was achieved by bending the flexible substrate near its edge using an insert member. | 08-07-2014 |
20140217397 | FLEXIBLE DISPLAY SUBSTRATE, FLEXIBLE ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A flexible display substrate, a flexible organic light emitting display device, and a method of manufacturing the same are provided. The flexible display substrate comprises a flexible substrate including a display area and a non-display area extending from the display area, and a wire formed on the flexible substrate. At least a part of the non-display area of the flexible substrate is formed in a crooked shape in a bending direction, and the wire positioned on at least a part of the non-display area of the flexible substrate includes a plurality of first wire patterns, and a second wire pattern formed on the plurality of first wire patterns and electrically connected with the plurality of first wire patterns. | 08-07-2014 |
20150137102 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE - Provided are an organic light-emitting display device and a method for manufacturing the same. A flexible substrate of the organic light-emitting display device is bent across a bend line and includes a first area, a first bending area adjacent to the first area, a second bending adjacent to the first bending area, and a second area adjacent to the second bending area. A wiring is formed over the first area, the first bending area, the second bending area, and the second area of the flexible substrate to electrically connect a display unit formed in the first area and a pad unit formed in the second area. A first alignment key is formed over the flexible substrate, and a second alignment is formed over the flexible substrate. The first alignment key is positioned to overlap the second alignment key with the flexible substrate bent across the bend line. | 05-21-2015 |
20150382446 | FLEXIBLE DISPLAY DEVICE WITH REDUCED BEND STRESS WIRES AND MANUFACTURING METHOD FOR THE SAME - There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display. | 12-31-2015 |
20160035759 | FLEXIBLE DISPLAY DEVICE WITH WIRE HAVING REINFORCED PORTION AND MANUFACTURING METHOD FOR THE SAME - There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display. | 02-04-2016 |
20160035812 | FLEXIBLE DISPLAY DEVICE WITH WIRE HAVING REINFORCED PORTION AND MANUFACTURING METHOD FOR THE SAME - There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display. | 02-04-2016 |
20160066409 | Flexible Display Device With Side Crack Protection Structure And Manufacturing Method For The Same - There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display. | 03-03-2016 |
20160079336 | FLEXIBLE DISPLAY SUBSTRATE, FLEXIBLE ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A flexible display substrate, a flexible organic light emitting display device, and a method of manufacturing the same are provided. The flexible display substrate comprises a flexible substrate including a display area and a non-display area extending from the display area, a first wire formed on the display area of the flexible substrate, and a second wire formed on the non-display area of the flexible substrate, wherein at least a part of the non-display area of the flexible substrate is curved in a bending direction, and the second wire formed on at least a part of the non-display area of the flexible substrate includes a first portion formed to extend in a first direction and a second portion formed to extend in a second direction. | 03-17-2016 |
20160093685 | FLEXIBLE DISPLAY DEVICE WITH BEND STRESS REDUCTION MEMBER AND MANUFACTURING METHOD FOR THE SAME - There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display. | 03-31-2016 |