Patent application number | Description | Published |
20090311827 | Adhesive for electronic components, method and for manufacturing semiconductor chip laminate, and semiconductor device - It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts. | 12-17-2009 |
20100076119 | ADHESIVE FOR ELECTRONIC COMPONENTS - The present invention has its object to provide an adhesive for bonding electronic components with a constant distance between them, which makes it possible to maintain a distance between bonded electronic components at high accuracy and to provide a highly reliable electronic apparatus, and which can be stably and continuously applied with a jet dispenser. The present invention is an adhesive for bonding electronic components, including spacer particles, an epoxy compound (A), and a curing agent. The spacer particles have a CV value of 10% or less. The epoxy compound (A) has a molecular structure including 10 or less monomer units with an aromatic ring in each repeating unit, is in a state of crystalline solid at 25° C., and has a viscosity of 1 Pa·s or less measured by an E-type viscometer at a temperature of 50 to 80° C. | 03-25-2010 |
20100197830 | ADHESIVE FOR ELECTRONIC COMPONENT - The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more. | 08-05-2010 |
20120016057 | ADHESIVE FOR ELECTRONIC COMPONENTS - It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group. | 01-19-2012 |
20120021233 | METHOD FO PRODUCING SEMICONDUCTOR CHIP STACK, AND SEMICONDUCTOR DEVICE - It is an object of the present invention to provide a method for producing a semiconductor chip laminate, which adjusts the amount of an adhesive for semiconductor components extending from a bonded region of a semiconductor chip and provides a smaller but highly-precise and highly-reliable semiconductor chip laminate. | 01-26-2012 |
20130199613 | INK FOR ACTIVE LAYER OF ORGANIC SOLAR CELL, ORGANIC SOLAR CELL, AND PROCESS FOR MANUFACTURE OF ORGANIC SOLAR CELL - The present invention aims to provide an ink for an active layer of an organic solar cell, wherein an active layer having high energy conversion efficiency can be stably and easily formed from the ink; an organic solar cell having high energy conversion efficiency; and a method for producing the organic solar cell. A first aspect of the present invention is an ink for an active layer of an organic solar cell, the ink comprising: an organic semiconductor compound; an inorganic semiconductor compound; an organic solvent; and a dispersant; wherein the dispersant is a compound having a structure with an aromatic ring and/or heterocyclic ring and a polar group asymmetrically bonded to the structure, and fulfills all of the following requirements (1) to (3):
| 08-08-2013 |
20130237018 | ADHESIVE FOR ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR CHIP MOUNT - An object of the present invention is to provide an adhesive for electronic components that allows suppression of occurrence of voids and is prevented from wicking up to an upper surface of a semiconductor chip. Another object of the present invention is to provide a production method for a semiconductor chip mount using the adhesive for electronic components. The present invention is an adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in FIG. | 09-12-2013 |
20140366948 | ORGANIC THIN FILM SOLAR CELL - The present invention aims to provide an organic thin-film solar cell that has a high photoelectric conversion efficiency and excellent durability. The present invention is an organic thin-film solar cell including a photoelectric conversion layer, wherein the photoelectric conversion layer includes a portion containing a sulfide of a Group 15 element in the periodic table and an organic semiconductor portion contacting with each other, and the organic semiconductor portion comprises an organic semiconductor, the organic semiconductor comprising a polythiophene derivative, a phthalocyanine derivative, a naphthalocyanine derivative, or a benzoporphyrin derivative. | 12-18-2014 |
20150027540 | ORGANIC THIN FILM SOLAR CELL - The present invention aims to provide an organic thin-film solar cell that has a high photoelectric conversion efficiency, little dispersion in the photoelectric conversion efficiency in a photoelectric conversion layer, and excellent durability. The present invention is an organic thin-film solar cell including a photoelectric conversion layer, wherein the photoelectric conversion layer includes a portion containing a sulfide of a Group 15 element in the periodic table and a portion containing an organic semiconductor having a molecular weight of less than 10,000, and the portion containing a sulfide of a Group 15 element in the periodic table and the portion containing an organic semiconductor having a molecular weight of less than 10,000 contact with each other. | 01-29-2015 |
20150107673 | COATING LIQUID FOR FORMING SULFIDE SEMICONDUCTOR, SULFIDE SEMICONDUCTOR THIN FILM, AND THIN FILM SOLAR CELL - The present invention aims to provide a sulfide semiconductor-forming coating liquid capable of easily forming a sulfide semiconductor having a large area, the sulfide semiconductor being useful as a semiconductor material for photoelectric conversion materials. The present invention also aims to provide a sulfide semiconductor thin film produced using the sulfide semiconductor-forming coating liquid; and a thin film solar cell. The present invention provides a sulfide semiconductor-forming coating liquid, the coating liquid containing a complex containing a metal element of group 15 of the periodic table and sulfur. | 04-23-2015 |
20150263217 | METHOD FOR MANUFACTURING SOLAR CELL, AND SOLAR CELL - The present invention aims to provide a method of producing a solar cell which can produce a porous inorganic oxide layer that has a high porosity and contains less impurities even by low-temperature firing. The present invention also aims to provide a solar cell produced by the method of producing a solar cell. The present invention directs to a method of producing a solar cell. The method includes: applying an inorganic oxide paste that contains inorganic oxide fine particles, a binder resin, and an organic solvent to a surface of a base to form an inorganic oxide layer on the base, the base including a conductive layer as an outermost layer thereof, the surface being a conductive layer-side surface; firing the inorganic oxide layer; irradiating the inorganic oxide layer with active energy rays or subjecting the inorganic oxide layer to ozonolysis to form a porous inorganic oxide layer; and laminating a semiconductor on the porous inorganic oxide layer. | 09-17-2015 |
20150280019 | SOLAR CELL - It is an object of the present invention to provide a solar cell capable of exhibiting excellent photoelectric conversion efficiency even when ultraviolet light is blocked. The present invention relates to a solar cell including: a cathode; an anode; a photoelectric conversion layer disposed between the cathode and the anode; and an electron transport layer disposed between the cathode and the photoelectric conversion layer, the electron transport layer containing titanium oxide and at least one element selected from the group consisting of pentavalent elements and hexavalent elements. | 10-01-2015 |
20150318480 | SOLAR CELL - The present invention aims to provide a solar cell having high photoelectric conversion efficiency and excellent durability. The present invention relates to a solar cell including at least: a cathode; an anode; a photoelectric conversion layer provided between the cathode and the anode; and a hole transport layer provided between the photoelectric conversion layer and the anode, the hole transport layer containing an organic semiconductor, the organic semiconductor having a carboxyl group and having a conjugated structure. | 11-05-2015 |
Patent application number | Description | Published |
20150276263 | HEAT SOURCE UNIT OF REFRIGERATING APPARATUS - A heat source unit of a refrigerating apparatus includes a heat exchanger, a blower, an electrical component, a rectifying member, and a casing. The casing houses the heat exchanger, blower, electrical component, and rectifying member. The casing has a vent that vents air upward. The electrical component controls driving of an actuator, and includes a heat-generating part and a heat sink. The heat sink is installed on the heat-generating part, and has a heat-radiating fin. The rectifying member extends along a vertical direction, and covers the heat-radiating fin, and rectifies flow of air. An air inlet is formed on a lower part, and an air outlet on an upper part of the rectifying member. A first air flow path is formed inside the rectifying member. An air flow generated by the blower passes through the first air flow path. The heat-radiating fin is positioned in the first air flow path. | 10-01-2015 |
20150276279 | HEAT SOURCE UNIT OF REFRIGERATING APPARATUS - A heat source unit of a refrigerating apparatus includes a heat exchanger, a blower, an electronic component controlling driving of an actuator, a casing having a vent, and first and second partitioning plates. The heat exchanger has first, second, third and fourth side face parts. The first partitioning plate is disposed between the first and fourth side face parts. An interior of the casing has a first space surrounded by the first to fourth side face parts and the first partitioning plate, and a second space partitioned from the first space by the first partitioning plate. The second space is divided by the second partitioning plate into a third space and a fourth space situated below the third space and exposed externally from the casing. The electrical component is disposed in the third space. The second partitioning plate has a first ventilation opening communicating between the third and fourth spaces. | 10-01-2015 |
20150282386 | HEAT SOURCE UNIT OF REFRIGERATING APPARATUS - A heat source unit of a refrigerating apparatus includes a heat exchanger, an actuator, an electrical component controlling the actuator, a casing, and a partitioning plate. The casing has bottom and top plates with a vent on the top plate. The heat exchanger has first, second, third and fourth side face parts. The actuator is disposed in a first space surrounded by the first to fourth side face parts, and the partitioning plate. The electronic component is disposed in a second space partitioned from the first space by the partitioning plate. The second space is in a corner formed by the first and second side face parts. The partitioning plate is positioned between end parts of the first and fourth side face parts, and at least a portion is inserted between the bottom and top plates and fixed in a placed state. | 10-01-2015 |